Query: A review of the status of plastic encapsulated semiconductor component reliability

Candidate papers:

abstract: La fiabilite des composants semiconducteurs (bipolaires et MOS) sous capsules de plastique s'est amelioree depuis leur introduction et leurs utilisations se multiplient. Les demandes du marche pour des produits bon marche et fiables ont eu pour consequence des developpements technologiques assurant une meilleure fiabilite, avec des ameliorations des capsules de plastique, en particulier des couches de passivation, un meilleur controle de la qualite. Des controles acceleres de l'humidite pour etablir la fiabilite font partie de la strategie de production a faible prix
author_names: Richard Lawson
title: A review of the status of plastic encapsulated semiconductor component reliability
year: 1984

abstract: Piezoresistive sensors are among the earliest micromachined silicon devices. The need for smaller, less expensive, higher performance sensors helped drive early micromachining technology, a precursor to microsystems or microelectromechanical systems (MEMS) The effect of stress on doped silicon and germanium has been known since the work of Smith at Bell Laboratories in 1954. Since then, researchers have extensively reported on microscale, piezoresistive strain gauges, pressure sensors, accelerometers, and cantilever force/displacement sensors, including many commercially successful devices. In this paper, we review the history of piezoresistance, its physics and related fabrication techniques. We also discuss electrical noise in piezoresistors, device examples and design considerations, and alternative materials. This paper provides a comprehensive overview of integrated piezoresistor technology with an introduction to the physics of piezoresistivity, process and material selection and design guidance useful to researchers and device engineers.
author_names: A Alvin Barlian

Woo-Tae Park

Joseph R Mallon

Ali J Rastegar

Beth L Pruitt
title: Review: Semiconductor Piezoresistance for Microsystems
venue: Proceedings of the IEEE
year: 2009

author_names: Robert Wolpert
title: A Review of the
year: 1985

abstract: Silicon carbide has the potential to replace silicon in a large spectrum of applications. To do so, SiC needs superior performance, a reasonable price and good reliability. However, there are a couple of properties and effects, which could compromise the reliability of SiC devices. Namely, power cycling capability, high temperature operation, bipolar degradation, susceptibility to humidity under operation and all kinds of MOS issues require special attention. After SiC devices have matured to a level at which standard applications are no longer affected by reliability issues, it is now time to find out how far SiC devices can be pushed or what safety margin are required. As testing for the entire useful life is not an option, it is essential to find the right tests that can precisely quantify the degradation or can at least indicate if there is a possible risk. Finally, these tests have to become internationally recognized standards.
author_names: Nando Kaminski

Sarah Rugen

Felix Hoffmann
title: Gaining Confidence A Review of Silicon Carbide's Reliability Status
venue: 2019 IEEE International Reliability Physics Symposium (IRPS)
year: 2019

abstract: Organic electronics are beginning to make significant inroads into the commercial world, and if the field continues to progress at its current, rapid pace, electronics based on organic thin film materials will soon become a mainstay of our technological existence. Already products based on active thin film organic devices are in the market place, most notably the displays of several mobile electronic appliances. Yet the future holds even greater promise for this technology, with an entirely new generation of ultralow cost, lightweight and even flexible electronic devices in the offing, which will perform functions traditionally accomplished using much more expensive components based on conventional semiconductor materials such as silicon.
author_names: Stephen R Forrest
title: The path to ubiquitous and low cost organic electronic appliances on plastic
venue: Nature
year: 2004

abstract: Global environmental concerns and the escalating demand for energy, coupled with steady progress in renewable energy technologies, are opening up new opportunities for utilization of renewable energy resources. Solar energy is the most abundant, inexhaustible and clean of all the renewable energy resources till date. The power from sun intercepted by the earth is about 1.8A xA 1011A MW, which is many times larger than the present rate of all the energy consumption. Photovoltaic technology is one of the finest ways to harness the solar power. This paper reviews the photovoltaic technology, its power generating capability, the different existing light absorbing materials used, its environmental aspect coupled with a variety of its applications. The different existing performance and reliability evaluation models, sizing and control, grid connection and distribution have also been discussed.
author_names: Bhubaneswari Parida

