ITherm 2000
Subtitle: the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, presented at Las Vegas, Nevada, USA, May 23-26, 2000
By: sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Gary B. Kromann, J. Richard Culham, Koneru Ramakrishna.
Contributors: Culham, J. Richard.; Kromann, Gary B.; Ramakrishna, Koneru.; Components, Packaging & Manufacturing Technology Society.
Publisher: IEEE
Published: 2000
Place of publication: Piscataway, New Jersey
Language: eng
Subjects: Electronic apparatus and appliances -- Thermal properties -- Congresses.; Heat sinks (Electronics) -- Congresses.; Ball grid array technology -- Congresses.
Genres: Congresses.
Other titles: ITherm 2000.; Thermal and thermomechanical phenomena in electronic systems.; Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Notes: "IEEE Catalog Number: 00CH37069"-- p. ii.

Includes bibliographical references and index.