mwirth-epo/epo-nmt-datasets huggingface dataset:
4.根据前述权利要求中任一项所述的工艺，其中在步骤D)中和在任选的步骤E)中，逐渐地增加DMS的量。
The process according to anyone of the preceding claims, wherein in step d) and in the optional step e) the amount of DMS is gradually increased.
5.根据前述权利要求中任一项所述的工艺，其中在步骤D)中，DMS的所述第二量是在步骤C)中的所述第一量的两倍。
The process according to anyone of the preceding claims, wherein in step D) the second amount of DMS is twice as much as the first amount in step C); or
在步骤E)中，以DMS的第三量和DMS的第四量实施第三沉积阶段和第四沉积阶段，DMS的所述第三量是在步骤C)中的所述第一量的三倍，其中DMS的所述第四量是在步骤C)中的所述第一量的四倍。
The process according to anyone of the preceding claims, wherein in step E) a third deposition phase is carried out with a third amount of DMS, which is three times as much as the first amount in step C); or wherein in step E) a third and fourth deposition phase are carried out with a third amount of DMS, which is three times as much as the first amount in step C) and a fourth amount of DMS, wherein the fourth amount of DMS is four times as much as the first amount in step C).
7.根据前述权利要求中任一项所述的工艺，其中控制所述沉积阶段中的DMS量以通过引入减少量的DMS来实现具有较小粒度的较小SiC晶体的形成和通过引入增加量的DMS来实现具有较大粒度的较大SiC晶体的形成，并且/或者通过实施各个沉积阶段达不同时间段来改变在所述沉积阶段中沉积的SiC涂层的厚度。
The process according to any of the preceding claims, wherein the DMS amounts in the deposition phases are controlled to effect the formation of smaller SiC crystals having smaller particle size by introducing a decreased amount of DMS and to effect the formation of larger SiC crystals having a larger particle size by introducing an increased amount of DMS and/or the thickness of the SiC coatings deposited in the deposition phases is varied by carrying out the individual deposition phases for varying time periods.
8.根据前述权利要求中任一项所述的工艺，其中步骤A)的所述多孔石墨基板具有≥6％且＜15％、优选地6％至13％、更优选地6％至＜12％、更优选地9％至11.5％的孔隙度且/或包括具有多达30μm的表面孔径的孔。
The process according to anyone of the preceding claims, wherein the porous graphite substrate of step A) has a porosity degree of ≥ 6 % and ≤ 15 %, preferably 6 % to 13 %, more preferably 11 to 13 %.
9.根据前述权利要求中任一项所述的工艺，其中在CVD沉积中使用的所述二甲基二氯硅烷的特征在于具有＞0wt.
The process according to anyone of the preceding claims, wherein the dimethyldichlorosilane used in the CVD deposition is characterized by having a content of siloxane impurities of < 2.00 wt.%.
10.根据权利要求2至10中任一项所述的工艺，其中实施步骤B-2)，直到形成呈以至少75μm、优选地至少100μm、优选地75μm至150μm的长度延伸的卷须的形式的连接结晶SiC材料，且/或其中实施步骤B-2)的所述注入阶段，直到形成界面层，所述界面层包含具有填充SiC的孔的多孔石墨并具有至少50μm、优选地至少75μm、优选地至少100μm、优选地至少150μm、优选地至少200μm、更优选地约200μm至约500μm的厚度，其中所述界面层位于所述石墨基板与在步骤C)至E)和步骤H)中形成的所述SiC表面层之间。
The process according to anyone of the claims 2 to 10, wherein step B-2) is carried out until tendrils of at least 75 µm length, preferably at least 100 µm length, preferably 75 to 150 µm length are formed and/or wherein the infusion phase of step B-2) is carried out until an interfacial layer is formed, comprising the porous graphite with SiC filled pores and having a thickness of at least 50 µm, preferably ate least 75 µm, preferably at least 100 µm, preferably at least 150 µm, preferably at least 200 µm, more preferably about 200 to about 500 µm, wherein the interfacial layer is located between the graphite substrate and the SiC surface layer formed in steps C) to E) and step H).
