MEMS design, fabrication, characterization, and packaging
Subtitle: 30 May-1 June 2001, Edinburgh, UK
By: Uwe F.W. Behringer, Deepak G. Uttamchandani, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering ; cosponsored by Scottish Enterprise (UK) ; cooperating organizations, EOS--European Optical Society [and] IEE--the Institution of Electrical Engineers (UK).
Contributors: Behringer, Uwe F. W.; Uttamchandani, Deepak.; Society of Photo-optical Instrumentation Engineers.; Scottish Enterprise.; European Optical Society.; Institution of Electrical Engineers.
Series: SPIE proceedings series ;; v. 4407; Proceedings of SPIE--the International Society for Optical Engineering ;; v. 4407.
Publisher: SPIE
Published: 2001
Place of publication: Bellingham, Wash., USA
Language: eng
Number of pages: 442
Subjects: Microelectromechanical systems -- Design and construction -- Congresses.; Microfabrication -- Congresses.; Microelectronic packaging -- Congresses.; Mechatronics -- Congresses.
Genres: Congresses.
Other titles: Microelectromechanical systems design, fabrication, characterization, and packaging
Notes: Includes bibliographical references and index.