Stress-induced phenomena in metallization
Subtitle: Tenth International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 5-7 November 2008
By: editors, Paul S. Ho, Shinichi Ogawa, Ehrenfried Zschech ; sponsoring organization, the University of Texas at Austin
Contributors: Ho, P. S.; Ogawa, Shinichi, Dr; Zschech, Ehrenfried
Series: AIP conference proceedings -- v. 1143; AIP conference proceedings -- no. 1143.
Publisher: American Institute of Physics
Published: 2009
Place of publication: Melville, N.Y
Language: eng
Number of pages: 233
ISBN-13: 9780735406803
Subjects: Copper; Metal-metal bonds; Strength of materials; Semiconductors; Nanostructured materials; Congresses; Defects; Electric properties; Interconnects (Integrated circuit technology)
Other titles: Tenth International Workshop on Stress-Induced Phenomena in Metallization; International Workshop on Stress-Induced Phenomena in Metallization
Notes: Includes bibliographical references and index.
Table of contents: title: Electromigration in copper interconnects; title: Low-K dielectrics and barrier layers; title: Microstructure and stress behavior of Cu structures; title: Chip package interaction, nanostructures and 3D interconnects.