Stress-induced phenomena in metallization
Subtitle: Sixth International Workshop on Stress-Induced Phenomena in Metallization, Ithaca, New York, 25-27 July 2001
By: editors, Shefford P. Baker ... [et al.].
Contributors: Baker, Shefford P.
Series: AIP conference proceedings -- v. 612; AIP conference proceedings -- no. 612.
Publisher: American Institute of Physics
Published: 2002
Place of publication: Melville, NY
Language: eng
Number of pages: 250
Subjects: Integrated circuits -- Defects -- Congresses.; Thin film devices -- Defects -- Congresses.; Electrodiffusion -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and indexes.