Three-dimensional molded interconnect devices (3D-MID)
Subtitle: materials, manufacturing, assembly, and applications for injection molded circuit carriers
By: Jörg Franke
Publisher: Hanser Publishers; Hanser Publications
Published: 2014
Place of publication: Munich; Cincinnati, OH
Language: eng
Number of pages: 356
ISBN-13: 9781569905517
Subjects: Interconnects (Integrated circuit technology); Design and construction; Injection molding of plastics
Work titles: Räumliche elektronische Baugruppen (3D-MID)
Notes: Includes bibliographical references (pages 307-323) and index.