Potting compounds and encapsulating compounds are often used interchangeably. However, while both serve the same purpose, they differ in their application. Here’s how: Potting compounds, such as a urethane potting compound or silicone potting compound, use a shell or “pot.” The electrical component, device, or circuitry is placed in this pot. Once in the right position, potting compound is used to fill the pot to completely cover the device and encase it. This method is the most common method because it is fast and efficient. Encapsulating compounds, on the other hand, don’t use a shell or pot to protect electrical devices, components, or circuitry. Instead, the device is placed in a removable mold and the encapsulating compound is poured in, which forms a thick coating. Once cured the mold is removed from the part and this coating can protect the electrical component from outside forces, like water and chemicals.