Materials, integration and packaging issues for high-frequency devices
Subtitle: symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A.
By: editors, P. Muralt ... [et al.].
Contributors: Muralt, P.; Materials Research Society.; Materials Research Society. Meeting; Symposium on Materials, Integration and Packaging Issues for High-Frequency Devices (2003 : Boston, Mass.)
Series: Materials Research Society symposium proceedings ;; v. 783; Materials Research Society symposia proceedings ;; v. 783.
Publisher: Materials Research Society
Published: 2004
Place of publication: Warrendale, Pa
Language: eng
Number of pages: 232
Subjects: Electronic packaging -- Materials -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and indexes.
"This volume is a collection of half of the papers given at Symposium B, the first MRS symposium on 'Materials, Integration and Packaging Issues for High-Frequency Devices,' held December 1-3 at the 2003 MRS Fall Meeting in Boston, Massachusetts."--P. xi.