Mechanical behavior of an axisymmetric solder joint-component system during encapsulation and thermal cycling
By: by D. M. Jarboe
Contributors: United States. Dept. of Energy; Bendix Corporation. Kansas City Division. Communications Services
Edition: Rev
Series: BDX ; 613-2172 (rev.)
Publisher: Dept. of Energy; for sale by the National Technical Information Service]
Published: 1979
Place of publication: [Washington]; [Springfield, Va
Language: eng
Number of pages: 27
Subjects: Solder and soldering; Joints (Engineering)
Notes: Prepared for the United States Department of Energy under contract number DE-AC04-76-DP00613

"Communications Services, Bendix, Kansas City Division."

June 1979

Includes bibliographical references