Modeling and simulation for microelectronic packaging assembly
Subtitle: manufacture, reliability, and testing
By: Sheng Liu, Yong Liu
Contributors: Liu, Yong, 1962-
Publisher: Wiley
Published: 2011
Place of publication: Hoboken, N.J
Language: eng
ISBN-13: 9780470827802
Subjects: Simulation methods; TECHNOLOGY & ENGINEERING / Electronics / Circuits / General; Microelectronic packaging
Description: "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
Notes: Includes bibliographical references and index.