Electrodeposition of copper-cadmium and copper-indium alloys from aqueous solutions
By: by Khalaq Saiful Alim
Publisher: s.n.]
Published: 1987
Place of publication: [s.l
Language: eng
Number of pages: 140
Description: Copper-cadmium and copper-indium electrodeposition from aqueous solution was investigated.  The percent copper in Cu-Cd deposits positively correlated with the amount of copper in the bath, pH, and stirring.  DTPA and current density increases initially decreased the percent copper and then caused it to increase.  The percent copper in Cu-In alloys decreased with increased current density and concentration of cyanide.  PH, temperature, and agitation increased the percent copper in Cu-In alloys.
Notes: Thesis (M.Sc.)--Laurentian University of Sudbury, 1987

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