omniomni/omni-engineering huggingface dataset:
Jim Highsmith. James A. Highsmith III (born 1945) is an American software engineer and author of books in the field of software development methodology. He is the creator of Adaptive Software Development, described in his 1999 book "Adaptive Software Development", and winner of the 2000 Jolt Award, and the Stevens Award in 2005. Highsmith was one of the 17 original signatories of the Agile Manifesto, the founding document for agile software development.

Life and work 
Jim Highsmith has more than 25 years experience as an IT manager, project manager, product manager, consultant, and software developer. He has consulted with IT, software, and product-development companies in the U.S., Europe, Canada, Japan, India, South Africa, Australia, and New Zealand to help them adapt to an accelerated pace of development in increasingly complex, unstable environments. He has also worked at NASA. Jim Highsmith's areas of consulting include agile software development, collaboration, and project management. Highsmith was also an executive consultant at Thoughtworks, a global software consultancy company.

Working as a principal of Information Architects, Inc., based in Salt Lake City, Highsmith taught and consulted on software quality process improvement, project management, and accelerated development techniques. He has also served as director of the Agile Project Management Advisory Service for the Cutter Consortium.  The Cutter Consortium is an IT advisory firm that has included a group of more than 125 internationally recognized experts who have come together to offer information, consulting and training. He is also one of the founders of the Agile Project Leadership Network.

In the book Adaptive Software Development (1999), Jim Highsmith uses the analogy of mountain climbing to illustrate his points about teamwork, planning, and adaptation to rapidly changing conditions.  The book contains the following adage: Rules can be barriers to hide behind or guidelines for the wise to consider and break when the circumstances justify it.  The book also covers the concepts of accidental software development, the adaptive conceptual model, and the adaptive development model.

Publications 
Jim Highsmith published several articles and books. A selection:
 1999 Adaptive Software Development: A Collaborative Approach to Managing Complex Systems. Dorset House Publishing.
 2002 Agile Software Development Ecosystems. Foreword by Tom DeMarco. Addison-Wesley Pearson Education.
 2004 Agile Project Management: Creating Innovative Products.  Addison-Wesley Professional.
2013 Adaptive Leadership: Accelerating Enterprise Agility. Addison-Wesley Professional.
2019 EDGE: Value-Driven Digital Transformation. Addison-Wesley Professional.

References

External links
 Cutter Consortium
 Highsmith: What Agile Needs to Do - Dr. Dobb's, March 2011

1945 births
American computer programmers
Businesspeople in software
Living people
American software engineers
American technology writers
Agile software development
Console application. A console application or command-line program is a computer program (applications or utilities) designed to be used via a text-only user interface, such as a text terminal, the command-line interface of some operating systems (Unix, DOS, etc.) or the text-based interface included with most graphical user interface (GUI) operating systems, such as the Windows Console in Microsoft Windows, the Terminal in macOS, and xterm in Unix.

Overview

A user typically interacts with a console application using only a keyboard and display screen, as opposed to GUI applications, which normally require the use of a mouse or other pointing device. Many console applications such as command line interpreters are command line tools, but numerous text-based user interface (TUI) programs also exist.

As the speed and ease-of-use of GUIs applications have improved over time, the use of console applications has greatly diminished, but not disappeared. Some users simply prefer console based applications, while some organizations still rely on existing console applications to handle key data processing tasks.

The ability to create console applications is kept as a feature of modern programming environments such as Visual Studio and the .NET Framework on Microsoft Windows. It simplifies the learning process of a new programming language by removing the complexity of a graphical user interface (see an example in the C# article).

For data processing tasks and computer administration, these programming environments represent the next level of operating system or data processing control after scripting. If an application is only going to be run by the original programmer and/or a few colleagues, there may be no need for a pretty graphical user interface, leaving the application leaner, faster and easier to maintain.

Text User Interface

Libraries

Multiple libraries are available to assist with the development of Text User Interfaces.

On Unix systems, such libraries are ncurses and curses.

On Microsoft Windows, conio.h is an example of such library.

