Proceedings, 3rd International Symposium on Advanced Packaging Materials
Subtitle: processes, properties and interfaces : Chateau Elan, Braselton, Georgia, March 9-12, 1997
By: co-sponsored by International Microelectronics and Packaging Society (IMAPS), IEEE Components, Packaging, and Manufacturing Technology Society, Georgia Institute of Technology, Packaging Research Center (PRC) ; general chair, Rao Tummala.
Contributors: Tummala, Rao R., 1942-; International Microelectronics and Packaging Society.; Components, Packaging & Manufacturing Technology Society.; Georgia Institute of Technology. Packaging Research Center.
Publisher: IMAPS; IEEE Service Center
Published: 1997
Place of publication: Reston, VA; Piscataway, NJ
Language: eng
Number of pages: 183
Subjects: Packaging -- Congresses.
Other titles: Proceedings, Third International Symposium on Advanced Packaging Materials; 3rd international symposium and exhibition on advanced packaging materials
Notes: "IEEE catalog number 97TH8263"--Cover.

Includes bibliographical references and index.