Thin film materials, processes, and reliability
Subtitle: plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium
By: [editor,  G. S. Mathad ; sponsoring divisions, Dielectric Science and Technology, Electronics.
Contributors: Mathad, G. S.; Electrochemical Society. Dielectric Science and Technology Division.; Electrochemical Society. Electronics Division.; Electrochemical Society. Meeting
Series: Proceedings -- v. 2003-13
Publisher: Electrochemical Society
Published: 2003
Place of publication: Pennington, NJ
Language: eng
Number of pages: 424
Subjects: Thin film devices -- Design and construction -- Congresses.; Thin films -- Congresses.; Plasma etching -- Congresses.
Notes: "... papers presented at the International Symposium on Thin Film Materials, Processes, and Reliability: plasma processing for the 100 nm node and copper interconnects with low-k inter level dielectric films ... held as part of the 203rd Meeting of the Electrochemical Society, Inc., in Paris, France, April 27-May 2, 2003)

Includes bibliographical references and indexes.