Twenty third IEEE/CPMT International Electronics Manufacturing Technology Symposium
Subtitle: proceedings 1998 IEMT symposium : October 19-21, 1998, Austin, TX, USA
By: sponsored by Semiconductor Equipment & Materials Int'l [and] the Components, Packaging, & Manufacturing Technology Society of the IEEE.
Contributors: Semiconductor Equipment and Materials International.; Components, Packaging & Manufacturing Technology Society.
Publisher: IEEE
Published: 1998
Place of publication: Piscataway, New Jersey
Language: eng
Number of pages: 496
Subjects: Electronic industries -- Congresses.; Electronic packaging -- Congresses.; Electronic apparatus and appliances -- Design and construction -- Congresses.; Semiconductors -- Design and construction -- Congresses.; Thin film devices -- Design and construction -- Congresses.; Ball grid array technology -- Congresses.
Genres: Congresses.
Other titles: IEMT symposium; Electronics Manufacturing Technology Symposium, 1998, Twenty-Third IEEE/CPMT.
Notes: Includes bibliographical references and author index.
Cover title.
"IEEE Catalog Number 98CH36205"--verso of T.p.
Also available via the World Wide Web with additional title: Electronics Manufacturing Technology Symposium, 1998, Twenty-Third IEEE/CPMT.