omniomni/omni-engineering huggingface dataset:
EVE/ZeBu. EVE/ZeBu is a provider of hardware-assisted verification tools for functional verification of application-specific integrated circuits (ASICs) and system on chip (SOC) designs and for validation of embedded software (software driver, operating system and application software) ahead of implementation in silicon.

EVE's hardware acceleration and hardware emulation products work in conjunction with Verilog, SystemVerilog, and VHDL-based simulators from Synopsys, Cadence Design Systems and Mentor Graphics. EVE's flagship product is ZeBu.

History
In 2000, EVE was founded in France.

In 2002, EVE launched its flagship ZeBu's first emulation product and SystemC support.

In May 2006, EVE introduced a communication link to SystemVerilog simulation, SystemVerilog assertion support, and a register transfer level compiler for mapping an ASIC or System-on-a-chip (SOC) design into ZeBu's arrays of FPGAs.

In January 2007, EVE acquired Tharas, a microprocessor-based hardware acceleration systems supplier.

In July 2009, EVE announced their ZeBu-Server emulator could handle one billion logic gates.

In October 2012, EVE was acquired by Synopsys.

Management team
Luc Burgun - CEO President and CTO, Co-founder
Ludovic Larzul - Engineering VP, Co-founder
Lauro Rizzatti - EVE-USA General Manager and WW Marketing VP
William Addi - Chief Financial Officer
Ron Burns - Sales VP
Christophe Ballan - Operations VP

Products
EVE has a ZeBu family of hardware acceleration and FPGA-based hardware emulation products,  which EVE claims has design capacity scalable from 10M to 1B ASIC gates and a top speed of 30 MHz.

Features
The ZeBu emulator supports operational modes for hardware description language (HDL) acceleration, ANSI C++/SystemC/SystemVerilog transaction-based co-emulation, where the testbench described at high-level of abstraction drives the design mapped in ZeBu via communication protocol interfaces called transactors, and an in-circuit emulator mode.

The ZeBu compiler does automation chip division, where one SoC is divided into multiple FPGAs based on user specified parameters for input file paths, such as EDIF Netlist, number of FPGAs the ZeBu board has, and the number of CPUs used for compilation.

ZeBu has static, dynamic and flexible probes for retrieving and depositing data. Static and flexible probes are created during compilation, with speeds exceeding 10 MHz. Dynamic probes do not require compilation, and slow down the execution speed of the emulator to few kilohertz.

ZeBu can be used by up to 25  multiple concurrent users.

See also
Hardware emulation

References

External links 

Electronic design automation companies
Companies based in San Jose, California
List of power stations in Switzerland. The following page lists power stations in Switzerland. For traction current see List of installations for 15 kV AC railway electrification in Germany, Austria and Switzerland.

Hydroelectric

There are 556 hydroelectric power plants in Switzerland that have a capacity of at least 300 kW. Some of these are listed below:

Nuclear

Thermal

A gas turbine testing facility in Birr AG, belonging to Ansaldo Energia, sometimes feeds up to 740 megawatts into the Swiss electricity grid.

See also

 List of power stations in Europe
 List of largest power stations in the world
 List of wind farms in Switzerland

References

Switzerland
 
Lists of buildings and structures in Switzerland
Masayoshi Tomizuka. Masayoshi Tomizuka is a professor in Control Theory in Department of Mechanical Engineering, University of California, Berkeley. He holds the Cheryl and John Neerhout, Jr., Distinguished Professorship Chair. Tomizuka received his B.S. and M.S. degrees in mechanical engineering from Keio University, Tokyo, Japan in 1968 and 1970, and his Ph.D. in mechanical engineering from the Massachusetts Institute of Technology in February 1974.  He was elected to the National Academy of Engineering in 2022.

Career 
Tomizuka joined the faculty of the Department of Mechanical Engineering  at the University of California, Berkeley in 1974.  He served as vice chair of mechanical engineering in charge of instruction from December 1989 to December 1991, and as vice chair in charge of graduate studies from July 1995 to December 1996. Since June 11, 2009, he has been executive associate dean for the College of Engineering at UC Berkeley. He also served as program director of the Dynamic Systems and Control Program at the National Science Foundation from Sept. 2002 to Dec. 2004.

