Three-dimensional stress analysis of plain weave composites
By: John D. Whitcomb.
Contributors: Langley Research Center.
Series: NASA technical memorandum -- 101672.
Publisher: National Aeronautics and Space Administration, Langley Research Center; For sale by the National Technical Information Service
Published: 1990
Place of publication: Hampton, Va; [Springfield, Va
Language: eng
Format: Microform
Subjects: Composite materials.
Other titles: Three dimensional stress analysis of plain weave composites.
Notes: Distributed to depository libraries in microfiche.

Microfiche. [Washington, D.C.? : National Aeronautics and Space Administration], 1990. 1 microfiche.