Materials Developments in Microelectronic Packaging: Performance and Reliability 
Subtitle: Proceedings of the Fourth Electronic Materials and Processing Con
Publisher: Asm Intl
Published: August 1991
Language: eng
Format: Hardcover
Number of pages: 378
ISBN-13: 9780871704351
Subjects: Testing; Science/Mathematics; Electrical Properties Of Materials; Electronic Engineering (Specific Aspects); Technology & Industrial Arts; Electronics - General; Circuits & components; Congresses; Materials; Microelectronic packaging