For solder balls, Micron is replacing tin-lead alloys (Sn36Pb2Ag or Sn37Pb ) with a tin (Sn), silver (Ag), and copper (Cu) alloys (e.g., SAC105, SAC305, SAC405, LF35).
For solder paste on modules, Micron is replacing Sn37Pb with Sn3.8Ag0.7Cu.
For leaded TSOP, Micron is replacing 90Sn10Pb with matte Sn plating.
These substitutions ensure Micron’s Pb-free parts are RoHS-compliant. Parts are certified for a surface mount temperature of 260°C.