Examples
Console-based applications include Alpine (an e-mail client), cmus (an audio player), Irssi (an IRC client), Lynx (a web browser), Midnight Commander (a file manager), Music on Console (an audio player), Mutt (an e-mail client), nano (a text editor), ne (a text editor), newsbeuter (an RSS reader), and ranger (a file manager).

See also
Text-based (computing)
Box-drawing character
Shell (computing)

References

Further reading
 

Terminal emulators
User interfaces
Windows administration
MacOS administration
Unix software
Virsa Systems. Virsa Systems was a California-based compliance software maker. It now forms the Governance, Risk Management, and Compliance (GRC) vertical of SAP Labs.

History

Virsa Systems was founded by Jasvir Gill, a software engineer based in Silicon Valley.  The Virsa tool was substantially based on a tool developed by PricewaterhouseCoopers, known as SAFE, which was purchased by Virsa in December 2004. The SAFE tool was a preventative, automated tool developed to control the granting and management of access within SAP.

On 3 April 2006, SAP AG announced its decision to acquire Virsa Systems. According to the press release, the acquisition was a part of its creation of a new business unit to provide customers with end-to-end solutions for GRC.

See also
Risk management

Footnotes

Companies based in Fremont, California
Software companies based in the San Francisco Bay Area
Defunct software companies of the United States
Association for Laboratory Automation. The Association for Laboratory Automation (ALA) was a scientific association, organized as a nonprofit 501(c)(3), for the medical, chemical and biological laboratory automation industry. It was the publisher of the peer-reviewed scientific journal, Journal of Laboratory Automation. In 2010, it merged with the Society for Biomolecular Sciences to form the Society for Laboratory Automation and Screening.

The ALA's mission was to advance science and education related to laboratory automation by encouraging the study, advancing the science, and improving the practice of medical and laboratory automation. Its focus is on the benefits and utilization of automation, robotics, and artificial intelligence in order to improve the quality, efficiency, and relevance of laboratory analysis.

External links
 Association for Lab Automation web site
 Journal of Laboratory Automation web site
 LabAutopedia

Scientific organizations based in the United States
Precision measurement equipment laboratory. A Precision Measurement Equipment Laboratory (PMEL) is a United States Air Force (USAF) facility in which the calibration and repair of test equipment takes place. This practice is also known as metrology: the science of measurement. Metrology is defined as the science of weights  & measures, while a PMEL is the place where technicians perform all of the metrology for the U.S. Air Force.  Air personnel in this career field are primarily responsible for the repair, calibration, and modification of test, measurement, and diagnostic equipment (TMDE), including precision measurement equipment laboratory standards and automatic test equipment. They also supervise the process and use of TMDE to perform voltage, current, power, impedance, frequency, microwave, temperature, physical-dimensional, and optical measurements.  They perform these functions in a strictly controlled laboratory environment where the temperature and humidity are constantly monitored. The Air Force Specialty Code (AFSC) of air personnel trained to work in the PMEL is 2P0X1 replacing 324X0 where "X" represents a variable number which denotes the level of expertise of the individual. There are also defense contractors and government civilians who perform this job. The Air Force's PMELs are governed by AFMETCAL (Air Force Metrology and Calibration Program)

Calibration sections

Typically electronic test equipment is maintained in different calibration sections (K-Sections). The technicians who work in the PMEL will often specialize in one of these sections. The K-Sections are derived from the primary function of the TMDE. This is based upon the calibration authority.

Most labs have three calibration sections divided into K1/K8, K5/K6 and K3/K4 that specialize in like test equipment.
For example, the K3/K4 section would maintain Frequency counter, Oscilloscope, Synthesized Signal Generator and power sensor. While K1/K8 would maintain digital multimeter, high voltage probe and resistance standards. Lastly K5/K6 would deal with truck scales, pressure gauges, optics and micrometers.

