Fracture analysis of the FAA/NASA wide stiffened panels
By: B.R. Seshadri ... [et al.].
Contributors: Seshadri, B. R.; Langley Research Center.; United States. National Aeronautics and Space Administration.
Series: NASA/TM -- 1998-208976.; NASA technical memorandum -- 208976.
Publisher: National Aeronautics and Space Administration, Langley Research Center; National Technical Information Service, distributor
Published: 1998
Place of publication: Hampton, Va; [Springfield, Va
Language: eng
Format: Microform
Subjects: Structural analysis.; Fracturing.; Panels.; Stiffness.; Applications programs (Computers); Plane strain.; Cracks.; Fracture mechanics.
Other titles: Fracture analysis of the FAA NASA wide stiffened panels.
Notes: Shipping list no.: 99-0559-M.

Microfiche. [Washington, D.C. : National Aeronautics and Space Administration, 1999] 1 microfiche.