omniomni/omni-engineering huggingface dataset:
UEFI Forum. UEFI Forum, Inc. is an alliance between technology companies to coordinate the development of the UEFI specifications. The board of directors includes representatives from twelve promoter companies: AMD, American Megatrends, ARM, Apple, Dell, Hewlett Packard Enterprise, HP Inc., Insyde Software, Intel, Lenovo, Microsoft, and Phoenix Technologies.

Overview 
The non-profit corporation has assumed responsibility for the management and promotion of the Unified Extensible Firmware Interface (UEFI) specification, a bootloader and runtime interface between platform firmware and an operating system. The original EFI specification was developed by Intel and was used as the starting point from which the UEFI versions were developed. The goal of the organization is to replace the aging PC BIOS.

In addition to the UEFI specification, the forum is responsible for a UEFI Platform Initialization (PI) specification, which addresses the firmware internal architecture as well as firmware-to-hardware interfaces. The forum also is responsible for Self-Certification Test suites, which defines conformance to the specifications that it defines.

In October 2013, the Advanced Configuration and Power Interface (ACPI) assets have also been transferred into the forum. The forum is responsible for the management and promotion of future ACPI specifications, which provides static tables at boot time and dynamic control methods as the primary runtime interfaces between the OS and system firmware for system configuration, power management and RAS (Reliability, Availability and Supportability) features. ACPI "Revision 5.0" is used as the starting point from which future ACPI versions will be developed.

Published specifications 
 UEFI Specification version 2.8, published March, 2019
 UEFI Shell Specification version 2.2, published January 26, 2016
 UEFI Platform Initialization Specification version 1.7, published January, 2019
 UEFI Platform Initialization Distribution Packaging Specification version 1.1, published January, 2016
 ACPI Specification version 6.4, published January 2021

Obsolete specifications 
 UEFI Specification version 2.0, 2.1, 2.2
 UEFI Platform Initialization Specification version 1.0, 1.1

See also 
 TianoCore EDK II
 ACPI Component Architecture (ACPICA)
 Distributed Management Task Force (DMTF)

References

External links 
 
 Fedora UEFI support
 Microsoft Windows UEFI support
 Book - Beyond BIOS 
 Book - Harnessing the UEFI Shell
 Book Chapter - UEFI:  From Reset Vector to Operating System
 Book - Beyond BIOS, 2nd edition, updated with UEFI2.3 and PI1.2
 Intel Technology Journal, Volume 15, Issue 01 - "UEFI Today: Bootstrapping the Continuum"

BIOS
Unified Extensible Firmware Interface
Technology consortia
Rannoch Corp.. Rannoch Corporation, was an American company based in Alexandria, Virginia. It was a research, development and production company working in the field of radar tracking for airport management, ground and airspace control and air defence.

Its products included the 'AirScene' Airport Management systems.

They had offices worldwide and competed in this market with companies such as: ERA (Czech Republic); Sensis Corporation (USA); Park Air Systems AS (Norway); HITT (Netherlands); Lochard (Australia) and Thales (France). 

In October 2006 Rannoch acquired ERA (6,25 million Euro was provided by an investment company for the acquisition) and moved large part of development and manufacturing to Pardubice, Czech Republic, location of ERA. In February 2007 Rannoch renamed itself to Era Corporation. In July 2008 ERA was bought by American SRA International for 125.5 million US dollars.

AirScene
The primary mission of their AirScene System is to track all types of aircraft in the air and on an airport surface and transponder-equipped vehicles to provide a high fidelity, high accuracy, and high update rate air/surface surveillance display.  The system receives and decodes signals transmitted by Mode A/C, Mode S and ADS-B transponders.  The system can be configured so that the sensors are connected to a central processor in real-time, for up-to-the-second track information. Each signal is directly communicated to the central processor where the aircraft/vehicle(s) is/are identified and its/their position calculated in real time (nominally once per second).

The remote sensors are designed to be small and compact for easy sitting and installation. Both the GPS and L-Band antenna are light and extremely service-friendly allowing them to be installed virtually anywhere and in any environmental condition.

References

Avionics Magazine, June 1, 2001: Will Multilateration Become Mainstream? discusses Rannoch's AirScene systems.

