Interconnect Technology and Design for Gigascale Integration
By: edited by Jeff Davis, James D. Meindl
Contributors: Meindl, James D.
Publisher: Springer US
Published: 2003
Place of publication: Boston, MA
Language: eng
Format: [electronic resource] /
Number of pages: 411
ISBN-13: 9781461350880; 9781461504610
Subjects: Systems engineering; Engineering; Computer-aided design; Computer engineering
Description: Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications of the semiconductor industry's next substantial milestone - gigascale integration.
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