Foldable flex and thinned silicon multichip packaging technology
By: edited by John W. Balde.
Contributors: Balde, John W., 1923-
Series: Emerging technology in advanced packaging series -- 1.
Publisher: Kluwer Academic Publishers
Published: 2003
Place of publication: Boston
Language: eng
Number of pages: 338
Subjects: Microelectronic packaging; Multichip modules (Microelectronics); Chip scale packaging; Flexible printed circuits
Notes: "A publication by Kluwer for IMAPS (International Microelectronic and Packaging Society)".

Includes bibliographical references and index.