External links
(http://www.rannoch.com Rannoch corporate website) (defunct, now points to SRA International)

Former defense companies of the United States
Defunct engineering companies of the United States
Defunct electronics companies of the United States
Companies based in Alexandria, Virginia
Direct-attached storage. Direct-attached storage (DAS) is digital storage directly attached to the computer accessing it, as opposed to storage accessed over a computer network (i.e. network-attached storage). DAS consists of one or more storage units such as hard drives, solid-state drives, optical disc drives within an external enclosure. The term "DAS" is a retronym to contrast with storage area network (SAN) and network-attached storage (NAS).

Features 
A typical DAS system is made of a data storage device (for example enclosures holding a number of hard disk drives) connected directly to a computer through a host bus adapter (HBA). Between those two points there is no network device (like hub, switch, or router), and this is the main characteristic of DAS.

The main protocols used for DAS connections are Parallel ATA, SATA, eSATA, NVMe, Parallel SCSI, SAS, USB, and IEEE 1394.

Storage features of SAN, DAS, and NAS 
Most functions found in modern storage do not depend on whether the storage is attached directly to servers (DAS), or via a network (SAN and NAS). In enterprise environments, direct-attached storage systems can utilize storage devices that have higher endurance in terms of data workload capability, along with scalability in the amount of capacity that storage arrays can achieve compared to consumer-grade NAS and other storage devices.

Advantages and disadvantages 
The key difference between DAS and NAS is that DAS storage does not incorporate any network hardware and related operating environment to provide a facility to share storage resources independently of the host so is only available via the host to which the DAS is attached.

DAS is typically considered much faster than NAS due to lower latency in the type of host connection although contemporary network and direct connection throughput typically exceeds the raw read/write performance of the storage units themselves.

A SAN (storage area network) has more in common with a DAS than a NAS with the key difference being that DAS is a 1:1 relationship between storage and host whereas SAN is many to many.

See also 
 Secondary storage device versus tertiary storage device or nearline storage — storage that remains attached versus storage that is attached or detached as needed
 RAID
 JBOD
 Storage area network
 Network-attached storage

References

Computer data storage
Sense (electronics). In electronics, sense is a technique used in power supplies to produce the correct voltage for a load.  Although simple batteries naturally maintain a steady voltage (except in cases of large internal impedance), a power supply must use a feedback system to make adjustments based on the difference between its intended output and its actual output. If this system works, the latter will be very close to the former.

Two types of sense are used, depending on where the power supply output is measured.  In local sense, the supply simply measures the voltage at its output terminals, where the leads to the load connect.  This method has the problem of not accounting for the voltage drop due to resistance of the leads, which is proportional to the amount of current drawn by the load.  That is, the supply might be producing the correct voltage at its output terminals, but there will be a lower voltage at the input terminals of the load.

When this might cause a problem, remote sense can be used to force the power supply to counteract the voltage drop by raising the voltage at its output terminals.  If successful, it will cancel the drop along the leads, yielding the correct voltage at the input terminals of the load.  This is accomplished by using separate "sense leads," connected to the load's input terminals, to measure the output voltage.  (Because the sensing function draws only a very small amount of current, there is practically no additional voltage drop due to the sense leads themselves.)  This is the same principle behind 4-wire sensing, the generic equivalent to power supply remote sensing.

Many power supplies that are equipped with remote sense can cause catastrophic damage to the loads if they are turned on while the sense leads are unconnected. To avoid this, some supplies are equipped with auto sense, which will automatically switch between local and remote sensing depending on whether the sense leads are correctly connected.

See also
 Sensor

External links
NasaTech Article On Sense
Are Power Supplies Universal?

Power supplies
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Lead (electronics). In electronics, a lead () or pin is an electrical connector consisting of a length of wire or a metal pad (surface-mount technology) that is designed to connect two locations electrically. Leads are used for many purposes, including: transfer of power; testing of an electrical circuit to see if it is working, using a test light or a multimeter; transmitting information, as when the leads from an electrocardiograph are attached to a person's body to transmit information about their heart rhythm; and sometimes to act as a heatsink. The tiny leads coming off through-hole electronic components are also often called pins; in ball grid array packages, they are in form of small spheres, and are therefore called "balls".

