Query: Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

Candidate papers:

abstract: Condition monitoring (CM) has already been proven to be a cost effective means of enhancing reliability and improving customer service in power equipment, such as transformers and rotating electrical machinery. CM for power semiconductor devices in power electronic converters is at a more embryonic stage; however, as progress is made in understanding semiconductor device failure modes, appropriate sensor technologies, and signal processing techniques, this situation will rapidly improve. This technical review is carried out with the aim of describing the current state of the art in CM research for power electronics. Reliability models for power electronics, including dominant failure mechanisms of devices are described first. This is followed by a description of recently proposed CM techniques. The benefits and limitations of these techniques are then discussed. It is intended that this review will provide the basis for future developments in power electronics CM.
author_names: Shaoyong Yang

Dawei Xiang

Angus T Bryant

Philip A Mawby

Li Ran

Peter J Tavner
title: Condition Monitoring for Device Reliability in Power Electronic Converters: A Review
venue: IEEE Transactions on Power Electronics
year: 2010

abstract: In terms of power supplies and power conversion, power electronics based converters have their own advantages. Proper condition monitoring for power electronic converter has become necessary which is now in incipient stage. This paper includes different kinds of failure modes associated with power electronics at the converter as well as device level and recent Condition Monitoring (CM) techniques to detect those faults at the earliest stage. Proper reliability improvement has to be performed on power electronic systems so that they could be more resistive to different aspects such as safety, cost and availability. Power semiconducting devices are considered to be the most sensitive part of the power electronic systems and the main causes of stresses on these devices could be initiated due to the atmospheric conditions as well as short duration heavy loads, which should be considered during power electronic system design and normal operation as the consequences of these can't be felt at the initial stage which demands conservative converter design.
author_names: Sai Srinivas Manohar

Animesh Sahoo

Aravinth Subramaniam

Sanjib Kumar Panda
title: Condition monitoring of power electronic converters in power plants A review
venue: 2017 20th International Conference on Electrical Machines and Systems (ICEMS)
year: 2017

abstract: The investigation shows that power semiconductor devices are the most fragile components of power electronic systems.Improving the reliability of power devices is the basis of a reliable power electronic system, and in recent years, many studies have focused on power device reliability.This paper describes the current state of the art in reliability research for power semiconductor devices, mainly includes failure mechanisms,condition monitoring, lifetime evaluation and active thermal control.Among them,condition monitoring technology are classified and summarized by the failure mechanism and the change rules of characteristic quantities; The method of lifetime estimation isillustrated from the practical point of view;Methods of active thermal control are classified and summarized from the two ideas of reducing loss and loss compensation which are refined by the principle of realization. At last, this paper draws the existing problems and challenges of power devices reliability studies.
author_names: Bo Wang

Jie Cai

Xiong Du

Luowei Zhou
title: Review of power semiconductor device reliability for power converters
year: 2017

abstract: Condition and health monitoring (C&HM) is an effective means of improving the availability and controlling the life time cost of power electronic components, converters and systems. Many solutions have been developed, but their adoption in industrial applications is still scarce. This paper intends to the reasons for this by favouring Industrially motivated research. Advanced C&HM techniques that open new possibilities for industrialisation are reviewed. Their potential, limitations and implementation are outlined and critically assessed with the goal of benefiting both industry applications and research. A significant part of the paper is dedicated to C&HM for power devices and modules, responding to the general perception that they are the least reliable with topics such as prognostics based qualification for power electronics to predict the future reliability of the products and remaining useful lifetime methods. In situ methods for estimation of junction temperature and use of temperature sensitive electrical parameters are summarised within the framework of C&HM. The C&HM of other notoriously unreliable components, such as capacitors and batteries are also addressed.
author_names: Stefan V Mollov

Frede Blaabjerg
title: Condition and Health Monitoring in Power Electronics
year: 2018

abstract: The urgency for an increased capacity boost bounded by enhanced reliability and sustainability through operating cost reduction has become the major objective of electric utilities worldwide. Power electronics have contributed to this goal for decades by providing additional flexibility and controllability to the power systems. Among power electronic based assets, high voltage dc (HVdc) transmission systems and flexible ac transmission systems (FACTS) controllers have played a substantial role on sustainable grid infrastructure. Recent advancements in power semiconductor devices, in particular in voltage source converter based technology, have facilitated the widespread application of HVdc systems and FACTS devices in transmission networks. Converters with larger power ratings and higher number of switches have been increasingly deployed for bulk power transfer and large scale renewable integration increasing the need of managing power converter assets optimally and in an efficient way. To this end, this paper reviews the state of the art of asset management strategies in the power industry and indicates the research challenges associated with the management of high power converter assets. Emphasis is made on the following aspects: condition monitoring, maintenance policies, and ageing and failure mechanisms. Within this context, the use of a physics of failure based assessment for the life cycle management of power converter assets is introduced and discussed.
author_names: Tibin Joseph

