Lead-free electronic solders
Subtitle: a special issue of Journal of Materials Science: Materials in Electronics
By: edited by K.N. Subramanian.
Contributors: Subramanian, K. N.
Publisher: Springer Science+Business; Springer
Published: 2007
Place of publication: New York
Language: eng
Number of pages: 375
ISBN-13: 9780387484310
Subjects: Lead-free electronics manufacturing processes; Electronics -- Materials; Solder and soldering
Other titles: Journal of Materials Science.  Materials in Electronics.
Notes: "This book contains the papers that were invited for a special issue of Journal of Materials Science: Materials in Electronics...to provide wider awareness of the current status of lead-free electronic solders..."--Preface.

Includes bibliographical references and index.
Table of contents: title: H. Ipser, et. al.; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al.; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson -- C. M. L. Wu, et. al.; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson -- C. M. L. Wu, et. al. -- Paul T. Vianco, et. al.; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson -- C. M. L. Wu, et. al. -- Paul T. Vianco, et. al. -- Katsuki Suganuma, et. al.; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson -- C. M. L. Wu, et. al. -- Paul T. Vianco, et. al. -- Katsuki Suganuma, et. al. -- Fu Guo; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson -- C. M. L. Wu, et. al. -- Paul T. Vianco, et. al. -- Katsuki Suganuma, et. al. -- Fu Guo -- Laura J. Turbini; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson -- C. M. L. Wu, et. al. -- Paul T. Vianco, et. al. -- Katsuki Suganuma, et. al. -- Fu Guo -- Laura J. Turbini -- C. E. Ho, et. al.; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson -- C. M. L. Wu, et. al. -- Paul T. Vianco, et. al. -- Katsuki Suganuma, et. al. -- Fu Guo -- Laura J. Turbini -- C. E. Ho, et. al. -- N. Chawla, et. al.; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson -- C. M. L. Wu, et. al. -- Paul T. Vianco, et. al. -- Katsuki Suganuma, et. al. -- Fu Guo -- Laura J. Turbini -- C. E. Ho, et. al. -- N. Chawla, et. al. -- Fuqian Yang, et al.; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson -- C. M. L. Wu, et. al. -- Paul T. Vianco, et. al. -- Katsuki Suganuma, et. al. -- Fu Guo -- Laura J. Turbini -- C. E. Ho, et. al. -- N. Chawla, et. al. -- Fuqian Yang, et al. -- J. K. Shang, et. al.; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson -- C. M. L. Wu, et. al. -- Paul T. Vianco, et. al. -- Katsuki Suganuma, et. al. -- Fu Guo -- Laura J. Turbini -- C. E. Ho, et. al. -- N. Chawla, et. al. -- Fuqian Yang, et al. -- J. K. Shang, et. al. -- Michael Osterman, et. al.; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson -- C. M. L. Wu, et. al. -- Paul T. Vianco, et. al. -- Katsuki Suganuma, et. al. -- Fu Guo -- Laura J. Turbini -- C. E. Ho, et. al. -- N. Chawla, et. al. -- Fuqian Yang, et al. -- J. K. Shang, et. al. -- Michael Osterman, et. al. -- K. N. Subramanian; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson -- C. M. L. Wu, et. al. -- Paul T. Vianco, et. al. -- Katsuki Suganuma, et. al. -- Fu Guo -- Laura J. Turbini -- C. E. Ho, et. al. -- N. Chawla, et. al. -- Fuqian