natgillin/translations-raw huggingface dataset:
Capable of producing a pattern with a ’minimum resolvable feature size’ of 180 nm or less;
zmožnost proizvajanja oblike z ’minimalno razločljivo potezo’ 180 nm ali manj;
The ’minimum resolvable feature size’ is calculated by the following formula:
’Minimalna razločljiva poteza’ se izračuna po naslednjem obrazcu:
MRF = ’minimum resolvable feature size’
MRF = ’minimalna razločljiva poteza’
Imprint lithography equipment capable of producing features of 180 nm or less;
tiskarska litografska oprema, s katero se lahko tiska podobe z največ 180 nm;
Note:3B001.f.2. includes:
Opomba:Točka 3B001(f)2 zajema:
Micro contact printing tools
mikrokontaktno tiskarsko orodje
Hot embossing tools
vroča reliefna orodja
Nano-imprint lithography tools
nanotiskarska litografska orodja
Step and flash imprint lithography (S-FIL) tools
’step and flash’ tiskarska litografska orodja (S-FIL)
Using deflected focussed electron beam, ion beam or "laser" beam; and
uporablja elektronski žarek z odklonjenim fokusom, ionski ali "laserski" žarek in
A spot size smaller than 0,2 µm;
točko, manjšo od 0,2 µm;
Being capable of producing a pattern with a feature size of less than 1 µm; or
zmožnost izdelave vzorca s potezami, manjšimi od 1 µm ali
An overlay accuracy of better than ±0,20 µm (3 sigma);
površinsko natančnost boljšo od ±0,20 µm (3 sigme);
Masks and reticles, designed for integrated circuits specified in 3A001;
maske in mrežice, izdelane za integrirana vezja iz točke 3A001;
Multi-layer masks with a phase shift layer;
večplastne maske s faznimi premičnimi plastmi;
Note:3B001.h. does not control multi-layer masks with a phase shift layer designed for the fabrication of memory devices not controlled by 3A001.
Opomba:Predmet nadzora v točki 3B001.h niso večplastne maske s faznimi premičnimi plastmi, narejene za izdelavo spominskih enot, ki niso predmet nadzora v točki 3A001.
i. Imprint lithography templates designed for integrated circuits specified in 3A001.
Tiskarske litografske šablone, izdelane za integrirana vezja iz točke 3A001.
Test equipment specially designed for testing finished or unfinished semiconductor devices as follows and specially designed components and accessories therefor:
preizkuševalna oprema, izdelana posebej za preizkušanje izdelanih in neizdelanih polprevodniških naprav in posebej zanjo izdelane komponente in pribor:
For testing microwave integrated circuits specified in 3A001.b.2.
za preizkušanje mikrovalovnih integriranih vezij iz točke 3A001(b)2.
Silicon carbide (SiC); or
silicijevega karbida (SiC) ali
"III/V compounds" of gallium or indium.
"III/V spojin" galija ali indija.
Resist materials as follows and "substrates" coated with the following resists:
Uporovni materiali in "podlage", prevlečene z naslednjimi krmiljenimi uporovnimi pastami:
Positive resists designed for semiconductor lithography specially adjusted (optimised) for use at wavelengths below 245 nm;
pozitivne uporovne paste za polprevodniško litografijo, posebej prirejene (optimizirane) za uporabo pri valovnih dolžinah pod 245 nm;
All resists designed for use with electron beams or ion beams, with a sensitivity of 0,01 µcoulomb/mm2 or better;
vse uporovne paste za uporabo z elektronskimi ali ionskimi žarki, z občutljivostjo 0,01 (mikrokulomba) μcoulomb/mm2 ali boljšo;
All resists optimised for surface imaging technologies, including ’silylated’ resists;
vse uporovne paste, optimizirane za tehniko površinske preslikave, skupaj s ’siliciranimi’ uporovnimi pastami;
All resists designed or optimised for use with imprint lithography equipment specified in 3B001.f.2. that use either a thermal or photo-curable process.
vse uporovne paste za uporabo ali optimizirane za uporabo s tiskarsko litografsko opremo iz podtočke 3B001(f)2, ki uporabljajo termični postopek ali postopek strjevanja s svetlobo.
