Query: Device  electronics for integrated

Candidate papers:

abstract: Semiconductor Electronics. Silicon Technology. Metal Semiconductor Contacts. pn Junctions. Currents in pn Junctions. Bipolar Transistors I: Basic Properties. Bipolar Transistors II: Limitations and Models. Properties of the Metal Oxide Silicon System. Mos Field Effect Transistors I: Physical Effects and Models. Mos Field Effect Transistors II: High Field Effects. Answers to Selected Problems. Selected List of Symbols. Index.
author_names: Richard S Muller

Theodore I Kamins
title: Device Electronics for Integrated Circuits
year: 1977

author_names: Contributors Patricia Veiga-Crespo
title: Device Electronics For Integrated Circuits
year: 2018

abstract: custom design. A chapter is devoted to VLSI architectures, and covers the implementation of finite state machines and the use of cellular logic to reduce complexity. This is followed by an introduction to digital signal processing, and descriptions of some typical signal processing architectures. Having done the groundwork, the author then presents three case studies of signal processing system designs. A digital finite impulse response filter is used to illustrate the basic approach to system design using the metrics introduced earlier. A frequency domain filter shows when to use semi custom VLSI circuits, and a digital beam former presents a case for full custom design. The tradeoffs between using commercial chips, and designing custom chips are discussed. Finally, the book ends with a look at networking, and a comparison of several interconnection schemes. The book is well structured with each chapter starting with a concise summary and finishing with a good reference list. It is aimed at graduate engineers, and forms a useful introduction to signal processing system design. M. J. NAYLOR, Department ofElectrical and Electronic Engineering, University ofCanterbury New Zealand
author_names: Laurence J Herbst
title: Book Review: Device Electronics for Integrated Circuits, 2nd Ed.
year: 1987

abstract: Device Electronics for Integrated Circuits: RICHARD S. MULLER and THEODORE I. KAMINS (John Wiley, 1977,404 pp. PS14.70) This book is a scholarly contribution at an advanced standard on the physical principles of bipolar and MOS silicon devices. The first of the seven chapters covers the basic physics of semiconductors and also deals with the general principles of monolithic integrated circuit technology. The next chapter contains a detailed account of metal semiconductor contacts and gives a better insight into Schottky diodes and transistors than most other texts. Chapters 3 and 4 present a somewhat unusual division of pn junction diode descriptions into predominantly electrostatic effects (Chapter 3) and current flow (Chapter 4) the account reads well. Then come two chapters on bipolar transistors. The first goes into basic device operation and the second embraces performance at low and high currents, high level injection, the charge control and other models. The final two chapters cover MOS fundamentals and MOSFETs. The book is pitched at a level appropriate for Honours undergraduates specifically interested in semiconductor device fundamentals, and for research workers in that field. The more advanced sections of this already erudite contribution are specially marked, as are the more advanced of the well thought out numerous problems set at the end of each chapter. Although much of the material is relevant to integrated circuits, the book decidedly falls short of displaying anything like the closeness to ICs expected from its title. There could have been much more on actual IC device structures and the significance of the various established processing techniques for bipolar and MOS transistors. Nor is there enough coverage of resistors and capacitors. The treatment of MOSFETs lacks the depth of that on bipolar devices, although the authors state correctly that MOS are on par with bipolar ICs at present, and might even overtake them in the future. Another weakness is the treatment of frequency dependent device parameters, which, at an elementary level, is inadequate in respect of subject coverage and equivalent circuit modelling. In spite of these criticisms, the book can be strongly recommended to all those who seek a good rigorous grounding in active silicon semiconductor device operation. L. J. HERBST, Head ofDepartment ofElectrical, Instrumentation and Control Engineering, Teesside Polytechnic, Middlesbrough
author_names: Laurence J Herbst
title: Book Review: Device Electronics for Integrated Circuits
year: 1979

