1993 IEEE 11th International Conference on Conduction and Breakdown in Dielectric Liquids (ICDL)
By: [Baden-Dattwil, Switzerland, July 19-23, 1993 ; sponsored by the IEEE Dielectrics and Electrical Insulation Society (IEEE-DEIS)]
Contributors: IEEE Dielectrics and Electrical Insulation Society
Publisher: IEEE
Published: 1993
Place of publication: New York]
Language: eng
Number of pages: 594
Copyright date: 1993
Subjects: Liquid dielectrics; Congresses; Electric conductivity; Breakdown (Electricity)
Notes: "IEEE catalog number 93CH3204-5."

Includes bibliographical references and index.