MEMS components and applications for industry, automobiles, aerospace, and communication
Subtitle: 22-23 October 2001, San Francisco, USA
By: Henry Helvajian, Siegfried W. Janson, Franz Lärmer, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering ; cosponsored by DARPA--Defense Advanced Research Projects Agency (USA) ; cooperating organizations, SEMI--Semiconductor Equipment and Materials International (USA) ... [et al.].
Contributors: Helvajian, Henry.; Janson, Siegfried W.; Lärmer, Franz.; Society of Photo-optical Instrumentation Engineers.; United States. Defense Advanced Research Projects Agency.; Semiconductor Equipment and Materials International.
Series: SPIE proceedings series ;; v. 4559; Proceedings of SPIE--the International Society for Optical Engineering ;; v. 4559.
Publisher: SPIE
Published: 2001
Place of publication: Bellingham, Wash
Language: eng
Number of pages: 190
Subjects: Microelectromechanical systems -- Design and construction -- Congresses.; Microelectromechanical systems -- Industrial applications -- Congresses.; Manufacturing processes -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and index.