Temperature/fluid measurements in electronic equipment
Subtitle: presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Boston, Massachusetts, December 13-18, 1987
By: sponsored by the Heat Transfer Division, ASME ; edited by J. Bartoszek ... [et al.].
Contributors: Bartoszek, J.; American Society of Mechanical Engineers. Heat Transfer Division.
Series: HTD ;; vol. 89; HTD (Series) ;; v. 89.
Publisher: ASME
Published: 1987
Place of publication: New York, N.Y. (345 E. 47th St., New York 10017)
Language: eng
Number of pages: 52
Subjects: Electronic apparatus and appliances -- Thermal properties -- Congresses.
Notes: Includes bibliographies.