Using DC power loss from Ansys Slwave as a heat source, this multiphysics approach provides realistic thermal modeling of IC packages and PCBs.  Remarkably, Icepak overcomes the difficulties of dissipating thermal energy from electronic components.  Which, if left unattended, can lead to component failure due to overheating.
Linked EM-Thermal Stress Analysis
After that, you can use Ansys Mechanical to calculate thermal stress.  Ultimately, this multiphysics technique enables you to do a linked EM-thermal-stress analysis before production to gain a thorough understanding of the design.