Special Issue: 3rd International Conference on Engineering and Technology Innovation
Subtitle: (ICETI 2014) : held in Kenting, Taiwan Oct. 31-Nov. 2, 2014
Series: Microsystem technologies -- volume 23, number 2 (February 2017), volume 23, number 6 (June 2017); Microsystem technologies -- volume 23, number 2 (February 2017), volume 23, number 6 (June 2017)
Publisher: Heidelberg : Springer
Published: 2017
Place of publication: Berlin
Language: eng
Subjects: Mikrosystemtechnik
Other titles: Third International Conference on Engineering and Technology Innovation
Work titles: 3rd International Conference on Engineering and Technology Innovation