Felületszerelési technológia az elektronikában
By: szerkesztette, Laczkó Béla.
Contributors: Laczkó, Béla.
Series: Témadokumentációs kiadványok,; 153. sz.
Publisher: OMIKK
Published: 1988
Place of publication: Budapest
Language: hun
Number of pages: 124
Subjects: Electronic packaging.; Surface mount technology.