Silicon wafer bonding technology
Subtitle: for VLSI and MEMS applications
By: edited by Subramanian S. Iyer and Andre J. Auberton-Hervé
Contributors: Iyer, Subramanian S; Auberton-Hervé, Andre J; Institution of Electrical Engineers; INSPEC (Information service). EMIS Group
Series: EMIS processing series -- no. 1
Publisher: Institution of Electrical Engineers
Published: 2002
Place of publication: London
Language: eng
Number of pages: 149
Subjects: Silicon-on-insulator technology; Integrated circuits -- Very large scale integration; Microelectromechanical systems; Semiconductor wafers
Notes: Includes bibliographical references and index