Thermo-mechanical characterization of evolving packaging materials and structures
Subtitle: presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California
By: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh.
Contributors: Liu, S. 1963-; Qian, Zhengfang.; Yeh, Chao-pin.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.; International Mechanical Engineering Congress and Exposition (1998 : Anaheim, Calif.); ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures (1998 : Anaheim, Calif.)
Series: EEP ;; vol. 24; EEP (Series) ;; vol. 24.
Publisher: American Society of Mechanical Engineers
Published: 1998
Place of publication: New York, N.Y
Language: eng
Number of pages: 141
Subjects: Electronic packaging -- Testing -- Congresses.; Electronic packaging -- Materials -- Fatigue -- Congresses.; Thermal stresses -- Congresses.; Deformations (Mechanics) -- Congresses.
Genres: Congresses.
Other titles: Characterization of evolving packaging materials and structures; Evolving packaging materials and structures; Packaging materials and structures
Notes: Includes bibliographical references and author index.
"Papers presented at the annual ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures"--Foreword.