Electronic and photonics packaging, electrical systems design and photonics, and nanotechnology--[2004]
Subtitle: presented at 2004 ASME International Mechanical Engineering Congress and Exposition : November 13-19, 2004, Anaheim, California, USA
By: sponsored by the Electronic and Photonic Packaging Division, ASME.
Contributors: American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.; International Mechanical Engineering Congress and Exposition (2004 : Anaheim, Calif.)
Series: EPP -- vol. 4.; EPP (Series) -- v. 4.
Publisher: ASME
Published: 2004
Place of publication: New York, N.Y
Language: eng
Number of pages: 586
Subjects: Electronic packaging -- Congresses.; Photonics -- Congresses.; Nanotechnology -- Congresses.; Microelectronic packaging -- Congresses.; Surface mount technology -- Congresses.; Microelectromechanical systems -- Congresses.; Integrated circuits -- Wafer-scale integration -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and author index.