Advances in electronic packaging, 2001
Subtitle: presented at the Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference & Exhibition : July 8-13, 2001, Kauai, Hawaii
By: sponsored by the Electrical and Electronic Packaging Division, ASME ; [edited by Yung-Cheng Lee].
Contributors: Lee, Yung-Cheng.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
Series: EEP (Series) -- vol. 26.
Publisher: American Society of Mechanical Engineers
Published: 2001
Place of publication: New York, New York
Language: eng
Subjects: Electronic packaging -- Congresses.
Genres: Congresses.
Other titles: InterPACK'01.
Notes: "... INterPACK'01 ..."--p. [i].

Includes bibliographic references and author index.