New generation components and their effect on PCBs
Subtitle: proceedings [of the EIPC winter conference], Münchener Messegelände, Bauzentrum, November 25, 1976
By: editor, M. G. Fassini.
Contributors: Fassini, M. G.
Series: Proceedings - European Institute of Printed Circuits ; 1976/2
Publisher: European Institute of Printed Circuits
Published: 1976
Place of publication: Zürich
Language: eng
Number of pages: 57
Subjects: Printed circuits -- Congresses.; Microelectronics -- Congresses.
Notes: Includes bibliographical references.
English or German.