Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices
Subtitle: presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France
By: Ephraim Suhir, editor ; sponsored by the Electrical and Electronic Packaging Division, ASME ... [et al.].
Contributors: Suhir, Ephraim.
Series: EEP ; vol. 25; EEP (Series) -- vol. 25.
Publisher: American Society of Mechanical Engineers
Published: 1998
Place of publication: New York
Language: eng
Number of pages: 349
Subjects: Polymers -- Mechanical properties -- Congresses.; Integrated circuits -- Reliability -- Congresses.; Electronic packaging -- Materials -- Congresses.; Polymeric composites -- Testing -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and index.