CSP markets and applications
By: authors, Thomas W. Goodman and E. Jan Vardaman ; graphics and production, Charles H. Kroger ; editor, Pat Tschirhart-Spangler.
Contributors: Vardaman, Jan.; Tschirhart-Spangler, Pat.
Publisher: TechSearch International Inc.
Published: 1998
Place of publication: Austin, Tex
Language: eng
Number of pages: 168
Subjects: Chip scale packaging.
Notes: Includes bibliographical references.
"January 1998."