Mechanical characterization and modeling of solder joints for the secondary side reflow of large IC packages
By: by James D. Yutzie.
Published: 1999
Language: eng
Number of pages: 96
Subjects: Surface mount technology.; Printed circuits -- Design and construction.
Notes: Typescript (photocopy).

Thesis (M.S.)--Oregon State University, 2000.

Includes bibliographical references (leaves 85-88).