Microelectronics packaging handbook
By: edited by Rao Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein. Part 1, Technology drivers.
Contributors: Tummala, Rao R., 1942-; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
Edition: 2nd ed.
Publisher: Chapman & Hall
Published: 1997
Place of publication: New York; London
Language: eng
Number of pages: 720
Subjects: Microelectronic packaging -- Handbooks, manuals, etc.