Construction Analysis (alphabetical by chip)
name: label: Collection Creator
content: Integrated Circuit Engineering Corporation.
setName: label: See more items in
content: I.C.E. Integrated Circuit Collection
unitdate: label: Date
content: 1997 - 1997
dataSource: label: Archival Repository
content: Archives Center, National Museum of American History
identifier: label: Identifier
content: NMAH.AC.0600, Series 4
objectType: label: Type
content: Archival materials
scopecontent: label: Scope and Contents
content: This series is arranged alphabetically by chip and contains analyses that cover x-rays, optical, scanning electron micrographs, cross sections, topological layout and dimensions, layer thickness, and materials.