Semiconductor machining at the micro-nano scale
By: edited by Jiwang Yan and John Patten.
Publisher: Transworld Research Network
Published: 2007
Place of publication: Kerala, India
Language: eng
Number of pages: 360
ISBN-13: 9788178953014
Subjects: Semiconductors -- Design and construction; Electronic industries; Semicondutores
Notes: Includes bibliographical references and index.
Table of contents: title: Part 1/ SINGLE- POINT MACHINING PROCESSES: Surface and subsurface integrity in ductile machining of semiconductor materials/ Jiwang Yan; title: Numerical simulations and cutting experiments on single point diamond machining of semiconductors and ceramics / John A. Patten, Jerry Jacob, Biswarup Bhattacharya, Andrew Grevstad, Ning Fang and Eric R. Marsh; title: Ductile machining and high pressure phase transformations of semiconductor crystals / Renato Goulart Jasinevicius, Jaime Gilberto Duduch and Paulo Sergio Pizani.; title: Part 2/ CHARACTERIZATION OF DEFORMATION MECHANISMS: Microstructural cahnges in silicon caused by indentation and machining / L. C. Zhang; title: MD simulation of semiconductor micromachining / Hiroaki Tanaka and Shoichi Shimada.; title: Part 3/ ABRASIVE MACHINING PROCESSES: Grinding of silicon wafers in the nano-technology era / Z.J. Pei, Z. C. Li and G. R. Fisher; title: Single-crystalline and poly-crystalline silicon wafer production using slurry wire for wafer slicing with micro-and nano-scale rolling-indenting / Sumeet Bhagavat and Imin Kao; title: Tribo-metrology of CMP / Norm V. Gitts; title: Part 4/ HYBRID AND LASER MACHINING: Semiconductor nanofabrication by combining nanoscale machining with wet etching / Noboiru Morita and Noritaka Kawasegi; title: Laser machining of semiconductor devices / Maher S. Amer.