Plastics for electronics
By: edited by Martin T. Goosey.
Contributors: Goosey, Martin T.
Publisher: Elsevier Applied Science Publishers; Sole distributor in the USA and Canada, Elsevier Science Pub. Co.
Published: 1985
Place of publication: London; New York; New York, NY, USA
Language: eng
Number of pages: 380
Subjects: Electronics -- Materials.; Plastics.
Notes: Includes bibliographies and index.
Table of contents: title: Introduction to plastics and their important properties for electronic applications / Martin T. Goosey; title: Fundamental properties of polymers for electronic applications / J. Comyn; title: Silicone protective encapsulants and coatings for electronic components and circuits / J.H. Davis; title: Epoxide resins and their formulation / Martin T. Goosey; title: Plastic encapsulation of semiconductors by transfer moulding / Martin T. Goosey; title: Plastic encapsulated device reliability / R.P. Merrett; title: Polymers for semiconductor processing / S. Clements; title: Plastics for telecommunications / M.C.W. Cottrill; title: Plastics for printed wiring substrates / R. Hurditch; title: Other materials and their applications in electronics / Martin T. Goosey.