Photonics packaging, integration, and interconnects VII
Subtitle: 23-25 January, 2007, San Jose, California, USA
By: Allen M. Earman, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering.
Contributors: Earman, Allen M.; Chen, Ray T.; Society of Photo-optical Instrumentation Engineers.
Series: Proceedings of SPIE -- v. 6478; Proceedings of SPIE--the International Society for Optical Engineering -- v. 6478.
Publisher: SPIE
Published: 2007
Place of publication: Bellingham, Wash
Language: eng
ISBN-13: 9780819465917
Subjects: Optoelectronic devices -- Design and construction -- Congresses; Optical interconnects -- Congresses; Microelectronic packaging -- Congresses; Photonics -- Congresses
Genres: Congresses
Other titles: Photonics packaging and integration VI.
Notes: An earlier conference was called: Photonics packaging and integration VI.

Includes bibliographical references and author index.