Research interests 
Tomizuka's current research interests include optimal and adaptive control, digital control, signal processing, motion control, and control problems related to robotics, manufacturing, data storage devices, vehicles and human-machine systems.

Society activities 
Tomizuka has been and is an active member of the Dynamic Systems and Control Division (DSCD) of the American Society of Mechanical Engineers (ASME).  He served as chairman of the executive committee of the Division (1986–87), Technical Editor of the ASME Journal of Dynamic Systems, Measurement and Control, J-DSMC (1988–93) and editor-in-chief of the IEEE/ASME Transactions on Mechatronics (1997–99).  He served as president of the American Automatic Control Council (1998–99). He chairs the IFAC Technical Committee on Mechatronic Systems.  He is a Fellow of the ASME, the Institute of Electric and Electronics Engineers (IEEE) and the Society of Manufacturing Engineers.  He is the recipient of the Best J-DSMC Best Paper Award (1995), the DSCD Outstanding Investigator Award (1996), the Pi Tau Sigma-ASME Charles Russ Richards Memorial Award (1997), the DSCD Leadership Award (2000), the Rufus Oldenburger Medal (2002) and the John R. Ragazzini Award (2006).  The Oldenburger Medal was awarded to him for his seminal contributions in the area of adaptive control, preview control and zero-phase control.

References

External links 
 Prof. Tomizuka's Personal Page
 Prof. Tomizuka's Research Lab
 Prof. Tomizuka's Curriculum Vitae
 Selected Publications of Prof. Tomizuka

Control theorists
American academics of Japanese descent
UC Berkeley College of Engineering faculty
Japanese mechanical engineers
1946 births
Living people
Fellows of the American Society of Mechanical Engineers
Fellows of the IEEE
Engineers from Tokyo
Academics from Tokyo
Japanese emigrants to the United States
Silicone foam. Silicone foam is a synthetic rubber product used in gasketing, sheets and firestops. It is available in solid, cured form as well as in individual liquid components for field installations.

Uses
Gaskets
Sheets
High temperature tubes for autoclaves
Firestops
Surfactants

Vulcanisation
When the constituent components of silicone foam are mixed together, they evolve hydrogen gas, which causes bubbles to form within the rubber, as it changes from liquid to solid. This results in an outward pressure. Temperature and humidity can influence the rate of expansion.

See also
Firestop
Vulcanisation
Rubber
Silicone resin

References

External links

YouTube video showing silicone foam being mixed and expanded
Silicone foam used as high temperature tube for autoclave
Stockwell Elastomerics silicone foam used in gasketing 
Silicone Engineering Silicone Foam used in Rail and Mass Transit Systems
Silicone sponge sheets
Silicone foam surfactant, the Marangioni effect on cell stabilisation
Silicone foam without use of toxic blowing agents

Foams
Rubber
Passive fire protection
Firestops
Government College of Engineering & Textile Technology Serampore. The Government College of Engineering & Textile Technology, Serampore (GCETTS) is an engineering college in Serampore, West Bengal, India.

History
A textile industry was established in India in the middle of 19th century. The need for trained technical personnel to drive that was felt in Bengal which led to the establishment of the institution. The Government College of Engineering and Textile Technology Serampore was established in 1908 as the Government Central Weaving Institute with a two-year certificate course in weaving in a rented house in Serampore. 
In 1938, a three-year diploma course in textile technology was started which was upgraded to degree course in 1957 under the affiliation of Calcutta University.

The institution was renamed as College of Textile Technology Serampore, which was changed to its present name in 2005.
From the year 2009 B.Tech in A.P.M and M.Tech in Chemical Processing of Textile was started.

Present status

Undergraduate and post graduate courses are:
 BTech in Textile Technology
 BTech in Computer Science and Engineering
 BTech in Information Technology
 BTech in Apparel Production and Management
 M.Tech in Textile Technology
 M.Tech in Chemical Processing Of Textiles

Department of Textile Technology 
This is the oldest department of the college. Earlier affiliated with University of Calcutta, the college has contributed immensely in providing technical manpower to the textile industry of the country. The department offers Post Graduate Programme ( M.Tech) as well. The department has state of the art machines in its spinning, weaving, Textile Processing lab and Testing lab.

