Advances in Electronic Packaging, 1995: Proceedings of the International Intersociety Electronic Packaging Conference, Interpack '95
Subtitle: Presented at the (Ice)
Publisher: American Society of Mechanical Engineers
Published: January 1995
Language: eng
Format: Hardcover
Number of pages: 1348
ISBN-13: 9780791813034
Subjects: Electronics engineering; Electronics - General; Technology & Industrial Arts