Physical Design for Multichip Modules
By: by M. Sriram, S.M. Kang
Contributors: Kang, S. M.
Series: The Springer International Series in Engineering and Computer Science -- 267; International series in engineering and computer science -- 267.
Publisher: Springer US
Published: 1994
Place of publication: Boston, MA
Language: eng
Format: [electronic resource] /
Number of pages: 197
ISBN-13: 9781461361534; 9781461526827
Subjects: Systems engineering; Engineering; Computer-aided design; Computer engineering
Notes: Online full text is restricted to subscribers.

Also available in print.

Mode of access: World Wide Web.