Organo-inorganic compounds as follows:
Organsko-anorganske spojine:
Organo-metallic compounds of aluminium, gallium or indium, having a purity (metal basis) better than 99,999 %;
organsko-kovinske spojine aluminija, galija ali indija, katerih čistota (kovinske osnove) je več kot 99,999 %;
Organo-arsenic, organo-antimony and organo-phosphorus compounds, having a purity (inorganic element basis) better than 99,999 %.
organsko-arzenove, organsko-antimonove in organsko-fosforjeve spojine, katerih čistota (anorganske osnove) je več kot 99,999 %.
Silicon carbide (SiC), gallium nitride (GaN), aluminium nitride (AlN) or aluminium gallium nitride (AlGaN) "substrates", or ingots, boules, or other preforms of those materials, having resistivities greater than 10000 ohm-cm at 20 °C.
"Substrati" silicijevega karbida (SiC), galijevega nitrida (GaN), aluminijevega nitrida (AlN) ali aluminijevega galijevega nitrida (AlGaN) ali ingoti, kosi ali drugi polizdelki teh materialov z odpornostjo več kot 10000 ohm-cm pri 20°(C)
"Substrates" specified in 3C005 with at least one epitaxial layer of silicon carbide, gallium nitride, aluminium nitride or aluminium gallium nitride.
"Substrati" iz točke 3C005 z vsaj eno epitaksialno plast iz silicijevega karbida, galijevega nitrida, aluminijevega nitrida ali aluminijevega galijevega nitrida.
"Software" specially designed for the "development" or "production" of equipment specified in 3A001.b. to 3A002.g. or 3B.
"Programska oprema", izdelana posebej za "razvoj" ali "proizvodnjo" opreme iz točk od 3A001(b) do 3A002(g) ali iz točke 3B
"Software" specially designed for the "use" of equipment specified in 3B001.a. to f. or 3B002.
"Programska oprema", ki je posebej napisana za "uporabo" opreme iz točk 3B001(a) do (f) ali 3B002.
’Physics-based’ simulation "software" specially designed for the "development" of lithographic, etching or deposition processes for translating masking patterns into specific topographical patterns in conductors, dielectrics or semiconductor materials.
’Na fiziki temelječa’ simulacijska "programska oprema", posebej zasnovana za "razvoj" postopkov litografije, jedkanja ali nanašanja pri prevajanju maskirnih vzorcev v specifične topografske vzorce v vodniških, dielektričnih ali polprevodniških materialih.
’Physics-based’ in 3D003 means using computations to determine a sequence of physical cause and effect events based on physical properties (e.g., temperature, pressure, diffusion constants and semiconductor materials properties).
Izraz ’na fiziki temelječa’ v točki 3D003 pomeni uporabo izračunov za ugotavljanje zaporedja fizičnih vzrokov in posledic na osnovi fizičnih lastnosti (npr. temperature, tlaka, difuzijskih konstant in lastnosti polprevodniških materialov).
"Software" specially designed or modified for the "use" of equipment specified in 3A101.b.
"Programska oprema", posebej izdelana ali prirejena za "uporabo" opreme iz točke 3A101(b)
Note 1:3E001 does not control "technology" for the "production" of equipment or components controlled by 3A003.
Opomba 1:Predmet nadzora v točki 3E001 ni "tehnologija" za "proizvodnjo" opreme ali komponente, ki niso predmet nadzora točke 3A003.
Note 2:3E001 does not control "technology" for the "development" or "production" of integrated circuits specified in 3A001.a.3. to 3A001.a.12., having all of the following:
Opomba 2:Predmet nadzora v točki 3E001 ni "tehnologija" za "razvoj" ali "proizvodnjo" integriranih vezjih, ki so predmet nadzora točk od 3A001(a)3 do 3A001(a)12 in imajo obe naslednji značilnosti:
Using "technology" of 0,5 µm or more; and
uporabljajo "tehnologijo" 0,5 µm ali več in
Not incorporating ’multi-layer structures’.
ne vključujejo ’večplastnih struktur’.
’Multi-layer structures’ do not include devices incorporating a maximum of three metal layers and three polysilicon layers.
’Večplastne strukture’ ne vključujejo naprav, ki so sestavljene iz največ treh kovinskih plasti in treh plasti polisilicija.
