Proceedings, 1997 IEEE Multi-Chip Module Conference
Subtitle: February 4-5, 1997, Santa Cruz, California
By: sponsored by IEEE Computer Society ... [et al.].
Contributors: IEEE Computer Society.
Publisher: IEEE Computer Society Press
Published: 1997
Place of publication: Los Alamitos, Calif
Language: eng
Number of pages: 171
Subjects: Multichip modules (Microelectronics) -- Congresses; Thin films -- Congresses; Neural networks (Computer science) -- Congresses; CAD/CAM systems -- Congresses; Optoelectronic devices -- Congresses
Genres: Congresses.
Other titles: 1997 IEEE Multi-Chip Module Conference.; IEEE Multi-Chip Module Conference.
Notes: "IEEE catalog number 97CB36039"--T.p. verso.

Includes bibliographical references and author index.
Table of contents: title: Session 1. Flip-chip I; title: Session II. Mixed signal MCMs; title: Session III. MCM design and CAD; title: Session IV: Panel: The best road to integration? Single chip or multi-chip?; title: Session V: Interconnect analysis and simulation; title: Session VI. Flip-chip II; title: Session VII. Test, technology and infrastructure; title: Session VIII: Optical MCMs; title: Session IX: Wrap up panel; title: Author index.