International Symposium on Advanced Packaging Materials
Subtitle: processes, properties and interfaces : proceedings : Chateau Elan, Braselton, Georgia, March 6-8, 2000
By: co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, C.P. Wong ... [et al.].
Contributors: Wong, C. P., 1947-; International Microelectronics and Packaging Society.
Publisher: IMAPS; IEEE
Published: 2000
Place of publication: Reston, Virginia; Piscataway, New Jersey
Language: eng
Number of pages: 349
Subjects: Electronic packaging -- Materials -- Congresses.
Genres: Congresses.
Other titles: Advanced packaging materials; Proceedings
Notes: Includes bibliographic references and index.
"... IEEE Catalog Number 00TH8507"--verso of t.p.