"Technology" according to the General Technology Note, other than that specified in 3E001, for the "development" or "production" of a "microprocessor microcircuit", "microcomputer microcircuit" or microcontroller microcircuit core, having an arithmetic logic unit with an access width of 32 bits or more and any of the following features or characteristics:
"Tehnologija" v skladu s Splošno opombo o tehnologiji, razen tiste iz točke 3E001, za "razvoj" ali "proizvodnjo""mikroprocesorskih mikrovezij", "mikroračunalniških mikrovezij" in jedra mikrokrmilniškega mikrovezja z aritmetično logično enoto z 32-bitno širino dostopa ali več in ima katero koli od naslednjih značilnosti:
A ’vector processor unit’ designed to perform more than two calculations on floating-point vectors (one-dimensional arrays of 32-bit or larger numbers) simultaneously;
’vektorska procesna enota’, izdelana za izvajanje več kot dveh izračunov vektorjev s premično vejico (enorazsežno polje 32-bitnih ali večjih števil) simultano;
A ’vector processor unit’ is a processor element with built-in instructions that perform multiple calculations on floating-point vectors (one-dimensional arrays of 32-bit or larger numbers) simultaneously, having at least one vector arithmetic logic unit.
’Vektorska procesna enota’ je element procesorja z vgrajenimi ukazi, ki izvajajo večkratne izračune vektorjev s premično vejico (enorazsežno polje 32-bitnih ali večjih števil), simultano in imajo vsaj eno vektorsko aritmetično logično enoto.
Designed to perform more than two 64-bit or larger floating-point operation results per cycle; or
izdelana je za izračunavanje več kot dveh rezultatov 64-bitne ali večje operacije v plavajoči vejici na cikel ali
Designed to perform more than four 16-bit fixed-point multiply-accumulate results per cycle (e.g., digital manipulation of analogue information that has been previously converted into digital form, also known as digital "signal processing").
izdelana je za izračunavanje več kot štirih rezultatov 16-bitnega množenja v nepremični vejici na cikel (npr. digitalna manipulacija analognih informacij, ki je bila pred tem pretvorjena v digitalno obliko, znana tudi kot digitalna "obdelava signalov").
Note:3E002.c. does not control "technology" for multimedia extensions.
Opomba:Predmet nadzora v točki 3E002(c) ni "tehnologija" za multimedijske razširitve.
Note 1:3E002 does not control "technology" for the "development" or "production" of micro-processor cores, having all of the following:
Opomba 1:Predmet nadzora v točki 3E002 ni "tehnologija" za "razvoj" ali "proizvodnjo" mikroprocesnih jeder, ki imajo obe naslednji značilnosti:
Using "technology" at or above 0,130 µm; and
uporabljajo "tehnologijo" 0,130 µm ali več in
Incorporating multi-layer structures with five or fewer metal layers.
vključujejo večplastne strukture z največ petimi kovinskimi plastmi.
Other "technology" for the "development" or "production" of the following:
Druga "tehnologija" za "razvoj" ali "proizvodnjo":
Hetero-structure semiconductor devices such as high electron mobility transistors (HEMT), hetero-bipolar transistors (HBT), quantum well and super lattice devices;
heterostrukturnih polprevodniških elementov, kot so na primer tranzistorji z visoko mobilnostjo elektronov (HEMT), heterobipolarni tranzistorji (HBT), elementi s kvantnimi potencialnimi jamami in elementi s superkristalno mrežo;
Note:3E003.b. does not control "technology" for high electron mobility transistors (HEMT) operating at frequencies lower than 31,8 GHz and hetero-junction bipolar transistors (HBT) operating at frequencies lower than 31,8 GHz.
Opomba:Predmet nadzora v točki 3E003(b) ni "tehnologija" za tranzistorje z visoko mobilnostjo elektronov (HEMT), ki delujejo na frekvencah, nižjih od 31,8 GHz in heter-bipolarne tranzistorje (HBT), ki delujejo na frekvencah, nižjih kot 31,8 GHz.
Substrates of films of diamond for electronic components.
podlag z diamantnimi filmi za elektronske komponente;
"Technology" according to the General Technology Note for the "use" of equipment or "software" specified in 3A001.a.1. or 2., 3A101, 3A102 or 3D101.
