Multichip modules and related technologies
Subtitle: MCM, TAB, and COB design
By: Gerald L. Ginsberg, Donald P. Schnorr.
Contributors: Schnorr, Donald P.
Series: Electronic packaging and interconnection series
Publisher: McGraw-Hill
Published: 1994
Place of publication: New York
Language: eng
Number of pages: 290
Subjects: Electronic packaging.; Multichip modules (Microelectronics) -- Design and construction.
Other titles: Multichip modules & related technologies.
Notes: Includes bibliographical references and index.
Cover title: Multichip modules & related technologies.