Thermal shock testing for assuring reliability of glass-sealed microelectronic packages
By: Walter B. Thomas III, Michael D. Lewis.
Contributors: Lewis, Michael D., 1937-; Goddard Space Flight Center.
Series: NASA technical memorandum -- 104537.
Publisher: National Aeronautics and Space Administration, Goddard Space Flight Center; For sale by the National Technical Information Service]
Published: 1991
Place of publication: Greenbelt, Md; [Springfield, Va
Language: eng
Format: Microform
Subjects: Quality assurance.
Notes: Distributed to depository libraries in microfiche.

Microfiche. [Washington, D.C.? : National Aeronautics and Space Administration], 1991. 1 microfiche.