Electronic packaging
Subtitle: materials and processes to reduce package cycle time and improve reliability : proceedings of the 7th Electronic Materials and Processing Congress, 24-27 August 1992, Cambridge, Massachusetts, USA
By: sponsored by the Electronic Materials and Processing Division of ASM International.
Contributors: ASM International. Electronic Materials and Processing Division.
Publisher: ASM International; Asm Intl
Published: 1992
Place of publication: Materials Park, OH
Language: eng
Number of pages: 260
Subjects: Electronic packaging -- Congresses; Electronic packaging -- Materials -- Congresses; Microelectronic packaging -- Materials -- Congresses
Notes: Includes bibliographical refrences.