International Symposium on Advanced Packaging Materials
Subtitle: processes, properties and interfaces : proceedings : Chateau Elan, Braselton, Georgia, March 11-14, 2001
By: co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, James E. Morris ... [et al.].
Contributors: Morris, James E., 1944-; International Microelectronics and Packaging Society.
Publisher: IMAPS; IEEE
Published: 2001
Place of publication: Washington, DC; Piscataway, New Jersey
Language: eng
Number of pages: 414
Subjects: Electronic packaging -- Materials -- Congresses.
Genres: Congresses.
Other titles: Advanced packaging materials; Proceedings
Notes: Includes bibliographical references and index.
"... IEEE Catalog Number 01TH8562"--T.p. verso.