Proceedings, 2002 International Conference on Advanced Packaging and Systems
Subtitle: March 10-13, 2002, Reno Hilton Hotel, Reno, Nevada
By: sponsored by IMAPS.
Contributors: International Microelectronics and Packaging Society.; Society of Photo-optical Instrumentation Engineers.
Series: SPIE -- v. 4828; Proceedings of SPIE--the International Society for Optical Engineering -- v. 4828.
Publisher: IMAPS
Published: 2002
Place of publication: Washington, D.C
Language: eng
Number of pages: 274
Subjects: Electronic packaging -- Congresses.
Genres: Congresses.
Other titles: 2002 International Conference on Advanced Packaging and Systems; ICAPS 2002; 2002 Proceedings, International Conference on Advanced Packaging and Systems
Notes: "Published in cooperation with SPIE"--Cover.

Includes bibliographical references and index.