Copper interconnect technology
By: Christoph Steinbrüchel and Barry Chin.
Contributors: Chin, Barry.
Series: Tutorial texts in optical engineering -- v. TT46; Tutorial texts series
Publisher: SPIE Optical Engineering Press
Published: 2001
Place of publication: Bellingham, Wash
Language: eng
Number of pages: 122
Subjects: Electronic packaging.; Semiconductors -- Junctions.; Microelectronic packaging.; Copper.
Notes: Includes bibliographical references and index.