Advanced Electronic Packaging
Subtitle: With Emphasis on Multichip Modules (IEEE Press Series on Microelectronic Systems)
Publisher: Wiley-IEEE Press
Published: October 13, 1998
Language: eng
Format: Hardcover
Number of pages: 784
ISBN-13: 9780780347007
Subjects: Electronics engineering; Technology & Industrial Arts; Microelectronics; Technology; Science/Mathematics; Multichip modules (Microelectr; Electronics - General; Engineering - Electrical & Electronic; Industrial Design - Packaging; Technology / Electronics / Circuits / Integrated; Electronics - Microelectronics; Design and construction; Microelectronic packaging; Multichip modules (Microelectronics)