International Symposium on Advances in Interconnection and Packaging
Subtitle: 5-9 November 1990, Boston, Massachusetts
By: Alfred P. DeFonzo, symposium chair/general editor ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organizations, Components, Hybrids, and Manufacturing Technology Society of IEEE, Computer Society of IEEE.
Contributors: DeFonzo, Alfred P.; Society of Photo-optical Instrumentation Engineers.; IEEE Components, Hybrids, and Manufacturing Technology Society.; IEEE Computer Society.
Series: Proceedings / SPIE--the International Society for Optical Engineering ;; v. 1389-1390; Proceedings of SPIE--the International Society for Optical Engineering ;; v. 1389-1390.
Publisher: SPIE
Published: 1991
Place of publication: Bellingham, Wash., USA
Language: eng
Subjects: Microelectronic packaging -- Congresses.
Other titles: Advances in interconnection and packaging.
Notes: Includes bibliographical references and indexes.