I-THERM IV
By: May 4-7, 1994, Washington Hilton, Washington, DC, USA ; InterSociety Conference on Thermal Phenomena in Electronic Systems ; co-sponsored by ... the K-16 Committee on Heat Transfer in Electronic Equipment, Heat Transfer Division, American Society of Mechanical Engineers (ASME) ... [et al.]
Contributors: American Society of Mechanical Engineers. K-16 Committee on Heat Transfer in Electronic Equipment.; Components, Packaging & Manufacturing Technology Society.
Publisher: Institute of Electrical and Electronics Engineers
Published: 1994
Place of publication: [New York]
Language: eng
Number of pages: 292
Subjects: Electronic apparatus and appliances -- Thermal properties -- Congresses.; Concurrent engineering -- Congresses.
Other titles: I-THERM 4.; I-THERM four.; Thermal phenomena in electronic systems.; Concurrent engineering and thermal phenomena.
Notes: Theme: Concurrent engineering and thermal phenomena.

"IEEE catalog number: 94CH3340-7"--T.p. verso.

"Principal sponsor, the IEEE-CPMT Society"--P. iii.

Includes bibliographical references.