Electronic integrated circuits packaging
By: Joseph A. Castrovilla, project analyst.
Contributors: Business Communications Co.
Series: Business opportunity report ;; GB-083
Publisher: Business Communications Co.
Published: 1987
Place of publication: Norwalk, Conn., U.S.A
Language: eng
Number of pages: 175
Subjects: Integrated circuits industry -- United States.; Electronic packaging.; Market surveys -- United States.
Notes: "February 1987"--T.p. verso.