Microelectronic packaging technology
Subtitle: materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989
By: edited by Wei T. Shieh ; sponsored by the Electronic Materials and Processing Division of ASM International.
Contributors: Shieh, Wei T.; ASM International. Electronic Materials and Processing Division.
Publisher: ASM International
Published: 1989
Place of publication: Metals Park, Ohio
Language: eng
Number of pages: 479
Subjects: Microelectronic packaging -- Congresses.; Microelectronics -- Materials -- Congresses.; Surface mount technology -- Congresses.
Other titles: Micro electronic packaging technology.
Notes: Includes bibliographies.
Cover title: Micro electronic packaging technology.
"SAN 204-7586"--T.p. verso.