Multichip modules
Subtitle: international conference and exhibition : 14-16 April 1993, Denver, Colorado
By: sponsored by ISHM--the Microelectronics Society, the International Electronics Packaging Society ; in cooperation with IEEE/Components, Hybrids, and Materials Technology Section, IPC--the Institute for Interconnecting and Packaging Electronic Circuits ; endorsed by EIA--Electronic Industrial Association.
Contributors: International Society for Hybrid Microelectronics.; International Electronics Packaging Society.; IEEE Components, Hybrids, and Materials Technology Section.; Institute for Interconnecting and Packaging Electronic Circuits (Evanston, Ill.)
Series: SPIE proceedings series -- v. 1986; Proceedings of SPIE--the International Society for Optical Engineering -- v. 1986.
Publisher: Published by ISHM and IEPS in cooperation with SPIE--the International Society for Optical Engineering
Published: 1993
Place of publication: Bellingham, Wash., USA
Language: eng
Number of pages: 586
Subjects: Multichip modules (Microelectronics) -- Congresses.; Electronic packaging -- Congresses.; Microelectronic packaging -- Congresses.
Notes: Papers from the Second International Conference and Exhibition on Multichip Modules.

Includes bibliographical references and index.