IBM 370 ceramic memory module, assembled
date: label: date ordered, given, or borrowed
content: 1984 04 10
name: label: maker
content: IBM
notes: label: Location
content: Currently not on view
place: label: location of prior holder
content: United States: New York
setName: label: See more items in
content: Work and Industry: Electricity
creditLine: label: Credit Line
content: from International Business Machines Corp., Thomas J. Watson Research Center
dataSource: label: Data Source
content: National Museum of American History
identifier: label: ID Number
content: 1984.0153.01
label: accession number
content: 1984.0153
label: catalog number
content: 1984.0153.01
objectType: label: Object Name
content: Memory Module
label: Other Terms
content: Memory Module; Solid State Devices
physicalDescription: label: Physical Description
content: ceramic (module material)
label: Physical Description
content: metal (cover material)
label: Physical Description
content: silicon (chip material)