In the matter of certain semiconductor chips with minimized chip package size and products containing same (III)
Subtitle: investigation no. 337-TA-630
Series: Publication -- 4209; USITC publication -- 4209.
Publisher: U.S. International Trade Commission
Published: 2010
Place of publication: Washington, DC
Language: eng
Format: [electronic resource] :
Number of pages: 249
Subjects: Semiconductor industry; Patent infringement; Commercial policy
Other titles: Certain semiconductor chips with minimized chip package size and products containing same (III)
Notes: Title from title screen (viewed on July 2, 2012).

"December 2010."

Includes bibliographical references.