Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices XI
Subtitle: 23-24 January 2012, San Francisco, California, United States
By: Sonia M. Garcia-Blanco, Rajeshuni Ramesham, editors ; sponsored by SPIE ; cosponsored by Dyoptyka (Ireland) [and] VUZIX Corporation ; cooperating organization, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
Contributors: SPIE (Society); Dyoptyka (Firm); Vuzix Corporation; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration
Series: Proceedings of SPIE -- v. 8250; Proceedings of SPIE--the International Society for Optical Engineering -- v. 8250.
Publisher: SPIE
Published: 2012
Place of publication: Bellingham, Wash
Language: eng
ISBN-13: 9780819488930
Subjects: Reliability; Microelectromechanical systems; Testing; Congresses; Microelectronic packaging
Notes: Includes bibliographical references and index.