Yang, et al. -- J. K. Shang, et. al. -- Michael Osterman, et. al. -- K. N. Subramanian -- Seung-Hyun Chae, et. al.; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson -- C. M. L. Wu, et. al. -- Paul T. Vianco, et. al. -- Katsuki Suganuma, et. al. -- Fu Guo -- Laura J. Turbini -- C. E. Ho, et. al. -- N. Chawla, et. al. -- Fuqian Yang, et al. -- J. K. Shang, et. al. -- Michael Osterman, et. al. -- K. N. Subramanian -- Seung-Hyun Chae, et. al. -- Chih Chen, et. al.; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson -- C. M. L. Wu, et. al. -- Paul T. Vianco, et. al. -- Katsuki Suganuma, et. al. -- Fu Guo -- Laura J. Turbini -- C. E. Ho, et. al. -- N. Chawla, et. al. -- Fuqian Yang, et al. -- J. K. Shang, et. al. -- Michael Osterman, et. al. -- K. N. Subramanian -- Seung-Hyun Chae, et. al. -- Chih Chen, et. al. -- K. N. Tu, et. al.; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson -- C. M. L. Wu, et. al. -- Paul T. Vianco, et. al. -- Katsuki Suganuma, et. al. -- Fu Guo -- Laura J. Turbini -- C. E. Ho, et. al. -- N. Chawla, et. al. -- Fuqian Yang, et al. -- J. K. Shang, et. al. -- Michael Osterman, et. al. -- K. N. Subramanian -- Seung-Hyun Chae, et. al. -- Chih Chen, et. al. -- K. N. Tu, et. al. -- J. W. Osenbach, et. al.; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson -- C. M. L. Wu, et. al. -- Paul T. Vianco, et. al. -- Katsuki Suganuma, et. al. -- Fu Guo -- Laura J. Turbini -- C. E. Ho, et. al. -- N. Chawla, et. al. -- Fuqian Yang, et al. -- J. K. Shang, et. al. -- Michael Osterman, et. al. -- K. N. Subramanian -- Seung-Hyun Chae, et. al. -- Chih Chen, et. al. -- K. N. Tu, et. al. -- J. W. Osenbach, et. al. -- W. J. Plumbridge; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson -- C. M. L. Wu, et. al. -- Paul T. Vianco, et. al. -- Katsuki Suganuma, et. al. -- Fu Guo -- Laura J. Turbini -- C. E. Ho, et. al. -- N. Chawla, et. al. -- Fuqian Yang, et al. -- J. K. Shang, et. al. -- Michael Osterman, et. al. -- K. N. Subramanian -- Seung-Hyun Chae, et. al. -- Chih Chen, et. al. -- K. N. Tu, et. al. -- J. W. Osenbach, et. al. -- W. J. Plumbridge -- D. R. Frear; title: H. Ipser, et. al. -- Sinn-Wen Chen, et. al. -- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / -- Iver E. Anderson -- C. M. L. Wu, et. al. -- Paul T. Vianco, et. al. -- Katsuki Suganuma, et. al. -- Fu Guo -- Laura J. Turbini -- C. E. Ho, et. al. -- N. Chawla, et. al. -- Fuqian Yang, et al. -- J. K. Shang, et. al. -- Michael Osterman, et. al. -- K. N. Subramanian -- Seung-Hyun Chae, et. al. -- Chih Chen, et. al. -- K. N. Tu, et. al. -- J. W. Osenbach, et. al. -- W. J. Plumbridge -- D. R. Frear -- Karl J. Puttlitz, et. al.; title: H. Ipser, et. al.-- Sinn-Wen Chen, et. al.-- D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications /-- Iver E. Anderson-- C. M. L. Wu, et. al.-- Paul T. Vianco, et. al.-- Katsuki Suganuma, et. al.-- Fu Guo-- Laura J. Turbini-- C. E. Ho, et. al.-- N. Chawla, et. al.-- Fuqian Yang, et al.-- J. K. Shang, et. al.-- Michael Osterman, et. al.-- K. N. Subramanian-- Seung-Hyun Chae, et. al.-- Chih Chen, et. al.-- K. N. Tu, et. al.-- J. W. Osenbach, et. al.-- W. J. Plumbridge-- D. R. Frear-- Karl J. Puttlitz, et. al.-- Karl J. Puttlitz, et. al.