Microelectronic interconnects and packages, system and process integration
By: Stuart K. Tewksbury, John R. Carruthers, conference chairs/editors.
Contributors: Tewksbury, Stuart K.; Carruthers, John R.; Society of Photo-optical Instrumentation Engineers.; International Symposium on Advances in Interconnection and Packaging (1990 : Boston, Mass.)
Series: International Symposium on Advances in Interconnection and Packaging ;; bk. 2; Proceedings / SPIE--the International Society for Optical Engineering ;; v. 1390; Proceedings of SPIE--the International Society for Optical Engineering ;; v. 1390.
Publisher: SPIE
Published: 1991
Place of publication: Bellingham, Wash
Language: eng
Number of pages: 582
Subjects: Microelectronic packaging -- Congresses.
Notes: Includes bibliographical references and index.
Papers from the International Symposium on Advances in Interconnection and Packaging, held 5-9 Nov. 1990, Boston, Mass.