Advanced MEMS packaging
By: John H. Lau ... [et al.].
Contributors: Lau, John H.
Publisher: McGraw-Hill; McGraw-Hill Education; McGraw Hill
Published: 2010
Place of publication: New York
Language: eng
Number of pages: 576
ISBN-13: 9780071626231
Subjects: Microelectromechanical systems; Microelectronic packaging