Packaging of electronic and photonic devices
Subtitle: presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida
By: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by G.J. Kowalski ... [et al.].
Contributors: Kowalski, G. J.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.; International Mechanical Engineering Congress and Exposition (2000 : Orlando, Fla.); Symposium on Mechanics of SMT and Photonic Structures (12th : 2000 : Orlando, Fla.)
Series: EEP ;; vol. 28; EEP (Series) ;; vol. 28.
Publisher: American Society of Mechanical Engineers
Published: 2000
Place of publication: New York, N.Y
Language: eng
Number of pages: 299
Subjects: Electronic packaging -- Congresses.; Surface mount technology -- Congresses.; Solder and soldering -- Congresses.; Semiconductor wafers -- Design and manufacture -- Congresses.; Photonics -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and author index.
Table of contents: title: 12th Symposium on Mechanics of SMT and Photonic Structures; title: Alternatives to lead solder : views, concerns, and issues in military electronics and other harsh environments. 1. Technical advances in lead-free interconnection technologies; title: Research and technological advances in wafer and electronic manufacturing.