Microwave-measurement-based IC interconnect characterization, modeling, and simulation for high speed VLSI circuit design
By: by Yungseon Eo
Published: 1993
Language: eng
Number of pages: 230
Subjects: Integrated circuits; Very large scale integration; Design and construction; Mathematical models
Notes: Typescript.

Vita.

Thesis (Ph. D.)--University of Florida, 1993.

Includes bibliographical references (leaves 223-229).