HEAM's design can be adapted for other memory-intensive applications by leveraging its three-tiered memory architecture and integrating Processing-In-Memory (PIM) technology. This approach can effectively address the challenges of large model sizes and memory-bound operations in various domains beyond recommendation systems. By organizing a memory hierarchy consisting of conventional DIMM, 3D-stacked DRAM with base die-level PIM, and lookup tables inside bank group-level PIM, HEAM optimizes memory access efficiency and enhances overall throughput.
To adapt HEAM's design for other applications, one could analyze the specific requirements of the target application to determine how compositional embedding or similar techniques could be utilized to reduce the size of embedding tables while maintaining performance. Additionally, incorporating a heterogeneous memory system with different types of memories like HBM and DIMM could help improve bandwidth utilization in scenarios where traditional architectures face limitations.