The sections are as follows:
K1, K2, K8  DC/Electrical Standards Section 
K3, K4     Frequency/RF Section  
K5        Temperature/Humidity  
K6,     Physical Dimensional Test Equipment 
K7,     RADIAC

Roles of PMEL technicians

The roles of technicians may vary from various locations but typically are divided by skill level. The 2P0X1 AFSC is broken down by skill levels. The five skill levels are 1,3,5,7,and 9. This skill level is determined by qualifications, rank and experience. In addition, this AFSC feeds into Chief Enlisted Manager code of 2P000.  The following are typical roles for the various skill levels. More information can be found in the PMEL CFETP .

See also
Accuracy and precision
Logistics center

External links
 
    Air Force Metrology Homepage

United States Air Force
Diode-or circuit. A diode-OR circuit is used in electronics to isolate two or more voltage sources.  There are two typical implementations:

When a DC supply voltage needs to be generated from one of a number of different sources, for example when terminating a parallel SCSI bus, a very simple circuit like this can be used:

In digital electronics a diode-OR circuit is used to derive a simple Boolean logic function.  This kind of circuit was once very common in diode–transistor logic but has been largely replaced by CMOS in modern electronics:

References

Logic gates
Perforated paper. Perforated paper is a craft material of lightweight card with regularly spaced holes in imitation of embroidery canvas. It is also sometimes referred to as punched paper.

Perforated paper is most commonly embroidered with cross stitch motifs and borders. Typical uses for such items include ornaments to decorate Christmas trees, bookmarks and greetings cards. It is also used in larger sized sheets to embroider motto sayings to frame and display on the wall.  Since the paper is of a heavy weight, it does not require a hoop or frame when stitching.  

Perforated paper is manufactured in a number of different colours and is typically sold as 14-count A4 size sheets. The count refers to the fact that there are 14 holes/perforations per linear inch.

History 
This material, known as Perforated card-board at the time, first became available in the 1820s as plain sheets used for the creation of bookmarks and small mottoes and sayings, often taken from the Bible. By the 1870s the Victorian craze for this inexpensive and versatile craft material was at its peak. The invention of new printing processes made the pre-printing of mottoes and bookmarks on the perforated paper possible. These items were extremely popular and original examples, in good condition, can still be found today.  The Victorian fad of embroidering mottoes on perforated paper died out around 1910 and was virtually lost as a needleart until recently being rediscovered. Perforated paper as we know it today was invented by Justin Ruble of Pennsylvania.

See also 
Cross-stitch

External links 
 Perforated Paper Needlework
 Free online class on perforated paper ornaments

Embroidery equipment
Paper art
Characteristic state function. The characteristic state function or Massieu's potential in statistical mechanics refers to a particular relationship between the partition function of an ensemble.

In particular, if the partition function P satisfies

 or 

in which Q is a thermodynamic quantity, then Q is known as the "characteristic state function" of the ensemble corresponding to "P". Beta refers to the thermodynamic beta.

Examples 
The microcanonical ensemble satisfies  hence, its characteristic state function is .
The canonical ensemble satisfies  hence, its characteristic state function is the Helmholtz free energy .
The grand canonical ensemble satisfies , so its characteristic state function is the Grand potential .
The isothermal-isobaric ensemble satisfies  so its characteristic function is the Gibbs free energy .

State functions are those which tell about the equilibrium state of a system

References 

Statistical mechanics
Gallium(III) iodide. Gallium(III) iodide  is the inorganic compound with the formula GaI3.  A yellow hygroscopic solid, it is the most common iodide of gallium.  In the chemical vapor transport method of growing crystals of gallium arsenide uses iodine as the transport agent.  In the solid state, it exists as the dimer Ga2I6. When vaporized, its forms GaI3 molecules of D3h symmetry where the Ga–I distance is 2.458 Angstroms.

Gallium triiodide can be reduced with gallium metal to give a green-colored gallium(I) iodide.  The nature of this species is unclear, but it is useful for the preparation of gallium(I) and gallium(II) compounds.

See also
Gallium halides

References

Cited sources

Iodides
Gallium compounds
Metal halides
Gallium(III) selenide. Gallium(III) selenide (Ga2Se3) is a chemical compound. It has a defect sphalerite (cubic form of ZnS) structure. It is a p-type semiconductor 

It can be formed by union of the elements. It hydrolyses slowly in water and quickly in mineral acids to form toxic hydrogen selenide gas. The reducing capabilities of the selenide ion make it vulnerable to oxidizing agents. It is advised therefore that it not come into contact with bases.

