Thermal modeling and design of electronic systems and devices
Subtitle: presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Dallas, Texas, November 25-30, 1990
By: sponsored by the Heat Transfer Division, ASME ; edited by R.A. Wirtz, G.L. Lehmann.
Contributors: Wirtz, R. A.; Lehmann, G. L.; American Society of Mechanical Engineers. Heat Transfer Division.
Series: HTD ;; vol. 153; HTD (Series) ;; v. 153.
Publisher: American Society of Mechanical Engineers
Published: 1990
Place of publication: New York, N.Y
Language: eng
Number of pages: 101
Subjects: Electronic apparatus and appliances -- Cooling -- Mathematical models -- Congresses.; Heat -- Transmission -- Mathematical models -- Congresses.
Notes: Includes bibliographical references.