Design & reliability of solders and solder interconnections
Subtitle: proceedings of a symposium held during the TMS Annual Meeting at Orlando, Florida, February 10-13, 1997
By: edited by Rao K. Mahidhara ... [et al.] ; sponsors, ASM-MSD Flow and Fracture Committee, TMS-SMD Mechanical Metallurgy Committee, TMS-EMPMD Electronic, Magnetic, Photonic Materials Committee.
Contributors: Mahidhara, Rao K.; American Society for Metals. Flow and Fracture Committee.; Minerals, Metals and Materials Society. Electronic, Magnetic, and Photonic Materials Division.; Minerals, Metals and Materials Society. Mechanical Metallurgy Committee.; Minerals, Metals and Materials Society. Meeting
Publisher: Minerals, Metals & Materials Society
Published: 1997
Place of publication: Warrendale, Pa
Language: eng
Number of pages: 448
Subjects: Electronic packaging -- Materials.; Solder and soldering.
Other titles: Design and reliability of solders and solder interconnections
Notes: Includes bibliographical references and index.