Electronic packaging of high speed circuitry
By: Stephen G. Konsowski, Arden R. Helland ; drawings by Darnetta Anderson and Robert L. Thing, Jr.
Contributors: Helland, Arden R.
Series: Electronic packaging and interconnection series
Publisher: McGraw-Hill
Published: 1997
Place of publication: New York
Language: eng
Number of pages: 445
Subjects: Electronic packaging.; Microwave devices -- Design and construction.
Description: This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging.

This state-of-the-art resource also provides you with practical design guidelines - plus information on the major issues of design verification and performance evaluation.
Notes: Includes bibliographical references and index.