Advanced Ta-based diffusion barriers for Cu interconnects
By: René Hübner.
Publisher: Nova Science Publishers
Published: 2009
Place of publication: New York
Language: eng
Number of pages: 102
ISBN-13: 9781604564518
Subjects: Interconnects (Integrated circuit technology); Integrated circuits; Electrodiffusion
Notes: Includes bibliographical references (p. [81]-94) and index.