CAE/CAD and thermal management issues in electronic systems
Subtitle: presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
By: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.].
Contributors: Agonafer, D.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.; International Mechanical Engineering Congress and Exposition (1997 : Dallas, Tex.)
Series: EEP ;; vol. 23; HTD ;; vol. 356; EEP (Series) ;; vol. 23.; HTD (Series) ;; v. 356.
Publisher: American Society of Mechanical Engineers
Published: 1997
Place of publication: New York
Language: eng
Number of pages: 109
Subjects: Electronic apparatus and appliances -- Temperature control -- Congresses.; Electronic packaging -- Design -- Data processing -- Congresses.; Heat -- Transmission -- Data processing -- Congresses.; Heat sinks (Electronics) -- Congresses.; Computer-aided engineering -- Congresses.
Notes: Includes bibliographical references and index.