"Tehnologija", ki je v skladu s Splošno opombo o tehnologiji namenjena za "uporabo" opreme ali "programske opreme" iz točke 3A001(a)1, 3A001(a)2, 3A102 ali 3D101.
"Technology" according to the General Technology Note for the "use" of equipment specified in 3A001.e.2., 3A001.e.3., 3A001.g., 3A201, 3A225 to 3A233.
"Tehnologija", ki je v skladu s Splošno opombo o tehnologiji namenjena za "uporabo" opreme iz točk 3A001(e)2, 3A001(e)3, 3A001.g, 3A201, in 3A225 do 3A233.
Note 1:Computers, related equipment and "software" performing telecommunications or "local area network" functions must also be evaluated against the performance characteristics of Category 5, Part 1 (Telecommunications).
Opomba 1:Računalnike, računalniško opremo in "programsko opremo", povezano z izvajanjem telekomunikacijskih funkcij ali funkcij "lokalnega omrežja", je treba obravnavati v primerjavi z delovnimi značilnostmi Skupine 5, del 1 (Telekomunikacije).
Note 2:Control units which directly interconnect the buses or channels of central processing units, "main storage" or disk controllers are not regarded as telecommunications equipment described in Category 5, Part 1 (Telecommunications).
Opomba 2:Krmilne enote, ki neposredno medsebojno povezujejo vodila ali kanale osrednjih procesnih enot, "glavni pomnilnik" ali krmilniki diskov ne veljajo za telekomunikacijsko opremo, opisano v Skupini 5, del 1 (Telekomunikacije).
N.B.:For the control status of "software" specially designed for packet switching, see 5D001.
Opomba:Glede nadzornega statusa "programske opreme", izdelane posebej za paketno preklapljanje, glej točko 5D001.
Note 3:Computers, related equipment and "software" performing cryptographic, cryptanalytic, certifiable multi-level security or certifiable user isolation functions, or which limit electromagnetic compatibility (EMC), must also be evaluated against the performance characteristics in Category 5, Part 2 ("Information Security").
Opomba 3:Računalnike, računalniško opremo in "programsko opremo" za izvajanje kriptografskih in kriptoanalitičnih funkcij z izvajanjem funkcij varnosti na več ravneh z ugotovljivostjo ali funkcijami izolacije ugotovljivega uporabnika ali ki tiste, omejujejo elektromagnetno kompatibilnost (EMC), je treba prav tako obravnavati v primerjavi z delovnimi značilnostmi iz Skupine 5, del 2 ("Informacijska varnost").
Electronic computers and related equipment, having any of the following and "electronic assemblies" and specially designed components therefor:
Elektronski računalniki in sorodna oprema, ki imajo katero koli od naslednjih značilnosti, ter "elektronski sklopi" in posebej izdelane komponente zanje:
N.B.:SEE ALSO 4A101.
Opomba:GLEJ TUDI TOČKO 4A101.
Specially designed to have any of the following:
posebej izdelani, da imajo katero koli izmed naslednjih značilnosti:
Rated for operation at an ambient temperature below 228 K (–45 °C) or above 358 K (85 °C); or
primernost za delovanje pri temperaturah okolja pod 228 K (–45 °C) ali nad 358 K (85 °C) ali
Note:4A001.a.1. does not control computers specially designed for civil automobile or railway train applications.
Opomba:Predmet nadzora v točki 4A00(a)1 se ne uporablja za računalnike, izdelane posebej za osebne avtomobile ali naprave za železniške vlake.
Dose Rate Upset 5 × 106 Gy (silicon)/s; or
določeno stalno dozo 5 × 106 Gy (silicij)/s ali
Single Event Upset 1 × 10-7 Error/bit/day;
posamezne sunke 1 × 10–7 napak/bit/dan;
Note:4A001.b. does not control electronic computers and related equipment when accompanying their user for the user’s personal use.
Opomba:Predmet nadzora v točki 4A001(b) niso elektronski računalniki in računalniška oprema, kadar spremljajo uporabnika za njegovo osebno uporabo.
