FCIP and expanding markets for flip chip
By: authors, Thomas W. Goodman and E. Jan Vardaman ; graphics and production, Charles H. Kroger ; contributor, Kawal Grover ; editor, Pat Tschirhart-Spangler
Contributors: Vardaman, Jan; Tschirhart-Spangler, Pat
Publisher: TechSearch International, Technology Licensing and Consulting
Published: 1997
Place of publication: Austin, Tex
Language: eng
Number of pages: 231
Subjects: Multichip modules (Microelectronics); Flip chip technology; Design and construction
Notes: Includes bibliographical references.