Semiconductor wafer bonding
Subtitle: science, technology, and applications VI : proceedings of the international symposium
By: editors, H. Baumgart ... [et al.] ; sponsoring Division: Electronics.
Contributors: Baumgart, H.; Electrochemical Society. Electronics Division.
Series: Proceedings ;; v. 2001-27; Proceedings (Electrochemical Society) ;; v. 2001-27.
Publisher: Electrochemical Society
Published: 2002
Place of publication: Pennington, NJ
Language: eng
Number of pages: 294
Subjects: Semiconductors -- Bonding -- Congresses.; Semiconductor wafers -- Congresses.; Microelectromechanical systems -- Design and construction -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and indexes.
"The Sixth International Symposium on Wafer Bonding: Science, Technology and Applications was held in September 2001 in San Francisco as part of the 2001 Fall Meeting of the Electrochemical Society"--Pref.