Chemical mechanical planarization VI
Subtitle: proceedings of the international symposium
By: editors, S. Seal ... [et al.].
Contributors: Seal, S.; Electrochemical Society. Electronics Division.; Electrochemical Society. Meeting
Series: Proceedings ;; v. 2003-21; Proceedings (Electrochemical Society) ;; v. 2003-21.
Publisher: Electrochemical Society
Published: 2003
Place of publication: Pennington, NJ
Language: eng
Number of pages: 358
Subjects: Microelectronics -- Materials -- Congresses.; Grinding and polishing -- Congresses.; Metals -- Pickling -- Congresses.; Integrated circuits -- Materials -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and indexes.
"... proceedings of the 6th International Symposium on Chemical Mechanical Planarization (CMP) in Integrated Circuit Device Manufacturing held at the 204th Meeting of the Electrochemical Society, in Orlando, Florida from October 12th to 17th, 2003"--Pref.
"Sponsoring division, Electronics."