Packet of papers To: Jack Brown From: Glen Madland
name: label: Collection Creator
content: Integrated Circuit Engineering Corporation.
setName: label: See more items in
content: I.C.E. Integrated Circuit Collection
label: See more items in
content: I.C.E. Integrated Circuit Collection / Series 17: Litigation / File Name B-1, Folder Number 1
dataSource: label: Archival Repository
content: Archives Center, National Museum of American History
objectType: label: Type
content: Archival materials
scopecontent: label: Scope and Contents note
content: Contents: Information for alleged trade secrets 1,2,33,40 & 41; Wafer orientation system from transistor automation; #33 Bonding needle to cut bonding wire; #40,41 NAVAN/HAMCO automatic tensioner (used with annular saw blades)