Cooling and thermal design of electronic systems
Subtitle: presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
By: sponsored by the Heat Transfer Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Cristina H. Amon ... [et al.].
Contributors: Amon, Cristina H.; American Society of Mechanical Engineers. Heat Transfer Division.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.; International Mechanical Engineering Congress and Exposition (1995 : San Francisco, Calif.)
Series: HTD ;; vol. 319; EEP ;; vol. 15; HTD (Series) ;; v. 319.; EEP (Series) ;; vol. 15.
Publisher: American Society of Mechanical Engineers
Published: 1995
Place of publication: New York
Language: eng
Number of pages: 233
Subjects: Electronic systems -- Cooling -- Congresses.; Electronic apparatus and appliances -- Cooling -- Congresses.; Electronic apparatus and appliances -- Thermal properties -- Congresses.
Notes: Includes bibliographical references and index.