Stress wave attenuation in thin structures by ultrasonic through-transmission
By: Samson S. Lee and James H. Williams, Jr. ; prepared for Lewis Research Center under grant NSG-3210
Contributors: Williams, James H; United States. National Aeronautics and Space Administration. Scientific and Technical Information Office; Lewis Research Center
Series: NASA contractor report -- 3203
Publisher: National Aeronautics and Space Administration, Scientific and Technical Information Office; For sale by the National Technical Information Service]
Published: 1980
Place of publication: Washington, D.C; [Springfield, Va
Language: eng
Number of pages: 30
Subjects: Acoustical engineering
Notes: "January 1980"--Cover

STAR category no. 71

Includes bibliographical references