ICEPT2003
Subtitle: Fifth International Conference on Electronic Packaging Technology : proceedings : Oct. 28-30, 2003, Shanghai, China
By: editors: Keyun Bi, Peter G. Barnwell, Jiaji Wang ; sponsored by: Chinese Institute of Electronics (CIE-CEPS) ; technical co-sponsorship with: IEEE-CPMT (USA) ... [et al.].
Contributors: Bi, Keyun.; Barnwell, Peter G.; Wang, J.; Zhongguo dian zi xue hui.; Components, Packaging & Manufacturing Technology Society.
Publisher: IEEE; China Electronic Packaging Association
Published: 2003
Place of publication: Piscataway, New ersey; [Shanghai, China?]
Language: eng
Number of pages: 517
Subjects: Electronic packaging. -- Congresses.
Genres: Congresses.
Other titles: Electronic packaging technology
Notes: Includes bibliographic references and author index.
"IEEE Catalog Number: 03EX750 Bound Edition ; 03EX750C CD-ROM Edition"--T.p. verso.
"China Electronic Packaging Association"--T.p.