"Digital computers", "electronic assemblies", and related equipment therefor, as follows and specially designed components therefor:
"Digitalni računalniki", "elektronski sklopi" in sorodna oprema ter posebej izdelane komponente zanje:
’Vector processors’;
’vektorske procesorje’;
Note 2:The control status of the "digital computers" and related equipment described in 4A003 is determined by the control status of other equipment or systems provided:
Opomba 2:Nadzorni status "digitalnih računalnikov" in sorodne opreme, opisanih v točki 4A003, je določen z nadzornim statusom druge opreme ali sistemov, pod pogojem:
The "digital computers" or related equipment are not a "principal element" of the other equipment or systems; and
da "digitalni računalniki" in sorodna oprema niso "osnovni element" druge opreme ali sistemov in
1:The control status of "signal processing" or "image enhancement" equipment specially designed for other equipment with functions limited to those required for the other equipment is determined by the control status of the other equipment even if it exceeds the "principal element" criterion.
Opomba 1:Nadzorni status opreme za "obdelavo signalov" ali "izboljšave slike", ki je posebej izdelana za drugo opremo, katerih funkcija je omejena na funkcije, dovoljene drugi opremi, je določen z nadzornim statusom druge opreme, tudi če presega kriterije "osnovnega elementa".
2:For the control status of "digital computers" or related equipment for telecommunications equipment, see Category 5, Part 1 (Telecommunications).
Opomba 2:Glede nadzornega statusa "digitalnih računalnikov" in sorodne opreme za telekomunikacijsko opremo glej Skupino 5, del 1 (Telekomunikacije).
The "technology" for the "digital computers" and related equipment is determined by 4E.
da je "tehnologija" za "digitalne računalnike" in sorodna oprema, opisana v točki 4E.
Note:For the purposes of 4A003.a., "digital computers" and related equipment are not considered to be designed or modified for "fault tolerance" if they utilise any of the following:
Opomba:V smislu točke 4A003(a) "digitalni računalniki" in sorodna oprema ne veljajo kot izdelani ali prirejeni za "toleranco napak":
The interconnection of two central processing units by data channels or by using shared storage to permit one central processing unit to perform other work until the second central processing unit fails, at which time the first central processing unit takes over in order to continue the system's functioning; or
če uporabljajo medsebojno povezavo dveh osrednjih procesnih enot z uporabo podatkovnih kanalov ali deljenega shranjevanja, kar omogoča eni osrednji procesni enoti izvajanje drugih opravil v času, ko druga procesna enota ne deluje, med tem časom pa prva procesna enota omogoča delovanje sistema ali
"Digital computers" having an "Adjusted Peak Performance" ("APP") exceeding 0,75 Weighted TeraFLOPS (WT);
"digitalni računalniki" s "korigirano največjo zmogljivostjo" ("APP") več kot 0,75 utežnega teraFLOPS (WT);
"Electronic assemblies" specially designed or modified for enhancing performance by aggregation of processors so that the "APP" of the aggregation exceeds the limit specified in 4A003.b.;
"elektronski sklopi", izdelani ali prirejeni posebej za izboljšanje zmogljivosti s kopičenjem "procesorjev", tako da "APP" presega mejo iz točke 4A003.b;
Note 1:4A003.c. controls only "electronic assemblies" and programmable interconnections not exceeding the limit specified in 4A003.b. when shipped as unintegrated "electronic assemblies".
Opomba 1:Točka 4A003(c) se uporablja samo za "elektronske sklope" in programirljive medsebojne povezave, ki ne presegajo meje iz točke 4A003(b), kadar so dobavljeni kot nevdelani "elektronski sklopi".
It does not control "electronic assemblies" inherently limited by nature of their design for use as related equipment specified in 4A003.e.
Predmet nadzora v tej točki niso "elektronski sklopi", ki so po svoji naravi namenjeni za uporabo z računalniško opremo iz točke 4A003(e)
Note 2:4A003.c. does not control "electronic assemblies" specially designed for a product or family of products whose maximum configuration does not exceed the limit specified in 4A003.b.
Opomba 2:Predmet nadzora v točki 4A003(c) niso "elektronski sklopi", izdelani posebej za izdelke ali družine izdelkov, katerih maksimalna konfiguracija ne presega meje iz točke 4A003(b)
Equipment performing analogue-to-digital conversions exceeding the limits specified in 3A001.a.5.;
oprema za izvajanje analogno-digitalnih pretvorb, ki presegajo omejitve iz točke 3A001(a)5;
Equipment specially designed to provide external interconnection of "digital computers" or associated equipment which allows communications at data rates exceeding 1,25 Gbyte/s.
oprema, izdelana posebej za zagotavljanje zunanjih medsebojnih povezav "digitalnih računalnikov", in pripadajoča oprema, ki omogoča komunikacijo pri podatkovnih hitrostih nad 1,25 Gbajtov na sekundo.
