Tribology In Chemical-Mechanical Planarization
Publisher: CRC
Published: March 1, 2005
Language: eng
Format: Hardcover
Number of pages: 200
ISBN-13: 9780824725679
Subjects: Technology: General Issues; Power Tools; Grinding and polishing; Science; Home Improvement / Construction; Science/Mathematics; Tribology; Engineering - General; Material Science; Technology / Material Science; Chemistry - General
First sentence: In the microelectronics community, the acronym CMP has been interpreted as either chemical-mechanical polishing or chemical-mechanical planarization.