Proceedings
Subtitle: 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California
By: sponsored by IMAPS--International Microelectronics and Packaging Society [and] CMP Media.
Contributors: International Microelectronics and Packaging Society.; CMP Media.; Society of Photo-optical Instrumentation Engineers.
Series: SPIE proceedings series ;; v. 4428; Proceedings of SPIE--the International Society for Optical Engineering ;; v. 4428.
Publisher: IMAPS; Published in cooperation with SPIE
Published: 2001
Place of publication: Washington, DC; [Bellingham, Wash.]
Language: eng
Number of pages: 380
Subjects: Microelectronic packaging -- Congresses.; Integrated circuits -- Design and construction -- Congresses.; Microelectromechanical systems -- Congresses.
Genres: Congresses.
Other titles: 2001 HD International Conference on High-Density Interconnect and Systems Packaging; HD International Conference on High-Density Interconnect and Systems Packaging; International Conference on High-Density Interconnect and Systems Packaging; High-density interconnect and systems packaging; High density interconnect and systems packaging
Notes: Includes bibliographical references and index.