Design, characterization, and packaging for MEMS and microelectronics II
Subtitle: 17-19 December, 2001, Adelaide, Australia
By: Paul D. Frnazon, chair/editor ; sponsored and published by SPIE--the International Society for Optical Engineering ; cosponsored by U.S. Air Force Office of Scientific Research, Asian Office of Aerospace Research and Development ... [et al.] ; cooperating organization IEEE South Australia Section.
Contributors: Franzon, Paul D.; Society of Photo-optical Instrumentation Engineers.; United States. Air Force. Asian Office of Aerospace Research and Development; Institute of Electrical and Electronics Engineers. South Australia Section.
Series: Proceedings of SPIE ;; v. 4593; Proceedings of SPIE--the International Society for Optical Engineering ;; v. 4593.
Publisher: SPIE
Published: 2001
Place of publication: Bellingham, Wash
Language: eng
Number of pages: 322
Subjects: Microelectromechanical systems -- Design and construction -- Congresses.; Microelectronic packaging -- Congresses.
Genres: Congresses.
Notes: Includes bibliographic references and author index.