Failure Analysis of Integrated Circuits
Subtitle: Tools and Techniques
By: edited by Lawrence C. Wagner
Series: The Springer International Series in Engineering and Computer Science -- 494; International series in engineering and computer science -- 494.
Publisher: Springer US
Published: 1999
Place of publication: Boston, MA
Language: eng
Format: [electronic resource] :
Number of pages: 255
ISBN-13: 9781461372318; 9781461549192
Subjects: Computer engineering; Optical materials
Description: Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique. Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.
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