Fatigue life prediction of solder joints in electronic packages with ANSYS
By: Erdogan Madenci, Ibrahim Guven, Bahattin Kilic.
Contributors: Guven, Ibrahim.; Kilic, Bahattin.
Series: Kluwer international series in engineering and computer science ;; SECS 719
Publisher: Kluwer Academic Publishers
Published: 2002
Place of publication: Boston, Mass
Language: eng
Number of pages: 185
Subjects: Electronic packaging -- Computer-aided design; Solder and soldering -- Quality control; Metals -- Fatigue; Service life (Engineering) -- Forecasting; ANSYS (Computer system)
Notes: Includes bibliographical references and index.