Advanced Flip Chip Packaging
By: edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong
Contributors: Lai, Yi-Shao; Wong, C.P.; SpringerLink (Online service)
Publisher: Springer US; Imprint: Springer
Published: 2013
Place of publication: Boston, MA
Language: eng
Format: [electronic resource] /
Number of pages: 560
ISBN-13: 9781441957689
Subjects: Systems engineering; Engineering; Circuits and Systems; Electronics; Optical materials; Optical and Electronic Materials; Instrumentation Electronics and Microelectronics
Description: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also:Offers broad-ranging chapters with a focus on IC-package-system integrationProvides viewpoints from leading industry executives and expertsDetails state-of-the-art achievements in process technologies and scientific researchPresents a clear development history and touches on trends in the industry while also discussing up-to-date technology informationAdvanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.
Table of contents: title: Flip Chip Technology Overview and Early Beginnings; title: Technology Trends of Flip Chip; title: Bumping Technologies; title: Flip-Chip Interconnections: Past, Present and Future; title: Underfill; title: Conductive Adhesives for Flip Chip Applications; title: Enabling Substrate Technologies: Past, Present and Future; title: IC-Package-System Integrated Design; title: Thermal Management of Flip Chip Packages; title: Thermo-Mechanical Reliability in Flip Chip Packages; title: Interfacial Reactions and Electromigration in Flip-Chip Solder Joints.