Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages
By: P.-E. Tegehall, B.D. Dunn
Contributors: European Space Agency; Dunn, Barrie D., 1945-
Series: ESA STM -- 267
Publisher: ESA Publications Division
Published: 2003
Place of publication: Noordwijk
Language: eng
Number of pages: 40
Subjects: Ball grid array technology
Notes: "March 2003."

Includes bibliographical references.