Fundamentals of microsystems packaging
By: Rao R. Tummala, editor.
Contributors: Tummala, Rao R., 1942-
Publisher: McGraw-Hill; McGraw-Hill Education
Published: 2001
Place of publication: New York
Language: eng
Number of pages: 967
Subjects: Electronic packaging -- Handbooks, manuals, etc.; Microelectronic packaging -- Handbooks, manuals, etc.; Miniature electronic equipment -- Packaging -- Handbooks, manuals, etc.
Genres: Handbooks, manuals, etc.
Notes: Includes bibliographical references and index.