Numerical simulation of convection in electronic equipment cooling
Subtitle: presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, San Francisco, California, December 10-15, 1989
By: sponsored by the Heat Transfer Division, ASME ; edited by A. Ortega, D. Agonafer.
Contributors: Ortega, A. 1954-; Agonafer, D.; American Society of Mechanical Engineers. Heat Transfer Division.
Series: HTD ;; vol. 121; HTD (Series) ;; v. 121.
Publisher: The Society
Published: 1989
Place of publication: New York, N.Y
Language: eng
Number of pages: 72
Subjects: Electronic apparatus and appliances -- Cooling -- Congresses.; Heat -- Convection -- Congresses.
Notes: Includes bibliographical references.