IEEE International Symposium and Exhibition on Advanced Packaging Materials
Subtitle: processes, properties and interfaces : March 15-17, 2006, Atlanta, GA
Publisher: Institute of Electrical and Electronics Engineers
Published: 2006
Place of publication: [New York, N.Y.]
Language: eng
Number of pages: 200
ISBN-13: 9781424402601
Subjects: Electronic packaging; Congresses; Materials
Other titles: Advanced packaging materials; IEEE CPMT; Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on.
Notes: Product Number 06TH8875.

Includes bibliographical references.

Electronic reproduction. New York, N.Y. : IEEE, c2006. System requirements: Adobe Acrobat Reader. Mode of access: World Wide Web. Made available through IEEE Xplore under title: Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on.