Stress-induced phenomena in metallization
Subtitle: third international workshop, Palo Alto, CA June 1995
By: editors, Paul S. Ho ... [et al.].
Contributors: Ho, P. S.
Series: AIP conference proceedings -- 373.; AIP conference proceedings -- no. 373.
Publisher: AIP Press
Published: 1996
Place of publication: Woodbury, N.Y
Language: eng
Number of pages: 304
Subjects: Semiconductors -- Defects -- Congresses; Metallic films -- Congresses; Thin film devices -- Defects -- Congresses; Aluminum films -- Congresses
Genres: Congresses.
Notes: "DOE CONF-9506336"--T.p. verso.

Includes bibliographical references and index.
Table of contents: title: Analysis of stresses in passivated metal lines / U. Burges ... [et al.]; title: Investigation of stresses in passivated gold lines / R. Pollak ... [et al.]; title: Plastic deformation and stress-induced voiding in Al-Cu interconnects / D. Jawarani ... [et al.]; title: Stress relaxation and microstructural change in passivated Al(Cu) lines during isothermal annealing / I.-S. Yeo ... [et al.]; title: Electrical measurement of stress-induced void growth / T.D. Sullivan, D.P. Bouldin, and D.H. Yao; title: Stress generation in Al-Si-Cu metallization resulting from thermal cycling between -196[degrees]C and 250[degrees]C / F. Baldwin ... [et al.]; title: Stress concentration at W vias / J.R. Lloyd, J.B. Sauber, and J.A. Walls; title: Modeling electromigration in multi-level interconnects / D. Chidambarrao and M.M. Pelella; title: Stress and alloying effects in electromigration / M.A. Korhonen ... [et al.]; title: Electromigration-induced voiding mechanisms in metallizations / O. Kraft, M. Bauer, and E. Arzt; title: Initial void formation in bamboo Al-Cu(1%) two-level structure / P.-H. Wang ... [et al.]; title: Comparison of electromigration in submicron Al(Cu) and Cu thin film lines / C-K. Hu ... [et al.]; title: Effects of aluminum texture on electromigration lifetime / H. Toyoda ... [et al.]; title: The effect of test structure and stress condition on electromigration failure / H. Kawasaki ... [et al.]; title: Cu behaviors induced by aging and their effects on electromigration resistance on Al-Cu lines / T. Nogami and T. Nemoto; title: In-situ side-view observation of electromigration in layered Al lines by ultrahigh voltage transmission electron microscopy / H. Okabayashi ... [et al.]; title: Line length effects on lifetime measurements and resistance saturation during electromigration testing / R.G. Filippi, G.A. Biery, and R.A. Wachnik; title: Dependence of electromigration failure modes on EM-induced and thermally-induced mechanical stress in interconnect lines / S. Pramanick ... [et al.]; title: Resistance oscillations induced by DC electromigration / S. Shingubara ... [et al.]; title: Void, Si nodule and current observations by optical beam heating and current change measurement / K. Nikawa and S. Inoue; title: Interface diffusion and electromigration failure in narrow aluminum lines with barrier layers / R.A. Augur, F. Van den Elshout, and R.A.M. Wolters; title: Highly electromigration-resistive via structure using Al-reflow for multi-level interconnection / I.S. Park.