I-THERM III
Subtitle: February 3-5, 1992, Four Seasons Hotel, Austin, TX, USA
By: InterSociety Conference on Thermal Phenomena in Electronic Systems.
Contributors: IEEE Components, Hybrids, and Manufacturing Technology Society. Technical Committee on Thermal Management.
Publisher: Institute of Electrical and Electronics Engineers; Additional copies may be purchased from IEEE Service Center
Published: 1992
Place of publication: New York, NY; Piscataway, NJ
Language: eng
Number of pages: 292
Subjects: Electronic apparatus and appliances -- Thermal properties -- Congresses.
Other titles: Thermal engineering in integrated design systems.; I-THERM 3.; I-THERM Three.
Notes: "Theme: ʻThermal engineering in integrated design systemsʼ."

Principal conference sponsor: IEEE Components, Hybrids, & Manufacturing Technology Society (CHMT) Technical committee on Thermal Management TC-9.

"IEEE catalog number 92CH3096-5"--T.p. verso.

Includes bibliographical references.