Many electrical components such as capacitors, resistors, and inductors have only two leads, while some integrated circuits can have several hundred or even more than a thousand for the largest ball grid array packages. Integrated circuit pins often either bend under the package body like a letter "J" (J-lead) or come out, down, and form a flat foot for securing to the board (S-lead or gull-lead). 

Most kinds of integrated circuit packaging are made by placing a silicon chip on a lead frame, wire bonding the chip to the metal leads of the lead frame, and covering the chip with plastic. The metal leads protruding from the plastic are then either "cut long" and bent to form through-hole pins, or "cut short" and bent to form surface-mount leads. Such lead frames are used for surface mount packages with leads – such as Small Outline Integrated Circuit Quad Flat Package  – and for through-hole packages such as dual in-line package  – and even for so-called "leadless" or "nolead" packages – such as Quad Flat Noleads package.

The lead frame (and therefore the pins, if any, formed from that lead frame) are occasionally made from Invar or similar alloys, due to their low coefficient of thermal expansion.

Electrical effects
For many circuit designs it can be assumed that the leads do not contribute to the electrical effects of individual components. However, this assumption begins to break down at higher frequencies and at very small scales. These effects come from the physical construction of the leads. The leads are often metal connections that run from the rest of the circuit to the materials that each component is made of. This design results in a very small capacitance between the ends of the leads where they connect to the device and very small inductances and resistances along each lead. Because the impedance of each component is a function of the frequency of the signals being passed through the device and the inductance and capacitance of the device, the leads can cause substantial variation in the properties of components in radio frequency circuits.

See also 
 Through-hole technology

References

Electrical components
Event reconstruction. In a particle detector experiment, event reconstruction is the process of interpreting the electronic signals produced by the detector to determine the original particles that passed through, their momenta, directions, and the primary vertex of the event.  Thus the initial physical process (for instance, that occurred at the interaction point of the particle accelerator), whose study is the ultimate goal of the experiment, can be determined. The total event reconstruction is not always possible and necessary; in some cases, only a part of the data described above is obtained and processed.

Experimental particle physics
Vortex (sailboat). The Laser Vortex is a high performance sailing dinghy designed by Jo Richards and awarded the "Sailboat of the Year" title on its introduction in 2000. It is a tunnel hulled single hander that has a trapeze and an optional asymmetrical spinnaker. It is manufactured by White Formula UK Ltd under licence from a consortium headed up by Jonathan Carter. Jo Richard remains the owner of the design. Laser Performance are no longer involved with the Vortex. In 2013 the decision was made to drop 'Laser' from the name, the boat is now known only as the Vortex.

The development of the Asymmetric 'kit' by Association Chairman and keen Vortex enthusiast Keith Escritt has brought new life to the class, with over 100 boats now flying the asymmetric option.

In handicap racing the Vortex sails off a Portsmouth Yardstick of 925 in the UK (960 without spinnaker) and 86.8 in the USA
.

References

External links
Laser Vortex Association Website
Laser Vortex Builders Website

Dinghies
2000s sailboat type designs
Sailboat types built by LaserPerformance
EWD. EWD may refer to:

Gaming
 Extreme Warfare Deluxe, a text-based wrestling-themed computer game

Science and technology
 Edsger W. Dijkstra (1930–2002), Dutch systems and computer scientist
 EWDs, his manuscripts
 Electric window defogger, on vehicular rear windows
 Electrical wiring diagram
 Electrowetting display, a form of electronic paper

Rail transport
 Earlswood railway station (West Midlands), in England
 Eastwood railway station, in Sydney, Australia
Index of steam energy articles. portable engine
 steam aircraft
 (steam ball) aeolipile
 (steam bath) sauna
 steam brig
 steam bus
 steam cannon
 steam car
 steam crane
 steam donkey
 steam dummy (dummy engine)
 (steam electric power plant) fossil fuel power plant (FFPP)
 (steam electrolysis) high-temperature electrolysis
 steam engine
 stationary steam engine
 steam explosion
 steam fair
 Steam generator (boiler) steam generator
 Steam generator (nuclear power)
 steam hammer
 steam locomotive
 steam locomotive nomenclature
 steam locomotives of British Railways
 Steam Locomotives of Ireland
 steam power during the Industrial Revolution
 steam railroad
 steam reforming
 steam rupture
 steam shovel
 (steam sterilizer) autoclave
 steam tank (vehicle)
 steam tractor
 (steam train)–see steam locomotive
 steam tricycle
 steam turbine
 steam turbine locomotive
 steamboat
 steamroller
 steam whistle
 traction engine

