Manufacturing challenges in electronic packaging
By: Y.C. Lee, W.T. Chen, [editors].
Contributors: Lee, Yung-Cheng.; Chen, William T.
Edition: 1st ed.
Publisher: Chapman & Hall
Published: 1998
Place of publication: London; New York
Language: eng
Number of pages: 261
Subjects: Electronic packaging; Manufacturing processes
Notes: Includes bibliographical references and index.