Chemical-Mechanical Planarization of Semiconductor Materials
By: edited by Michael R. Oliver
Series: Springer Series in Materials Science -- 69; Springer Series in Materials Science -- 69
Publisher: Springer Berlin Heidelberg
Published: 2004
Place of publication: Berlin, Heidelberg
Language: eng
Format: [electronic resource] /
Number of pages: 428
ISBN-13: 9783642077388; 9783662062340
Subjects: Physical organic chemistry; Electronics; Structural control (Engineering); Surfaces (Physics); Optical materials
Description: This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
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Table of contents: title: Introduction; title: CMP Technology; title: Metal Polishing Processes; title: Metal CMP Science; title: Equipment Used in CMP Processes; title: CMP Polishing Pads; title: Fundamentals of CMP Slurry; title: CMP Cleaning; title: Patterned Wafer Effects; title: Integration Issues of CMP; title: Appendix: Pourbaix Diagrams.