The basic principle behind plasma technology is when a high-energy plasma is used in a plasma jet or plasma system to alter the surface of a material. When the plasma comes into contact with the material's surface, it causes physical and chemical changes to occur. For example, when depositing a thin film, the plasma will vaporize materials from a target and deposit them onto the surface of the substrate while emitting UV radiation. The composition of the deposited film will depend on the composition of the target, gas composition, and plasma parameters. Plasma processing can be performed using various methods, low pressure plasma, atmospheric plasma, corona discharge, and dielectric barrier discharge. Each of these methods has its advantages and disadvantages. Gas discharge is the most common method used for plasma processing, as it is relatively simple and easy to control. Low pressure plasma is more expensive but provides better control over the plasma. Atmospheric plasma is used when a localized area of a part needs activation or cleaning in conjunction with a multi axis robot.