HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML
By: John Albers.
Contributors: National Institute of Standards and Technology (U.S.)
Series: Semiconductor measurement technology; NIST special publication ;; 400-96
Publisher: U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology; For sale by the Supt. of Docs., U.S. G.P.O.
Published: 1995
Place of publication: Gaithersburg, MD; Washington, DC
Language: eng
Number of pages: 87
Subjects: Semiconductors -- Thermal properties.; Thermal analysis -- Computer programs.; Fourier analysis -- Data processing.
Notes: Includes bibliographical references (p. 47-49).
"August 1995."