Selvarasan Iniyan

Ranko Goic
title: A review of solar photovoltaic technologies
year: 2011

abstract: Polymer solar cells are reviewed in the context of the processing techniques leading to complete devices. A distinction is made between the film forming techniques that are used currently such as spincoating, doctor blading and casting and the, from a processing point of view, more desirable film forming techniques such as slot die coating, gravure coating, knife over edge coating, off set coating, spray coating and printing techniques such as ink jet printing, pad printing and screen printing. The former are used almost exclusively and are not suited for high volume production whereas the latter are highly suited, but little explored in the context of polymer solar cells. A further distinction is made between printing and coating when a film is formed. The entire process leading to polymer solar cells is broken down into the individual steps and the available techniques and materials for each step are described with focus on the particular advantages and disadvantages associated with each case.
author_names: Frederik C Krebs
title: Fabrication and processing of polymer solar cells: A review of printing and coating techniques
year: 2009

abstract: The field of biomaterials has become a vital area, as these materials can enhance the quality and longevity of human life and the science and technology associated with this field has now led to multi million dollar business. The paper focuses its attention mainly on titanium based alloys, even though there exists biomaterials made up of ceramics, polymers and composite materials. The paper discusses the biomechanical compatibility of many metallic materials and it brings out the overall superiority of Ti based alloys, even though it is costlier. As it is well known that a good biomaterial should possess the fundamental properties such as better mechanical and biological compatibility and enhanced wear and corrosion resistance in biological environment, the paper discusses the influence of alloy chemistry, thermomechanical processing and surface condition on these properties. In addition, this paper also discusses in detail the various surface modification techniques to achieve superior biocompatibility, higher wear and corrosion resistance. Overall, an attempt has been made to bring out the current scenario of Ti based materials for biomedical applications.
author_names: M B Geetha

A K Singh

R Asokamani

Ashok Kumar Gogia
title: Ti based biomaterials, the ultimate choice for orthopaedic implants A review
year: 2009

abstract: It has been known for many years that sex steroid hormones play a role in the development, growth, and behavior of certain tumors. Hormonal manipulation has been shown to be effective in the management of a significant number of patients with breast, prostate, and gynecological malignancies. 14,6 '3 It is recognized that, in order for sex steroid hormones to exert their effect, specific receptors should be present. I 4 9 l 5 Thus, detection of sex steroid hormone receptors in hormone dependent tumors has been important in our understanding of tumor biology and the mechanism of endocrine therapy. Hormone receptor analysis is traditionally performed on surgically removed specimens. However, there are situations where surgical specimens are not available or suitable for such analysis. In these circumstances, cytologic material such as fine needle aspirates, imprints, and exfoliated cells in malignant effusions can be utilized for estrogen and progesterone receptor analysis. Fine needle aspiration biopsy (FNAB) offers a suitable alternative for hormone receptor analysis in several circumstances: first, in inoperable cases and metastatic or recurrent tumors in which the size and the accessibility to surgical biopsy presents a problem; second, in selected cases in which preoperative irradiation or presurgical therapy are the initial treatment options; and third, in advanced tumors where serial hormone receptor studies may potentially provide information regarding response to therapy. FNAB is an easy, cost effective, and nontraumatic procedure which permits sampling of several areas of the same tumor and allows better assessment of hormone receptor heterogeneity. Imprint preparations have also been utilized for hormone receptor analysis and are recommended for tumors
title: Comprehensive review
year: 2019

abstract: Military specified, ceramic packaged and radiation hardened components will disappear before the end of the century. The only long term sustainable alternative may well be to use plastic packaged Commercial Components. The material in this report comes from the Defense Logistics Agency sponsored Plastic Package Availability Program and from an AT and T field reliability study. It summarizes Case Studies from companies which have been building and fielding highly reliable commercial and DOD military systems using plastic commercial components. Findings are, that when properly selected commercial components are operated within the true limitations of their design and packaging, they are as reliable as today`s Mil Spec components. Further, they offer cost, space and weight savings, shared manufacturing and field test experience with industry, and access to the most modern technology. Also reported are potential problems that may be encountered when using commercial components, their long term storage and use reliability characteristics, recommended design processes and supplier selection practices, commercial best business practices, and a semiconductor manufacturer`s view of the military`s switch to commercial plastic microcircuits.
author_names: J Timothy Hanlon
title: The future of components for high reliability military and space applications
year: 1996