I-Therm '88
Subtitle: May 11-13, 1988, the Biltmore Hotel, Los Angeles, CA, USA
By: InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components.
Contributors: IEEE Components, Hybrids, and Manufacturing Technology Society.
Publisher: IEEE; IEEE Service Center [distributor]
Published: 1988
Place of publication: New York, NY, U.S.A; Piscataway, NJ
Language: eng
Number of pages: 194
Subjects: Electronic apparatus and appliances -- Thermal properties -- Congresses.
Other titles: Proceedings 1988.
Notes: Includes bibliographies.
Cover title: Proceedings 1988.
Principal conference sponsor: Components, Hybrids, & Manufacturing Technology Society.
"IEEE catalog number 88CH2590-8"--T.p. verso.