1998 International Conference on Multichip Modules and High Density Packaging
Publisher: Institute of Electrical & Electronics Enginee
Published: April 1998
Language: eng
Format: Paperback
Number of pages: 562
ISBN-13: 9780780348509
Subjects: Electronics engineering; Printing & reprographic technology; Science/Mathematics; Technology; Technology & Industrial Arts; Electronics - Circuits - Integrated; Engineering - Electrical & Electronic; Manufacturing