Structural analysis in microelectronics and fiber optics, 1997
Subtitle: presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
By: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir.
Contributors: Suhir, Ephraim.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.; International Mechanical Engineering Congress and Exposition (1997 : Dallas, Tex.)
Series: EEP ;; vol. 21; EEP (Series) ;; vol. 21.
Publisher: American Society of Mechanical Engineers
Published: 1997
Place of publication: New York
Language: eng
Number of pages: 272
Subjects: Microelectronic packaging -- Congresses.; Fiber optics -- Congresses.; Structural analysis (Engineering) -- Congresses.
Notes: Includes bibliographical references and author index.