Routing in the third dimension
Subtitle: from VLSI chips to MCMs
By: Naveed A. Sherwani, Siddharth Bhingarde, Anand Panyam.
Contributors: Bhingarde, Siddharth.; Panyam, Anand.
Publisher: IEEE Press; Institute of Electrical and Electronics Engineers
Published: 1995
Place of publication: Piscataway, NJ; New York
Language: eng
Number of pages: 358
Subjects: Integrated circuits -- Very large scale integration -- Computer-aided design.; Multichip modules (Microelectronics) -- Computer-aided design.
Notes: Includes bibliographical references (p. 335-350) and indexes.