Printed circuit and multilayer boards
Subtitle: design and production. Significant techniques presented at NEPCON and INTERNEPCON conferences and in the Electronic packaging and production magazine.
Contributors: International Electronic Packaging and Production Conference; National Electronic Packaging and Production Conference
Publisher: M.S. Kiver
Published: 1972
Place of publication: Chicago
Language: eng
Number of pages: 183
Subjects: Printed circuits
Other titles: Electronic packaging and production