Practical guide to the packaging of electronics
Subtitle: thermal and mechanical design and analysis
By: Ali Jamnia
Series: Mechanical engineering -- 146; Mechanical engineering (Marcel Dekker, Inc.) -- 146
Publisher: Marcel Dekker
Published: 2003
Place of publication: New York
Language: eng
Number of pages: 202
Subjects: Electronic packaging
Notes: Includes bibliographical references (p. 198-199) and index