Moisture sensitivity of plastic packages of IC devices
By: X.J. Fan, E. Suhir, editors ; foreword by C.P. Wong
Series: Micro- and opto-electronic materials, structures, and systems; Micro- and opto-electronic materials, structures, and systems
Publisher: Springer
Published: 2010
Place of publication: New York
Language: eng
Number of pages: 570
ISBN-13: 9781441957184; 9781441957191
Subjects: Materials; Plastics in packaging; Moisture; Integrated circuits; Electronic packaging
Other titles: Moisture sensitivity of plastic packages of integrated circuits devices
Notes: Includes bibliographical references and index.