Packaging of Electronic & Photonic Devices
Subtitle: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.)
Contributors: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division (Corporate Author); INTERNATIONAL MECHANICAL ENGINEERING CON (Editor); Symposium on Mechanics of Smt and Photon (Editor)
Publisher: American Society of Mechanical Engineers
Published: December 2000
Language: eng
Format: Paperback
Number of pages: 299
ISBN-13: 9780791819302
Subjects: Semiconductor wafers; Technology & Industrial Arts; Industrial Design - Packaging; Congresses; Surface mount technology; Reference; Solder and soldering; Electronics - General; Electronic packaging