Microelectronic ultrasonic bonding.
By: George G. Harman, editor.
Series: NBS special publication 400-2. Semiconductor measurement technology; NBS special publication ;; 400-2.; Semiconductor measurement technology.
Publisher: U.S. National Bureau of Standards; [for sale by the Supt. of Docs., U.S. Govt. Print. Off.]
Published: 1974
Place of publication: [Washington]
Language: eng
Number of pages: 102
Subjects: Ultrasonic welding.; Microelectronics.
Notes: Includes bibliographical references.
"CODEN: XNBSAV."