Application for assistance under the College Facilities Loan Program.
Contributors: United States. Office of Postsecondary Education.
Publisher: U.S. Dept. of Education, Office of Postsecondary Education
Published: 1988
Place of publication: Washington, D.C
Language: eng
Number of pages: 24
Subjects: College facilities -- United States -- Finance.; Federal aid to higher education -- United States.
Notes: Cover title.

Shipping list no.: 88-172-P.

"Closing date: May 16, 1988."

"CFDA number: 84.142."

"OMB no. 1840-0580, exp. date 5/90, Ed form E40-30P, (6/87)."