Diffusion bonding 2
By: edited by D.J. Stephenson.
Contributors: Stephenson, D. J.
Publisher: Elsevier Applied Science; Sole distributor in the USA and Canada, Elsevier Science Pub. Co.
Published: 1991
Place of publication: London; New York; New York, NY, USA
Language: eng
Number of pages: 316
Subjects: Diffusion bonding (Metals) -- Congresses.; Aluminum alloys -- Bonding -- Congresses.; Heat resistant materials -- Congresses.
Notes: Includes bibliographical references.
"Proceedings of the Second International Conference on Diffusion Bonding, held at Cranfield Institute of Technology, U.K., from 28 to 29 March, 1990."