Wafer scale integration, II
Subtitle: proceedings of the Second IFIP WG 10.5 Workshop on Wafer Scale Integration, Egham, England, 23-25 September 1987
By: edited by R.M. Lea.
Contributors: Lea, R. M., 1943-
Publisher: North-Holland; Sole distributors for the U.S.A. and Canada, Elsevier Science Pub. Co.
Published: 1988
Place of publication: Amsterdam; New York; New York, N.Y., U.S.A
Language: eng
Number of pages: 249
Subjects: Integrated circuits -- Very large scale integration -- Congresses; Semiconductor wafers -- Congresses
Notes: Includes bibliographies.