Materials, Integration and Packaging Issues for High-Frequency Devices II
Subtitle: Symposium Held November 29-December 1, 2004, Boston, Massachussetts, U.S.A.
Publisher: Materials Research Society
Published: January 2005
Language: eng
Format: Hardcover
Number of pages: 270
ISBN-13: 9781558997813
Subjects: Electronics - General; Technology & Industrial Arts