Electronic packaging reliability
Subtitle: presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993
By: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Luu T. Nguyen, Michael G. Pecht.
Contributors: Nguyen, Luu T.; Pecht, Michael.; American Society of Mechanical Engineers. Winter Meeting; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
Series: EEP ;; vol. 6; EEP (Series) ;; vol. 6.
Publisher: American Society of Mechanical Engineers
Published: 1993
Place of publication: New York
Language: eng
Number of pages: 131
Subjects: Electronic packaging -- Reliability -- Congresses.
Notes: Includes bibliographical references and index.