International conference on wafer scale integration
Subtitle: proceedings, San Francisco, California, USA
By: sponosreseored by IEEE Computer Society, IEEE Components, Hybrids, and Manufacuturing Technology Society ; edited by Vijay K. Jain and  Peter W. Wyatt.
Publisher: IEEE Computer Society Press
Published: 1992
Place of publication: Los Alamitos, Calif
Language: eng
Number of pages: 364
Notes: PRIORITY 2.