Stress versus temperature dependent activation energies in creep
By: A.D. Freed, S.V. Raj, and K.P. Walker ; prepared for the 3rd International Conference on Constitutive Laws for Engineering Materials, Theory and Applications and Workshop on Innovative Use of Materials in Industrial and Infrastructure Design and Manufacturing sponsored by the University of Arizona, Tucson, Arizona, January 7-12, 1991.
Contributors: Raj, Subramanium Varada.; Walker, K. P.; United States. National Aeronautics and Space Administration.
Series: NASA technical memorandum -- 103192.
Publisher: NASA; For sale by the National Technical Information Service
Published: 1990
Place of publication: [Washington, D.C.]; [Springfield, Va
Language: eng
Format: Microform
Number of pages: 10
Subjects: Copper -- Creep.; Activation energy.; Creep properties.; Gibbs free energy.; Stresses.; Temperature dependence.
Notes: Cover title.

Shipping list no.: 91-0093-M.

"Performing organization report no.: E-5580"--Technical rept. documentation p.

Includes bibliographical references (p. 9-10).

Also available via Internet from the NASA Technical Report Server web site. Address as of 4/18/06: http://ntrs.nasa.gov/archive/nasa/casi.ntrs.nasa.gov/19900014457%5F1990014457.pdf; current access available via PURL.

Microfiche. [Washington, D.C.? : National Aeronautics and Space Administration, 1990]. 1 microfiche : negative.

505-63-1B.