Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Subtitle: Wafer-Level Transfer Packaging and Fabrication Techniques Using ...
Publisher: Springer
Published: Apr 28, 2018
Format: hardcover
Number of pages: 115
ISBN-13: 9783319778716
Notes: Source title: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using ... (Springer Series in Advanced Manufacturing)