High performance electronic packaging
Subtitle: international conference, London, UK, 28-30 November 1990
By: Keith Johnson, conference technical director ; organised by TWI and co-sponsored by the Institution of Electrical Engineers and the Institute of Physics.
Contributors: Johnson, Keith; Welding Institute.; Institution of Electrical Engineers.; Institute of Physics (Great Britain)
Publisher: Abington Pub.
Published: 1991
Place of publication: Cambridge, England
Language: eng
Number of pages: 233
Subjects: Electronic packaging -- Congresses.; Microelectronic packaging -- Congresses.
Notes: Includes bibliographical references and index.