Hybrid assemblies and multichip modules
By: Fred W. Kear.
Series: Manufacturing engineering and materials processing ;; 38
Publisher: M. Dekker
Published: 1993
Place of publication: New York
Language: eng
Number of pages: 278
Subjects: Hybrid integrated circuits -- Design and construction.; Multichip modules (Microelectronics) -- Design and construction.
Notes: Includes bibliographical references (p. 265-267) and index.