Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices X
Subtitle: 24-25 January 2011, San Francisco, California, United States
By: Sonia Garcia-Blanco, Rajeshuni Ramesham, editors ; sponsored by SPIE ; cosponsored by INO (Canada), DALSA Corporation (Canada), [and], SET--Smart Equipment Technology (France)
Contributors: SPIE (Society); Institut national d'optique (Canada); DALSA Corporation (Canada); Smart Equipment Technology (France)
Series: Proceedings of SPIE -- v. 7928; Proceedings of SPIE--the International Society for Optical Engineering -- v. 7928.
Publisher: SPIE
Published: 2011
Place of publication: Bellingham, Wash
Language: eng
ISBN-13: 9780819484659
Subjects: Reliability; Microelectromechanical systems; Testing; Congresses; Microelectronic packaging
Notes: Includes bibliographical references.