Multichip modules
Subtitle: international conference and exhibition, 13-15 April 1994, Denver, Colorado
By: sponsored by ISHM--the Microelectronics Society ... [et al.] ; in cooperation with SEMI--Semiconductor Equipment and Materials International, IPC--the Institute for Interconnecting and Packaging Electronic Circuits.
Contributors: International Society for Hybrid Microelectronics.; Semiconductor Equipment and Materials International.; International Electronics Packing Society.; Institute for Interconnecting and Packaging Electronic Circuits (Evanston, Ill.); Society of Photo-optical Instrumentation Engineers.; International Conference and Exhibition on Multichip Modules (3rd : 1994 : Denver, Colo.)
Series: SPIE proceedings series ;; v. 2256; Proceedings of SPIE--the International Society for Optical Engineering ;; v. 2256.
Publisher: ISHM; International Electronics Packaging Society; Published in cooperation with SPIE--the International Society for Optical Engineering
Published: 1994
Place of publication: Reston, Va; Wheaton, Ill; [Belingham, Wash.]
Language: eng
Number of pages: 630
Subjects: Multichip modules (Microelectronics) -- Congresses.; Electronic packaging -- Congresses.; Microelectronic packaging -- Congresses.
Genres: Congresses.
Other titles: 1994 proceedings International Conference and Exhibition on Multichip Modules.
Notes: Includes bibliographical references and index.
"Third International Conference and Exhibition on Multichip Modules"--P. iii.
Spine title: 1994 proceedings International Conference and Exhibition on Multichip Modules.