Manufacturing aspects in electronic packaging
Subtitle: presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992
By: sponsored by the Electrical and Electronic Packaging Division and the Production Engineering Division, ASME ; edited by Y.C. Lee, T.J. Bennett.
Contributors: Lee, Yung-Cheng.; Bennett, T. J.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.; American Society of Mechanical Engineers. Production Engineering Division.; American Society of Mechanical Engineers. Winter Meeting
Series: EEP ;; vol. 2; PED ;; vol. 60; EEP (Series) ;; vol. 2.; PED (Series) ;; vol. 60.
Publisher: The Society
Published: 1992
Place of publication: New York
Language: eng
Number of pages: 211
Subjects: Electronic packaging -- Congresses.; Manufacturing processes -- Congresses.
Notes: Includes bibliographical references and index.