Influence of temperature on microelectronics and system reliability
By: Pradeep Lall, Michael G. Pecht, Edward B. Hakim.
Contributors: Pecht, Michael.; Hakim, Edward B.
Series: The electronic packaging series
Publisher: CRC Press
Published: 1997
Place of publication: Boca Raton
Language: eng
Number of pages: 307
Subjects: Microelectronics -- Materials -- Thermal properties.; Electronic packaging.; Electronic apparatus and appliances -- Reliability.
Notes: Includes bibliographical references (p. 257-291) and index.