Query: Solid state industrial relays

Candidate papers:

abstract: This paper focuses on providing an improved and efficient alternative to electromechanical relays (EMRs) in view of the growing demand characteristics for an effective power multiplexing in induction heating applications. A major analytical approach to the design and implementation of bidirectional switches (BDSs) based on different power semiconductor technologies is presented, including thorough static and dynamic characterizations. Emerging gallium nitride high electron mobility transistors (GaN HEMTs) and silicon carbide (SiC) based devices are identified as potential candidates for the mentioned applications.
author_names: Manuel Fernandez

Xavier Perpina

Jose Rebollo

Miquel Vellvehi

David Sanchez

Tomas Cabeza

Sergio Llorente

Xavier Jorda
title: Solid State Relay Solutions for Induction Cooking Applications Based on Advanced Power Semiconductor Devices
venue: IEEE Transactions on Industrial Electronics
year: 2019

abstract: In this paper, an electromagnetic compatibility estimator is proposed using an artificial neural network with a scaled conjugate gradient algorithm. Neural networks are trained with the help of seven different optimization algorithms in MATLAB. Their performance is evaluated on the basis of number of neurons, desired output, and mean squared error in offline mode in MATLAB. Among seven algorithms, scaled conjugate gradient algorithm is found to be the best choice. Hence, it is implemented in LabVIEW for online assessment of electromagnetic compatibility issues. Voltage dip, swell, and harmonics are generated with the help of an experimental setup. It consists of 230 V, 50 Hz input voltage supply, microcontroller, variac, and solid state relays. It is interfaced to the LabVIEW software with the help of an NI USB 6361 data acquisition system. It enabled the continuous online monitoring of various signals. Along with voltage dip and swell, harmonics are also evaluated with the help of spectrum analyzer in LabVIEW. The detailed description of a hardware setup and mathematical modeling of trained network is given in this paper.
author_names: Chetan B Khadse

Madhuri A Chaudhari

Vijay B Borghate
title: Electromagnetic Compatibility Estimator Using Scaled Conjugate Gradient Backpropagation Based Artificial Neural Network
venue: IEEE Transactions on Industrial Informatics
year: 2017

abstract: In today's portable devices, major DC DC topologies are mixed and matched to provide multiple DC rails to power point of load (POL) rails. The traditional high frequency DC converter approaches to achieve high efficiency have their strengths and draw backs, and none of them could be considered ideal solution to energy efficiency and battery run time issues of modern portable devices. Supercapacitor assisted low dropout regulators (SCALDO) is a novel linear regulator topology developed by combining an array of supercapacitors, an LDO and a very low frequency switching arrangement to achieve high efficiency in linear converter comparable with high frequency switching converters. The technique implemented in commonly used DC DC converter stages such as 12 5V, 5 3.3 V and 5 1.2 V with efficiency improvement factors of 2, 1.33 and 3 respectively, with the example of increasing the 42% efficiency of a 12 5 V linear converter to 84% theoretically. In these early prototype versions, solid state relays were used as the low frequency switches to eliminate the unnecessary discharging of the supercapacitors (SC) however, high on resistance in these switches increase the switch losses. This paper provides the details of a new design technique to eliminate this SC discharge issue and to further reduce the switch losses by using back to back MOSFET switches, together with performance details of 12 5 V practical converter.
author_names: Kosala Gunawardane

Sting Xie

Nihal Kularatna
title: Back to back MOSFET switches to reduce the losses in SCALDO implementation
venue: 2017 IEEE International Conference on Industrial Technology (ICIT)
year: 2017

abstract: Ground differential protection relays (device 87G) have been used to protect the windings of resistance grounded power transformers. There have been problems of relay misoperation and nonoperation with electromechanical 87G relays due to current transformer (CT) burden and saturation. Due to their low burden, it has been assumed by some that solid state digital relays are not subject to these problems. The purpose of this paper is to evaluate the truth of this assumption. Under what circumstances, and with what types of CTs, might problems occur? An analysis is performed of digital ground differential protection over a range of power transformer and CT sizes. Guidelines are developed for CT accuracy ratings suitable for this application. The effect of different relay algorithms on scheme performance relative to CTs is also discussed.
author_names: Peter E Sutherland
title: Current transformer application with digital ground differential protection relays
venue: 2000 IEEE Industrial and Commercial Power Systems Technical Conference. Conference Record (Cat. No.00CH37053)
year: 2000

abstract: A variety of electromechanical and solid state protective relays were tested for pickup and time delay characteristics while tilted in several directions from vertical and while undergoing oscillatory motion. These tests showed that induction disk and induction cup relays were seriously affected by tilting and motion, but that hinged armature and solid state relays were not affected.<ETX>
author_names: Baldwin Bridger

