Reliability and yield problems of wire bonding in microelectronics
Subtitle: the application of materials and interface science
By: by George G. Harman.
Contributors: International Society for Hybrid Microelectronics.
Publisher: International Society for Hybrid Microelectronics; Intl Society of Hybrid
Published: 1989
Place of publication: Reston, Va
Language: eng
Number of pages: 202
Subjects: Wire bonding (Electronic packaging) -- Production control.; Electronic packaging -- Reliability.; Electronic packaging -- Defects.; Semiconductors -- Failure.
Notes: Includes bibliographical references.
"A technical monograph of the International Society for Hybrid Microelectronics"--Cover.