Thermal conductivity 22
By: edited by Timothy W. Tong.
Contributors: Tong, T. W.
Publisher: Technomic Pub. Co.
Published: 1994
Place of publication: Lancaster, Penn
Language: eng
Number of pages: 999
Subjects: Thermal conductivity -- Congresses.; Materials -- Thermal properties -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and index.
"Proceedings of the Twenty-second International Conference on Thermal Conductivity"--Cover.