Prevalent single chip packages for integrated circuit packages
By: David Kellerman, project analyst.
Contributors: Business Communications Co.
Series: Business opportunity report ;; GB-195
Publisher: Business Communications Co.
Published: 1997
Place of publication: Norwalk, CT
Language: eng
Number of pages: 132
Subjects: Integrated circuits industry.; Multichip modules (Microelectronics); Microelectronic packaging.; Market surveys.