Solder paste in electronics packaging
Subtitle: technology and applications in surface mount, hybrid circuits, and component assembly
By: Jennie S. Hwang.
Publisher: Van Nostrand Reinhold
Published: 1989
Place of publication: New York
Language: eng
Number of pages: 456
Subjects: Printed circuits -- Design and construction.; Solder pastes.; Surface mount technology.
Notes: Includes bibliographies and index.