Proceedings of the ASME InterPack Conference--2009
Subtitle: presented at 2009 ASME InterPack Conference : July 19-23, 2009, San Francisco, California, USA
By: sponsored by Electronic and Photonics Packaging Division, ASME
Contributors: Suhling, J. C. (Jeffrey C.); Ishizuka, Masaru; Tonapi, Sandeep Shrikant; American Society of Mechanical Engineers. Electronic and Photonic Packaging Division
Publisher: American Society of Mechanical Engineers
Published: 2009
Place of publication: New York
Language: eng
ISBN-13: 9780791843598; 9780791843604
Other titles: InterPACK '09; 2009 proceedings of the ASME InterPack Conference; IPACK2009; IPACK 2009; ASME InterPack Conference--2009; Integration and packaging of MEMS, NEMS, and electronic systems
Notes: "Jeffrey C. Suhling, general chair ... Masaru Ishizuka, co-general chair Far East ... Sandeep Tonapi, technical program chair"--P. iii.

Includes bibliographical references and index.
Table of contents: title: v. 1. Advanced packaging ; Electro-thermal-mechanical issues in packaging : multi-physics ; Manufacturing and test ; Materials and processes ; MEMS and MEMS packaging ; Natotechnology and NEMS ; Photonics and optics ; Reliability; title: v. 2. Modeling and simulation ; Thermal management (TM-1) : component level thermal management ; Thermal management (TM-II) : system level thermal management.