Influence of cooling hole geometry and material conductivity on the thermal response of cooled silicon nitride plate
By: Ali Abdul-Aziz, Ramakrishna T. Bhatt, Morris Girgis.
Contributors: Bhatt, Ramakrishna T.; Girgis, Morris.; NASA Glenn Research Center.
Series: NASA/TM -- 2002-211688.; NASA technical memorandum -- 211688.
Publisher: National Aeronautics and Space Administration, Glenn Research Center; Available from NASA Center for AeroSpace Information
Published: 2002
Place of publication: Cleveland, Ohio; Hanover MD
Language: eng
Format: Microform
Subjects: Ceramics.; Finite elements.; Cooling plates.; Silicon nitride.; Stress analysis.; Cooling channels.
Notes: Shipping list no.: 2003-0312-M.

"November 2002."

Also available via Internet from the NASA web site. Address as of 2/18/04: http://gltrs.grc.nasa.gov/reports/2002/TM-2002-211688.pdf; current access available via PURL.

Microfiche. [Washington, D.C. : National Aeronautics and Space Administration, 2003] 1 microfiche.