High-density microvia substrates
Subtitle: markets, applications, and infrastructure
By: [authors, E. Jan Vardaman, Frank Bachner, and Doug Feicht ; graphics and production, Charles Kroger ; contributor, Linda Matthew]
Contributors: Bachner, Frank; Feicht, Doug; TechSearch International
Publisher: TechSearch International
Published: 1999
Place of publication: Austin, Tex
Language: eng
Subjects: Integrated circuits industry; Market surveys; Microelectronic packaging
Notes: Includes bibliographical references.