Proceedings of the Sustainable Building Envelope Materials Symposium
Subtitle: Washington, D.C., November 19, 1997
By: sponsored by Building Environment and Thermal Envelope Council (BETEC).
Contributors: Building Environment and Thermal Envelope Council.
Publisher: Sustainable Development International Corp.; Obtained from National Institute of Building Sciences
Published: 1997
Place of publication: Olney, MD; Washington, D.C
Language: eng
Number of pages: 100
Subjects: Sustainable architecture -- Congresses; Building materials -- Environmental aspects -- Congresses
Genres: Congresses.
Notes: Includes bibliographical references.