TI thermal compression ball-bonder
name: label: maker
content: Texas Instruments
notes: label: Location
content: Currently not on view
setName: label: See more items in
content: Work and Industry: Electricity
creditLine: label: Credit Line
content: from Texas Instruments
dataSource: label: Data Source
content: National Museum of American History
identifier: label: ID Number
content: 1987.0487.435
label: collector/donor number
content: G00276
label: catalog number
content: 1987.0487.435
label: accession number
content: 1987.0487
objectType: label: Object Name
content: Bonder, Thermal Compression Ball
label: Object Name
content: circuit assembly tool
label: Object Name
content: ball, compression, bonder-thermal
label: Other Terms
content: Bonder, Thermal Compression Ball; Solid State; Microelectronics
physicalDescription: label: Measurements
content: overall: 27 in x 34 in x 22 in; 68.58 cm x 86.36 cm x 55.88 cm