Materials for Information Technology
Subtitle: Devices, Interconnects and Packaging (Engineering Materials and Processes)
Contributors: Ehrenfried Zschech (Editor); Caroline Whelan (Editor); Thomas Mikolajick (Editor)
Edition: 1 edition
Publisher: Springer
Published: October 6, 2005
Language: eng
Format: Hardcover
Number of pages: 508
ISBN-13: 9781852339418
Subjects: Condensed matter physics (liquids & solids); Materials science; Physics; Engineering - General; Technology; Technology & Industrial Arts; Science/Mathematics; Material Science; Metallurgy; Assembly; Electronic materials; Interconnects; Materials Characterisation; Packaging; Semiconductors; Technology / Engineering / General; Electronics - Circuits - General; Congresses; Information technology; Materials; Microelectronics