Solutions to CFD benchmark problems in electronic packaging
Subtitle: presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993
By: sponsored by the Heat Transfer Division, ASME ; edited by Dereje Agonafer.
Contributors: Agonafer, D.; American Society of Mechanical Engineers. Heat Transfer Division.
Series: HTD ;; vol. 255; HTD (Series) ;; v. 255.
Publisher: American Society of Mechanical Engineers
Published: 1993
Place of publication: New York, N.Y
Language: eng
Number of pages: 57
Subjects: Electronic packaging -- Congresses.; Fluid dynamics -- Data processing -- Congresses.
Notes: Includes bibliographical references and index.