Lead-free solder interconnect reliability
By: edited by Dongkai Shangguan.
Contributors: Shangguan, Dongkai, 1963-
Publisher: ASM International
Published: 2005
Place of publication: Materials Park, OH
Language: eng
Subjects: Microelectronic packaging -- Reliability.; Solder and soldering.; Lead-free electronics manufacturing processes.
Notes: Includes bibliographical references and index.