Analysis of the effects of aperture geometry on print quality in solder paste stenciling
By: by Keith Eric Monaghan.
Series: Master's theses (State University of New York at Binghamton) -- no. 2128
Published: 1995
Language: eng
Number of pages: 69
Subjects: Electronic packaging.; Surface mount technology.; Solder pastes.; Stencils and stencil cutting.
Other titles: Aperture geometry; Print quality in solder paste stenciling; Solder paste stenciling
Notes: Thesis (M.S.E.E.) -- State University of New York at Binghamton, Watson School of Engineering and Applied Science, 1995.

Includes bibliographical references.