Low Dielectric Constant Materials for IC Applications
By: edited by Paul S. Ho, Jihperng Jim Leu, Wei William Lee
Contributors: Leu, Jihperng Jim; Lee, Wei William
Series: Springer Series in Advanced Microelectronics -- 9; Springer series in advanced microelectronics -- 9.
Publisher: Springer Berlin Heidelberg
Published: 2003
Place of publication: Berlin, Heidelberg
Language: eng
Format: [electronic resource] /
Number of pages: 310
ISBN-13: 9783642632211; 9783642559082
Subjects: Electronics; Surfaces (Physics); Optical materials
Description: Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.
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Table of contents: title: Overview on Low Dielectric Constant Materials for IC Applications; title: Materials Issues and Characterization of Low-k Dielctric Materials; title: Structure and Property Characterization of Low-k Dielectric Porous Thin Films Determined by X-Ray Reflactivity and Small-Angle Neutron Scattering; title: Vapor Deposition of Low-k Polymeric Dielectrics; title: Plasma Enhanced Chemical Vapor Deposition of FSG and a-C: Low-k Materials; title: Porous Organosilicates for ON-Chip Applications: Dielectric Generational Extendibility by the Introduction of Porosity; title: Metal/Polymer Interfacial Interactions; title: Diffusion of Metals in Polymers and During Metal-Polymer Interface Formation; title: Plasma Etching of Low Dielectric Constant Materials; title: Integration of SiLK Semiconductor Dielectric.