Low Dielectric Constant Materials for IC Applications
Contributors: Paul S. Ho (Editor); Jihperng Leu (Editor); Wei William Lee (Editor)
Edition: 1 edition
Publisher: Springer
Published: December 16, 2002
Language: eng
Format: Hardcover
Number of pages: 309
ISBN-13: 9783540678199
Subjects: Electricity, magnetism & electromagnetism; Electronics engineering; Science/Mathematics; Electronics - Circuits - Integrated; Technology & Industrial Arts; Dielectrics; Technology; Material Science; Integrated Circuits; Electronics - Microelectronics; Engineering - Electrical & Electronic; Dielectric Materials; Integrated circuit manufacture; Interconnects; Low dielectric constant; Permittivity; Technology / Optics; Electricity; Electric insulators and insula; Electric insulators and insulation
First sentence: As integrated circuit dimensions continue to decrease, RC delay, crosstalk noise and power dissipation of the interconnect structure become limiting factors for ultra-large-scale integration of integrated circuits.