Seventh annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA
Subtitle: 1995 proceedings
By: sponsored by IEEE Computer Society, IEEE Components, Packaging, & Manufacturing Technology Society ; edited by Stuart Tewksbury and Glenn Chapman.
Contributors: Chapman, Glenn.; Tewksbury, Stuart K.; IEEE Computer Society.; Components, Packaging & Manufacturing Technology Society.
Publisher: IEEE]; Distributed by IEEE Service Center
Published: 1995
Place of publication: [Piscataway, N.J
Language: eng
Number of pages: 382
Subjects: Integrated circuits -- Wafer-scale integration -- Congresses.
Other titles: 1995 IEEE International Conference on Wafer Scale Integration
Notes: "IEEE Catalog number 95CH3574-2"--T.p. verso.

Includes bibliographical references and index.