Thermal management of electronic systems
Subtitle: proceedings of Eurotherm Seminar 29, 14-16 June 1993, Delft, The Netherlands
By: edited by C.J. Hoogendoorn, R.A.W.M. Henkes and C.J.M. Lasance
Contributors: Hoogendoorn, Charles J.; Henkes, R. A. W. M.; Lasance, C. J. M.
Publisher: Springer
Published: 1994
Place of publication: Dordrecht
Language: eng
Format: [electronic resource] :
Number of pages: 334
ISBN-13: 9789401044721; 9789401110822
Subjects: Temperature control; Congresses; Electronic apparatus and appliances; Electronic systems
Description: This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermally induced failure, numerical and experimental analysis of systems at various packaging levels, channels and electronic components, measurement techniques, liquid cooling, thermal characterization, thermal stress and die attach defects. For research and development engineers and scientists whose work involves the design and manufacture of electronic systems.
Notes: Softcover reprint of the hardcover 1st edition originally published by Kluwer in 1994.

Includes bibliographical references and index.