Ball grid array & fine pitch peripheral interconnections
Subtitle: a handbook of the technology & applications for microelectronics/electronics manufacturing
By: by Jennie S. Hwang.
Publisher: Electrochemical Publications Ltd
Published: 1995
Place of publication: Isle of Man [England]
Language: eng
Number of pages: 241
Subjects: Electronic packaging.; Microelectronic packaging.; Solder and soldering.; Multichip modules (Microelectronics)
Other titles: Ball grid array and fine pitch peripheral interconnections
Notes: Includes bibliographical references and index.