Proceedings of the International Symposium on Thin Film Materials, Processes, Reliability, and Applications, Thin Film Processes
By: editors, G. S. Mathad, M. Meyyappan, M. Engelhardt ; Dielectric Science & Technology, Electronics, and Electrodeposition Divisions.
Contributors: Mathad, G. S.; Meyyappan, M.; Engelhardt, M.; Electrochemical Society. Dielectric Science and Technology Division.; Electrochemical Society. Electronics Division.; Electrochemical Society. Electrodeposition Division.; Electrochemical Society. Meeting; International Society of Electrochemistry. Meeting
Series: Proceedings / Electrochemical Society ;; v. 97-30; Proceedings (Electrochemical Society) ;; v. 97-30.
Publisher: Electrochemical Society
Published: 1998
Place of publication: Pennington, NJ
Language: eng
Number of pages: 370
Subjects: Thin film devices -- Design and construction -- Congresses.; Thin films -- Congresses.; Plasma etching -- Congresses.
Other titles: Thin film processes
Notes: Includes bibliographical references and indexes.
"Held as a part of the Joint International Meeting of the Electrochemical Society, Inc. and the International Society for Electrochemistry in Paris, France, Aug. 31-Sept. 5, 1997"--P. iii.