Inelastic strain analysis of solder joint in NASA fatigue speciment
Subtitle: final report
By: prepared by Abhijit Dasgupta, Chen Oyan.
Contributors: Oyan, Chen.; United States. National Aeronautics and Space Administration.
Series: NASA-CR -- 189882.; NASA contractor report -- NASA CR-189882.
Publisher: National Aeronautics and Space Administration; National Technical Information Service, distributor
Published: 1991
Place of publication: [Washington, DC; Springfield, Va.?
Language: eng
Format: Microform
Subjects: Strains and stresses.; Solder and soldering.
Notes: Distributed to depository libraries in microfiche.

Shipping list no.: 92-2682-M.

Microfiche. [Washington, D.C. : National Aeronautics and Space Administration], 1992. 1 microfiche.