Note:4A003.g. does not control internal interconnection equipment (e.g. backplanes, buses), passive interconnection equipment, "network access controllers" or "communications channel controllers".
Opomba:Predmet nadzora v točki 4A003(g) ni oprema za interne medsebojne povezave (npr. hrbtne plošče, vodila), oprema za pasivne medsebojne povezave, "krmilniki za dostop do omrežja" ali "krmilniki za komunikacijske kanale".
Computers as follows and specially designed related equipment, "electronic assemblies" and components therefor:
Računalniki in posebej izdelana računalniška oprema, "elektronski sklopi" in posebej izdelane komponente zanje:
Analogue computers, "digital computers" or digital differential analysers, other than those specified in 4A001.a.1., which are ruggedized and designed or modified for use in space launch vehicles specified in 9A004 or sounding rockets specified in 9A104.
Analogni računalniki, "digitalni računalniki" ali diferencialni digitalni analizatorji, razen tistih iz točke 4A001(a)1, ki so izdelani ali prirejeni za uporabo v nosilnih raketah iz točke 9A004 ali sondirnih raketah iz točke 9A104.
Note:This control only applies when the equipment is supplied with "software" specified in 7D103 or 9D103.
Opomba:Ta nadzor se uporablja le, kadar se oprema dobavlja skupaj s "programsko opremo" iz točke 7D103 ali 9D103.
"Software" as follows:
"programska oprema":
"Software", other than that specified in 4D001.a., specially designed or modified for the "development" or "production" of equipment as follows:
"Programska oprema", ki ni določena v 4D001(a), izdelana ali prilagojena posebej za "razvoj" ali "proizvodnjo" opreme:
"Digital computers" having an "Adjusted Peak Performance" ("APP") exceeding 0,1 Weighted TeraFLOPS (WT);
"digitalni računalniki" s "korigirano največjo zmogljivostjo" ("APP") več kot 0,1 utežnega teraFLOPS (WT);
"Electronic assemblies" specially designed or modified for enhancing performance by aggregation of processors so that the "APP" of the aggregation exceeds the limit in 4D001.b.1.;
"elektronskih sklopov", izdelanih ali prirejenih posebej za izboljšanje zmogljivosti s kopičenjem procesorjev, tako da »APP« sklopa presega mejo iz točke 4D001(b)1;
Note:4D003 does not control "software" when accompanying its user for the user's personal use.
Opomba:Predmet nadzora v točki 4D003(c) ni "programska oprema", ki spremlja uporabnika za njegovo osebno uporabo.
"Technology", other than that specified in 4E001.a., specially designed or modified for the "development" or "production" of equipment as follows:
"Tehnologija", ki ni določena v 4E001(a), izdelana ali prilagojena posebej za "razvoj" ali "proizvodnjo" opreme:
"Electronic assemblies" specially designed or modified for enhancing performance by aggregation of processors so that the "APP" of the aggregation exceeds the limit in 4E001.b.1.
"elektronskih sklopov", izdelanih ali prirejenih posebej za izboljšanje zmogljivosti s kopičenjem "procesorjev", tako da "APP" sklopa presega mejo iz točke 4E001(b)1.
i processor number (i,…n)
i številka procesorja (i, … n)
processor cycle time (ti = 1/Fi)
procesorski čas (ti = 1/Fi)
processor frequency
frekvenca procesorja
peak floating point calculating rate
največja hitrost računanja v plavajoči vejici
architecture adjustment factor
korekcijski faktor arhitekture računalnika
Calculate "APP" as "APP" = W1 × R1 + W2 × R2 + … + Wn × Rn.
Izračunati "APP" kot "APP" = W1 x R1 + W2 x R2 + … + Wn x Rn.
For ’vector processors’, Wi = 0,9.
Za ’vektorske procesorje’, Wi = 0,9.
For non-’vector processors’, Wi = 0,3.
Za ne ’vektorske procesorje’, Wi = 0,3.