References

Selenides
Gallium compounds
Semiconductor materials
Gallium(III) telluride. Gallium(III) telluride (Ga2Te3) is a chemical compound classified as a metal telluride. At room temperature gallium(III) telluride is an odorless, black, brittle crystalline solid and is a semiconductor of the III-VI type that crystallizes in a lattice structure.

Synthesis
Gallium(III) telluride is most commonly synthesized through the solid-state reaction of trimethylgallium and a telluride oxide complex under high temperatures. It is also possible to synthesize the compound by reacting elemental gallium and elemental tellurium at high temperatures.

Properties

Physical properties
At room temperature, gallium(III) telluride is a black, odorless, brittle crystal. The compound crystallizes in a four-coordinate tetrahedral structure. The crystal is not immediately reactive or flammable, though serious protective ware should be worn while handling this compound (see toxicity). Gallium(III) telluride has a melting point of 788 °C to 792 °C and is not soluble in water.

Chemical properties
Gallium(III) telluride is stable at room temperature. The compound is relatively unreactive, and there are no known materials with which it is incompatible. Gallium(III) telluride will over time emit telluride fumes and it naturally decomposes. There is no risk of hazardous polymerization.

Toxicity
The toxicological properties of gallium(III) telluride have not been thoroughly investigated. However elemental tellurium has relatively low toxicity. It is converted in the body to dimethyl telluride which imparts a garlic-like odor to the breath and sweat. Heavy exposures may, in addition, result in headache, drowsiness, metallic taste, loss of appetite, nausea, tremors, convulsions, and respiratory arrest. Proper precautions should be taken when handling this compound, including lab goggles and safety gloves. This compound should be handled in a well ventilated area.

Uses

Industrial
Gallium(III) telluride is a p-type semiconductor of the III-VI type. Currently its use in industry is relatively limited but further application are being explored, especially as its use in a thin film and for applications in laser diodes and solar cells.

Biomedical
The medical uses of gallium(III) telluride are still being investigated.

Other Uses
Gallium(III) telluride has been used in the production of sputtering targets, used for semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. High-purity gallium(III) telluride is commercially available in many crystalline and polycrystalline forms.

References

Tellurides
Gallium compounds
Gallium(II) telluride. Gallium(II) telluride, GaTe, is a chemical compound of gallium and tellurium.
There is research interest in the structure and electronic properties of GaTe because of the possibility that it, or related compounds, may have applications in the electronics industry. Gallium telluride can be made by reacting the elements or by metal organic vapour deposition (MOCVD).

GaTe produced from the elements has a monoclinic crystal structure. Each gallium atom is tetrahedrally coordinated by 3 tellurium and one gallium atom. The gallium-gallium bond length in the Ga2 unit is 2.43 Angstrom. The structure consists of layers and can be formulated as Ga24+ 2Te2−. The bonding within the layers is ionic-covalent and between the layers is predominantly van der Waals. GaTe is classified as a layered semiconductor (like GaSe and InSe which have similar structures). It is a direct band gap semiconductor with an energy of 1.65eV at room temperature.
A hexagonal form can be produced by low pressure metal organic vapour deposition (MOCVD) from alkyl gallium telluride cubane-type clusters e.g. from (t-butylGa( μ3-Te))4. The core consists of a cube of eight atoms, four gallium, and four tellurium atoms. Each gallium has an attached t-butyl group and three adjacent tellurium atoms and each tellurium has three adjacent gallium atoms. The hexagonal form, which is closely related to the monoclinic form, containing Ga24+ units,  converts to the monoclinic form when annealed at 500 °C.

References

Tellurides
Gallium compounds
SGI VPro. VPro, also known as Odyssey, is a computer graphics architecture for Silicon Graphics workstations. First released on the Octane2, it was subsequently used on the Fuel and Tezro workstations and the Onyx visualization systems, where it was branded InfinitePerformance.

