EuPac '94
Subtitle: Vortäge und Posterbeiträge der 1. Europäischen Konferenz für elektronische Packaging-Technologie und des 7. Internationalen Kolloquium "Verbindungstechnik in der Elektronik" in Essen vom 1. bis 3. Februar 1994 = Lectures and poster show contributions of the 1st European Conference on Electronic Packaging Technology and the 7th International Conference "Interconnection Technology in Electronics" taking place in Essen from February 1st to 3rd 1994
By: Veranstalter = organizer, Deutscher Verband für Schweisstechnik e.V. (DVS) = German Welding Society.
Contributors: Deutscher Verband für Schweisstechnik.; International Conference "Interconnection Technology in Electronics (7th : 1994 : Essen, Germany)
Series: DVS-Berichte,; Bd. 158
Publisher: DVS-Verlag
Published: 1994
Place of publication: Düsseldorf
Language: ger
Number of pages: 264
Subjects: Electronic packaging -- Congresses.; Integrated circuits -- Congresses.; Multichip modules (Microelectronics) -- Congresses.
Notes: Includes bibliographical references.
English and German.