Semiconductor wafer bonding
Subtitle: science and technology
By: Q.-Y. Tong, U. Gösele.
Contributors: Gösele, U.; Electrochemical Society.
Series: The Electrochemical Society series
Publisher: John Wiley
Published: 1999
Place of publication: New York
Language: eng
Number of pages: 297
Subjects: Semiconductors -- Bonding.; Semiconductor wafers.
Description: Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more.

For materials scientists and electrical engineers who need to exploit the potential of this flourishing technology, Semiconductor Wafer Bonding is a convenient one-stop resource for answers to many common questions. It is also an excellent text/reference for graduate students eager to learn about this interdisciplinary field, which spans surface chemistry, solid-state physics, materials science, and electrical engineering.
Notes: "Sponsored by the Electrochemical Society, Inc., Pennington, New Jersey."
Includes index.