Finite element modeling of an avionics leadless chip carrier assembly
By: by Wei-Hua Ko.
Series: Master's theses (State University of New York at Binghamton) -- no. 2053
Published: 1994
Language: eng
Number of pages: 88
Subjects: Surface mount technology.
Notes: Thesis (M.A.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, 1994.

Includes bibliographical references (leaves 85-88).