Chemical-mechanical planarization
Subtitle: symposium held April 22-24, 2003, San Francisco, California, U.S.A.
By: editors: Duane S. Boning ... [et al.].
Contributors: Boning, Duane S.; Materials research Society. Meeting; Symposium on Chemical-Mechanical Planarization (2003 : San Francisco, Calif.)
Series: Materials Research Society symposium proceedings ;; 767; Materials Research Society symposia proceedings ;; v. 767.
Publisher: Materials Research Society; Cambridge University Press
Published: 2003
Place of publication: Warrendale, Pa
Language: eng
Number of pages: 348
Subjects: Microelectronics -- Materials -- Congresses.; Grinding and polishing -- Congresses.; Metals -- Pickling -- Congresses.; Semiconductors -- Surfaces -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and indexes.
"The papers in this proceedings were presented at Symposium F, 'Chemical-Mechanical Planarization,' held April 22-24 at the 2003 MRS Spring Meeting in San Francisco, California ..."--p. xi.