Probability and statistics for engineers and scientists
Edition: 4th ed.
Publisher: Brooks/Cole
Published: 2012
Place of publication: Boston
Language: eng
Number of pages: 826
ISBN-13: 9781111827045
Table of contents: title: Machine generated contents note: 1.1.Probabilities; title: 1.2.Events; title: 1.3.Combinations of Events; title: 1.4.Conditional Probability; title: 1.5.Probabilities of Event Intersections; title: 1.6.Posterior Probabilities; title: 1.7.Counting Techniques; title: 1.8.Case Study: Microelectronic Solder Joints; title: 1.9.Case Study: Internet Marketing; title: 1.10.Supplementary Problems; title: 2.1.Discrete Random Variables; title: 2.2.Continuous Random Variables; title: 2.3.The Expectation of a Random Variable; title: 2.4.The Variance of a Random Variable; title: 2.5.Jointly Distributed Random Variables; title: 2.6.Combinations and Functions of Random Variables; title: 2.7.Case Study: Microelectronic Solder Joints; title: 2.8.Case Study: Internet Marketing; title: 2.9.Supplementary Problems; title: 3.1.The Binomial Distribution; title: 3.2.The Geometric and Negative Binomial Distributions; title: 3.3.The Hypergeometric Distribution; title: 3.4.The Poisson Distribution; title: 3.5.The Multinomial Distribution; title: 3.6.Case Study: Microelectronic Solder Joints; title: 3.7.Case Study: Internet Marketing; title: 3.8.Supplementary Problems; title: 4.1.The Uniform Distribution; title: 4.2.The Exponential Distribution; title: 4.3.The Gamma Distribution; title: 4.4.The Weibull Distribution; title: 4.5.The Beta Distribution; title: 4.6.Case Study: Microelectronic Solder Joints; title: 4.7.Case Study: Internet Marketing; title: 4.8.Supplementary Problems; title: 5.1.Probability Calculations Using the Normal Distribution; title: 5.2.Linear Combinations of Normal Random Variables; title: 5.3.Approximating Distributions with the Normal Distribution; title: 5.4.Distributions Related to the Normal Distribution; title: 5.5.Case Study: Microelectronic Solder Joints; title: 5.6.Case Study: Internet Marketing; title: 5.7.Supplementary Problems; title: 6.1.Experimentation; title: 6.2.Data Presentation; title: 6.3.Sample Statistics; title: 6.4.Examples; title: 6.5.Case Study: Microelectronic Solder Joints; title: 6.6.Case Study: Internet Marketing; title: 6.7.Supplementary Problems; title: 7.1.Point Estimates; title: 7.2.Properties of Point Estimates; title: 7.3.Sampling Distributions; title: 7.4.Constructing Parameter Esti.