Structural Analysis in Microelectronics & Fiber Optics, 1997
Subtitle: Proceedings, Asme International Mechanical Engineering Congress & Exposition, Dallas, Tx, 1997 (Eep (Series), Vol. 21.)
Contributors: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division (Corporate Author); Ephraim Suhir (Editor)
Publisher: American Society of Mechanical Engineers
Published: June 1997
Language: eng
Format: Paperback
Number of pages: 272
ISBN-13: 9780791818398
Subjects: Electronics engineering; Technology & Industrial Arts; Microelectronic packaging; Electronics - General; Technology; Science/Mathematics; Structural analysis (Engineering); Congresses; Engineering - General; Fiber optics; Structural analysis (Engineeri