Packaging, reliability and manufacturing issues associated with electronic and photonic products
By: presented at the 2001 ASME International Mechanical Engineering Congress and Exposition, November 11-16, 2001, New York, New York ; sponsored by the Electronic and Photonic Packaging Division, ASME ; edited by Suresh Sitaraman ... [et al.].
Contributors: Sitaraman, Suresh.; American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.; International Mechanical Engineering Congress and Exposition (2001 : New York, N.Y.)
Series: EPP ;; v. 1; EPP (Series) ;; v. 1.
Publisher: ASME
Published: 2001
Place of publication: New York, N.Y
Language: eng
Number of pages: 305
Subjects: Electronic packaging -- Reliability -- Congresses.; Photonics -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and index.