Wafer Bonding
Contributors: M. Alexe (Editor); U. Gösele (Editor)
Edition: 1 edition
Publisher: Springer
Published: June 24, 2004
Language: eng
Format: Hardcover
Number of pages: 499
ISBN-13: 9783540210498
Subjects: Semi-conductors & super-conductors; Science; Material Science; Technology; Physics; Semiconductor wafers; Electronics - Semiconductors; Optics; Compound semiconductors; MEMS; Optoelectronics; Silicon-on-insulator; Technology / Material Science; Wafer bonding; Bonding; Semiconductors
First sentence: Patents tell their own (hi)story, which is not always covered by scientific literature.