Integrated Circuit (IC) packaging refers to the process of enclosing semiconductor chips (ASICs, ICs or microchips) in protective enclosures that enable connection to the printed circuit board (PCB). Packages serve several critical functions beyond just providing a means of connection to the next level of assembly:
Physical Protection (mechanical/electrical): Packages shield silicon chips from mechanical damage, moisture, and contaminants. They also provide electrical shielding: emissions exiting the silicon and immunity from outside signals which could impede product function.
Thermal Management: Efficient heat dissipation is crucial to prevent overheating. Packages typically have heat-spreaders (aka lids), heat sinks, and thermal vias to help manage thermal flow at the system level. Tektronix Component Solutions provides turn-key simulation services to ensure packages meet customer’s performance requirements.
Signal Integrity: Proper package design ensures reliable signal transmission between the chip and the PCB. The Tektronix team performs extensive simulations to ensure targets for both Signal Integrity and Power Integrity are met
Form Factor: Packages come in various configurations to meet customer’s needs. Tektronix Component Solutions offers a number of package architectural solutions (QFN/FCBGA/WBBGA/COF).