Copper wrap is a continuous deposit of plated copper that is deposited within the barrel of the hole and extends onto the surface of the PCB (or the surface of the innerlayer core if part of a HDI structure) by a minimum of 25 um.
For class 2 demands the thickness of the surface deposit of the copper wrap is minimum 5um, but for class 3 demands this will vary dependant upon where this feature is situated within the build. Please consult our technicians for further information on class 3 demands.