Mechanical design of electronic sytems
By: James W. Dally, Pradeep Lall, Jeffrey C. Suhling.
Contributors: Lall, Pradeep.; Suhling, J. C.
Publisher: College House Enterprises
Published: 2008
Place of publication: Knoxville, Tenn
Language: eng
Number of pages: 648
ISBN-13: 9780976241331
Subjects: Electronic packaging; Electronic systems -- Design and construction
Notes: Includes bibliographic references and index.
Table of contents: title: Electronic components and semiconductors services.; title: Circuit analysis.; title: First level packaging: the chip carrier.; title: Second level packaging: substrates and printed circuit boards.; title: Production of printed circuit boards.; title: Electronics manufacturing: chip carrier to substrate.; title: Third level packaging: connectors, cables, modules, card cages and cabinet.; title: Thermal analysis methods: conduction.; title: Thermal analysis methods: radiation and convection.; title: Stress and failure: analysis of mechanical components.; title: Thermo-mechanical analysis.; title: Analysis of vibration of electronic equipment.; title: Theory of reliability.; title: Design to improve reliability.