Proceedings of the symposia on reliability of semiconductor devices and interconnection and multilevel metallization, interconnection, and contact technologies
By: edited by Harzara S. Rathore, Geraldine C. Schwartz, Robin A. Susko ; [sponsored by] Dielectrics and Insulation and Electronics divisions.
Contributors: Rathore, Harzara S.; Schwartz, G. C.; Susko, R. A.; Electrochemical Society. Dielectrics and Insulation Division.; Electrochemical Society. Electronics Division.
Series: Proceedings ;; v. 89-6; Proceedings (Electrochemical Society) ;; v. 89-6.
Publisher: Electrochemical Society
Published: 1989
Place of publication: Pennington, NJ (10 S. Main St., Pennington 08534-2896)
Language: eng
Number of pages: 495
Subjects: Semiconductors -- Reliability -- Congresses.; Integrated circuits -- Very large scale integration -- Design and construction -- Congresses.; Metallizing -- Congresses.
Other titles: Reliability of semiconductor devices and interconnection and multilevel metallization, interconnection, and contact technologies.
Notes: Includes bibliographical references.
Spine title: Reliability of semiconductor devices and interconnection and multilevel metallization, interconnection, and contact technologies.
"Held during the fall meeting of the Electrochemical Society, October 9 to 14, 1988"--Pref.