Chemical vapor deposition of tungsten and tungsten silicides for VLSI/ULSI applications
By: by John E.J. Schmitz.
Series: Materials science and process technology series
Publisher: Noyes Publications
Published: 1992
Place of publication: Park Ridge, N.J., U.S.A
Language: eng
Number of pages: 235
Subjects: Integrated circuits -- Very large scale integration -- Materials.; Tungsten.; Vapor-plating.; Integrated circuits -- Ultra large scale integration -- Materials.
Notes: Includes bibliographical references and index.