12.一种能够通过根据前述权利要求中任一项所述的工艺获得的涂覆碳化硅的主体。
A silicon carbide coated body obtainable by a process according to any of the preceding claims.
I-A)多孔石墨基板，所述多孔石墨基板具有6％至15％的孔隙度并包括具有10μm至30μm的表面孔径的孔，以及
A silicon carbide coated body comprising I-A) a porous graphite substrate and II-A) at least two SiC coating layer of different density; and optionally III-A) an interfacial layer located between the graphite substrate and the SiC coating layers comprising the porous graphite and pores filled with SiC in the form of tendrils of at least 50 µm length, extending from the at least one SiC coating layer into the porous graphite substrate.
II-A)不同密度的至少两个SiC涂层，所述至少两个SiC涂层覆盖所述多孔石墨基板；以及任选地
The silicon carbide coated body according to claim 11 or 12, wherein the at least two SiC coating layer II-A) are characterized by different crystal sizes.
III-A)界面层，所述界面层位于所述石墨基板与所述SiC涂层之间，所述界面层包括多孔石墨和填充有紧密地连接的基本上四面体结晶SiC材料的孔，所述SiC材料呈从至少一个SiC涂层以至少50μm的长度延伸到所述多孔石墨基板中的卷须的形式。
The silicon carbide coated body according to any of claims 11 to 13, wherein the graphite substrate has an open porosity of ≥ 6 % and ≤ 15 %, preferably 6 % to 13 %, more preferably 11 to 13 % and/or the silicon carbide coated body has an interfacial layer III-A) wherein the pores are filled with SiC in the form of tendrils of at least 75 µm length, preferably at least 100 µm length, preferably 75 to 150 µm length.
15.根据权利要求12至14中任一项所述的涂覆碳化硅的主体的用于制造用于高温应用、基座和反应器、半导体材料、晶片的制品的用途。
The use of the silicon carbide coated body according to any of claims 11 to 14 for manufacturing articles for high temperature applications, susceptors and reactors, semiconductor materials, wafer.
分析信号输出端子，位于所述主板的上部并且输出分析信号，所述分析信号用于测试所述存储装置或所述存储装置与主机之间的通信；
A test board comprising: a main board; a storage device connector positioned at an upper section of the main board and configured to vertically combine the main board and a storage device with each other; an analysis signal output terminal positioned at the upper section of the main board and configured to output an analysis signal for testing the storage device or communication between the storage device and a host; a host connector connected to a first side section of the main board and configured to combine the main board and the host with each other; and a first sub board detachably connected to a second side section of the main board.
主机连接器，连接到所述主板的第一侧部并且将所述主板和所述主机彼此组合；以及
2.
第一子板，可拆卸地连接到所述主板的第二侧部。
The test board of claim 1, further comprising: a second sub board detachably connected to a first side section of the first sub board.
2.根据权利要求1所述的测试板，进一步包括：
3.
3.根据权利要求2所述的测试板，其中根据与所述存储装置相对应的物理尺寸，将所述第一子板联接，以与所述主板选择性地分离。
The test board of claim 2, wherein the first sub board is coupled to be selectively separated from the main board according to a physical size corresponding to the storage device.
4.根据权利要求2所述的测试板，其中根据与所述存储装置相对应的物理尺寸，将所述第二子板联接，以与所述第一子板选择性地分离。
The test board of claim 2, wherein the second sub board is coupled to be selectively separated from the first sub board according to a physical size corresponding to the storage device.
5.根据权利要求2所述的测试板，其中所述第一子板和所述第二子板具有不同的尺寸。
The test board of claim 2, wherein the first sub board and the second sub board have different sizes.
6.根据权利要求2所述的测试板，其中所述主板包括主接地端子，所述第一子板包括第一接地端子，并且所述第二子板包括第二接地端子。
The test board of claim 2, wherein the main board includes a main ground terminal, the first sub board includes a first ground terminal, and the second sub board includes a second ground terminal.
