Proceedings
Subtitle: Second International Conference on Properties and Applications of Dielectric Materials, Beijing, China, September 12-16, 1988
By: cosponsored by IEEE-Dielectrics and Electrical Insulation Society [and], Chinese Electrotechnical Society, Dielectric Committee [and], Tsinghua University, China.
Contributors: IEEE Dielectrics and Electrical Insulation Society.; Zhongguo dian gong ji shu xue hui. Dielectric Committee.; Guo li qing hua da xue (Hsin-chu shih, Taiwan)
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Published: 1988
Place of publication: New York, NY (345 E. 47th St., New York 10017)
Language: eng
Number of pages: 779
Subjects: Dielectrics -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and indexes.
"88Ch2587-4"--T.p., v.1-2.