8th IEEE Workshop on Signal Propagation on Interconnects
Subtitle: proceedings : May 9-12, 2004, Hotel "Crowne Plaza", Heidelberg, Germany
By: co-sponsored by IEEE Components, Packaging and Manufacturing Society, Technical Committee on Electrical Design, Modeling and Simulation (TC-EDMS) and by IEEE Computer Society Tect Technology Technical Council (TTTC).
Contributors: Components, Packaging & Manufacturing Technology Society. Technical Committee on Electrical Design, Modeling and Simulation.; IEEE Computer Society. Test Technology Council.
Publisher: IEEE
Published: 2004
Place of publication: Piscataway, N.J
Language: eng
Number of pages: 218
Subjects: Printed circuits -- Congresses.; Signal theory (Telecommunication) -- Congresses.
Genres: Congresses.
Other titles: Signal propagation on interconnects; Signal Propagation on Interconnects, 2004, proceedings, 8th IEEE Workshop on.
Notes: "IEEE Cat No: 04EX845"--T.p. verso.

Includes bibliographical references.

Also issued online with additional title: Signal Propagation on Interconnects, 2004, proceedings, 8th IEEE Workshop on.