Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Subtitle: EuroSimE 2007
By: edited by L.J. Ernst ... [et al.] ; fully sponsored by IEEE--CPMT.
Contributors: Ernst, L. J.; Components, Packaging & Manufacturing Technology Society.
Publisher: IEEE
Published: 2007
Place of publication: Piscataway, NJ
Language: eng
Number of pages: 767
Subjects: Microelectronics -- Simulation methods -- Congresses; Systems engineering -- Simulation methods -- Congresses
Genres: Congresses.
Other titles: EuroSimE 2007; 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems; Proceedings of EuroSimE 2007
Notes: "IEEE catalog number 05EX1050"--P. ii.

Includes bibliographical references.