Stress-induced phenomena in metallization
Subtitle: eleventh International Workshop on Stress-Induced Phenomena in Metallization, Bad Schandau, Germany, 12-14 April 2010
By: editors, Ehrenfried Zschech, Paul S. Ho, Shinichi Ogawa
Contributors: Zschech, Ehrenfried; Ho, P. S.; Ogawa, Shinʼichi
Series: AIP conference proceedings -- v. 1300; AIP conference proceedings -- no. 1300.
Publisher: American Institute of Physics
Published: 2010
Place of publication: Melville, N.Y
Language: eng
Number of pages: 257
ISBN-13: 9780735408555
Subjects: Copper; Metal-metal bonds; Strength of materials; Semiconductors; Nanostructured materials; Congresses; Defects; Electric properties; Interconnects (Integrated circuit technology)
Other titles: Eleventh International Workshop on Stress-Induced Phenomena in Metallization; International Workshop on Stress-Induced Phenomena in Metallization
Notes: Includes bibliographical references and index.