A flip-chip bonder is a technique for connecting dies such as semiconductor equipment, integrated chips, micro-electromechanical systems, and integrated passive devices with each other. Then these interconnected dies are connected to external circuitry through the use of solder bumps. Moreover, a flip-chip bonder is also referred to as a controlled collapse chip connection and is known as C4. For the record, the onset of new technologies such as smart grids, smart manufacturing, and smart grids will enhance the demand for flip-chip bonders.
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