Advances in electronic packaging, 1999
Subtitle: proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference : InterPACK '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii
By: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Masumi Saka, Yung-Cheng Lee.
Contributors: Agonafer, D.; Saka, M.; Lee, Yung-Cheng.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
Series: EEP,; vol. 26; EEP (Series) ;; vol. 26.
Publisher: American Society of Mechanical Engineers
Published: 1999
Place of publication: New York, N.Y
Language: eng
Subjects: Electronic packaging -- Congresses.
Genres: Congresses.
Other titles: InterPACK '99
Notes: Includes bibliographic references and author index.