Adhesives in micromechanical sensor packaging
By: Outi Rusanen.
Contributors: Valtion teknillinen tutkimuskeskus.
Series: VTT publications -- 407.; VTT julkaisuja -- 407.
Publisher: Technical Research Centre of Finland
Published: 2000
Place of publication: Espoo [Finland]
Language: eng
Subjects: Adhesives.; Microelectronic packaging.
Notes: Thesis (doctoral) -- University of Oulu, 2000.

Includes bibliographical references.