New visions in electronic packaging in the 70's
Subtitle: 1970 Eastern Electronics Packaging Conference, June 8-9, Massachusetts Institute of Technology.
Contributors: Institute of Electrical and Electronics Engineers. Component Hybrid and Packaging Technologies Group.; Institute of Electrical and Electronics Engineers. Boston Section.
Publisher: Institute of Electrical and Electronics Engineers
Published: 1970
Place of publication: New York
Language: eng
Notes: Sponsored by the Component Hybrid and Packaging TechnologiesGroup and the Boston Section of the IEEE.