Seventh Annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA
Subtitle: 1995 proceedings
By: sponsored by IEEE Computer Society, IEEE Components, Packaging, & Manufacturing Technology Society ; edited by Stuart Tewksbury and Glenn Chapman.
Contributors: Chapman, Glenn.; Tewksbury, Stuart.; IEEE Computer Society.; Components, Packaging & Manufacturing Technology Society.
Publisher: IEEE]; Distributed by IEEE Service Center
Published: 1995
Place of publication: [Piscataway, N.J.?
Language: eng
Number of pages: 382
Subjects: Integrated circuits -- Wafer-scale integration -- Congresses
Genres: Congresses.
Other titles: 1995 proceedings, Seventh Annual IEEE International Conference on Wafer Scale Integration.; 1995 IEEE International Conference on Wafer Scale Integration.; Wafer Scale Integration, 1995, proceedings, Seventh Annual IEEE International Conference on.
Notes: "IEEE Catalog number 95CH3574-2"--T.p. verso.

Includes bibliographical references and index.

Also available via the World Wide Web with additional title: Wafer Scale Integration, 1995, proceedings, Seventh Annual IEEE International Conference on.