Heat transfer in electronics, 1989
Subtitle: presented at the 1989 National Heat Transfer Conference, Philadelphia, Pennsylvania, August 6-9, 1989
By: sponsored by the Heat Transfer Division ; edited by R.K. Shah.
Contributors: Shah, R. K.; American Society of Mechanical Engineers. Heat Transfer Division.
Series: HTD ;; vol. 111; HTD (Series) ;; v. 111.
Publisher: American Society of Mechanical Engineers
Published: 1989
Place of publication: New York, N.Y
Language: eng
Number of pages: 190
Subjects: Electronic apparatus and appliances -- Cooling -- Congresses.; Heat -- Convection -- Congresses.; Heat -- Transmission -- Congresses.
Notes: Includes bibliographical references.