Interconnect and contact metallization for ULSI
Subtitle: proceedings of the international symposium
By: editors, G.S. Mathad, H.S. Rathore, Y. Arita ; [sponsored by] Dielectric Science and Technology, Electronics, and Electrodeposition Divisions.
Contributors: Mathad, G. S.; Rathore, Harzara S.; Arita, Y.
Series: Proceedings ;; 99-31; Proceedings (Electrochemical Society) ;; v. 99-31.
Publisher: Electrochemical Society
Published: 2000
Place of publication: Pennington, N.J
Language: eng
Number of pages: 340
Subjects: Integrated circuits -- Ultra large scale integration -- Design and construction -- Congresses.; Integrated circuits -- Ultra large scale integration -- Materials -- Congresses.; Electrochemical metallizing -- Congresses.; Plasma-enhanced chemical vapor deposition -- Congresses.; Electric contacts -- Congresses.; Electric conductivity -- Congresses.; Copper -- Congresses.; Dielectrics -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and indexes.
"Papers presented at the symposium ... held in Honolulu, HI, October 17-22, 1999 ..."--Pref.