Microelectronics packaging handbook
By: edited by Rao R. Tummala, Eugene J. Rymaszewski.
Contributors: Tummala, Rao R., 1942-; Rymaszewski, Eugene J.
Publisher: Van Nostrand Reinhold
Published: 1989
Place of publication: New York, N.Y
Language: eng
Number of pages: 1194
Subjects: Microelectronic packaging -- Handbooks, manuals, etc.
Notes: Includes bibliographies and index.