Materials for Advanced Packaging
By: edited by Daniel Lu, C.P. Wong
Contributors: Wong, C. P., 1947-; SpringerLink (Online service)
Publisher: Springer US
Published: 2009
Place of publication: Boston, MA
Language: eng
Format: [electronic resource] /
Number of pages: 719
ISBN-13: 9780387782188; 9780387782195
Subjects: Electronics; Materials; Nanotechnology; Optical materials