Ball Bonding Technique, 10759-2
name: label: Collection Creator
content: Integrated Circuit Engineering Corporation.
setName: label: See more items in
content: I.C.E. Integrated Circuit Collection
label: See more items in
content: I.C.E. Integrated Circuit Collection / Series 18: Photographs
unitdate: label: Date
content: undated
container: label: Container
content: Box 6 (Series 18), Folder 15
dataSource: label: Archival Repository
content: Archives Center, National Museum of American History
objectType: label: Type
content: Archival materials