A wafer chuck for use between -196 and 350⁰C
By: R. Y. Koyama and M. G. Buehler.
Contributors: Buehler, Martin G., joint author.; United States. Division of Electric Energy Systems.; United States. Defense Advance Research Projects Agency.
Series: Semiconductor measurement technology; National Bureau of Standards special publication ; 400-55; NBS special publication ;; 400-55.
Publisher: U.S. Dept. of Commerce, National Bureau of Standards : for sale by the Supt. of Docs., U.S. Govt. Print. Off.
Published: 1979
Place of publication: Washington
Language: eng
Number of pages: 17
Subjects: Semiconductors -- Testing -- Equipment and supplies.; Probes (Electronic instruments)
Notes: Bibliography: p. 13.
"Sponsored by Division of Electric Energy Systems, Department of Energy and the Defense Advanced Research Projects Agency."