Novel three-dimensional vertical interconnect technology for microwave and RF applications
By: Kavita Goverdhanam, Rainee N. Simons, Linda P.B. Katehi.
Contributors: Simons, Rainee, 1949-; Katehi, Linda P. B.; NASA Glenn Research Center.
Series: NASA/TM -- 1999-209043.; NASA technical memorandum -- 209043.
Publisher: National Aeronautics and Space Administration, Glenn Research Center; National Technical Information Service, distributor
Published: 1999
Place of publication: [Cleveland, Ohio]; [Springfield, Va
Language: eng
Format: Microform
Subjects: Microwave circuits.; Integrated circuits.; Radio frequencies.
Other titles: Novel three dimensional vertical interconnect technology for microwave and RF applications.
Notes: Shipping list no.: 99-0729-M.

Microfiche. [Washington, D.C. : National Aeronautics and Space Administration, 1999] 1 microfiche.