Polymeric materials for electronics packaging and interconnection
By: John H. Lupinski, editor, Robert S. Moore, editor.
Contributors: Lupinski, John H., 1927-; Moore, Robert S., 1933-; American Chemical Society. Division of Polymeric Materials: Science and Engineering.; American Chemical Society. Division of Polymer Chemistry.; American Chemical Society. Meeting
Series: ACS symposium series ;; 407
Publisher: American Chemical Society
Published: 1989
Place of publication: Washington, DC
Language: eng
Number of pages: 499
Subjects: Electronic packaging -- Materials -- Congresses.; Polymers -- Congresses.
Notes: Includes bibliographical references.
"Developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988."