A method for making a randomised zone on an integrated circuit, the integrated circuit being intended to comprise at least: • a first and a second level of the electrical tracks , • an interconnection level located between the first and second levels of the electrical tracks and including vias intended to electrically connect the electrical tracks of the first level with electrical tracks of the second level , the method comprising at least the following steps: • provide at least the first level of the electrical tracks , then provide the interconnection level comprising the vias , • deposit a dielectric layer then a deformable layer over the interconnection level, • make, in a zone of the deformable layer intended to comprise the randomised zone , recessed patterns, by penetration of a printing mould into the deformable layer , making of the patterns being configured so that the patterns feature a random nature in the deformable layer , thus forming random patterns and that at least some random patterns extend in line with at least two vias of the interconnection level, • transfer the random patterns into the dielectric layer to form transferred random patterns therein and expose the vias located in line with the transferred random patterns , • fill the transferred random patterns with an electrically-conductive material so as to form electrical connections between vias , • make the second level of the electrical tracks over the vias and the electrical connections, and said making of the patterns so that the patterns feature a random nature in the deformable layer , comprises the following steps: • provide said printing mould , said mould having a front face carrying initial reliefs , • achieve a random collapse of the initial reliefs so as to form random reliefs , • make the front face of the mould penetrate into the deformable layer to leave the random patterns therein, • the step of achieving the random collapse of the initial reliefs of the mould being carried out before and/or during the penetration of the front face of the mould into the deformable layer . • a first and a second level of the electrical tracks , • an interconnection level located between the first and second levels of the electrical tracks and including vias intended to electrically connect the electrical tracks of the first level with electrical tracks of the second level , • provide at least the first level of the electrical tracks , then provide the interconnection level comprising the vias , • deposit a dielectric layer then a deformable layer over the interconnection level, • make, in a zone of the deformable layer intended to comprise the randomised zone , recessed patterns, by penetration of a printing mould into the deformable layer , making of the patterns being configured so that the patterns feature a random nature in the deformable layer , thus forming random patterns and that at least some random patterns extend in line with at least two vias of the interconnection level, • transfer the random patterns into the dielectric layer to form transferred random patterns therein and expose the vias located in line with the transferred random patterns , • fill the transferred random patterns with an electrically-conductive material so as to form electrical connections between vias , • make the second level of the electrical tracks over the vias and the electrical connections, • provide said printing mould , said mould having a front face carrying initial reliefs , • achieve a random collapse of the initial reliefs so as to form random reliefs , • make the front face of the mould penetrate into the deformable layer to leave the random patterns therein, • the step of achieving the random collapse of the initial reliefs of the mould being carried out before and/or during the penetration of the front face of the mould into the deformable layer . <EOS>