Application of CAE/CAD to electronic systems
Subtitle: presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia
By: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.].
Contributors: Agonafer, D.; American Society of Mechanical Engineers.  Electrical and Electronic Packaging Division.; International Mechanical Engineering Congress and Exposition (1996 : Atlanta, Ga.)
Series: EEP ;; vol. 18; EEP (Series) ;; vol. 18.
Publisher: American Society of Mechanical Engineers
Published: 1996
Place of publication: New York, N.Y
Language: eng
Number of pages: 123
Subjects: Electronic packaging -- Cooling -- Congresses.; Heat sinks (Electronics) -- Congresses.; CAD/CAM systems -- Congresses.; Computer-aided engineering -- Congresses.; Computer-aided design -- Congresses.
Notes: Includes bibliographical references and index.