7.根据权利要求6所述的测试板，其中所述主板通过所述主接地端子、所述第一接地端子和所述第二接地端子中的任意一个与所述主机组合，以减小所述分析信号的电噪声。
The test board of claim 6, wherein the main board is combined with the host through any one ground terminal of the main ground terminal, the first ground terminal, and the second ground terminal to reduce an electrical noise of the analysis signal.
8.根据权利要求7所述的测试板，其中当所述主板与所述第一子板和所述第二子板彼此串联连接时，所述主板通过所述第二接地端子与所述主机组合。
The test board of claim 7, wherein the main board is combined with the host through the second ground terminal when the main board and the first and second sub boards are connected to one another in series.
9.根据权利要求7所述的测试板，其中当所述第一子板与所述主板分离时，所述主板通过所述主接地端子与所述主机组合。
The test board of claim 7, wherein the main board is combined with the host through the main ground terminal when the first sub board is separated from the main board.
10.根据权利要求7所述的测试板，其中当所述第二子板与所述第一子板分离时，所述主板通过所述第一接地端子与所述主机组合。
The test board of claim 7, wherein the main board is combined with the host through the first ground terminal when the second sub board is separated from the first sub board.
11.根据权利要求2所述的测试板，其中所述分析信号输出端子包括多个输出端子，所述多个输出端子分别连接到将所述存储装置连接器和所述主机连接器彼此连接的线，并且通过所述多个输出端子将所述分析信号输出到所述主板的外部。
The test board of claim 2, wherein the analysis signal includes at least one of a signal transferred between the host and the storage device, a communication signal between a physical layer of the host and a physical layer of the storage device, a signal for measuring power consumption of the storage device, an asynchronous communication signal between the host and the storage device.
12.根据权利要求11所述的测试板，其中所述分析信号输出端子输出处于预定目标范围内的所述分析信号。
The test board of claim 2, wherein the analysis signal output terminal includes a plurality of output terminals respectively connected to lines connecting the storage device connector and the host connector with each other and outputs, through the plurality of output terminals, the analysis signal to an outside of the main board.
13.根据权利要求2所述的测试板，其中所述分析信号包括以下至少一种：在所述主机与所述存储装置之间传送的信号，在所述主机的物理层与所述存储装置的物理层之间的通信信号，用于测量所述存储装置的功耗的信号，以及所述主机与所述存储装置之间的异步通信信号。
The test board of claim 12, wherein the analysis signal output terminal is configured to output the analysis signal within a predetermined target range.
14.根据权利要求1所述的测试板，其中所述主机连接器的形状因子与所述存储装置连接器相同，并且连接到所述主机。
The test board of claim 1, wherein the host connector is configured in a same form factor as the storage device connector, and is configured to be connected to the host.
15.根据权利要求1所述的测试板，其中所述分析信号输出端子包括防止所述分析信号的功率下降或信号损失的电路。
The test board of claim 1, wherein the analysis signal output terminal includes a circuit for preventing power drop or signal loss of the analysis signal.
分析信号输出端子，设置在所述主板的上部，以在所述存储装置联接到所述存储装置连接器时输出向所述存储装置连接器传送的信号或从所述存储装置连接器传送的信号。
A test board comprising: a main board; a storage device connector provided on an upper section of the main board to vertically couple the main board to a storage device; a host connector provided on a first side section of the main board to horizontally couple the main board to a host; an analysis signal output terminal provided on the upper section of the main board to output a signal transferred to or from the storage device connector when the storage device is coupled to the storage device connector; and one or more sub boards each coupled, in series, to each other and to a second side section of the main board, wherein the sub boards are coupled to be selectively detached according to a form factor of the storage device.
本公开大体上涉及增材制造机器和过程，并且更具体地涉及在打印过程期间维持粉末层内的目标能量吸收的电子束熔化机器。
The present disclosure generally relates to additive manufacturing machines and processes, and more particularly to electron beam melting machines that maintain target energy absorption within a powder layer during a print process.
