Package electrical modeling, thermal modeling, and processing for GaAs wireless applications
By: by Dean L. Monthei.
Series: Electronic packaging and interconnects series
Publisher: Kluwer Academic
Published: 1999
Place of publication: Boston
Language: eng
Number of pages: 234
Subjects: Electronic packaging; Gallium arsenide semiconductors -- Design and construction; Wireless communication systems -- Equipment and supplies
Notes: Includes bibliographical references and index.