ITherm'98
Subtitle: the Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electric Systems : Seattle, Washington, USA, May 27-30, 1998
By: edited by Sushil H. Bhavnani, Gary B. Kromann, Douglas J. Nelson.
Contributors: Bhavnani, S. H.; Kromann, Gary B.; Nelson, D. J.
Publisher: IEEE
Published: 1998
Place of publication: Piscataway, New Jersey
Language: eng
Number of pages: 541
Subjects: Electronic apparatus and appliances -- Thermal properties -- Congresses.; Heat sinks (Electronics) -- Congresses.; Ball grid array technology -- Congresses.
Other titles: Thermal and thermomechanical phenomena in electronic systems.; Emerging challenges in portable and handheld electronics.
Notes: "IEEE Catalog Number: 98CH36208"-- p. ii.

Includes bibliographical references.