Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
Subtitle: Materials, Processes, Equipment, and Reliability
Publisher: Springer
Published: Jan 29, 2019
Format: hardcover
Number of pages: 279
ISBN-13: 9783319992556
Notes: Source title: Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability