High performance design automation for multi-chip modules and packages
By: editor, Jun-Dong Cho ; co-editor, Paul D. Franzon.
Contributors: Cho, Jun-Dong; Franzon, Paul D.
Series: Selected topics in electronics and systems ;; vol. 5
Publisher: World Scientific
Published: 1996
Place of publication: Singapore; River Edge, NJ
Language: eng
Number of pages: 254
Subjects: Electronic packaging -- Design -- Data processing.; Multichip modules (Microelectronics) -- Design -- Data processing.; Computer-aided design.
Notes: Includes bibliographical references.