VPro provides some very advanced capabilities such as per-pixel lighting, also known as "phong shading", (through the SGIX_fragment_lighting extension) and 48-bit RGBA color. On the other hand, later designs suffered from constrained bandwidth and poorer texture mapping performance compared to competing GPU solutions, which rapidly caught up to SGI in the market.

Four different Odyssey-based VPro graphics board revisions existed, designated V6, V8, V10 and V12. The first series were the V6 and V8, with 32MB and 128MB of RAM respectively; the V10 and V12 had double the geometry performance of the older V6/V8, but were otherwise similar. The V6 and V10 can have up to 8MB RAM allocated to textures, while V8 and V12 can have up to 108MB RAM used for textures. The V10 and V12 boards used in Fuel, Tezro and Onyx 3000 computers use a different XIO connector than the cards used in Octane2 workstations.

The VPro graphics subsystem consists of an SGI proprietary chip set and associated software. The chip set consists of the buzz ASIC, the pixel blaster and jammer (PB&J) ASIC, and associated SDRAM. The buzz ASIC is a single-chip graphics pipeline. It operates at 251 MHz and contains on-chip SRAM. The buzz ASIC has three interfaces:

 Host (16-bit, 400-MHz peer-to-peer XIO link)
 SDRAM (The SDRAM is 32 MB (V6 or V10) or 128 MB (V8 or V12); the memory bus operates at half the speed of the buzz ASIC.)
 PB&J ASIC

As a result of a patent infringement settlement, SGI acquired rights to some of the Nvidia Quadro GPUs and released VPro-branded products (the V3, VR3, V7 and VR7) based on these (the GeForce 256, Quadro, Quadro 2 MXR, and Quadro 2 Pro, respectively). These cards share nothing with the original Odyssey line and could not be used in SGI MIPS workstations.

All VPro boards support the OpenGL ARB imaging extensions, allowing for hardware acceleration of numerous imaging operations at real-time rates.

VPro Series (Odyssey-based)

References

External links 
 

Graphics chips
VPro
Hafnium carbide. Hafnium carbide (HfC) is a chemical compound of hafnium and carbon. Previously the material was estimated to have a melting point of about 3,900 °C. More recent tests have been able to conclusively prove that the substance has an even higher melting point of 3,958 °C exceeding those of tantalum carbide and tantalum hafnium carbide which were both previously estimated to be higher. However, it has a low oxidation resistance, with the oxidation starting at temperatures as low as 430 °C. Experimental testing in 2018 confirmed the higher melting point yielding a result of 3,982 (±30°C) with a small possibility that the melting point may even exceed 4,000°C.

Atomistic simulations conducted in 2015 predicted that a similar compound, hafnium carbonitride (HfCN), could have a melting point exceeding even that of hafnium carbide. Experimental evidence gathered in 2020 confirmed that it did indeed have a higher melting point exceeding 4,000 °C, with more recent ab initio molecular dynamics calculations predicting the HfC0.75N0.22 phase to have a melting point as high as 4,110 ± 62 °C, highest known for any material.

Hafnium carbide is usually carbon deficient and therefore its composition is often expressed as HfCx (x = 0.5 to 1.0). It has a cubic (rock-salt) crystal structure at any value of x.

Hafnium carbide powder is obtained by the reduction of hafnium(IV) oxide with carbon at 1,800 to 2,000 °C. A long processing time is required to remove all oxygen. Alternatively, high-purity HfC coatings can be obtained by chemical vapor deposition from a gas mixture of methane, hydrogen, and vaporized hafnium(IV) chloride. 

Because of the technical complexity and high cost of the synthesis, HfC has a very limited use, despite its favorable properties such as high hardness (greater than 9 Mohs) and melting point.

The magnetic properties of HfCx change from paramagnetic for x ≤ 0.8 to diamagnetic at larger x. An inverse behavior (dia-paramagnetic transition with increasing x) is observed for TaCx, despite its having the same crystal structure as HfCx.

See also 
 Tantalum carbide
 Tantalum hafnium carbide
 Hafnium carbonitride

References

Carbides
Hafnium compounds
Rock salt crystal structure
Refractory materials