HOTPAC
Subtitle: programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML
By: John Albers
Contributors: National Institute of Standards and Technology (U.S.)
Series: Semiconductor measurement technology; NIST special publication -- 400-96
Publisher: U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology; For sale by the Supt. of Docs., U.S. G.P.O.
Published: 1995
Place of publication: Gaithersburg, MD; Washington, DC
Language: eng
Format: Microform
Number of pages: 87
Subjects: Semiconductors -- Thermal properties; Thermal analysis -- Computer programs
Other titles: HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program ..; Programs for thermal analysis including version 3.0 of the TXYZ program ..
Notes: Distributed to depository libraries in microfiche

Shipping list no.: 95-0785-M

"August 1995."

Includes bibliographical references (p. 47-49)

Microfiche. [Washington, D.C.?] : Supt. of Docs., U.S. G.P.O., [1995] 2 microfiches : negative