Aluminum-based PCB welding skills Because the LED aluminum-based PCB has good heat dissipation capacity, manual soldering is relatively tricky. Therefore, some soldering skills are critical in the soldering process. The following talks explicitly about the main items and abilities in the aluminum substrate soldering process. 1. The temperature of the welding zone should be controlled at 255℃±5℃. The welding time should be between 10S~15S because the heat sink is a copper foil of thermal conductivity material. The thermal expansion parameters of the metal layer composed of aluminum, copper, or iron The thermal expansion parameters of the high thermal conductivity materials of the layers are very different. When the temperature is too high or the time is too long, the brutal force will occur due to the other thermal expansion parameters of the three, which will cause the heat sink to bubble or delamination. 2. When using a manual soldering iron to solder aluminum PCB, you must pay attention to the temperature control during the soldering process. Generally, the temperature should be controlled at 260℃±5℃, the time should be held at about 3 seconds, and the constant temperature must be used when soldering. For soldering iron soldering, you must strictly abide by the relevant specifications and systems of the soldering operation when soldering. Do not solder during the soldering process when the soldering iron temperature is not enough, and do not loosen the soldering iron tip too quickly during soldering. Do not solder multiple times; otherwise, the pad may fall off. When soldering aluminum PCBs with a large area, it is recommended to use additional processing tools to heat them before soldering. 3. When starting to solder all the pins, add solder to the tip of the soldering iron, and apply flux to all the pins to keep the pins moist. Touch the end of each pin of the chip with the tip of a soldering iron until you see the solder flowing into the pin. When soldering, keep the tip of the soldering iron parallel to the soldered pin to prevent overlap due to excessive soldering. 4. After soldering all the component pins, soak all the nails with flux to clean the solder. Suck off the excess solder was needed to eliminate any short circuits and overlaps. Finally, use tweezers to check whether there is false soldering. After the inspection is completed, remove the solder from the circuit board, soak the harrowing brush with alcohol and wipe it carefully along the pin direction until the solder disappears.