Manufacturing Facilities
name: label: Collection Creator
content: Integrated Circuit Engineering Corporation.
setName: label: See more items in
content: I.C.E. Integrated Circuit Collection
unitdate: label: Date
content: 1980-1983
dataSource: label: Archival Repository
content: Archives Center, National Museum of American History
identifier: label: Identifier
content: NMAH.AC.0600, Series 6
objectType: label: Type
content: Archival materials
scopecontent: label: Scope and Contents
content: This series consists of published reports which provide an examination of each major IC process, from older technologies to the more recent Complimentary Metal Oxide Semiconductor (CMOS) and BiCMOS processes. The processes for deposition and the reasons for the use of new materials for IC metallization are reviewed in detail. Each major process from crystal growing through device packaging is described with clear and concise illustrations. While the content is primarily based on silicon processing, the basics of gallium arsenide are covered.