Packaging in the 1990's
By: a national teleconference, November 17, 1989.
Contributors: National Training Center for Microelectronics.
Publisher: National Training Center for Microelectronics, Northampton Community College
Published: 1989
Place of publication: [Bethlehem, Pa.]
Language: eng
Subjects: Microelectronic packaging -- Congresses.
Notes: Includes bibliographical references.
Cover title.