Assessing and characterizing inter- and intra-die variation using a statistical metrology framework
Subtitle: a CMP case study
By: R. Divecha ... [et al.].
Contributors: Divecha, R.; Hewlett-Packard Laboratories.
Series: HP Laboratories technical report -- HPL-96-78.
Publisher: Hewlett-Packard Laboratories, Technical Publications Dept.
Published: 1997
Place of publication: Palo Alto, Calif
Language: eng
Subjects: Statistics; Metals -- Pickling
Description: Abstract: "A statistical metrology methodology has ben developed and used to study the contributions to spatial variation in ILD thickness remaining after chemical-mechanical polishing.  New elements of statistical metrology are described, including a three-phase experimental approach and the use of a modified repeated measure analysis of variance technique."
Notes: "January, 1997."

Includes bibliographical references.

Supported in part by ARPA. N00174-93-C-0035.

Supported in part by AASERT. DAAHA04-95-1-0459.