DIP (Dual In-line Package) and THT (Through-Hole Technology) are both important terms in the field of electronic component packaging and PCB assembly. DIP, also known as Dual In-line Package or DIL Package, refers to a specific type of electronic component packaging that features two parallel rows of pins or leads extending from the bottom of the package. DIPパッケージ is widely used in electronic assemblies due to their compact size and ease of insertion into PCBs. THT, on the other hand, stands for Through-Hole Technology. It refers to the manufacturing process that involves drilling holes on a PCB and inserting component leads or pins through these holes. The components are then soldered on the opposite side of the PCB to establish electrical connections. While DIP is commonly associated with the type of component package used in PCB assembly, THT is the manufacturing process that involves the insertion and soldering of components through holes.