Thermoplastic compounds for solderable electronic interconnect devices
By: principal author, David J. Williams ; research director, Ann Bogojavlensky.
Contributors: Bogojavlensky, Ann.
Publisher: PST Group
Published: 1991
Place of publication: Littleton, MA, USA (311 Great Rd., Littleton 01460)
Language: eng
Number of pages: 229
Subjects: Surface mount technology.; Heat resistant plastics.; Thermoplastics.
Notes: Includes bibliographical references.