Chip Scale Package
Subtitle: Design, Materials, Process, Reliability, and Applications
Publisher: McGraw-Hill Professional
Published: February 28, 1999
Language: eng
Number of pages: 564
ISBN-13: 9780070383043
Description: The first comprehensive, in-depth guide to chip scale packaging (CSP), this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT).

Featuring the latest design techniques, plus details on more than 40 different types of CSP, hands engineers and designers the complete, professional set of working tools to: solve technical and design issues; find the most efficient, cost-effective CSP solutions for deployments; answer questions on interfacing, speed, robustness, and more; compare properties of wirebonds, flip chips, rigid and flex substrates, wafer-level redistribution, and other CSP products; get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM, and other major companies; and learn about CSP products under development.