Materials developments in microelectronic packaging
Subtitle: performance and reliability : proceedings of the fourth Electronic Materials and Processing Congress
By: sponsored by the Electronic Materials and Processing Division of ASM International ; edited by Prabjit Singh.
Contributors: Singh, Prabjit.; ASM International. Electronic Materials and Processing Division.
Publisher: ASM International
Published: 1991
Place of publication: Materials Park, Ohio
Language: eng
Number of pages: 403
Subjects: Microelectronic packaging -- Materials -- Testing -- Congresses.
Notes: Includes bibliographical references.