与减材制造方法相比，增材制造过程通常涉及一种或多种材料的堆积以形成净形或近净形(NNS)物体。
Additive manufacturing processes generally involve the buildup of one or more materials to make a net or near net shape (NNS) object, in contrast to subtractive manufacturing methods.
尽管“增材制造”是工业标准术语，但增材制造涵盖了以多种增材制造术语公知的多种制造和成型技术，包括自由成型制造、3D打印、快速成型/加工等。
Though "additive manufacturing" is an industry standard term, additive manufacturing encompasses various manufacturing and prototyping techniques known under a variety of additive manufacturing terms, including freeform fabrication, 3D printing, rapid prototyping/tooling, etc. Additive manufacturing techniques are capable of fabricating complex components from a wide variety of materials.
一般来说，独立物体能够由计算机辅助设计(CAD)模型制造。
Generally, a freestanding object can be fabricated from a computer aided design (CAD) model.
电子束熔化(EBM)是一个常见的工业术语，用于表示通过使用电子束烧结、熔化或熔融细粉末来生产三维(3D)物体。
Electron beam melting (EBM) is a common industry term used to refer to producing three-dimensional (3D) objects by using an electron beam to sinter, melt, or otherwise fuse a fine powder.
在EBM过程期间，将被电子束熔化的粉末均匀地铺展在构建平台上的粉末床上，并且电子束在电子控制单元或发射引导装置的控制下烧结或熔化正在构建的物体的横截面层。
During an EBM process, the powder to be melted by the electron beam is spread evenly over a powder bed on a build platform, and the electron beam sinters or melts a cross sectional layer of the object being built under control of an electronic control unit or an emission directing device.
降低构建平台并将另一层粉末铺展在粉末床和正在构建的物体上，然后连续熔化/烧结粉末。
The build platform is lowered and another layer of powder is spread over the powder bed and object being built, followed by successive melting/sintering of the powder.
重复该过程，直到零件完全由熔化/烧结的粉末材料构成为止。
The process is repeated until the part is completely built up from the melted/sintered powder material.
值得注意的是，随着添加粉末的老化和吸收杂质，添加粉末的表面化学自然地发生变化。
Notably, the surface chemistry of additive powder naturally varies as the additive powder ages and picks up impurities.
此外，添加粉末的表面化学可显著影响粉末层的二次电子发射物，并可导致被添加粉末吸收的能量的可变性。
Moreover, the surface chemistry of the additive powder can significantly affect the secondary electron emissions of the powder layer and can lead to variability in the energy absorbed by the additive powder.
当电子束的能级保持在目标能级恒定时，粉末能量吸收中的这些变化可能导致添加粉末的过度熔化、熔化不足或以其他方式不适当地熔化。
When the energy level of the electron beam remains constant at a target energy level, these variations in powder energy absorption may lead to over-melting, under-melting, or otherwise improper fusing of the additive powder.
添加粉末的这种不适当的熔融会导致构建瑕疵、翘曲、分层、微结构变化和其他打印不规则现象，从而导致较低质量零件、结构性不足甚至有缺陷的零件。
This improper fusing of the additive powder can result in build imperfections, warping, delamination, microstructure variation, and other printing irregularities which result in lower quality parts, structural weaknesses, and even defective parts.
因此，促进更稳定的制造过程，产生更少的有缺陷或次优零件的增材制造机器将是有用的。
Accordingly, an additive manufacturing machine that facilitates a more stabilized build process that generates fewer defective or suboptimal parts would be useful.
更具体地，能够检测电子发射物或能量沉积并调整电子束以在粉末层上维持恒定能量的电子束熔化机器将是特别有益的。
More particularly, an electron beam melting machine that is capable of detecting electron emissions or energy deposition and adjusting the electron beam to maintain constant energy at the powder layer would be particularly beneficial.
