CAE/CAD application to electronic packaging
Subtitle: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
By: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Robert E. Fulton.
Contributors: Agonafer, D.; Fulton, Robert E.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.; International Mechanical Engineering Congress and Exposition (1994 : Chicago, Ill.)
Series: EEP - -- Vol. 9.; EEP (Series) -- vol. 9.
Publisher: American Society of Mechanical Engineers
Published: 1994
Place of publication: New York, N.Y
Language: eng
Number of pages: 89
Subjects: Heat sinks (Electronics) -- Congresses.; Electronic packaging -- Congresses.; Heat sinks (Electronics); Electronic packaging.
Other titles: Computer-aided design application to electronic packaging.
Notes: Includes bibliographical references and index.