Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing
By: editors, S. Raghavan, R.L. Opila, L. Zhang ; Electronics and Dielectric Science and Technology Divisions [of the Electrochemical Society].
Contributors: Raghavan, S.; Opila, Robert Leon, 1953-; Zhang, L.; Electrochemical Society. Electronics Division.; Electrochemical Society. Dielectric Science and Technology Division.; Electrochemical Society. Meeting
Series: Proceedings / Electrochemical Society ;; v. 98-7; Proceedings (Electrochemical Society) ;; v. 98-7.
Publisher: Electrochemical Society
Published: 1998
Place of publication: Pennington, New Jersey
Language: eng
Number of pages: 273
Subjects: Microelectronics -- Materials -- Congresses.; Grinding and polishing -- Congresses.; Metals -- Pickling -- Congresses.; Semiconductors -- Surfaces -- Congresses.
Genres: Congresses.
Other titles: Chemical mechanical planarization in integrated circuit device manufacturing
Notes: Includes bibliographical references and indexes.
"Electronics and Dielectric Science and Technology Divisions."
"This volume contains most of the papers presented at the Second International Symposium on Chemical Mechanical Planarization (CMP) in Integrated Circuit (IC) Device Manufacturing held at the 193rd Annual Meeting of Electrochemical Society in San Diego during May 5-7, 1998."