Robert J Walker
title: Operating characteristics of protective relays in positions other than vertical
venue: Conference Record, Industrial and Commercial Power Systems Technical Conference, 1988.
year: 1988

abstract: Electromechanical relays were the first logic element used in a computer. Today, small compact reed relays are again being extensively used as logic elements. A logic factor, FL, measures the improvement that a logic device can affect if interposed between a logic source and logic detector. A logic figure of merit, TFM, determined when FL 1.0 can be used for comparison of the logic performance of logic devices. TFM is developed for an arbitrary electromechanical relay. For a miniature reed relay packaged for printed circuit boards, TFM 1.7 milliseconds. For comparison, solid state devices have TFM 1 nanoseconds and COSMOS (complementary symmetry metal oxide semiconductor) devices have TFM 20 nanoseconds.
author_names: Lawrence Joseph Giacoletto
title: Logic Rating of Electromechanical Relays
venue: IEEE Transactions on Industrial Electronics and Control Instrumentation
year: 1975

abstract: There are many advantages to upgrading old electromechanical, solid state, and first generation numeric relays with modern numeric relays. Reliability increases because there is less direct wiring and interconnection wiring. Reliability and security of multifunction logic and settings are improved with next generation user interface software. Remote I/O modules, remote analog/digital inputs, and thermal measurement capabilities have expanded the protection, control, and monitoring. New protection and monitoring features improve power system equipment life and increase personnel safety. Maintenance costs are reduced, while internal watchdogs alert the user if the relay has a problem. Settings groups can be changed instantaneously to adapt to varying power system requirements. Modern, second generation numeric relays offer a variety of secure communications capabilities for interfacing with Smart Grid controls, SCADA systems, and business networks. Event memory is larger for more on board, standardized oscillographs and event reporting. Relay security is in accord with the latest NERC standards. Initially, every relay upgrade seems simple and straight forward; then come the details. Operating personnel have expectations for reading targets, resetting trips, ease of interface for settings and events, motor restarting, synch closing, etc. Regulator requirements (NERC CIP, for example) must be implemented while maintaining smooth operations. Relay engineers must assure that operational ease is maintained with the new upgrade relay. Accurate one line drawings and connection drawings, as well as good wiring documentation, are essential. Escutcheon plates might be necessary, or perhaps switchgear will need modification (panel cutting, new doors, relocation, etc) Also, this is an opportunity to reevaluate arc flash hazards and possibly reduce the risks. These and other considerations are taken from actual relay replacement projects. This paper provides guidance for your next replacement or upgrade project, resulting in reducing cost, saving time, and minimizing unexpected or unplanned complications.
author_names: Daniel L Ransom
title: Upgrading relay protection? Be prepared
venue: 49th IEEE/IAS Industrial Commercial Power Systems Technical Conference
year: 2013

abstract: Electrical engineering students at the University of South Australia have worked on an energy efficient 10 kVA 3 phase switchable distribution transformer system as their final year project in their undergraduate degree. Past research has shown that transformer efficiency gains can be made by switching between series and parallel winding configurations. A dsPIC33FJ256GP710 microcontroller is utilized to acquire transformer performance data from voltage and current sensors and perform waveform analysis (RMS magnitude and phase) using DSP techniques. In addition the microcontroller coordinates the switching of the winding configurations using solid state relays to obtain the optimum efficiency of the transformation of electrical power.
author_names: Sam A M Ali

K McGlasson

Paul Waterloo Drennan

J How
title: Development of a data acquisition and analysis system for a 10 kVA 3 phase switchable distribution transformer
venue: 2008 3rd IEEE Conference on Industrial Electronics and Applications
year: 2008

abstract: The electromagnetic, electromechanical and solid state (analog electronic) technologies have been used in protection systems since the late 1800's. The developments in VLSI circuits prompted the use of analog electronics in designing and building protective relays. Since the introduction of microprocessors, their use in protection systems has been increasing gradually. The modern protection systems use them along with the needed analog electronics. The technologies used in protection systems are described in this paper. Some of the changes in the designs that have become possible due to the versatility of the present technologies are discussed. Some thoughts on the expected direction in which power system protection is likely to move are identified.
author_names: M S Sachdev
title: Technologies used in Power System Protection Systems
venue: 2006 IEEE International Conference on Industrial Technology
year: 2006

abstract: The application of microcomputer based relays grow rapidly and a number of microprocessor based protective relays are applied in electric utility power systems. Since the performances of the protective relays are normally categorized by their function, the same test procedure is applied to a group of relays with the same protective function regardless of their operation mechanism. Unlike electromechanical or solid state relays, a microcomputer based relay is a software driven system. The performance of such a relay depends on the hardware design, the accuracy of the input signals and the algorithms embedded inside the unit. Though they may have similar protective functions, the physical capability and constraints of microcomputer based relays may vary from one vendor to another. Some of these features are difficult to be tested or evaluated through traditional testing procedures. This paper discusses the hardware and software design issues and illustrates how they can affect the performance of a microcomputer based relay system.
author_names: Weijen Lee
title: Beyond the normal testing procedure a closer look at the microcomputer based relay
venue: 1997 IEEE Industrial and Commercial Power Systems Technical Conference. Conference Record
year: 1997