Advances in electronic packaging 2005
Subtitle: proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems, presented at 2005 ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems, July 17-22, 2005 San Fransico, California USA
By: sponsored by Electronic and Photonics Packaging Division, ASME.
Contributors: American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.
Publisher: American Society of Mechanical Engineers
Published: 2005
Place of publication: New York, NY
Language: eng
Subjects: Electronic packaging -- Congresses.; Microelectromechanical systems -- Congresses.; Nanotechnology -- Congresses.; Electronic systems -- Congresses.
Genres: Congresses.
Other titles: InterPACK2005.; ASME InterPACK Conference.
Notes: Includes bibliographical references and author index.
Table of contents: value: pt. A. Thermal management of electronic and photonic systems, thermal management of micro/nanosystems, optical MEMs, airborne, space and defense electronic packaging; value: pt. B. Packaging of electronic and photonic systems, packaging for micro/nanosystems, reliability of electronic and photonic systems, modeling and characterization of electronic and photonic systems, manufacturing and test of electronic and photonic systems, manufacturability of MEMS, RF microwave, biosensors/bioengineering; value: pt. C. Reliability of micro/nanosystems, testing and characterization of MEMS, materials, processes, and technologies, micro and nanofabrication processes embedded passives, microfluidics, RF MEMS, electro-thermal inteactions, solid state power generation and refrigeration for electronic packages and systems, heat transfer in electronic equipment.