Area Array Package Design
Subtitle: Techniques in High Density Electronics
Edition: 1 edition
Publisher: McGraw-Hill Professional
Published: October 24, 2003
Language: eng
Format: Hardcover
Number of pages: 204
ISBN-13: 9780071428279
Subjects: Electronics engineering; Reference works; Technology & Industrial Arts; Engineering - Electrical & Electronic; Electronic Apparatus And Devices; Semiconductors; Technology; Science/Mathematics; Manufacturing; Electronics - Microelectronics; Technology / Electronics / Microelectronics; Electronic packaging; Electronics - General; Electronics - Semiconductors; Design
First sentence: The ideal electronic package is an economical and manufacturable electromechanical platform for one or more electronic devices that affords protection, facilitates handling, and provides the geometric translations and compatible interface required for connection to the next system level by practical assembly processes.