FEA Analysis for Investigation of Stress Intensity Factor (SIF) for a Plate with Hole and Patches
Subtitle: ICIEMS 2014
Publisher: Association of Scientists, Developers and Faculties
Published: 2014
Place of publication: India
Language: eng
Format: Paperback
Number of pages: 487
ISBN-13: 9788192523330
Description: Material and its processing effect the relative structure contains small flaws whose size and distribution.  These may vary from nonmetallic inclusions and micro voids to weld defects, grinding cracks, quench cracks, surface laps, etc. The objective of a Fracture Mechanics analysis is to determine if these small flaws will grow into large enough cracks to cause the component to fail catastrophically. By using fracture mechanics theories i.e. LEFM approach, applied to two dimensional objects such as plates and shells etc. The aim of this paper is to estimate numerically the beneficial effect of a plate with hole and bounded single and double side patches are symmetrically bonded on the top and bottom on surface for repairing crack using the finite element method. An observed the change in stress intensity factor along the crack length by using FRANC-2D/L simulation software. The obtained results show the reduction of stress intensity factors. The effects of the adhesive, patch and plate properties on the rate of reduction of the stress intensity factors are highlighted.