Quantitative comparison of electronic component-solder joint stress relief in encapsulated assemblies
Subtitle: topical report
By: by D. A. Cummings
Contributors: United States. Dept. of Energy; Bendix Corporation. Kansas City Division. Communications Services
Series: BDX ; 613-1868/rev
Publisher: Dept. of Energy; for sale by the National Technical Information Service]
Published: 1978
Place of publication: [Washington]; [Springfield, Va
Language: eng
Number of pages: 24
Subjects: Electric cables -- Joints; Electric resistance
Notes: Prepared for the U.S. Dept. of Energy under contract DE-AC04-76-DP00613

"Communications Services, Bendix, Kansas City Division."

Nov. 1978

Includes bibliographical references