RADC Product Evaluation Report PE 205: Quality of Packages with Solder Dip Lead Finish, Type C, Type E; National Semiconductor Corp. (November 1980)
name: label: Collection Creator
content: Integrated Circuit Engineering Corporation.
setName: label: See more items in
content: I.C.E. Integrated Circuit Collection
label: See more items in
content: I.C.E. Integrated Circuit Collection / Series 10: Government/Military
container: label: Container
content: Box 2 (Series 10)
dataSource: label: Archival Repository
content: Archives Center, National Museum of American History
objectType: label: Type
content: Archival materials