Packaging world--changing scenario
Subtitle: technical papers presented at the World Packaging Congress, January 8-10, 1987, New Delhi.
Contributors: Indian Institute of Packaging.; World Packaging Organisation.
Publisher: Indian Institute of Packaging
Published: 1987
Place of publication: Bombay
Language: eng
Subjects: Packaging -- Congresses.; Packaging -- Technological innovations -- Congresses.
Notes: "Indian Institute of Packaging under the auspices of World Packaging Organisation"--Cover.