Computer science and information technology departments

The Computer Science and Engineering Department and Information Technology Department were formed in 2001 and 2000 respectively. Due to the formation of West Bengal University of Technology, the Serampore Textile College incorporated in its curriculum the CSE and IT departments and changed its name to the present name. The CSE and IT departments share all the labs as the subjects are very similar.

Laboratories include electronics, microprocessors, communication engineering, software labs (operating systems, database management systems (DBMS), media, control and systems simulation), basic programming (subjects like Java, World Wide Web, Artificial Intelligence). The physics lab, chemistry lab, and mechanical workshop and electrical workshop, are shared among all departments.

Gallery

References

External links
 Official website
 Official website of WBUT

Colleges affiliated to West Bengal University of Technology
Engineering colleges in West Bengal
Textile schools in India
Universities and colleges in Hooghly district
1908 establishments in India
Universities and colleges established in 1908
255n. 255N is a US Army Military Occupational Specialty code for a Network Management Technician - a Warrant Officer Military Occupational Specialty  in the Signal Corps. It was previously known as 250N.

Network Management Technicians transport the voice, video and data networks establishing and maintaining the transport layer environment of Army's portion of the Cyberspace domain through network management/enterprise systems management (NM/ESM) functions to include fault management, configuration management, auditing and accountability measures, maintaining performance standards, and implementing security measures at all levels in support of combat information superiority and command and control. They supervise and manage the operation and internetworking of telecommunications networks, network systems equipment, network nodal transmission and transport systems, network management system platforms, networked information systems and associated personnel at both the local area and wide area network level. They plan, install, administer, manage, maintain, integrate, operate, service, secure, optimize and troubleshoot communications networks and networked-systems connectivity and capacity in order to transmit information as an element of combat power. They supervise and oversee network security planning and the implementation and use of electronic keys and frequency management to support communications networks and networked-systems. They manage the training of personnel on the planning, installation, administration, management, maintenance, integration, operation, servicing, securing, optimization and troubleshooting of communications networks and networked-systems. They develop policy recommendations and provide technical guidance and advice to commanders and staffs on the management and operation of Army, joint, intergovernmental, interagency and multinational communications networks and networked-systems.

References

United States military specialisms
Iconics. ICONICS is an industrial automation software provider. ICONICS software is used by many industries such as automotive, transportation, building control, security, food, pharmaceutical, machine building, oil & gas, petrochemical, water & wastewater, renewable energy and manufacturing. It is a subsidiary of Mitsubishi Electric.

History
Founded in 1986, headquartered in Foxborough, Massachusetts, the company has offices worldwide, including Australia, Canada, China, France, Germany, India, Middle East, Netherlands, Singapore and United Kingdom. ICONICS also has joint software development and sales offices in the Czech Republic and Italy. ICONICS is a Microsoft Gold Certified Partner whose products are tied closely to Microsoft operating systems. The company's first offerings were integrated with DOS, then evolved with the emergence of Microsoft Windows (including 3.1, NT, CE, 2000 and XP).

In 2011, ICONICS signed a global partnership agreement with Mitsubishi Electric to develop integrated software for the Process Automation and Social Infrastructure global markets, with Mitsubishi Electric contributing a 19.9% equity investment in ICONICS. In March 2019 Mitsubishi Electric took full ownership.

ICONICS is a charter member of the OPC Foundation, an organization responsible for maintaining the standards for automation connectivity. In 2021, ICONICS appointed Mr. Edward (“Ted”) Hill as the company’s new President and CEO. Mr. Hill replaced Mr. Yuji Ichioka, who served as the Interim President and CEO following the November 2020 retirement of the company’s founder, Mr. Russ Agrusa.

