Influence of aluminum oxide film on thermocompression bonding of gold wire to evaporated aluminum film
By: Seiichi Iwata, Akitoshi Ishizaka, Hiroshi Yamamoto.
Contributors: Ishizaka, Akitoshi.; Yamamoto, Hiroshi.; United States. National Aeronautics and Space Administration.
Series: NASA technical memorandum -- 77503.
Publisher: National Aeronautics and Space Administration
Published: 1984
Place of publication: Washington, D.C
Language: eng
Format: Microform
Subjects: Integrated circuits.
Notes: "Translation of Nippon Kinzoku Gakkaishi (Journal of Japan Institute of Metals), Vol. 45, No. 6, 1981, pp. 603-609."

"October 1984."

"N85-12127"--Microfiche header.

Bibliography: p. 23.

Microfiche. [Washington, D.C.? : National Aeronautics and Space Administration, 1985]. 1 microfiche ; 11 x 15 cm.

NASW 3541.