1995 International Conference on Multichip Modules
Subtitle: proceedings : 19-21 April 1995, Denver, Colorado
By: sponsored by ISHM--the Microelectronics Society ... [et al.] ; endorsed by SEMI--Semiconductor Equipment and Materials International, PCMCIA--Personal Computer Memory Card International Association ; [edited and assembled by the 1995 Technical Program Committee and ISHM staff].
Contributors: International Society for Hybrid Microelectronics.; Semiconductor Equipment and Materials International.
Series: SPIE proceedings series ;; v. 2575; Proceedings of SPIE--the International Society for Optical Engineering ;; v. 2575.
Publisher: ISHM; Published in cooperation with SPIE--the International Society for Optical Engineering
Published: 1995
Place of publication: Reston, Va
Language: eng
Number of pages: 572
Subjects: Multichip modules (Microelectronics) -- Congresses.; Electronic packaging -- Congresses.; Microelectronic packaging -- Congresses.
Other titles: Multichip modules; ICEMCM '95
Notes: Includes bibliographical references and index.