Both wave soldering and reflow soldering are crucial processes in PCB assembly, serving the purpose of establishing connections between PCB boards and components. Reflow soldering is commonly employed in scenarios involving SMD due to their densely packed pins and high sensitivity to temperature variations. On the other hand, wave soldering is typically utilized for DIP components, which possess larger pins. In this process, the circuit board is passed over a wave of molten solder, allowing the liquid solder to cover the entire pad area. Through the principle of surface tension, the molten solder forms solder joints with the component’s pins, ensuring a robust and dependable connection.