Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications
By: edited by Martin A. Schmidt ... [et al. ; sponsored by the] Electronics and Dielectric Science and Technology divisions.
Contributors: Schmidt, Martin A.; Electrochemical Society. Electronics Division.; Electrochemical Society. Dielectric Science and Technology Division.
Series: Proceedings / Electrochemical Society ;; v. 93-29; Proceedings (Electrochemical Society) ;; v. 93-29.
Publisher: Electrochemical Society
Published: 1993
Place of publication: Pennington, NJ
Language: eng
Number of pages: 485
Subjects: Semiconductors -- Bonding -- Congresses.; Semiconductor wafers -- Congresses.
Other titles: Semiconductor wafer bonding: science, technology, and applications.
Notes: Includes bibliographical references and indexes.
Symposium held at the Hawaii meeting of The Electrochemical Society, May 16-21, 1993.