ISTFA '91
Subtitle: proceedings of the 17th International Symposium for Testing & Failure Analysis
By: sponsored by the Electronic Materials and Processing Division of ASM International.
Contributors: ASM International. Electronic Materials and Processing Division.
Publisher: ASM International
Published: 1991
Place of publication: Materials Park, Ohio
Language: eng
Number of pages: 565
Subjects: Electronics -- Materials -- Testing -- Congresses.; Electronic apparatus and appliances -- Testing -- Congresses.
Notes: Conference held Los Angeles, Calif., Nov. 11-15, 1991.

Includes bibliographical references.