Physical design for multichip modules
By: by M. Sriram, S.M. Kang.
Contributors: Kang, Sung-Mo, 1945-
Series: The Kluwer international series in engineering and computer science ;; SECS 267
Publisher: Kluwer Academic Publishers
Published: 1994
Place of publication: Boston
Language: eng
Number of pages: 197
Subjects: Electronic packaging -- Design; Multichip modules (Microelectronics) -- Design and construction
Notes: Includes bibliographical references (p. 181-191) and index.