1994 IEEE Hong Kong Electron Devices Meeting
Subtitle: proceedings, July 18, 1994, the Hong Kong University of Science & Technology
By: sponsored by IEEE Electron Devices Society, the Hong Kong University of Science & Technology.
Contributors: IEEE Electron Devices Society.; Hong Kong University of Science and Technology.
Publisher: Institute of Electrical and Electronics Engineers; IEEE Service Center
Published: 1994
Place of publication: [New York]; Piscataway, N.J
Language: eng
Number of pages: 65
Subjects: Electronic apparatus and appliances -- Congresses.; Solid state electronics -- Congresses.
Notes: Includes bibliographical references.
"IEEE cat. no. 94TH0704-7."