方面和优势将在以下描述中部分地阐述，或者可以从描述中显而易见，或者可以通过实践本发明来得知。
Aspects and advantages will be set forth in part in the following description, or may be obvious from the description, or may be learned through practice of the invention.
根据本主题的一个实施例，提供了一种操作增材制造机器的方法。
According to one embodiment of the present subject matter, a method of operating an additive manufacturing machine is provided.
该方法包括在可移动地位于构建室内的构建平台上沉积添加粉末层；以入射能级和能量密度将电子束引向该添加粉末层；测量来自该添加粉末层的电子发射物；以及至少部分地基于所测得的电子发射物来调整该电子束的入射能级和能量密度中的至少一个。
The method includes depositing a layer of additive powder over a build platform movably positioned within a build chamber, directing an electron beam toward the layer of additive powder at an incident energy level and energy density, measuring electron emissions from the layer of additive powder, and adjusting at least one of the incident energy level and energy density of the electron beam based at least in part on the measured electron emissions.
根据另一个示例性实施例，提供了一种增材制造机器，该增材制造机器包括：构建平台，该构建平台构造成用于支撑部件并且可在构建室内沿着竖直方向移动；粉末分配组件，该粉末分配组件用于在构建平台上选择性地沉积添加粉末层；以及能量源，该能量源用于选择性地将电子束引导到添加粉末层上。
According to another exemplary embodiment, an additive manufacturing machine is provided including a build platform configured for supporting a component and being movable along a vertical direction within a build chamber, a powder dispensing assembly for selectively depositing a layer of additive powder over the build platform, and an energy source for selectively directing an electron beam onto the layer of additive powder.
发射物检测系统检测来自添加粉末层的电子发射物，控制器可操作地联接到能量源和发射物检测系统。
An emission detection system detects electron emissions from the layer of additive powder and a controller is operably coupled to the energy source and the emission detection system.
控制器构造成以入射能级和能量密度将电子束引向添加粉末层，测量来自添加粉末层的电子发射物，以及至少部分地基于所测得的电子发射物来调整电子束的入射能级和能量密度中的至少一个。
The controller is configured for directing the electron beam toward the layer of additive powder at an incident energy level and energy density, measuring the electron emissions from the layer of additive powder, and adjusting at least one of the incident energy level and the energy density of the electron beam based at least in part on the measured electron emissions.
参考以下描述和所附权利要求书，将更好地理解这些及其他特征、方面和优势。
These and other features, aspects and advantages will become better understood with reference to the following description and appended claims.
并入并构成该说明书的一部分的附图图示了本发明的实施例，并同描述一起用来说明本发明的某些原理。
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain certain principles of the invention.
在说明书中阐述了针对本领域普通技术人员的本发明的完整且可行的公开，包括其最佳模式，其参考所附的附图。
A full and enabling disclosure of the present invention, including the best mode thereof, directed to one of ordinary skill in the art, is set forth in the specification, which makes reference to the appended figures.
图1示出了根据本主题的示例性实施例的增材制造机器的示意图。
FIG. 1 shows a schematic view of an additive manufacturing machine according to an exemplary embodiment of the present subject matter.
图2示出根据本主题的示例性实施例的图1的示例性增材制造机器的构建平台的特写示意图。
FIG. 2 shows a close-up schematic view of a build platform of the exemplary additive manufacturing machine of FIG. 1 according to an exemplary embodiment of the present subject matter.
图3是根据本公开的一个实施例的操作增材制造机器(例如电子束熔化机器)的方法。
FIG. 3 is a method of operating an additive manufacturing machine, such as an electron beam melting machine, in accordance with one embodiment of the present disclosure.
在本说明书和附图中重复使用参考字符旨在表示本发明的相同或类似的特征或元件。
Repeat use of reference characters in the present specification and drawings is intended to represent the same or analogous features or elements of the present invention.
现将详细参考本发明的实施例，其一个以上示例图示在附图中。
Reference now will be made in detail to embodiments of the invention, one or more examples of which are illustrated in the drawings.
