Thermal management handbook
Subtitle: for electronic assemblies
By: Jerry Sergent, Al Krum.
Contributors: Krum, Al.
Series: Electronic packaging and interconnection series
Publisher: McGraw-Hill
Published: 1998
Place of publication: New York
Language: eng
Subjects: Electronic apparatus and appliances -- Temperature control.; Electronic packaging.; Multichip modules (Microelectronics) -- Design and construction.
Notes: Includes bibliographical references and index.