Area Array Package Design
Subtitle: Techniques in High Density Electronics
Publisher: McGraw-Hill Professional
Published: October 24, 2003
Language: eng
Number of pages: 204
ISBN-13: 9780071428279
First sentence: The ideal electronic package is an economical and manufacturable electromechanical platform for one or more electronic devices that affords protection, facilitates handling, and provides the geometric translations and compatible interface required for connection to the next system level by practical assembly processes.