Electronic Packaging Materials Science VII
Subtitle: Symposium Held November 29-December 3, 1993, Boston, Massachusetts, U.S.A. (Materials Research Society Symposium Proceedings, Vol 323)
Contributors: Peter Borgesen (Editor); Klavs F. Jensen (Editor); Rober A. Pollak (Editor)
Publisher: Materials Research Society
Published: June 1994
Language: eng
Format: Hardcover
Number of pages: 449
ISBN-13: 9781558992221
Subjects: Industrial Design - Packaging; Electronics - General; Technology; Technology & Industrial Arts; Science/Mathematics