Advanced wirebond interconnection technology
By: by Shankara K. Prasad.
Publisher: Kluwer Academic Publishers
Published: 2004
Place of publication: Boston
Language: eng
Number of pages: 668
Subjects: Wire bonding (Electronic packaging) -- Production control.; Electronic packaging -- Reliability.
Description: "Advanced Wirebond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as designating a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor, but the book also explains why to do it that way." "A CD-ROM is included, which contains 2D and 3D animations of many concepts that are discussed in this book. The animations with voice-overs help the reader grasp the ideas faster with visual experience, which leads to better retention."--BOOK JACKET.
Notes: Includes bibliographical references (p. [655]-660) and index.