每个示例通过说明的方式提供，而不应当解释为限制本发明。
Each example is provided by way of explanation of the invention, not limitation of the invention.
事实上，对于本领域技术人员来而言，显然，在不偏离本发明的范围或精神的情况下，可以在本发明中进行各种修改和变型。
In fact, it will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the scope or spirit of the invention.
例如，作为一个实施例的部分图示或描述的特征可以与另一个实施例一起使用，以产生又一个实施例。
For instance, features illustrated or described as part of one embodiment can be used with another embodiment to yield a still further embodiment.
因此，本发明旨在覆盖落入所附权利要求及其等同物的范围内的这些修改和变型。
Thus, it is intended that the present invention covers such modifications and variations as come within the scope of the appended claims and their equivalents.
本主题大体上涉及利用电子束熔化(EBM)过程的改进的增材制造系统和方法。
The present subject matter is generally directed to an improved additive manufacturing system and method utilizing an electron beam melting (EBM) process.
具体地，本主题的各方面针对在EBM过程中改进的功率控制，例如通过动态地调整被输送到粉末床以熔融添加粉末的能量。
Specifically, aspects of the present subject matter are directed toward improved power control in an EBM process, e.g., by dynamically adjusting the energy delivered to the powder bed for fusing additive powders.
调整入射能级以补偿未被添加粉末吸收的能量。
The incident energy level is adjusted to compensate for energy not absorbed by the additive powder.
未被吸收的能量以电子发射物的形式被检测到，包括透射通过构建平台的二次电子和/或电子。
This unabsorbed energy is detected in the form of electron emissions, which include secondary electrons and/or electrons which are transmitted through the build platform.
以这种方式，EBM机器在构建层内维持恒定的能量吸收，从而改进了过程控制、减少了缺陷并提高了打印的部件的质量。
In this manner, the EBM machine maintains constant energy absorption within a build layer for improved process control, fewer defects, and higher quality printed components.
参照图1，将根据示例性实施例描述电子束熔化(EBM)系统100。
Referring to FIG. 1, an electron beam melting (EBM) system 100 will be described according to an exemplary embodiment.
如图所示，系统100包括固定的外壳或构建区域102，该固定的外壳或构建区域102提供用于执行增材制造过程的无污染且受控的环境。
As illustrated, system 100 includes a fixed enclosure or build area 102 which provides a contaminant-free and controlled environment for performing an additive manufacturing process.
在这方面，例如，外壳102用于隔离和保护系统100的其他部件。
In this regard, for example, enclosure 102 serves to isolate and protect the other components of the system 100.
此外，外壳102可以包括真空口104，该真空口104用于在构建区域102内抽真空，例如，以减少在打印过程期间电子的散射。
In addition, enclosure 102 may include a vacuum port 104 which is used to draw a vacuum within build area 102, e.g., to reduce the scattering of electrons during the printing process.
外壳102通常可以包含EBM系统100的一些或全部部件。
Enclosure 102 may generally contain some or all components of EBM system 100.
根据示例性实施例，EBM系统100通常包括台110、粉末供应部112、刮刀或重涂覆机机构114、溢流容器或储存器116以及位于外壳102内的构建平台118。
According to an exemplary embodiment, EBM system 100 generally includes a table 110, a powder supply 112, a scraper or recoater mechanism 114, an overflow container or reservoir 116, and a build platform 118 positioned within enclosure 102.
另外，能量源120产生能量束122，并且射束转向设备124引导能量束122以促进EBM过程，如下面更详细描述的。
In addition, an energy source 120 generates an energy beam 122 and a beam steering apparatus 124 directs energy beam 122 to facilitate the EBM process, as described in more detail below.
本公开总体上涉及用于提取碳氢化合物(诸如油气)的地下井的勘测。
The present disclosure generally relates to the surveying of subsurface wells used to extract hydrocarbons such as oil and gas.
