Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices IX
Subtitle: 25-26 January 2010, San Francisco, California, United States
By: Richard C. Kullberg, Rajeshuni Ramesham, editors ; sponsored and published by SPIE
Contributors: SPIE (Society)
Series: Proceedings of SPIE -- v. 7592; Proceedings of SPIE--the International Society for Optical Engineering -- v. 7592.
Publisher: SPIE
Published: 2010
Place of publication: Bellingham, Wash
Language: eng
ISBN-13: 9780819479884
Subjects: Reliability; Microelectromechanical systems; Testing; Congresses; Microelectronic packaging
Notes: Includes bibliographical references.