Comparison of convective and resistive thermal cycling of circuit board vias.
Published: 2006
Language: eng
Number of pages: 64
ISBN-13: 9780494163672
Description: An experiment was conducted to compare two methods of accelerated reliability testing of plated through vias (PTV), Interconnect Stress Testing (IST) and Accelerated Thermal Cycling (ATC), to see if the two tests produce the same reliability results for the same set of samples. Statistical and finite element analyses of the test data led to the conclusion that both IST and ATC produce the same results for high aspect ratio PTVs in circuit boards constructed with one of three different laminate materials. Cross-sections of samples from ATC and IST also conclude that the failure modes were consistent between the two test methods.
Notes: Source: Masters Abstracts International, Volume: 44-06, page: 2973.

Thesis (M.A.Sc.)--University of Toronto, 2006.

Electronic version licensed for access by U. of T. users.

ROBARTS MICROTEXT copy on microfiche.