Electronic packaging.
Contributors: Society of Automotive Engineers.; SAE International Congress & Exposition (1998 : Detroit, Mich.)
Publisher: Society of Automotive Engineers
Published: 1998
Place of publication: Warrendale, A
Language: eng
Number of pages: 81
Subjects: Electronic packaging -- Congresses.
Notes: "SP-1345".

"SAE/SP-98/1338".

Includes bibliographical references.