Roles of Ti-intermetallic compound layer(s) on the electromigration resistance of Al-Cu interconnecting stripes
By: Chii-Chang Lee
Published: 1991
Language: eng
Number of pages: 154
Notes: "92-9852."

Thesis (D. Eng. Sci.)--Columbia University, 1991.

Includes bibliographical references.

Microfilm. Ann Arbor, Mich. : University Microfilms International, 1992. 1 microfilm reel ; 35 mm.