Manufacturing Process and Materials Challenges in Microelectronic Packaging
Subtitle: Presented at the Winter Annual Meeting of the American Society of Mechanical ... December 1-6, 1991 (Amd (Series), V. 131.)
Contributors: William T. Chen (Editor); American Society of Mechanical Engineers. Applied Mechanics Division (Corporate Author); Peter A. Engel (Editor); W. E. Jahsman (Editor)
Publisher: Amer Society of Mechanical
Published: August 1991
Language: eng
Format: Paperback
Number of pages: 153
ISBN-13: 9780791808962
Subjects: Science/Mathematics; Microelectronic packaging; Congresses; Electronic packaging