Multichip module technology handbook
By: Philip E. Garrou, Iwona Turlik.
Contributors: Turlik, Iwona.
Series: Electronic packaging and interconnection series
Publisher: McGraw-Hill
Published: 1998
Place of publication: New York
Language: eng
Subjects: Multichip modules (Microelectronics); Microelectronic packaging.; Integrated circuits -- Very large scale integration -- Design and construction.
Notes: Includes bibliographical references and index.