High-performance packaging for monolithic microwave and millimeter-wave integrated circuits
By: K.A. Shalkhauser and K. Li and Y.C. Shih.
Contributors: Li, K.; Shih, Y. C.; United States. National Aeronautics and Space Administration.
Series: NASA technical memorandum -- 105744.
Publisher: National Aeronautics and Space Administration; For sale by the National Technical Information Service
Published: 1992
Place of publication: [Washington, DC; Springfield, Va
Language: eng
Format: Microform
Subjects: Phased array antennas.; Microwave integrated circuits.
Other titles: High performance packaging for monolithic ....
Notes: Distributed to depository libraries in microfiche.

Shipping list no.: 93-0047-M.

Microfiche. [Washington, D.C. : National Aeronautics and Space Administration], 1992. 1 microfiche.