Simiconductor wafer bonding 9
Subtitle: science, technology, and applications.
By: editors, H. Baumgart ... [et al.].
Contributors: Baumgart, H.; Electrochemical Society. Electronics Division.
Series: ECS transactions -- vol.3, no.6
Publisher: The Electrochemical Society
Published: 2006
Place of publication: Pennington, N.J
Language: eng
Number of pages: 386
Subjects: Semiconductors -- Bonding -- Congresses.; Semiconductor wafers -- Congresses.; Microelectromechanical systems -- Design and construction -- Congresses.
Genres: Congresses.
Other titles: Simiconductor wafer bonding nine
Notes: Includes bibliographical references and index.