European Microelectronics Packaging & Interconnection Symposium
Subtitle: proceedings : IMAPS Europe Cracow 2002 : 16-18 June 2002, Cracow Poland : IMAPS Poland
By: sponsored by European Commission IST Programme, KBN State Committee for Scientific Research ; [organised by IMAPS Poland Chapter]
Contributors: Information Society Technologies Programme; Komitet Badań Naukowych (Poland); International Microelectronics and Packaging Society. Poland Chapter
Publisher: International Microelectronics and Packaging Society, Poland Chapter
Published: 2002
Place of publication: Cracow [Poland]
Language: eng
Number of pages: 428
Subjects: Microelectronic packaging; Congresses; Interconnects (Integrated circuit technology)
Other titles: European Microelectronics Packaging and Interconnection Symposium; IMAPS Europe Cracow 2002
Notes: Includes bibliographical references and index.