See also 

 List of environment topics
 :Category:Steam road vehicles

Steam energy topics
Euchroite. Euchroite is a hydrated copper arsenate hydroxide mineral with formula: Cu2AsO4OH·3H2O. It is a vitreous green to emerald green mineral crystallizing in the orthorhombic system. It has a Mohs hardness of 3.5–4.0 and a specific gravity of 3.39–3.45. It was first described in 1823 in Ľubietová, Slovakia.

References

External links

Mindat localities
Webmineral

Copper(II) minerals
Arsenate minerals
Orthorhombic minerals
Minerals in space group 19
Bromine trifluoride. Bromine trifluoride is an interhalogen compound with the formula BrF3. At room temperature, it is a straw-coloured liquid with a pungent odor which decomposes violently on contact with water and organic compounds. It is a powerful fluorinating agent and an ionizing inorganic solvent. It is used to produce uranium hexafluoride (UF6) in the processing and reprocessing of nuclear fuel.

Synthesis
Bromine trifluoride was first described by Paul Lebeau in 1906, who obtained the material by the reaction of bromine with fluorine at 20 °C:

The disproportionation of bromine monofluoride also gives bromine trifluoride:

Structure
Like ClF3 and IF3, the BrF3 molecule is T-shaped and planar. In the VSEPR formalism, the bromine center is assigned two electron lone pairs. The distance from the bromine atom to each axial fluorine atom is 1.81 Å and to the equatorial fluorine atom is 1.72 Å. The angle between an axial fluorine atom and the equatorial fluorine atom is slightly smaller than 90° — the 86.2° angle observed is due to the repulsion generated by the electron pairs being greater than that of the Br-F bonds.

Chemical properties
In a highly exothermic reaction, BrF3 reacts with water to form hydrobromic acid and hydrofluoric acid:

BrF3 is a fluorinating agent, but less reactive than ClF3. Already at -196 °C, it reacts with acetonitrile to give 1,1,1-trifluoroethane.

 +  Br2 +  N2

The liquid is conducting, owing to autoionisation:

Fluoride salts dissolve readily in BrF3 forming tetrafluorobromate:

It reacts as a fluoride donor:

References

External links
 WebBook page for BrF3

Bromine(III) compounds
Fluorides
Interhalogen compounds
Fluorinating agents
Oxidizing agents
Substances discovered in the 1900s
Bromine pentafluoride. Bromine pentafluoride, BrF5, is an interhalogen compound and a fluoride of bromine. It is a strong fluorinating agent.

BrF5 finds use in oxygen isotope analysis. Laser ablation of solid silicates in the presence of BrF5 releases O2 for subsequent analysis. It has also been tested as an oxidizer in liquid rocket propellants and is used as a fluorinating agent in the processing of uranium.

Preparation
BrF5 was first prepared in 1931 by the direct reaction of bromine and fluorine. This reaction is suitable for the preparation of large quantities, and is carried out at temperatures over  with an excess of fluorine:

Br2 + 5 F2 → 2 BrF5

For the preparation of smaller amounts, potassium bromide is used:

KBr + 3 F2 → KF + BrF5

This route yields BrF5 almost completely free of trifluorides and other impurities.

Reactions
BrF5 reacts with water to form bromic acid and hydrofluoric acid:

BrF5 + 3 H2O → HBrO3 + 5 HF

It is an extremely effective fluorinating agent, being able to convert most metals to their highest fluorides even at room temperature. With uranium and uranium compounds, it can be used to produce uranium hexafluoride:

5 U + 6 BrF5 → 5 UF6 + 3 Br2

Hazards
BrF5 reacts violently with water, and is severely corrosive and toxic. Its vapors are also extremely irritating to all parts of the human body, especially the skin, eyes and other mucous membranes. Like many other interhalogen compounds, it will release "smoke" containing acidic vapors if exposed to moist air, which comes from its reaction with the water in the air. Exposure to 100 ppm or more for more than one minute is lethal to most experimental animals. Chronic exposure may cause kidney damage and liver failure.

