Electromigration in thin films and electronic devices
Subtitle: materials and reliability
By: edited by Choong-Un Kim
Series: Woodhead Publishing in materials; Woodhead Publishing in materials
Publisher: Woodhead Publishing
Published: 2011
Place of publication: Oxford; Philadelphia
Language: eng
Number of pages: 340
ISBN-13: 9781845699376; 9780857093752
Subjects: Electrodiffusion; Integrated circuits; Deterioration; Thin films; Interconnects (Integrated circuit technology)
Notes: Includes bibliographical references and index.
Table of contents: title: Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang; title: Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa; title: Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht.