Area Array Packaging Processes
Subtitle: for BGA, Flip Chip, and CSP
Edition: 1 edition
Publisher: McGraw-Hill Professional
Published: October 23, 2003
Language: eng
Format: Hardcover
Number of pages: 259
ISBN-13: 9780071428293
Subjects: Electronics engineering; Reference works; Technology; Microelectronic packaging; Electronic Apparatus And Devices; Semiconductors; Technology & Industrial Arts; Science/Mathematics; Multichip modules (Microelectr; Electronics - Microelectronics; Engineering - Electrical & Electronic; Manufacturing; Technology / Electronics / Microelectronics; Electronics - General; Electronics - Semiconductors; Multichip modules (Microelectronics)
First sentence: One of the significant developments to improve cost, reliability, and productivity in the electronic packaging industry has been flip chip (FC) technology.