System design using high density packaging and multi chip modules
By: Etienne Hirt.
Edition: 1. Aufl.
Series: Series in microelectronics -- v. 93
Publisher: Hartung-Gorre
Published: 2000
Place of publication: Konstanz
Language: eng
Number of pages: 188
Subjects: System design.; Microelectronic packaging.; Multichip modules (Microelectronics) -- Design and construction.
Notes: Originally presented as the author's thesis (doctoral)--Eidgenössische Techn. Hochsch., Zürich, 2000.

"Nachdruck der Diss. ETH No. 13604."

Includes bibliographical references.

Summary also in German.