The objective is to heat and remove the solder joint and remove the component as quickly as possible, and avoid heating surrounding areas as much as possible. Heating only the solder joints required to remove the defective components, and performing the task quickly and with one try reduces thermally stressing other areas. Solder wick or desoldering stations are good methods to remove solder from isolated areas. Methods involving hot plates or hot air have a better chance of caused PCB failure later on.