CAE - CAD & Thermal Management Issues in Electronic Systems
Subtitle: Proceedings, Asme International Mechanical Engineering Congress & Exposition,  Dallas, Tx. 1997 (Eep Htd Series Volumes 23 and 356)
Contributors: American Society of Mechanical Engineers (Corporate Author); Dereje Agonafer (Editor)
Publisher: American Society of Mechanical Engineers
Published: June 1997
Language: eng
Format: Paperback
Number of pages: 104
ISBN-13: 9780791818527
Subjects: Electronics engineering; Science/Mathematics; Electronic apparatus and appliances; Data processing; Technology & Industrial Arts; Technology; Heat; Engineering - General; Electronic packaging; Electronics - General; Temperature control; Congresses; Transmission; Design; Electronic apparatus and appli