Applications of experimental mechanics to electronic packaging
Subtitle: presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
By: sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling.
Contributors: Suhling, J. C.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.; American Society of Mechanical Engineers. Applied Mechanics Division.; International Mechanical Engineering Congress and Exposition (1995 : San Francisco, Calif.)
Series: EEP ;; vol. 13; AMD ;; vol. 214; EEP (Series) ;; vol. 13.; AMD (Series) ;; v. 214.
Publisher: American Society of Mechanical Engineers
Published: 1995
Place of publication: New York
Language: eng
Number of pages: 117
Subjects: Electronic packaging -- Congresses.; Mechanics, Applied -- Congresses.
Notes: Includes bibliographical references and index.