Solder joint rework simulation analysis
By: by the Electronics Manufacturing Productivity Facility
Contributors: Electronics Manufacturing Productivity Facility (U.S.)
Series: EMPF TB -- 0019; EMPF TB -- 0019
Publisher: The Facility
Published: 1990
Place of publication: Ridgecrest, Calif
Language: eng
Number of pages: 39
Subjects: Solder and soldering
Notes: Shipping list no.: 91-099-P

Includes bibliographical references (p. 9)