Thermal conductivity of a polymide film between 4.2 and 300 K, with and without alumina particles as filler
By: D.L. Rule, D.R. Smith, L.L. Sparks
Contributors: Smith, D. R; Sparks, Larry L; National Institute of Standards and Technology (U.S.)
Series: NISTIR -- 3948
Publisher: U.S. Dept. of Commerce, National Institute of Standards and Technology; Order from National Technical Information Service
Published: 1990
Place of publication: Boulder, Colo; [Springfield, VA
Language: eng
Number of pages: 66
Subjects: Polyimides -- Thermal properties; Aluminum oxide -- Thermal properties
Notes: Distributed to depository libraries in microfiche

"August 1990."

Includes bibliographical references (p. 65-66)

Sponsored by SSC Laboratory