Packet of Papers
name: label: Collection Creator
content: Integrated Circuit Engineering Corporation.
setName: label: See more items in
content: I.C.E. Integrated Circuit Collection
label: See more items in
content: I.C.E. Integrated Circuit Collection / Series 17: Litigation / File Name A-2, Folder Number 30
dataSource: label: Archival Repository
content: Archives Center, National Museum of American History
objectType: label: Type
content: Archival materials
scopecontent: label: Scope and Contents note
content: Contents: 4:1 ETCH solution; Emitter diffusion; P base diffusion; Isolation diffusion; EPO growth; Buried layer diffusion; SiO2; Initial oxidation procedure; Pattern wafer cleaning before diffusion - method E; Pattern wafer cleaning before diffusion - method D