Thermal management concepts in microelectronic packaging
Subtitle: from component to system
By: Robert T. Howard, project coordinator ; editors: Stephen S. Furkay, Richard F. Kilburn, Gabriel Monti.
Contributors: Howard, Robert T.; Furkay, Stephen S.; Kilburn, Richard F.; Monti, Gabriel; International Society for Hybrid Microelectronics.
Publisher: International Society for Hybrid Microelectronics
Published: 1984
Place of publication: Silver Spring, Md
Language: eng
Number of pages: 362
Subjects: Microelectronic packaging; Electronic apparatus and appliances -- Temperature control; Thermal analysis
Notes: Includes bibliographies.