ISTFA '92
Subtitle: proceedings of the 18th International Symposium for Testing and Failure Analysis, 19-23 October 1992, Los Angeles, California
By: sponsored by the Electronic Materials and Processing Division of ASM International.
Contributors: ASM International. Electronic Materials and Processing Division.
Publisher: ASM International
Published: 1992
Place of publication: Materials Park, OH
Language: eng
Number of pages: 451
Subjects: Electronics -- Materials -- Testing -- Congresses.; Electronic apparatus and appliances -- Testing -- Congresses.
Notes: Includes bibliographical references.