Roadmaps of packaging technology
By: author, Eric Bogatin ; editors, Dick Potter, Laura Peters.
Contributors: Potter, Dick.; Peters, Laura.; Integrated Circuit Engineering Corporation.
Publisher: Integrated Circuit Engineering
Published: 1997
Place of publication: Scottsdale, AZ
Language: eng
Subjects: Microelectronic packaging.; Multichip modules (Microelectronics) -- Design and construction.