Direct Bonded Copper (DBC) is used when a high copper thickness is required - 140um (4oz)-350um (10oz). The copper is bonded to the Ceramic substrate on one or both sides using a high-temperature oxidation process. Direct Plated Copper (DPC) is the newest development in the field of Ceramic Substrate PCBs and using this method can result in copper thickness' ranging from 10um (≈ 1/3oz) to 140um (4oz). With DPC track printing and etching is then performed with the thin Copper allowing for very fine tracks and reduced undercutting.