abstract: The demand for novel electronics that can monitor human health, for example, the physical conditions of individuals, during daily life using different techniques from those used in traditional clinic diagnostic facilities is increasing. These novel electronics include stretchable sensor devices that allow various biosignals to be directly measured on human skin without restricting routine activity. The thin, skin like characteristics of these devices enable stable operation under various deformations, such as stretching, pressing, and rubbing, experienced while attached to skin. The mechanically engineered design of these devices also minimizes the inconvenience caused by long term wear owing to conformal lamination on the skin. The final form of a skin attachable device must be an integrated platform with an independent and complete system containing all components on a single, thin, lightweight, stretchable substrate. To fabricate fully integrated devices, various aspects, such as material design for deformable interconnection, fabrication of high performance active devices, miniaturization, and dense arrangement of component devices, should be considered. In particular, a power supply system is critical and must be combined in an electromechanically stable and efficient manner with all devices, including sensors. Additionally, the biosignals obtained by these sensors should be wirelessly transmitted to external electronic devices for free daily activity. This Account covers recent progress in developing fully integrated, stretchable, skin attachable devices by presenting our strategies to achieve this goal. First, we introduce several integration methods used in this field to build stretchable systems with a special focus on the utilization of liquid gallium alloy. The unique characteristics and patterning process of liquid metal are summarized. Second, various skin attachable sensors, including strain, pressure, with enhanced sensitivity and mechanical properties are discussed along with their applications for biosignal monitoring. Dual mode sensors that simultaneously detect temperature and pressure signals without interference are also introduced. Third, we emphasize supercapacitors as promising, efficient energy storage devices for power management systems in wearable devices. Supercapacitors for skin attachable applications should have a high performance, such as high operation voltage, high energy and power densities, cyclic and air stability and water resistance. For this, strategies to select novel materials for electrode, electrolyte, and encapsulation are suggested. Several approaches to fabricate stretchable supercapacitor systems are also presented. Finally, we introduce recent examples of skin attachable, stretchable electronics that integrate sensors, power management devices, and wireless data transfer functions on a single elastomer substrate. Conventional wireless technologies, such as near field communications (NFC) and Bluetooth, are incorporated in miniaturized features on the devices. To date, much research has been performed in this field, but there are still many technologies to develop. The performance of individual devices and mass fabrication techniques should be enhanced. We expect that future electronic devices with fully integrated functions will include advanced human machine interaction capabilities and expand the overall abilities of the human body.
author_names: Yu Ra Jeong

Geumbee Lee

Heun Park

Jeong Sook Ha
title: Stretchable, Skin Attachable Electronics with Integrated Energy Storage Devices for Biosignal Monitoring.
venue: Accounts of chemical research
year: 2019

abstract: being converged with artificial intelligence (AI) by providing users' biological and behavioral signals collected in wearable biodevices,[21 31] offering intelligent services based on big data cloud computing and machine learning.[32 40] A number of research groups have demonstrated flexible memories, thin film transistors (TFTs) and integrated circuits (ICs) as key technology for data processing, information storage, and communication.[41 49] Since Kim et al.[50] reported functional flexible resistive random access memory (RRAM) various chalcogenidebased phase change memories (PCMs)[51 54] as well as RRAMs using inorganic (e.g. WO3, Al2O3, HfO2, TiO2) carbon (graphene, carbon nanotubes (CNTs)[58 64] and organic materials[65 68] have been fabricated on polymer films. In addition, an ultrathin TFT and Si based large scale integration (LSI) were demonstrated for high density flexible electronics.[8,69,70] Beyond the front end device level, flexible packaging has been developed to interconnect core and peripheral modules to realize fully operational system on plastic (SoP)[71 75] Neuromorphic computing systems (brain inspired model of parallel neuron network) are considered as a promising technology for AI applications, overcoming the limitation of von Neumann architecture (serial and iterative processing) for intelligent data analysis and low power consumption.[76 81] With the rapid advancement in the electronics (e.g. memristor, PCM, and TFT) on plastics or any type of surface,[82 90] emulation of biological synapses (adaptive synaptic weight,[91 94] and spike timing dependent plasticity (STDP)[95 99] of neurons) is being demonstrated on flexible substrate, which realizes an era of merged electronics toward cognitive IoT, physiological sensor, wearable computer, and autonomous driving system.[92,100] Here, we present recent progress in the field of electronics for flexible and neuromorphic applications that can be classified into four main categories: i) various devices (e.g. resistive memory, PCM, TFT, and IC) on plastic for computing, ii) flexible electronic systems using large scale interconnection and packaging, iii) electronics for neuromorphic engineering, and iv) promising research areas of flexible synaptic applications. In addition, we have organized the main features of the studies in each section as a table to clearly compare their performance and challenges. The new electronic concept of a flexible and Novel Electronics for Flexible and Neuromorphic Computing
author_names: Han Eol Lee

Jung Hwan Park

Tae Jin Kim

Doyoung Im

Jung Ho Shin

Do Hyun Kim

Baker Mohammad

Il-Suk Kang

Keon Jae Lee
title: Novel Electronics for Flexible and Neuromorphic Computing
year: 2018

abstract: A memristive nonvolatile logic in memory circuit can provide a novel energy efficient computing architecture for battery powered flexible electronics. However, the cell to cell interference existing in the memristor crossbar array impedes both the reading process and parallel computing. Here, it is demonstrated that integration of an amorphous In Zn Sn O (a IZTO) semiconductor based selector (1S) device and a poly(1,3,5 trivinyl 1,3,5 trimethyl cyclotrisiloxane) (pV3D3) based memristor (1M) on a flexible substrate can overcome these problems. The developed a IZTO based selector device, having a Pd/a IZTO/Pd structure, exhibits nonlinear current voltage (I V) characteristics with outstanding stability against electrical and mechanical stresses. Its underlying conduction mechanism is systematically determined via the temperature dependent I V characteristics. The flexible one selector one memristor (1S 1M) array exhibits reliable electrical characteristics and significant leakage current suppression. Furthermore, single instruction multiple data (SIMD) the foundation of parallel computing, is successfully implemented by performing NOT and NOR gates over multiple rows within the 1S 1M array. The results presented here will pave the way for development of a flexible nonvolatile logic in memory circuit for energy efficient flexible electronics.
author_names: Byung Chul Jang

