Proceedings of 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06)
Subtitle: June 27th-June 30 2006 : Shanghai University, Shanghai, China
By: organized by IEEE ... [et al.].
Contributors: Institute of Electrical and Electronics Engineers.; Components, Packaging & Manufacturing Technology Society.
Publisher: IEEE
Published: 2006
Place of publication: Piscataway, NJ
Language: eng
Number of pages: 328
Subjects: Integrated circuits -- Design and construction -- Congresses.; Electronic packaging -- Congresses.; Microelectromechanical systems -- Congresses.
Genres: Congresses.
Other titles: 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06); Proceedings, HDP '06
Notes: "IEEE catalog number 06EX1427"--T.p. verso.

Includes bibliographical references and index.