The effect of deposition rate on intrinsic stress in copper and silver thin films
By: by Andrea Lee Del Vecchio
Published: 2004
Language: eng
Number of pages: 131
Subjects: Thin films; Multilayered Thin films; Surfaces; Metallic films
Notes: Thesis (Ph.D., Division of Engineering and Applied Sciences)--Harvard University, 2004

Includes bibliographical references (leaves 111-116).