Beam lead is a technology used in the fabrication of semiconductor devices, particularly integrated circuits. It involves the direct deposition of a metal beam onto the surface of a semiconductor die during the wafer processing cycle. This beam extends from the edge of the chip and can be bonded directly to interconnecting pads on the circuit substrate, eliminating the need for individual wire interconnections. This method, known as flip-chip bonding, offers a more efficient and automated assembly process for semiconductor chips onto larger substrates.