Soldering processes and equipment
By: edited by Michael G. Pecht.
Contributors: Pecht, Michael.
Publisher: Wiley
Published: 1993
Place of publication: New York
Language: eng
Number of pages: 296
Subjects: Electronic packaging -- Materials; Solders and soldering; Surface mount technology
Notes: Includes bibliographical references and index.
"A Wiley-Interscience publication."