2006 International SiGe Technology and Device Meeting
Subtitle: Princeton University, Princeton, NJ, USA, May 15th-May 17th, 2006
Contributors: Institute of Electrical and Electronics Engineers; American Vacuum Society
Publisher: IEEE
Published: 2006
Place of publication: Piscataway, N.J
Language: eng
Number of pages: 287
Subjects: Silicon alloys; Congresses; Germanium alloys; Semiconductors; Materials; Integrated circuits
Other titles: ISTDM 2006; Conference digest of the third International Silicon Germanium Technology and Device Meeting
Notes: "IEEE Cat. No. 06EX1419"--T.p. verso.

Includes bibliographical references.