Materials & process integration for MEMS
By: edited by Francis E.H. Tay
Series: Microsystems -- volume 9; Microsystems (Series) -- v. 9.
Published: 2002
Language: eng
ISBN-13: 9781475757910; 9781441953032
Subjects: Microelectromechanical systems; Micromechanics; Microstructure
Description: This book provides the background, tools, and directions you need to confidently choose fabrication methods and materials for miniaturization problems (materials, processes, designs, characterisations and potential applications). MEMS technology and applications have grown at a tremendous pace, while structural dimensions have grown smaller and smaller, reaching down even to the molecular level. With this movement have come new types of applications and rapid advances in the technologies and techniques needed to fabricate the increasingly miniature devices that are literally changing our world. The development of micro-mechanical systems (MEMS) foreshadows momentous changes not only in the technology world, but in virtually every aspect of human life.
Notes: Print version record.
Table of contents: title: 1. Integration of Piezoelectric Pb (ZrxTi1?x)03 (PZT) Thin Films into Micromachined Sensors and Actuators; title: 2. Porous Silicon as a Sacrificial Layer in Production of Silicon Diaphragms by Precision Grinding; title: 3. GaAs Cantilever and Bridge Membrane-Like Structures Fully Compatible with AlGaAs/InGaAs/GaAs and InGaP/InGaAs/GaAs Based HFETs; title: 4. Magnetron Sputtered TiNiCu Shape Memory Alloy Thin Film for MEMS Applications; title: 5. Chemically Amplified Resist for Micromachining using X-Ray Lithography; title: 6. Self-Assembled Monolayers (SAM) for Tunneling Sensors; title: 7. Oxidation Process-Optimization for Large Area Silicon Fusion Bonded Devices and MEMS Structures; title: 8. Silicon Nanomachining by Scanning Probe Lithography and Anisotropie Wet Etching; title: 9. A Novel Bulk Micromachining Method in Gallium Arsenide; title: 10. Deep X-Ray Lithography for MEMS-Photoelectron Exposure of the Upper and Bottom Resist Layers; title: 11. Spray Coating Technology of Photoresist/Polymer for 3-D Patterning and Interconnect; title: 12. Uncooled Infrared Image Sensor of Dielectric Bolometer Mode using Ferroelectric BST Thin Film Prepared by Metal Organic Decomposition; title: 13. Tactical Grade MEMS Gyroscopes Fabricated by the SBM Process; title: 14. Plasma Etching Techniques to Form High-Aspect-Ratio MEMS Structures.