Stress-induced phenomena in metallization
Subtitle: Seventh International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004
By: editors, Paul S. Ho ... [et al.].
Contributors: Ho, P. S.
Series: AIP conference proceedings,; v. 741; AIP conference proceedings ;; no. 741.
Publisher: American Institute of Physics
Published: 2004
Place of publication: Melville, N.Y
Language: eng
Number of pages: 272
Subjects: Semiconductors -- Defects -- Congresses.; Integrated circuits -- Defects -- Congresses.; Interconnects (Integrated circuit technology) -- Defects -- Congresses.; Dielectric films -- Defects -- Congresses.; Metallic films -- Defects -- Congresses.; Thin film devices -- Defects -- Congresses.; Copper -- Electric properties -- Congresses.; Metallizing -- Congresses.; Electrodiffusion -- Congresses.; Damascening -- Congresses.
Genres: Congresses.
Other titles: Stress induced phenomena in metallization
Notes: Includes bibliographical references and indexes.
"Held at the University of Texas at Austin"--Pref.
Also available via the World Wide Web.
Table of contents: title: Fracture and reliability for low k dielectrics; title: Electromigration; title: Thermal stresses and void formation.