8th International Advanced Packaging Materials Symposium
Subtitle: 2002 proceedings, March 3-6, 2002, Stone Mountain, GA, USA
By: sponsors, IEEE Components, Packaging, and Manufacturing Technology [and] Packaging Research Center at Georgia Tech (USA)
Contributors: Components, Packaging & Manufacturing Technology Society.; Georgia Institute of Technology. Packaging Research Center.
Publisher: IEEE
Published: 2002
Place of publication: New York City, NY
Language: eng
Number of pages: 379
Subjects: Electronic packaging -- Materials -- Congresses
Genres: Congresses.
Other titles: 2002 8th International Advanced Packaging Materials Symposium.; Eightth International Advanced Packaging Materials Symposium.
Notes: Includes bibliographical references.

Also available via the World Wide Web with additional title: Advanced packaging materials, 2002, proceedings, 2002 8th International Symposium on.