Proceedings of SLIP '03
Subtitle: International Workshop on System Level Interconnect Prediction
By: co-sponsored by ACM/SIGDA and IEEE Computer Society (Technical Committee on VLSI).
Contributors: ACM Special Interest Group on Design Automation.; IEEE Computer Society. Technical Committee on VLSI.
Publisher: Association for Computing Machinery
Published: 2003
Place of publication: New York, N.Y
Language: eng
Number of pages: 140
Subjects: Integrated circuits -- Very large scale integration -- Design and construction -- Congresses; Semiconductors -- Junctions -- Mathematical models -- Congresses
Genres: Congresses.
Other titles: 2003 International Workshop on System Level Interconnect Prediction.; SLIP '03 :; Proceedings of the 2003 International Workshop on System-Level Interconnect Prediction.
Notes: "ACM order number 477037"--T.p. verso.

Includes bibliographical references and author index.

Also available on the World Wide Web via ACM Digital Library with title: Proceedings of the 2003 International Workshop on System-Level Interconnect Prediction.

OCLC order: ACM Digital Library.