Proceedings
Subtitle: IMAPS Conference and Exhibition on Ceramic Interconnect Technology : the next generation : April 7-9 2003, The Westin Hotel, Denver, Colorado
By: sponsored by International Microelectronics and Packaging Society (IMAPS) & Ceramic Interconnect Initiative ; endorsed by the American Ceramic Society (ACerS).
Contributors: International Microelectronics and Packaging Society. Ceramic Interconnect Initiative.; American Ceramic Society.
Series: SPIE proceedings series -- v. 5231; Proceedings of SPIE--the International Society for Optical Engineering -- v. 5231.
Publisher: SPIE
Published: 2003
Place of publication: Bellingham, Wash., USA
Language: eng
Number of pages: 254
Subjects: Electronic ceramics -- Congresses; Interconnects (Integrated circuit technology) -- Congresses; Ceramic materials -- Industrial applications -- Congresses; Wireless communications systems -- Congresses
Genres: Congresses.
Other titles: IMAPS Conference and Exhibition on Ceramic Interconnect Technology; Ceramic interconnect technology :; 2003 Ceramic Interconnect Technology Conference; Ceramic Interconnect Technology
Notes: "Assembled and edited by the Technical Program Committee and the IMAPS staff".--t.p. verso.

Includes bibliographical references and index.