Electronics packaging forum
Subtitle: multichip module technology issues
By: edited by James E. Morris.
Contributors: Morris, James E., 1944-; IEEE Components, Hybrids, and Manufacturing Technology Society.
Publisher: IEEE Press
Published: 1993
Place of publication: Piscataway, NJ
Language: eng
Number of pages: 392
Subjects: Electronic packaging -- Design.; Multichip modules (Microelectronics) -- Design and construction.
Description: Keep up with the leading-edge technology with this practical volume, which brings a multidisciplinary treatment to the field of electronic packaging and multichip modules. The most comprehensive resource on packaging now, the volume uses real-world examples to focus on the multichip module's important and still emerging role.

Important topics covered include building long-term reliability by increasing polyimide stability, recent discoveries in the field of soldering phenomena relating to fundamental fluid mechanical processes, circuit and electromagnetic solutions to problems of modeling highspeed electrical interconnections, how to use the finite-difference time-domain approach in electromagnetic modeling, and the development of dedicated test chips for package evaluation in varied field conditions.

Electronics Packaging Forum is a key source of information on technology and techniques for businesses involved in packaging today.
Notes: Includes bibliographical references and index.
IEEE Components, Hybrids, and Manufacturing Technology Society, sponsor."