Carlos Ernesto Ugalde-Loo

Jun Liang

Paul F Coventry
title: Asset Management Strategies for Power Electronic Converters in Transmission Networks: Application to Hvdc and FACTS Devices
venue: IEEE Access
year: 2018

abstract: With the extensive use of power converters in modern hybrid vehicles, rises the need for efficient methods of condition monitoring and fault diagnosis to ensure the reliability of the automotive electrical power system. This paper is a technical review that studies power electronic devices and converters used in hybrid electric vehicles with a description of possible faults and a highlight on the recent progress of condition monitoring and fault diagnosis methods used in electric drive systems.
author_names: H Al-Sheikh

Ouadie Bennouna

Ghaleb Hoblos

Nazih Moubayed
title: Study on power converters used in hybrid vehicles with monitoring and diagnostics techniques
venue: MELECON 2014 2014 17th IEEE Mediterranean Electrotechnical Conference
year: 2014

abstract: Defense applications require quality electrical power in the form of three phase/single phase AC, 50 Hz/400 Hz and regulated DC power in general in the form of 5/12/24/28/48 V. To full fill these requirements, power conversion systems in the form of UPS, PCS, SMPS are required to be developed. Also various applications require different servo drives for controlled and desired speed torque applications. Hence it is important to have efficient, compact, and reliable power conversion units with high power density to supply a wide range of loads for Military systems. More and more efforts are required for better power electronic systems in terms of reliability to ensure high availability, long life, sufficient robustness, low maintenance for such applications. Wideband gap devices such as Silicon Carbide (SiC) and Gallium Nitride (GaN) devices in power electronic converters can be used to reduce the device losses in futuristic defense applications. This paper presents the over view, need and requirement, customization and design aspects of power converter systems for defense applications. Some of the case studies on recent developments of such variants of power conditioning systems are also presented in this paper.
author_names: Kirti Rathod

Arbind Kumar

Geeta Waghulde

Pradeep Kurulkar
title: Power supply systems for defence applications a review part: II power conditioner system
venue: 2017 National Power Electronics Conference (NPEC)
year: 2017

abstract: Condition monitoring is needed in power electronic systems as a cost effective means of improving reliability. Packaging related solder fatigue has been identified as one of the main root causes of power electronic module failures. This paper presents a method to monitor solder fatigue inside a module by identifying the increase of internal thermal resistance due to that solder fatigue, taking account of the masking effect of the variable operating point. It is assumed that the total loss in the module increases as junction temperature rises, causing an increase in case above ambient temperature rise, which can be measured. A dynamic thermal model of the heat sink is utilized to estimate the power loss from temperature measurements, while a device power loss model is developed to estimate the internal thermal resistance by considering the converter electrical loading. Experiment and simulation are used to demonstrate the concept and verify the method.
author_names: Dawei Xiang

Li Ran

Peter J Tavner

Angus T Bryant

Shaoyong Yang

Phil Mawby
title: Monitoring Solder Fatigue in a Power Module Using Case Above Ambient Temperature Rise
venue: IEEE Transactions on Industry Applications
year: 2011

abstract: Reliability of power electronic systems is a major concern for application engineers in the automotive and power system sectors. Power electronic modules are one of the main sources of failure in wind energy conversion systems. Power electronic converters used in wind turbine electric drivetrains, railway traction, more electric aircrafts, marine propulsion and grid connected systems like FACTS/HVDC require reliable power devices and modules. Wide bandgap semiconductors like SiC have demonstrated enlarged electrothermal Safe Operating Areas compared with silicon devices. However, the reliability of SiC power modules and packages has been identified as an area of potential weakness. Traditional packaging systems have been developed for Si hence the different thermomechanical properties of SiC cause different stresses in the packaging thereby potentially causing reduced reliability. This paper identifies some of the key areas for the development of reliable power electronic systems using SiC. The focus is on condition monitoring, packaging system innovation and thermo mechanical stress analysis as a function of the mechanical properties of Si and SiC. Power cycling experiments and finite element models have been used to support the analysis.
author_names: J Ortiz Gonzalez

Li Ran

A M Soli

Zarina Davletzhanova

Olayiwola Alatise

Philip A Mawby

Borong Hu

Zheng Zeng

Hai Ren

Li Hui

Shengyou Xu
title: Enabling high reliability power modules: A multidisciplinary task
venue: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM)
year: 2016

abstract: Condition monitoring is desired by power electronic system designers as a cost effective means of improving reliability. This paper presents a method to monitor solder fatigue inside a power module by identifying internal thermal resistance increases due to solder fatigue, taking account of the masking effects of a variable operating condition. It is assumed that the total power loss increases as junction temperature rises, causing an increase in the case temperature above ambient, which can be measured. A dynamic thermal model of the heat sink is established, to estimate power loss by measurement, while a device power loss model is developed to estimate internal thermal resistance by further considering the converter electrical loading. Experiment and simulation using validated models are used to characterise the proposed method and verify the concept.
author_names: Dawei Xiang

Li Ran

Peter J Tavner

Shaoyong Yang

Angus T Bryant

Philip A Mawby
title: Monitoring solder fatigue in a power module using the rise of case above ambient temperature
venue: 2010 IEEE Energy Conversion Congress and Exposition
year: 2010