A wafer chuck for use between -196 and 350C̊
By: R. Y. Koyama and M. G. Beuhler, Electron Devices Division, Center for Electronics and Electrical Engineering, National Engineering Laboratory, National Bureau of Standards
Contributors: Buehler, Martin G., author; Center for Electronics and Electrical Engineering (U.S.). Electron Devices Division; United States. Division of Electric Energy Systems; United States. Defense Advanced Research Projects Agency
Series: NBS special publication -- 400-55; Semiconductor measurement technology
Publisher: Department of Commerce, National Bureau of Standards : for sale by the Supt. of Docs., U.S. Govt. Print. Off.
Published: 1979
Place of publication: Washington
Language: eng
Subjects: Semiconductor wafers
Notes: Sponsored by Division of Electric Energy Systems, Department of Energy and the Defense Advanced Research Projects Agency.

Includes bibliographical references.