Introduction to system-on-package (SOP)
Subtitle: miniaturization of the entire system
By: Rao R. Tummala, Madhavan Swaminathan.
Contributors: Swaminathan, Madhavan.
Publisher: McGraw-Hill
Published: 2008
Place of publication: New York
Language: eng
Number of pages: 785
ISBN-13: 9780071459068
Subjects: Multichip modules (Microelectronics) -- Design and construction; Microelectronic packaging
Notes: Includes bibliographical references and index.