Mems and microsystems
Subtitle: design, manufacture, and packaging
By: Tai-Ran Hsu.
Edition: 2nd ed.
Publisher: John Wiley
Published: 2008
Place of publication: Hoboken, NJ
Language: eng
ISBN-13: 9780470083017
Subjects: Microelectronics; Microelectromechanical systems; Microelectronic packaging
Notes: Includes bibliographical references and index.