Proceedings
Subtitle: 4th International Symposium on Advanced Packaging Materials : processes, properties and interfaces : Chateau Elan, Braselton, Georgia, March 15-18, 1998
By: co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, C.P. Wong.
Contributors: Wong, C. P., 1947-; International Microelectronics and Packaging Society.
Publisher: IMAPS; IEEE
Published: 1998
Place of publication: Reston, Virginia; Piscataway, New Jersey
Language: eng
Number of pages: 300
Subjects: Electronic packaging -- Materials -- Congresses.
Other titles: 4th International Symposium on Advanced Packaging Materials; 4th International Symposium and Exhibition on Advanced Packaging Materials; 1998 proceedings, International Symposium and Exhibition on Advanced Packaging Materials
Notes: Includes bibliographical references and author index.
"IEEE catalog number 98EX153"--verso of T.p.