更具体地，本公开的实施例涉及一种井下潜航器，其用于各种流体和地下井的特性的现场测量。
More specifically, embodiments of the disclosure relate to a downhole submersible vehicle for the in situ measurement of various fluids and properties of subsurface wells.
地下井可以钻入地表以获取具有碳氢化合物的地理地层中储存的流体。
Subsurface wells may be drilled into the earth to access fluids stored in geographic formations having hydrocarbons.
这些地理地层可以包含或称之为“储层”。
These geographic formations may contain or be referred to as a “reservoir.”
关于井中的流体和井的性质的信息对于正确描述储层以及进行最佳钻孔和生产操作以有效地提取碳氢化合物是至关重要的。
Information about fluids in and properties of a well is important for properly characterizing the reservoir and conducting optimal drilling and production operations to efficiently extract hydrocarbons.
井可以具有竖直、偏斜和水平段的组合，这些组合使得对井的勘测既困难又费时。
Wells may have combinations of vertical, deviated, and horizontal sections that make surveying the wells challenging and time-consuming.
例如，可以通过使用来自地面的机械运输工具来勘测井，诸如连续油管(即，柔性集成井管)。
For example, a well may be surveyed via the use of a mechanical conveyance from the surface, such as coiled tubing (that is, flexible integrated well tubulars).
但是，连续油管的使用受到井孔尺寸的限制，并且更重要的是，可能会被锁定到井的几何结构上。
However, the use of coiled tubing is subject to hole size limitations and, more significantly, may become locked up to well geometry.
用于勘测井的其他方法可以包括线缆运输井牵引器，线缆运输井牵引器受到井孔的不规则性(例如，井孔尺寸的增大或减小影响牵引器臂)和井的几何结构限制。
Other approaches for well surveying may include wireline conveyed well tractors that are limited by hole irregularities (for example, the increase or decrease of hole sizes affecting tractor arms) and well geometry.
用于勘测井的现有技术，诸如通过连续油管、线缆(钢丝或电线)或者与线缆或与连续油管组合的油井牵引器而运输到井眼中的生产测井仪等，由于多种因素而可能会限制井眼的进入，这些因素诸如为井眼的长度、井眼的轨迹和倾角以及井眼尺寸(例如，内部直径或井孔尺寸)。
Existing technologies for surveying a well, such as production logging tools conveyed into the wellbore by coiled tubing, wireline (either slick line or electric line), or a well tractor in combination with wireline or with coiled tubing, may have limited wellbore access due to numerous factors, such as the length of the wellbore, the trajectory and inclination of the wellbore and the wellbore size (for example, inner diameter or hole size).
通过现有技术这些因素以及其他现场环境因素可能会限制和制约进入和勘测整个井眼。
These factors, and additional in situ environmental factors, may limit and restrict access to and surveying of the entire wellbore via existing technologies.
本公开的实施例包括一种用于勘测地下井的无人潜航器(有时称为“无人机”)。
Embodiments of the disclosure include an unmanned submersible vehicle (sometimes referred to as a “drone”) for use in surveying subsurface wells.
有利的是，无人潜航器能够通过使用机载推进单元和动力单元而不论取向如何(即竖直、偏斜或水平)都能进入井的所有段，因此取消了使用连续油管、线缆或从地面延伸的相关设备。
Advantageously, the unmanned submersible vehicle is capable of accessing all sections of wells regardless of orientation (that is, vertical, deviated, or horizontal) by use of onboard propulsion units and power unit, thus eliminating the use of coiled tubing, a wireline, or associated equipment extending from the surface.
此外，无人潜航器可以推进穿过井而没有与钻孔壁直接接触。
Moreover, the unmanned submersible vehicle may be propelled through the well without direct contact with the borehole wall.
当无人潜航器浸没在井中时，无人潜航器还可以能够给动力单元的电池充电以延长数据收集(即，测量值的获取)的持续时间。
The unmanned submersible vehicle may also be capable of recharging a battery of the power unit to extend the duration of data collection (that is, acquisition of measurements) when the unmanned submersible vehicle is submersed in a well.