Photonics packaging and integration IV
Subtitle: 29 January 2003, San Jose, California, USA
By: Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering.
Contributors: Heyler, Randy A.; Chen, Ray T.; Society of Photo-optical Instrumentation Engineers.
Series: SPIE proceedings series,; v. 5358; Proceedings of SPIE--the International Society for Optical Engineering ;; v. 5358.
Publisher: SPIE
Published: 2004
Place of publication: Bellingham, Wash., USA
Language: eng
Number of pages: 168
Subjects: Optoelectronic devices -- Design and construction -- Congresses.; Microelectronic packaging -- Congresses.; Optical interconnects -- Congresses.; Photonics -- Congresses.
Genres: Congresses.
Other titles: Photonics packaging and integration 4; Photonics packaging and integration four; Optoelectronic interconnects. Photonics packaging and integration
Notes: Includes bibliographical references and index.
Earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration