Stress Induced Phenomena and Reliability in 3D Microelectronics
Subtitle: Kyoto, Japan, 28-30 May 2012
By: Editors, Paul S. Ho, University of Texas, Texas, USA and 6 others
Contributors: Ho, P. S., editor
Series: AIP Proceedings -- Volume 1601
Publisher: AIP Publishing
Published: 2014
Place of publication: Melville, New York
Language: eng
Number of pages: 185
ISBN-13: 9780735412354
Subjects: Three-dimensional integrated circuits; Congresses
Notes: "Conference collection"--Title page.

"All papers have been peer reviewed."--Title page.

Includes bibliographical references.