Sensors in electronic packaging
Subtitle: presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
By: sponsored by the Manufacturing Engineering Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh.
Contributors: Ume, Charles.; Chao, Pin-Yeh.; American Society of Mechanical Engineers. Manufacturing Engineering Division.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.; International Mechanical Engineering Congress and Exposition (1995 : San Francisco, Calif.)
Series: MED ;; vol. 3; EEP ;; vol. 14; MED (Series) ;; v. 3.; EEP (Series) ;; vol. 14.
Publisher: American Society of Mechanical Engineers
Published: 1995
Place of publication: New York
Language: eng
Number of pages: 123
Subjects: Electronic packaging -- Equipment and supplies -- Congresses.; Detectors -- Industrial applications -- Congresses.
Notes: Includes bibliographical references and index.