bobc/bobc_hardware — pull request #22 by cefiar (2013-12-22 12:57:07+00:00)
Title: Major layout changes to add extra components.

Addresses bug #20, bug #19, and bug #18.
Notable U1 relocation (adds room for Thermistor protection, less FET drive impedance).
Notable orientation change to Endstop connectors.
Increases in ground plane area on both Back and Front of PCB.
Board size increased to 95mm x 100mm (from 89mm x 100mm).