Materials for high-density electronic packaging and interconnection
Subtitle: report of the Committee on Materials for High-Density Electronic Pakaging
By: National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
Contributors: National Research Council (U.S.). National Materials Advisory Board.
Series: NMAB -- 449; NMAB (Series) -- 449.
Publisher: National Academy Press; Available from Defense Technical Information Center, Cameron Station
Published: 1990
Place of publication: Washington, D.C; Alexandria, VA
Language: eng
Number of pages: 139
Subjects: Microelectronic packaging -- Materials.; Electronic packaging -- Materials.
Notes: "NMAB-449."

Includes bibliographical references