A lead frame is a metal frame that supports and connects the various components of an integrated circuit (IC). The lead frame typically consists of a central die paddle (the portion to which the IC die is attached), Outer leads (the pins that protrude from the IC package and make electrical contact with the external circuitry), and inner leads (the pins that connect the die to the outer leads). An extended coverage lead frame is a lead frame that has been modified to provide increased coverage over critical areas of the IC. This can be accomplished by adding metal tabs or other structures to the lead frame, or by altering the shape of the lead frame itself. Extended coverage lead frames are used in high-reliability applications where it is important to minimize potential damage to the IC.