Low-temperture solder for jointing large cryogenic structures
By: John D. Buckley and Paul G. Sandefur, Jr
Contributors: Sandefur, Paul G; United States. National Aeronautics and Space Administration. Scientific and Technical Information Branch; Langley Research Center (U.S.)
Series: NASA technical memorandum -- 81836
Publisher: National Aeronautics and Space Administration, Scientific and Technical Information Branch; For sale by the National Technical Information Service]
Published: 1980
Place of publication: Washington, D.C; [Springfield, Va
Language: eng
Number of pages: 12
Subjects: Solder and soldering; Low temperature engineering; Metals -- Effect of low temperatures on
Notes: "Langley Research Center."

Sept. 1980

Includes bibliographical references