Proceedings of the ASME Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS--2011
Subtitle: presented at ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS : July 6-8, 2011, Portland, Oregon, USA
Contributors: Suhling, J. C. (Jeffrey C.); Ishizuka, Masaru; Tonapi, Sandeep Shrikant; American Society of Mechanical Engineers. Electronic and Photonic Packaging Division
Publisher: American Society of Mechanical Engineers
Published: 2012
Place of publication: New York
Language: eng
ISBN-13: 9780791844618; 9780791844625
Subjects: Congresses; Electronic packaging
Other titles: InterPACK '11; 2011 proceedings of the ASME Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS; IPACK2011
Notes: Includes bibliographical references and index.