Thermoviscoplastic model with application to copper
By: Alan D. Freed.
Contributors: United States. National Aeronautics and Space Administration. Scientific and Technical Information Division.
Series: NASA technical paper -- 2845.
Publisher: National Aeronautics and Space Administration, Scientific and Technical Information Division; For sale by the National Technical Information Service]
Published: 1989
Place of publication: [Washington, DC]; [Springfield, Va
Language: eng
Format: Microform
Subjects: Viscoplasticity.; Copper -- Creep.
Notes: Distributed to depository libraries in microfiche.

Microfiche. [Washington, D.C.? : National Aeronautics and Space Administration], 1989. 1 microfiche.