Chip Scale Package
Subtitle: Design, Materials, Process, Reliability, and Applications
Edition: 1 edition
Publisher: McGraw-Hill Professional
Published: February 28, 1999
Language: eng
Format: Hardcover
Number of pages: 564
ISBN-13: 9780070383043
Subjects: Electronics engineering; Technology; Industrial Design - Packaging; Electronics - Microelectronics; Microelectronics; Technology & Industrial Arts; Science/Mathematics; Integrated Circuits; Electronics - Circuits - General; Engineering - Electrical & Electronic; Technology / Electronics / General; Electronics - Circuits - Integrated; Design and construction; Microelectronic packaging