Electronics packaging technology conference
Subtitle: proceedings of 6th Electronics Packaging Technology Conference : (EPTC 2004) : 8-10 December, 2004, Pan Pacific Hotel, Singapore
By: edited by, Kok Chuan Toh ... [et al.] ; organised by : IEEE Reliability/CPMT/ED Singapore Chapter ; technically co-sponsored by IEEE CPMT Society, IMAPS.
Contributors: Toh, Kok Chuan.; IEEE Reliability/CPMT/ED Singapore Chapter.; Components, Packaging & Manufacturing Technology Society.; International Microelectronics and Packaging Society.
Publisher: IEEE
Published: 2004
Place of publication: Piscataway, N.J
Language: eng
Number of pages: 804
Subjects: Electronic packaging -- Congresses.; Microelectronics -- Congresses.
Genres: Congresses.
Other titles: Proceedings of 6th Electronics Packaging Technology Conference; EPTC 2004
Notes: Includes bibliographical references and author index.
"IEEE Catalog Number 04EX971 Bound Edition ; 04EX971C CD-ROM Edition"--T.p. verso.
Also available via the World Wide Web.