Open-mode debonding analysis of curved sandwich panels subjected to heating and cryogenic cooling on opposite faces
By: William L. Ko.
Contributors: NASA Dryden Flight Research Center.
Series: NASA/TP -- 1999-206580.; NASA technical paper -- 206580.
Publisher: National Aeronautics and Space Administration, Dryden Flight Research Center; National Technical Information Service, distributor
Published: 1999
Place of publication: Edwards, Calif; [Springfield, Va
Language: eng
Format: Microform
Subjects: Aerospace engineering; Sandwich structures; Debonding (Materials); Stress distribution; Curved panels; Structural engineering
Other titles: Open mode debonding analysis of curved sandwich panels subjected to heating and cryogenic cooling on opposite faces.
Notes: Shipping list no.: 2000-0048-M.

Microfiche. [Washington, D.C. : National Aeronautics and Space Administration, 1999] 1 microfiche.