Morphological evolution of electrodeposits and electrochemical processing in ULSI fabrication and electrodeposition of and on semiconductors IV
Subtitle: proceedings of the international symposia
By: editors, K. Kondo ... [et al.] ; sponsoring divisions, Electrodeposition, Dielectric Science and Technology, Electronics
Contributors: Electrochemical Society. Electrodeposition Division; Electrochemical Society. Dielectric Science and Technology Division; Electrochemical Society. Electronics Division; Electrochemical Society. Meeting
Series: Proceedings -- v. 2001-08; Proceedings (Electrochemical Society) -- v. 2001-08.
Publisher: Electrochemical Society
Published: 2005
Place of publication: Pennington, NJ
Language: eng
Number of pages: 406
Subjects: Electroplating; Congresses; Copper plating; Integrated circuits; Ultra large scale integration; Interconnects (Integrated circuit technology)
Other titles: Electrochemical processing in ULSI fabrication and electrodeposition of and on semiconductors IV
Notes: Papers from two symposia held during the 2001 spring meeting of the Electrochemical Society in Washington, D.C.

Includes bibliographical references and indexes.

Also issued online.