Transport phenomena in thermal engineering
Subtitle: proceedings of the Sixth International Symposium on Transport Phenomena in Thermal Engineering (ISTP-VI), Seoul, Korea, May 9-13
By: organized under the auspices of Pacific Center of Thermal-Fluids Engineering ; edited by Joon Sik Lee, Suk Ho Chung, Ki Hyun Kim.
Contributors: Chung, Suk Ho.; Kim, Ki Hyun.; Lee, Joon Sik.; Pacific Center of Thermal-Fluids Engineering.
Publisher: Begell House
Published: 1993
Place of publication: New York
Language: eng
Number of pages: 778
Subjects: Heat -- Convection -- Congresses.; Heat -- Transmission -- Congresses.; Transport theory -- Congresses.
Notes: Includes bibliographical references and index.