Design guidelines for surface mount and fine pitch technology
By: Vern Solberg.
Edition: 2nd ed.
Series: Electronic packaging & interconnection series; Electronic packaging and interconnection series.
Publisher: McGraw-Hill
Published: 1996
Place of publication: New York
Language: eng
Number of pages: 261
Subjects: Printed circuits -- Design and construction.; Surface mount technology.; Fine pitch technology.
Notes: Includes index.