Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Subtitle: Wafer-Level Transfer Packaging and Fabrication Techniques Using ...
Publisher: Springer
Published: Jan 05, 2019
Format: paperback
Number of pages: 123
ISBN-13: 9783030085612
Notes: Source title: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using ... (Springer Series in Advanced Manufacturing)