Multichip modules
Subtitle: systems advantages, major constructions, and materials technologies
By: edited by R. Wayne Johnson, Robert K.F. Teng, John W. Balde.
Contributors: Johnson, R. Wayne, 1957-; Teng, Robert K. F.; Balde, John W., 1923-
Series: A volume in the IEEE Press selected reprint series; IEEE Press selected reprint series
Publisher: IEEE Press; IEEE; Brand: Ieee
Published: 1991
Place of publication: New York
Language: eng
Number of pages: 603
Subjects: Electronic packaging.; Microelectronic packaging.; Multichip modules (Microelectronics)
Notes: Includes bibliographical references and indexes.