My main research is about finding new ways to join certain materials which we cannot weld them or join them or glue them using conventional techniques. Here you can see some applications of diffusion bonding process. On this side we have a high-strain joints. Applications are in the jet engines, aerospace and sometimes in food industries. In the middle we have the medical devices which in this particular case the strain is not so much of concern but we must maintain the shape of the original component while we are joining or welding these materials together. On that other side we can see the gain high precision component using an electronic and micro-bap system. For instance the sample you see in my hand it is a part of the mobile phone and we are supposed to join a flat face on this component without changing its shape. In the bottom picture you will see that some alloys are bonded to the ceramics. For instance here the steel is joined to the sapphire which is possible only by diffusion bonding. In order to do this kind of unconventional joining for the unconventional normally materials what we use with the technique which is called diffusion bonding using this rig. This is basically a vacuum chamber which inside we insert the materials which we would like to join and the system is capable to heat the materials to the temperature we set basically for that particular applications and also has got a loading system which basically keeps a certain load on the samples which are being joined. Once the joining is finished we take out the sample and then we do all sorts of the test on the bond sample to make sure that it is safe.