Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics
Subtitle: proceedings of the international symposium
By: editor, G.S. Mathad ; assistant editors, H.S. Rathore ... [et al.].
Contributors: Mathad, G. S.; Rathore, Harzara S.; Electrochemical Society. Dielectric Science and Technology Division.; Electrochemical Society. Electronics Division.; Electrochemical Society. Electrodeposition Division.; Electrochemical Society. Meeting
Series: Proceedings ;; v. 2000-27; Proceedings (Electrochemical Society) ;; v. 2000-27.
Publisher: Electrochemical Society
Published: 2001
Place of publication: Pennington, NJ
Language: eng
Number of pages: 224
Subjects: Integrated circuits -- Materials -- Congresses.; Electroplating -- Congresses.; Copper -- Congresses.; Dielectric films -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and indexes.
"Papers presented at the Symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics ... was held as part of the 198th Meeting of the Electrochemical Society, in Phoenix, AZ, October 22-27, 2000"--Pref.
"Dielectric Science & Technology, Electronics, and Electrodeposition Divisions."