Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003)
Subtitle: 10-12 December, 2003, Pan Pacific Hotel, Singapore
By: edited by Mahadevan K. Iyer, Toh Kok Chuan, Mui Yew Cheong ; organised by IEEE Reliability/CPMT/ED Singapore Chapter ; technically co-sponsored by IEEE CPMT Society, IMAPS.
Contributors: Iyer, Mahadevan K.; Toh, Kok Chuan.; Mui, Yew Cheong.; IEEE Reliability/CPMT/ED Singapore Chapter.; Components, Packaging & Manufacturing Technology Society.; International Microelectronics and Packaging Society.
Publisher: IEEE
Published: 2003
Place of publication: Piscataway, N.J
Language: eng
Number of pages: 827
Subjects: Electronic packaging -- Congresses.; Microelectronics -- Congresses.
Genres: Congresses.
Other titles: EPTC 2003; Proceedings, EPTC 2003; 5th Electronics Packaging Technology Conference
Notes: Includes bibliographic references and author index.
"IEEE Catalog Number 03EX766 Bound Edition ; 03EX766C CD-ROM Edition"--T.p. verso.