Adhesives technology for electronic applications
Subtitle: materials, processes, reliability
By: by James J. Licari and Dale W. Swanson
Contributors: Swanson, Dale W.; Knovel (Firm)
Series: Materials and processes for electronic applications series
Publisher: William Andrew Pub.
Published: 2005
Place of publication: Norwich, NY
Language: eng
Format: [electronic resource] :
Number of pages: 459
Subjects: Adhesives; Electronics; Materials; Electronic packaging
Notes: Includes bibliographical references and index.

Electronic reproduction. Norwich, N.Y. : Knovel, 2006. HTML/PDF. Includes interactive index. Mode of access: Intranet. Electronic access restricted to users at licensed institutions.