Worldwide applications
ICONICS software is used by companies throughout the world including:

Transneft Russian Pipeline 
Heathrow Terminal 5
Loudoun Water
The Pentagon
University of Virginia
Microsoft campus

Other companies using ICONICS software for their industrial automation applications include the Rome Metro, Deutsche Bahn, Mohegan Sun Casino, Federation Tower, Schiphol Airport, Phoenix Sky Harbor International Airport and Poste Italiane.

References

Automation organizations
Companies based in Massachusetts
Mitsubishi Electric
Technology companies established in 1986
1986 establishments in Massachusetts
Nikolay Benardos. Nikolay Nikolayevich Benardos (Russian: Никола́й Никола́евич Бенардо́с) (1842–1905) was an inventor from the Russian Empire who was of Greek descent who in 1881 introduced carbon arc welding, which was the first practical arc welding method.

Biography 
Nikolay Benardos was born on July 8, 1842, in Benardosivka, Kherson Governorate, Russian Empire.

During the 1860s and 1870s he investigated the electric arc, and he worked on this in Moscow, St. Petersburg and Kineshma. Nikolay Benardos was the first to apply an electric arc to heat the edges of the steel sheets to the plastic state. He demonstrated a new way of metal compounds in Paris in 1881.

He could not stay in the capital due to his financial state of affairs and in 1899 he moved to Fastiv (now Kyiv Oblast, Ukraine).

He died at the age of 63 in Fastiv.

M. M. Benardos Museum in Pereiaslav, Ukraine 
The museum was established in Pereiaslav (Ukraine) in 1981 to commemorate 100 years after inventing the Elektrogefest. The museum consists of five rooms: a study, living room, workshop, laboratory and the exhibition hall.

References

External links 
 Biography of Benardos by A. A. Chekanov 
 Benardos Nikolay Nikolayevich at weldworld.ru 
 БЕНАРДОС Микола Миколайович 

1842 births
1905 deaths
Inventors from the Russian Empire
People from the Russian Empire of Greek descent
Engineers from the Russian Empire
Maingear. Maingear (stylized as MAINGEAR) is an American privately held computer manufacturer headquartered in Warren, New Jersey. The company builds, designs, and supports custom desktops, gaming computers, customizable laptops, and workstations in the United States.

History
Maingear is a PC system builder that offers custom desktops, custom-built laptops, workstations, small form factor PCs, and media.

The company was founded in 2002 by Wallace Santos, founder and CEO. Santos began building computers with a focus on customer service and luxury quality. In November 2022, a professional gamer known as Shroud announced on Twitter that he became the co-owner of Maingear.

Partnerships 

In 2016, Razer Inc. collaborated with Maingear to release the R1 Razer Edition. Coca-Cola have also partnered with Maingear for custom products.

In 2017, the company partnered with HP Inc. to release a custom-tuned version of their Omen X.

In 2018, the E-Sports betting platform, Unikrn, announced it will be working with Maingear to produce a UKG CryptoMining PC.

Along with his November 2022 co-ownership announcement, Shroud also announced that he partnered with Maingear and released his own custom build.

References

Computer hardware companies
Computer systems companies
Companies based in Union County, New Jersey
Computer companies of the United States
Parag Saxena. Parag Saxena (Hindi: पराग सक्सेना; born 27 April 1955) is an Indian investment manager that is Co-Founder and General Partner of Vedanta Capital. He had previously founded Invesco Private Capital, a subsidiary of Invesco, and New Silk Route.

Early life and education 
Saxena earned a B.Tech from the Indian Institute of Technology, an M.S. in Chemical Engineering from the West Virginia College of Graduate Studies and an M.B.A. from the Wharton School of the University of Pennsylvania.

Career 

Saxena started his career at Becton Dickinson as a product manager in 1978. Saxena was subsequently the Managing Partner and founded Invesco Private Capital, a subsidiary of Invesco. Parag, over the course of four years, consistently qualified for Forbes Midas List. Parag was named the 23rd, 38th, 31st and 28th best deal maker in venture capital in the 2006, 2007, 2008 and 2009 lists, respectively.

