Materials in microelectronic and optoelectronic packaging
By: edited by Hung C. Ling, Koichi Niwa, Vishwa N. Shukla.
Contributors: Ling, Hung C.; Niwa, Koichi.; Shukla, Vishwa N.; International Symposium on Materials for Optoelectronic and Microelectronic Packaging (1992 : San Francisco, Calif.); International Ceramic Science and Technology Congress (3rd : 1992 : San Francisco, Calif.)
Series: Ceramic transactions,; v. 33
Publisher: American Ceramic Society
Published: 1993
Place of publication: Westerville, Ohio
Language: eng
Number of pages: 471
Subjects: Microelectronic packaging -- Materials.; Optoelectronic devices -- Materials.
Notes: Includes bibliographical references and index.
"Proceedings of the International Symposium on Materials for Optoelectronic and Microelectronic Packaging, presented at the third International Ceramic Science and Technology Congress, held in San Francisco, CA, November 1-4, 1992"--T.p. verso.