Structural analysis in microelectronics and fiber optics, 1994
Subtitle: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
By: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Ephraim Suhir.
Contributors: Suhir, Ephraim.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.; International Mechanical Engineering Congress and Exposition (1994 : Chicago, Ill.)
Series: EEP ;; vol. 8; EEP (Series) ;; vol. 8.
Publisher: American Society of Mechanical Engineers
Published: 1994
Place of publication: New York
Language: eng
Number of pages: 81
Subjects: Microelectronic packaging -- Congresses.; Fiber optics -- Congresses.; Structural analysis (Engineering) -- Congresses.; Strains and stresses -- Congresses.
Notes: Includes bibliographical references and index.