Advances in electronic packaging--2005
Subtitle: presented at 2005 ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems : July 17-22, 2005, San Francisco, California, USA
By: sponsored by  Electronic and Photonic Packaging Division, ASME.
Contributors: American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.; ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2005 : San Francisco, Calif.)
Publisher: American Society of Mechanical Engineers
Published: 2005
Place of publication: New York, N.Y
Language: eng
Subjects: Electronic packaging -- Congresses.
Genres: Congresses.
Other titles: Integration and Packaging of MEMS, NEMS, and electronic systems; InterPACK'05
Notes: At head of title: Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.

" ... InterPACK'05 ..."--P. iii.

Includes bibliographical references and author index.