Electronic packaging materials science VIII
Subtitle: symposium held April 17-20, 1995, San Francisco, CA., U.S.A.
By: editors, Robert C. Sundahl...[et al.].
Contributors: Sundahl, Robert C.
Series: Materials Research Society symposium proceedings -- v. 390.; Materials Research Society symposia proceedings -- v. 390
Publisher: Materials Research Society
Published: 1995
Place of publication: Pittsburgh, Pa
Language: eng
Number of pages: 450
Subjects: Electronic packaging -- Congresses.; Electronic packaging -- Materials -- Congresses.
Notes: Includes bibliographical references and indexes.