Proceedings of the 7th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
Subtitle: EURoSimE 2006, Grand Hotel di Como, Como, Italy, April 24-25-26, 2006
By: edited by L.J. Ernst ... [et al.].
Contributors: Ernst, L. J.
Publisher: IEEE
Published: 2006
Place of publication: Piscataway, NJ
Language: eng
Number of pages: 774
Other titles: Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems; EuroSimE 2006