Heat transfer in electronic equipment, 1991
Subtitle: presented at the 28th National Heat Transfer Conference, Minneapolis, Minnesota, July 28-31, 1991
By: sponsored by the Heat Transfer Division, ASME ; edited by A. Ortega, D. Agonafer, B.W. Webb.
Contributors: Ortega, A. 1954-; Agonafer, D.; Webb, B. W.; National Heat Transfer Conference; American Society of Mechanical Engineers. Heat Transfer Division.
Series: HTD ;; vol. 171; HTD (Series) ;; v. 171.
Publisher: American Society of Mechanical Engineers
Published: 1991
Place of publication: New York, N.Y
Language: eng
Number of pages: 143
Subjects: Electronic apparatus and appliances -- Cooling -- Congresses.; Heat -- Transmission -- Congresses.; Electronic packaging -- Cooling -- Congresses.
Notes: Includes bibliographical references and index.