Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication
Subtitle: from particle scale to feature, die and wafer scales
By: Jianfeng Luo, David Dornfeld.
Contributors: Dornfeld, D. A.
Publisher: Springer
Published: 2004
Place of publication: Berlin; [London]
Language: eng
Number of pages: 311
Subjects: Integrated circuits -- Design and construction; Integrated circuits -- Design and construction -- Simulation methods
Notes: Includes bibliographical references and index.