Cryogenic and immersion cooling of optics and electronic equipment
Subtitle: presented at AIAA/ASME Thermophysics and Heat Transfer Conference, June 18-20, 1990, Seattle, Washington
By: sponsored by the Heat Transfer Division, ASME ; edited by T.W. Simon, S. Oktay.
Contributors: Simon, T. W.; Oktay, S.; American Society of Mechanical Engineers. Heat Transfer Division.; American Society of Mechanical Engineers. K-16 Committee on Heat Transfer in Electronic Equipment.; AIAA/ASME Thermophysics and Heat Transfer Conference (5th : 1990 : Seattle, Wash.)
Series: HTD ;; vol. 131; HTD (Series) ;; v. 131.
Publisher: American Society of Mechanical Engineers
Published: 1990
Place of publication: New York, N.Y
Language: eng
Number of pages: 52
Subjects: Electronic apparatus and appliances -- Cooling -- Congresses.; Optical instruments -- Cooling -- Congresses.; Low temperature engineering -- Congresses.
Notes: Includes bibliographical references.
"Sponsored by the K-16 Committee on Heat Transfer in Electronic Equipment"--P. iii.
"H00584"--P. [4] of cover.