Microelectronics technology
Subtitle: polymers for advanced imaging and packaging : developed from a symposium sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc., and the Polymers for Microelectronics Division of the Society of Polymer Science, Japan, at the 209th National Meeting of the American Chemical Society, Anaheim, California, April 2-6, 1995
By: Elsa Reichmanis ... [et al., editors].
Contributors: Reichmanis, Elsa, 1953-; American Chemical Society. Division of Polymeric Materials: Science and Engineering.; Kōbunshi Gakkai (Japan). Polymers for Microelectronics Division.; American Chemical Society. Meeting
Series: ACS symposium series ;; 614
Publisher: American Chemical Society
Published: 1995
Place of publication: Washington, DC
Language: eng
Number of pages: 563
Subjects: Microelectronic packaging -- Materials -- Congresses.; Polymers -- Congresses.; Photoresists -- Congresses.
Notes: Includes bibliographical references and indexes.