IWIPP proceedings
Subtitle: IEEE International Workshop on Integrated Power Packaging : the Congress Plaza Hotel, Chicago, Illinois, USA, September 17-19, 1998
By: [sponsors, IEEE Components, Packaging & Manufacturing Technology Society] ... [et al.].
Contributors: Components, Packaging & Manufacturing Technology Society.
Publisher: IEEE
Published: 1998
Place of publication: Piscataway, NJ
Language: eng
Number of pages: 79
Subjects: Electronic packaging -- Congresses.; Power electronics -- Congresses.
Genres: Congresses.
Other titles: Integrated power packaging
Notes: Includes bibliographical references.
"IEEE Catalog Number: 98EX203"--verso of T.p.