International Symposium on Advanced Packaging Materials
Subtitle: processes, properties and interfaces : proceedings : Chateau Elan, Braselton, Georgia, March 14-17, 1999
By: co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, C.P. Wong ... [et al.].
Contributors: Wong, C. P., 1947-; International Microelectronics and Packaging Society.
Publisher: IMAPS; IEEE
Published: 1999
Place of publication: Reston, Virginia; Piscataway, New Jersey
Language: eng
Number of pages: 362
Subjects: Electronic packaging -- Materials -- Congresses.
Genres: Congresses.
Other titles: Advanced packaging materials
Notes: Includes bibliographic references and index.
"... IEEE Catalog Number 99TH8405"--verso of T.p.