Power Electronic Packaging
Subtitle: Design, Assembly Process, Reliability and Modeling
By: by Yong Liu
Contributors: SpringerLink (Online service)
Publisher: Springer US
Published: 2012
Place of publication: Boston, MA
Language: eng
Format: [electronic resource] :
ISBN-13: 9781461410539
Subjects: Systems engineering; Circuits and Systems; Spectroscopy and Microscopy; Instrumentation Electronics and Microelectronics; Solid state physics; Production of electric energy or power; Electrical Machines and Networks Power Electronics; Electronics; Engineering