Semiconductor Packaging
Subtitle: Materials Interaction and Reliability
Contributors: Lo, Randy Hsiao-Yu
Publisher: Taylor & Francis
Published: 2012
Number of pages: 216
Subjects: Materials science; Circuits & components; Electronics engineering
Description: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Notes: Open Access Unrestricted online access

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