MEMS packaging
By: edited by Tai-Ran Hsu
Contributors: INSPEC (Information service); Knovel (Firm)
Series: EMIS processing series -- no. 3; EMIS processing series -- no. 3.
Publisher: INSPEC
Published: 2004
Place of publication: London
Language: eng
Format: [electronic resource] /
Number of pages: 275
ISBN-13: 9781615839629
Subjects: Microelectromechanical systems; Microelectronic packaging; Micromachines; Mise sous boîtier (Microélectronique); Bauelement; Mikroelektronik; Mikromechanik
Notes: Includes bibliographical references and index.

Electronic reproduction. Norwich, N.Y. : Knovel, 2011. System requirements: Adobe Acrobat Reader. Available via the World Wide Web. Access restricted to users at licensed institutions. Includes interactive index.