Advances in electronic packaging, 1992
Subtitle: proceedings of the Joint ASME/JSME Conference on Electronic Packaging : presented at the First Joint ASME/JSME Conference on Electronic Packaging, Milpitas, California, April 9-12, 1992
By: sponsored by the American Society of Mechanical Engineers, the Japan Society of Mechanical Engineers ; edited by William T. Chen, Hiroyuki Abe'.
Contributors: Chen, William T.; Abé, H. 1936-; American Society of Mechanical Engineers.; Nihon Kikai Gakkai.
Series: EEP ;; vol. 1 [i.e. 2]; EEP (Series) ;; vol. 2.
Publisher: American Society of Mechanical Engineers
Published: 1992
Place of publication: New York (345 E. 47th St., New York)
Language: eng
Number of pages: 1015
Subjects: Electronic packaging -- Congresses.