Proceedings
By: 3rd International Symposium on Advanced Packaging Materials--processes, properties, and interfaces, Chateau Elan, Braselton, Georgia, March 9-12, 1997 ; co-sponsored by International Microelectronics and Packaging Society (IMAPS), IEEE Components, Packaging, and Manufacturing Technology Society, Georgia Institute of Technology, Packaging Research Center (PRC) ;  participating societies: American Society of Materials ... [et al.].
Contributors: International Microelectronics and Packaging Society.; Components, Packaging & Manufacturing Technology Society.; Georgia Institute of Technology. Packaging Research Center.; ASM International.
Publisher: Institute of Electrical and Electronics Engineers
Published: 1997
Place of publication: [New York]
Language: eng
Number of pages: 183
Subjects: Electronic packaging -- Materials -- Congresses.
Notes: Includes bibliographical references and index.