Sensing, modeling, and simulation in emerging electronic packaging
Subtitle: presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia
By: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Chao-pin Yeh, Charles Ume.
Contributors: Ume, Charles.; Yeh, Chao-pin.; American Society of Mechanical Engineers.  Electrical and Electronic Packaging Division.; International Mechanical Engineering Congress and Exposition (1996 : Atlanta, Ga.)
Series: EEP ;; vol. 17; EEP (Series) ;; vol. 17.
Publisher: American Society of Mechanical Engineers
Published: 1996
Place of publication: New York, N.Y
Language: eng
Number of pages: 125
Subjects: Electronic packaging -- Congresses.; Multichip modules (Microelectronics) -- Congresses.
Notes: Includes bibliographical references and index.