Application of fracture mechanics in electronic packaging and materials
Subtitle: presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
By: sponsored by the Electrical and Electronic Packaging Division, ASME [and] the Materials Division, ASME ; edited by Tien Y. Wu ... [et al.].
Contributors: Wu, Tien Y.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.; American Society of Mechanical Engineers. Materials Division.; International Mechanical Engineering Congress and Exposition (1995 : San Francisco, Calif.)
Series: EEP ;; vol. 11; MD ;; vol. 64; EEP (Series) ;; v. 11.; MD (Series) ;; v. 64.
Publisher: American Society of Mechanical Engineers
Published: 1995
Place of publication: New York
Language: eng
Number of pages: 271
Subjects: Electronic packaging -- Congresses.; Fracture mechanics -- Congresses.
Notes: Includes bibliographical references and index.
Papers presented at a symposium held during the 1995 ASME International Mechancial Engineering Congress and Exposition.