In order to melt the solder ball, either infrared or convection reflow methods can be used. It is important to reach a minimum solder joint temperature (SJT) of 225-235 °C to ensure that the solder volume of the paste and ball melt. However, it is crucial not to exceed the specified PPT of any components. The dwell time for the SJT should be less than three minutes above the eutectic tin/lead solder melting point of 183 °C.