Polytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics
Subtitle: Odaiba, Tokyo, Japan, January 15-18, 2007 s
By: IEEE Components, Packaging and Manufacturing Technology Society.
Contributors: Institute of Electrical and Electronics Engineers.
Publisher: IEEE
Published: 2007
Place of publication: Piscataway, NJ
Language: eng
Number of pages: 310
Subjects: Microelectronic packaging -- Materials -- Congresses.; Polymers -- Congresses.; Integrated circuits -- Reliability -- Congresses.; Photonics -- Materials -- Congresses.; Polymeric composites -- Congresses.
Genres: Congresses.
Notes: "IEEE Catalog Number 07TH88956".

Includes bibliographical references and index.