Advances in CMP/polishing technologies for the manufacture of electronic devices
By: edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa
Publisher: Elsevier; William Andrew
Published: 2012
Place of publication: Oxford; New York
Language: eng
Number of pages: 317
ISBN-13: 9781437778595
Subjects: Electrolytic polishing; Grinding and polishing; Chemical mechanical planarization
Other titles: CMP polishing technologies for the manufacture of electronic devices
Description: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components.  --P. 4 of cover.
Notes: Includes bibliographical references and index.