ICEPT 2006 proceedings
Subtitle: 7th International Conference on Electronics Packaging Technology : Shanghai, China, August 26 to 29, 2006
By: chairman, Keyun, Bi.
Contributors: Bi, Keyun.; Institute of Electrical and Electronics Engineers.; China Electronic Packaging Society.
Publisher: IEEE Press
Published: 2006
Place of publication: Piscataway, NJ
Language: eng
Number of pages: 872
Subjects: Electronic packaging -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and index.