Question Where can I find HMC device application notes on Packaging, Die Handling, Mounting, Bonding etc. Answer The die datasheets in general have a page dedicated to : Mounting & Bonding Techniques for Millimeterwave GaAs MMICsHandling PrecautionsMountingWire Bonding Please refer to the die datasheet for this. Here are some other HMC application notes that should be useful for package mounting, layout and thermal management: http://www.analog.com/media/en/technical-documentation/application-notes/smt_assembly_for_leadless_packages.pdf http://www.analog.com/media/en/technical-documentation/application-notes/layout_guidelines_for_mmic_components.pdf http://www.analog.com/media/en/technical-documentation/application-notes/thermal_management_for_surface_mount_components.pdf http://www.analog.com/media/en/technical-documentation/application-notes/smt_assembly_for_leadless_packages.pdf