Advanced electronic packaging
Subtitle: with emphasis on multichip modules
By: edited by William D. Brown.
Contributors: Brown, William D., 1943-
Series: IEEE Press series on microelectronic systems
Publisher: IEEE Press
Published: 1999
Place of publication: New York
Language: eng
Number of pages: 789
Subjects: Microelectronic packaging.; Multichip modules (Microelectronics) -- Design and construction.
Description: An excellent desk reference for practicing engineers or an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the packaging of integrated circuits, specifically, multichip modules (MCMs). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design trade-offs.

Also addressed are the critical role of economics and future trends in electronic packaging.
Notes: Includes bibliographical references and index.