Cost vs. quality trade-off for high-density packaging of electronic systems
By: Michael Scheffler
Edition: 1st ed.
Series: Series in microelectronics -- v. 119
Publisher: Hartung-Gorre
Published: 2001
Place of publication: Konstanz
Language: eng
Number of pages: 158
Subjects: Electronic packaging; Cost effectiveness; Quality control
Notes: "Reprint of diss. ETH no. 14210"--T.p. verso.

Includes bibliographical references (p. [145]-155).