He spent 23 years at Invesco Private Capital. He also worked at Chancellor Capital Management, acquired by Invesco in 1998. He stepped down as managing partner of Invesco Private Capital in April 2006, with the New York Times noting many investors had been leaving the company, and quoting him as noting that conflict among management and lawsuits against Invesco had made it increasingly hard to raise funds. 

In 2006, he co-founded New Silk Route with Rajat Gupta and Raj Rajaratnam, as well as Mark Schwartz. The fund closed to investors in late 2008. Raja Gupta filed a lawsuit against Saxena in 2013, alleging Saxena in 2012 started limiting his access to New Silk Route after Gupta had sentenced in 2012 for securities fraud. The lawsuit was dismissed by a judge in 2013 for being irrelevant.

Personal life
He and Usha Saxena have several children together.

See also 
New Silk Route

References

1955 births
Living people
Businesspeople from Pune
Private equity and venture capital investors
Wharton School alumni
IIT Bombay alumni
Dymalloy. Dymalloy is a metal matrix composite of 20% copper and 80% silver alloy matrix with type I diamond. It has a very high thermal conductivity of 420 W/(m·K), and its thermal expansion can be adjusted to match other materials, e.g., silicon and gallium arsenide chips. It is chiefly used in microelectronics as a substrate for high-power and high-density multi-chip modules, where it aids with removing waste heat.

Dymalloy was developed as part of CRADA between Sun Microsystems and Lawrence Livermore National Laboratory. It was first researched for use in space-based electronics for the Brilliant Pebbles project.
Dymalloy is prepared from diamond powder of about 25 micrometers in size. The grains are coated by physical vapor deposition with 10 nanometers thick layer of alloy of tungsten with 26% rhenium, forming a tungsten carbide layer that assists bonding, then coated with 100 nanometers of copper to avoid carbide oxidation, then compacted in a mold and infiltrated with molten copper-silver alloy. Adding 55 vol.% of diamond yields material with thermal expansion matching that of gallium arsenide; a slightly higher amount of diamond allows matching to silicon. Copper can be used instead of copper-silver alloy, but the higher melting point may cause a partial transformation of diamond to graphite. The material shows some plasticity. High mechanical strain causes brittle failure in the diamond grains and ductile failure in the matrix. The diamond grains give the alloy a degree of surface texture; when a smooth surface is desired, the alloy can be plated and polished.

In 1996, the price for a 10×10×0.1 cm substrate was quoted as USD 200.

Similar alloys are possible with the metal phase of one or more of silver, copper, gold, aluminium, magnesium, and zinc. The carbide-forming metal can be selected from titanium, zirconium, hafnium, vanadium, niobium, tantalum, and chromium, where Ti, Zr, and Hf are preferable. The amount of carbide-forming metal must be sufficient to coat at least 25% of the diamond grains, as otherwise, the bonding is insufficient, and the heat transfer between matrix and diamond grains is weak, which leads to loss of effectivity towards the level of the matrix metal alone. The material may deform at higher temperatures and must be low to prevent the formation of too thick a carbide layer that would hinder heat transfer. The volume of diamond should be higher than 30 vol.%, as a lower ratio does not provide a significant increase of thermal conductivity, and lower than 70 vol.% as a higher ratio of diamond makes thermal expansion matching to semiconductors difficult.  The grains should also be surrounded with metal to avoid deformation due to different thermal expansion coefficients between diamond and metal; the carbide coating assists with this.

A similar material is AlSiC, with aluminium instead of copper-silver alloy and silicon carbide instead of diamond.

References

Metal matrix composites
Copper alloys
Diamond
Chip carriers
Sensistor. Sensistor is a resistor whose resistance changes with temperature.

The resistance increases exponentially with temperature, that is the temperature coefficient is positive (e.g. 0.7% per degree Celsius).

Sensistors are used in electronic circuits for compensation of temperature influence or as sensors of temperature for other circuits.

Sensistors are made by using very heavily doped semiconductors so that their operation is similar to PTC-type thermistors. However, very heavily doped semiconductor behaves more like a metal and the resistance change is more gradual than it is the case for other PTC thermistors.

See also 
 thermistor

References 

Sensors