2000 HD International Conference on High-Density Interconnect and Systems Packaging
Subtitle: 25-28 April 2000, the Adam's Mark Hotel, Denver, Colorado, USA
By: sponsored by IMAPS--International Microelectronics and Packaging Society [and] CMP Media ; published in cooperation with SPIE--the International Society for Optical Engineering.
Contributors: International Microelectronics and Packaging Society.; Society of Photo-optical Instrumentation Engineers.; CMP Media.
Series: SPIE proceedings series -- v. 4217; Proceedings of SPIE--the International Society for Optical Engineering -- v. 4217.
Publisher: IMAPS; SPIE
Published: 2000
Place of publication: Reston, VA; Bellingham, Washington
Language: eng
Number of pages: 617
Subjects: Microelectronic packaging -- Congresses; Integrated circuits -- Design and construction -- Congresses; Microelectromechanical systems -- Congresses
Genres: Congresses.
Other titles: HD International Conference on High-Density Interconnect and Systems Packaging; International Conference on High-Density Interconnect and Systems Packaging; High-density interconnect and systems packaging
Notes: Includes bibliographical references and index.