Bonding time is the duration involved in the ball bonding process. This process entails the joining of a wire and a pad surface through a solid phase welding technique. During ball bonding, a wire is passed through a hollow capillary, and an Electronic Flame-Off (EFO) system is used to melt a small portion of the wire extending outside. The molten wire forms a ball due to surface tension before solidifying. Subsequently, the ball is pressed onto the pad with sufficient force, causing plastic deformation and resulting in a strong and intimate bond between the wire and the bond pad surface.