Yunyong Nam

Beom Jun Koo

Junhwan Choi

Sung Gap Im

Sang-Hee Ko Park

Sung-Yool Choi
title: Memristive Logic in Memory Integrated Circuits for Energy Efficient Flexible Electronics
year: 2018

abstract: Traditional textile materials can be transformed into functional electronic components upon being dyed or coated with films of intrinsically conducting polymers, such as poly(aniline) poly(pyrrole) and poly(3,4 ethylenedioxythiophene) A variety of textile electronic devices are built from the conductive fibers and fabrics thus obtained, including: physiochemical sensors, thermoelectric fibers/fabrics, heated garments, artificial muscles and textile supercapacitors. In all these cases, electrical performance and device ruggedness is determined by the morphology of the conducting polymer active layer on the fiber or fabric substrate. Tremendous variation in active layer morphology can be observed with different coating or dyeing conditions. Here, we summarize various methods used to create fiber and fabric based devices and highlight the influence of the coating method on active layer morphology and device stability.
author_names: Linden K Allison

Steven Hoxie

Trisha L Andrew
title: Towards seamlessly integrated textile electronics: methods to coat fabrics and fibers with conducting polymers for electronic applications.
venue: Chemical communications
year: 2017

abstract: Soft features in electronic devices have provided an opportunity of gleaning a wide spectrum of intimate biosignals. Lack of data processing tools in a soft form, however, proclaims the need of bulky wires or low performance near field communication externally linked to a "rigid" processor board, thus tarnishing the true meaning of "soft" electronics. Furthermore, although of rising interest in stretchable hybrid electronics, lack of consideration in multilayer, miniaturized design and system level data computing limits their practical use. The results presented here form the basis of fully printable, system level soft electronics for practical data processing and computing with advanced capabilities of universal circuit design and multilayer device integration into a single platform. Single droplet printing based integration of rigid islands and core shell vertical interconnect access (via) into a common soft matrix with a symmetric arrangement leads to a double side universal soft electronic platform that features site selective, simultaneous double side strain isolation, and vertical interconnection, respectively. Systematic studies of island morphology engineering, surface strain mapping, and electrical analysis of the platform propose optimized designs. Commensurate with the universal layout, a complete example of double side integrated, stretchable 1 MHz binary decoders comprised of 36 logic gates interacting with 9 vias is demonstrated by printing based, double side electronic functionalization.
author_names: Junghwan Byun

Eunho Oh

Byeongmoon Lee

Sangwoo Kim

Seunghwan Lee

Yongtaek Hong
title: A Single Droplet Printed Double Side Universal Soft Electronic Platform for Highly Integrated Stretchable Hybrid Electronics
year: 2017

abstract: Organic and printed electronics integration has the potential to revolutionize many technologies, including biomedical diagnostics. This work demonstrates the successful integration of multiple printed electronic functionalities into a single device capable of the measurement of hydrogen peroxide and total cholesterol. The single use device employed printed electrochemical sensors for hydrogen peroxide electroreduction integrated with printed electrochromic display and battery. The system was driven by a conventional electronic circuit designed to illustrate the complete integration of silicon integrated circuits via pick and place or using organic electronic circuits. The device was capable of measuring 8 mL samples of both hydrogen peroxide (0 5 mM, 2.72 x 10 6 A*mM 1) and total cholesterol in serum from 0 to 9 mM (1.34 x 10 8 A*mM 1, r2 0.99, RSD 10% n 3) and the result was output on a semiquantitative linear bar display. The device could operate for 10 min via a printed battery, and display the result for many hours or days. A mobile phone "app" was also capable of reading the test result and transmitting this to a remote health care provider. Such a technology could allow improved management of conditions such as hypercholesterolemia.
author_names: Termeh Ahmadraji

Laura Gonzalez-Macia

Tapio Ritvonen

Andreas Willert

Satu Ylimaula

Dave Donaghy

Saara Tuurala

Mika Suhonen

Dave Smart

Aoife Morrin

Vitaly Efremov

Reinhard R Baumann

Munira Raja

Antti Kemppainen

Anthony J Killard
title: Biomedical Diagnostics Enabled by Integrated Organic and Printed Electronics.
venue: Analytical chemistry
year: 2017