Proceedings of the 1997 1st Electronic Packaging Technology Conference
By: edited by Andrew A.O. Tay ; organised by IEEE CPMT Singapore Chapter ; technically co-sponsored by IEEE CPMT Society ; sponsored by Institute of Materials Research and Engineering, Institute of Microelectronics.
Contributors: Tay, Andrew A. O.; Components, Packaging & Manufacturing Technology Society. Singapore Chapter.
Publisher: Institute of Electrical and Electronics Engineers
Published: 1997
Place of publication: [New York]
Language: eng
Number of pages: 319
Subjects: Electronic packaging -- Congresses.
Notes: Includes bibliographical references.
"IEEE catalog no. 97TH8307"--Cover.