Materials, technology and reliability of low-k dielectrics and copper interconnects
Subtitle: symposium held April 18-21, 2006, San Francisco, California, U.S.A.
By: editors, Ting Y. Tsui ... [et al.].
Contributors: Tsui, Ting Y.; Materials Research Society. Meeting
Series: Materials Research Society symposium proceedings -- v. 914; Materials Research Society symposia proceedings -- v. 914.
Publisher: Materials Research Society
Published: 2006
Place of publication: Warrendale, Pa
Language: eng
Number of pages: 462
Subjects: Semiconductors -- Materials -- Congresses; Semiconductors -- Junctions -- Congresses; Dielectric films -- Congresses; Integrated circuits -- Materials -- Congresses; Integrated circuits -- Reliability -- Congresses
Genres: Congresses
Notes: "... Symposium F, "Materials, Technology and Reliability of Low-k Dielectrics and Cooper," held April 18-21 at the 2006 MRS Spring Meeting in San Francisco, California ..."--Pref.

Includes bibliographical references and indexes.