Micro-electro-mechanical systems (MEMS)--1999
Subtitle: microelectromechanical systems, microfluidics, MEMS packaging, thermal devices and measurements, medical applications of microsystems : presented at the 1999 ASME International Mechanical Engineering Congress and Exposition, November 14-19, 1999, Nashville, Tennessee
By: sponsored by the Fluids Engineering Division, ASME ... [et al.] ; edited by Abraham P. Lee ... [et al.].
Contributors: Lee, Abraham P.; American Society of Mechanical Engineers. Fluids Engineering Division.; International Mechanical Engineering Congress and Exposition. 1999. Nashville, Tennessee.
Series: MEMS ;; v. 1.; MEMS (Series) (American Society of Mechanical Engineers) ;; v. 1.
Publisher: American Society of Mechanical Engineers
Published: 1999
Place of publication: New York, N.Y
Language: eng
Number of pages: 611
Subjects: Microelectromechanical systems -- Congresses.; Fluidic devices -- Congresses.; Microelectronic packaging -- Congresses.; Medical electronics -- Congresses.
Genres: Congresses.
Other titles: Microelectromechanical systems (MEMS)--1999.; MEMS--1999.