Miniaturisierung auf Baugruppenebene
By: Thomas Hoffmann.
Series: Mikroelektronik ;; Bd. 9; Mikroelektronik (Heidelberg, Germany) ;; Bd. 9.
Publisher: Hüthig
Published: 1992
Place of publication: Heidelberg
Language: ger
Number of pages: 319
Subjects: Electronic packaging.
Notes: Includes bibliographical references (p. [301]-313) and index.