Advanced interconnects and contact materials and processes for future integrated circuits
Subtitle: symposium held April 13-16, 1998, San Francisco, California, U.S.A.
By: editors, Shyam P. Murarka ... [et al.].
Contributors: Murarka, S. P.
Series: Materials Research Society symposium proceedings ;; v. 514; Materials Research Society symposia proceedings ;; v. 514.
Publisher: Materials Research Society
Published: 1998
Place of publication: Warrendale, Pa
Language: eng
Number of pages: 560
Subjects: Electronic packaging -- Materials -- Congresses.; Integrated circuits -- Materials -- Congresses.; Semiconductors -- Congresses.
Notes: Includes bibliographical references and indexes.