Chemical mechanical planarization IV
Subtitle: proceedings of the International Symposium
By: editors, R.L. Opila ... [et al.]
Contributors: Opila, R. L.; Electrochemical Society. Dielectric Science and Technology Division.; Electrochemical Society. Electronics Division.; Electrochemical Society. Meeting
Series: Proceedings ;; v. 2000-26.; Proceedings (Electrochemical Society) ;; v. 2000-26.
Publisher: Electrochemical Society, Inc.
Published: 2001
Place of publication: Pennington, NJ
Language: eng
Number of pages: 338
Subjects: Microelectronics -- Materials -- Congresses; Grinding and polishing -- Congresses; Metals -- Pickling -- Congresses; Integrated circuits -- Materials -- Congresses
Genres: Congresses.
Notes: Includes bibliographical references and indexes.
"Proceedings of the Fourth International Symposium on Chemical Mechanical Planarization (CMP) in Integrated Circuit (IC) Device Manufacturing held at the 198th Meeting of the Electrochemical Society held in Phoeniz, AZ from October 23 to October 25, 2000"--p. iii.
"Dielecric Science and Technology and Electronics Divisions."