Chemical Mechanical Polishing in Silicon Processing, Volume 63 (Semiconductors and Semimetals)
Contributors: Shin M. Hwa Li (Editor); Robert M. Miller (Editor); Robert K. Willardson (Series Editor); Eicke R. Weber (Series Editor)
Publisher: Academic Press
Published: October 15, 1999
Language: eng
Format: Hardcover
Number of pages: 307
ISBN-13: 9780127521725
Subjects: Materials science; Metals technology / metallurgy; Semiconductor Physics; Semiconductors; Science; Technology & Industrial Arts; Science/Mathematics; Engineering - Electrical & Electronic; Optics; Physics; Technology / Optics; Electricity; Electronics - Semiconductors
First sentence: Chemical mechanical planarization (CMP) has become, in a few short years, a required semiconductor processing module used in fabrication facilities worldwide.