Thin film deposition refers to any technique where a very thin film of material, usually only a few atoms thick, covers a particular substrate. What makes this process attractive is the versatility and range of both the coating and target material, which allows the coating to improve or alter the substrate’s performance. Common applications include making the substrate scratch-resistant, making it more or less electrically conductive, or improving on a substrate’s durability. The two primary methods of thin film deposition systems rely on either a physical evaporation process or chemical reactions to atomise the source material before bonding it to the substrate layer by layer. Physical processes rely on very low pressures on a resistive heat source to produce the required vapour pressure, while chemical processes use reactive gas and another precursor gas. When the two gases interact on the substrate, a chemical reaction occurs that results in an even film without the need for spin coating methods that may influence thickness or purity.