Silicon Wafer Bonding Technology for Vlsi and Mems Applications (Emis Processing Series, 1)
Contributors: Subramanian S. Iyer (Editor); Andre J. Auberton-Herve (Editor)
Publisher: INSPEC, Inc.
Published: May 15, 2002
Language: eng
Format: Hardcover
Number of pages: 200
ISBN-13: 9780852960394
Subjects: Semi-conductors & super-conductors; Technology; Material Science; Technology & Industrial Arts; Science/Mathematics; Electronics - Circuits - VLSI; Engineering - Electrical & Electronic; Teaching Methods & Materials - Science & Technology
First sentence: Wafer direct bonding refers to the phenomenon that mirror-polished, flat and clean wafers, when brought into contact, bond to each other at room temperature without the use of adhesives or external forces.