Bonding in Microsystem Technology
Edition: 1 edition
Publisher: Springer
Published: July 26, 2006
Language: eng
Format: Hardcover
Number of pages: 331
ISBN-13: 9781402045783
Subjects: Nanotechnology; Science/Mathematics; Technology; Technology & Industrial Arts; Electronics - Microelectronics; Engineering - Mechanical; Optics; Technology / Engineering / Mechanical; bonding/anodic bonding; deep micromachining; microengineering; silicon; Electronics - General; Micromachining; Microtechnology
Notes: Springer Series in Advanced Microelectronics