Benefiting from thermal and mechanical simulation in micro-electronics
By: edited by G.Q. Zhang, Philips CFT, Eindhoven, the Netherlands, L.J. Ernst, Delft University of Technology, Delft, the Netherlands, O. de Saint Leger, COMPETE Network co-ordinator at MTA, Paris, France
Contributors: Zhang, G. Q., editor; Ernst, L. J., editor; Saint Leger, O. de, editor
Published: 2000
Language: eng
Number of pages: 192
ISBN-13: 9781475731590; 9781441948731
Subjects: Simulation methods; Micromechanics; Congresses; Microelectronics
Description: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- <LIST type="5" The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation /LIST Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
Notes: Originally published: Boston, Mass.; London: Kluwer Academic, 2000.

Selected conference papers.

Includes bibliographical references.

Print version record.