Electronic Packaging Materials Science III (Materials Research Society Symposium Proceedings, Vol 108)
Contributors: Robert C. Sundahl (Editor)
Publisher: Materials Research Society
Published: April 1988
Language: eng
Format: Hardcover
ISBN-13: 9780931837760
Subjects: Technology & Industrial Arts; Materials; Electronic Engineering (Specific Aspects); Materials For Engineering; Electronics - General; Congresses; Electronic packaging