The intrinsic measurement of solderability using wetting balance analysis
By: by Kamalesh Dhaneshwar.
Series: Master's theses (State University of New York at Binghamton) -- no. 2095
Published: 1995
Language: eng
Number of pages: 152
Subjects: Surface mount technology.; Solder pastes.; Adhesive joints.
Other titles: Measurement of solderability; Solderability; Wetting balance analysis
Notes: Thesis (M.S.I.E.) -- State University of New York at Binghamton, Watson School of Engineering and Applied Science, 1995.

Includes bibliographical references (leaves [153]-[155]).