Additionally, BrF5 is a strong oxidizing agent and may spontaneously ignite or explode upon contact with flammable substances such as organic materials and metal dust.

References

External links
 WebBook page for BrF5

National Pollutant Inventory - Fluoride and compounds fact sheet

Fluorides
Bromine(V) compounds
Interhalogen compounds
Fluorinating agents
Oxidizing agents
Substances discovered in the 1930s
Arthur Gossard. Arthur C. Gossard (June 18, 1935 – June 26, 2022) was a professor of materials and electrical engineering at the University of California, Santa Barbara. In 1982, he co-discovered the fractional quantum Hall effect. His research is related to molecular beam epitaxy (MBE). He has a doctorate in physics from UC Berkeley. After university, he joined Bell Labs. 

In 1987, he was elected a member of the US National Academy of Engineering for contributions to the study of the physics of ultra-thin semiconducting layers through molecular beam epitaxy, leading to new physics and new devices. He was also a member of the US National Academy of Sciences.

In 2016, Gossard was named as a recipient of a National Medal of Technology and Innovation.
He died on June 26, 2022 at 87 years old.

Lectures 

 1991 - Heterostructures for new dimensions of electron confinement Lecture sponsored by the Dept. of Electrical and Computer engineering, University of California, San Diego. Electrical and Computer Engineering Distinguished Lecture Series. Digital Object Made Available by Special Collections & Archives, UC San Diego.

References

External links
 UC Santa Barbara faculty profile

American materials scientists
Members of the United States National Academy of Engineering
University of California, Santa Barbara faculty
University of California, Berkeley alumni
Members of the United States National Academy of Sciences
Oliver E. Buckley Condensed Matter Prize winners
National Medal of Technology recipients
Fellows of the American Physical Society
Calvin Quate. Calvin Forrest Quate (December 7, 1923 – July 6, 2019) was one of the inventors of the atomic force microscope.  He was a professor emeritus of Applied Physics and Electrical Engineering at Stanford University.

Education
He earned his bachelor's degree in electrical engineering from the University of Utah College of Engineering in 1944, and his Ph.D. from Stanford University in 1950.

Career and research
Quate is known for his work on acoustic and atomic force microscopy. The scanning acoustic microscope, invented with a colleague in 1973, has resolution exceeding optical microscopes, revealing structure in opaque or even transparent materials not visible to optics.

In 1981, Quate read about a new type of microscope able to examine electrically conductive materials. Together with Gerd Binnig and Christoph Gerber, he developed a related instrument that would work on non-conductive materials, including biological tissue, and the Atomic Force Microscope was born. AFM traces surface contours using a needle to maintain constant pressure against the surface to reveal atomic detail. AFM is the foundation of the $100 million nanotechnology industry. Binnig, Quate and Gerber were rewarded with the Kavli Prize in 2016 for developing the Atomic Force Microscope.

Quate was a member of the National Academy of Engineering and National Academy of Sciences. He was awarded the 1980 IEEE Morris N. Liebmann Memorial Award and the IEEE Medal of Honor in 1988 for "the invention and development of the scanning acoustic microscope." Quate became a senior research fellow at the Palo Alto Research Center (PARC) in 1984. In 2000, he became a recipient of the Joseph F. Keithley Award For Advances in Measurement Science. He was a fellow of the Norwegian Academy of Science and Letters. Quate died on July 6, 2019, at the age of 95.

References

External links
 Obituary Stanford University
 IEEE History Center biography

1923 births
2019 deaths
People from White Pine County, Nevada
Members of the United States National Academy of Sciences
American inventors
American electrical engineers
Foreign members of the Royal Society
IEEE Medal of Honor recipients
Fellows of the IEEE
National Medal of Science laureates
University of Utah alumni
Stanford University School of Engineering faculty
Members of the United States National Academy of Engineering
Fellows of the Royal Microscopical Society
Scientists at PARC (company)
Members of the Norwegian Academy of Science and Letters
Kavli Prize laureates in Nanoscience