Design for manufacturability through design-process integration IV
Subtitle: 24-25 February 2010, San Jose, California, United States
By: Michael L. Rieger, Joerg Thiele, editors ; sponsored and published by SPIE ; cooperating organization, SEMATECH Inc. (United States)
Contributors: SPIE (Society); SEMATECH (Organization)
Series: Proceedings of SPIE -- v. 7641
Publisher: SPIE
Published: 2010
Place of publication: Bellingham, Wash
Language: eng
ISBN-13: 9780819480552
Subjects: Semiconductor wafers; Semiconductors; Microelectronics industry; Analysis; Design and construction; Quality control; Congresses; Defects; Integrated circuits
Other titles: Design for manufacturability through design-process integration four
Notes: Includes bibliographical references and author index.