ICSD '98
Subtitle: proceedings of the 1998 IEEE 6th International Conference on Conduction and Breakdown in Solid Dielectrics, June 22-25, 1998, ABB Forum, Västerås, Sweden
By: sponsored by the IEEE Dielectrics and Electrical Insulation Society.
Contributors: IEEE Dielectrics and Electrical Insulation Society.
Publisher: Institute of Electrical and Electronics Engineers; Available from IEEE Service Center
Published: 1998
Place of publication: [New York, N.Y.]; Piscataway, NJ
Language: eng
Number of pages: 595
Subjects: Dielectrics -- Congresses.; Breakdown (Electricity) -- Congresses.; Electric conductivity -- Congresses.
Other titles: ICSD ninety-eight.; Proceedings of the 1998 IEEE 6th International Conference on Conduction and Breakdown in Solid Dielectrics.; Proceedings of the 6th International Conference on Conduction and Breakdown in Solid Dielectrics.; 1998 IEEE 6th International Conference on Conduction & Breakdown in Solid Dielectrics.
Notes: "98CH36132."

Includes bibliographical references and index.