Thermal conductivity 33
Subtitle: thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA
By: Heng Ban [editor]
Contributors: Ban, Heng, editor; International Thermal Expansion Symposium (21st : 2017 : Logan, Utah)
Publisher: DEStech Publications
Published: 2018
Place of publication: Lancaster, PA
Language: eng
Number of pages: 265
ISBN-13: 9781605955353
Subjects: Heat; Congresses; Conduction; Measurement; Methodology; Materials; Thermal properties; Expansion (Heat)
Notes: Includes bibliographical references and author index.