Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium
Subtitle: proceedings 1999 IEMT symposium : October 18-19, 1999, Austin, TX, USA
By: sponsored by: Semiconductor Equipment & Materials Int'l [and] the Components, Packaging, & Manufacturing Technology Society of the IEEE.
Contributors: Semiconductor Equipment and Materials International.; Components, Packaging & Manufacturing Technology Society.
Publisher: IEEE
Published: 1999
Place of publication: Piscataway, N.J
Language: eng
Number of pages: 479
Subjects: Electronic industries -- Congresses.; Electronic packaging -- Congresses.; Electronic apparatus and appliances -- Design and construction -- Congresses.; Semiconductors -- Design and construction -- Congresses.; Thin film devices -- Design and construction -- Congresses.; Ball grid array technology -- Congresses.
Genres: Congresses.
Other titles: IEMT symposium.; Electronics Manufacturing Technology Symposium, 1999, Twenty-Fourth IEEE/CPMT.
Notes: Cover title.

"IEEE Catalog Number 99CH36330"--T.p. verso.

Includes bibliographical references and author index.

Also available via the World Wide Web with additional title: Electronics Manufacturing Technology Symposium, 1999, Twenty-Fourth IEEE/CPMT.