Wafer scale integration, III
Subtitle: proceedings of the Third IFIP WG 10.5 Workshop on Wafer Scale Integration, Como, Italy, 6-8 June 1989
By: edited by Mariagiovanna Sami, Fausto Distante.
Contributors: Sami, Mariagiovanna.; Distante, Fausto.
Publisher: North-Holland; Distributors for the U.S. and Canada, Elsevier Science Pub. Co.
Published: 1990
Place of publication: Amsterdam; New York; New York, N.Y., U.S.A
Language: eng
Number of pages: 402
Subjects: Integrated circuits -- Wafer scale integration -- Congresses.
Notes: Includes bibliographical references.