An electronic device, comprising: a housing , comprising: a first case , comprising an upper surface and a lower surface that are opposite to each other, a through hole , and a side wall , wherein the through hole runs through the upper surface and the lower surface , and the side wall extends away from the upper surface along a contour of the lower surface ; and a second case , disposed at an end of the side wall away from the upper surface ; a first heat source , disposed in the housing and corresponding to the through hole ; a second heat source , disposed in the housing ; and a heat dissipation module , comprising: a first fan , comprising a first air outlet , wherein the first fan is disposed on one side of the first case ; a second fan , comprising a second air outlet , wherein the second fan is disposed on the other side of the first case and is adjacent to the second heat source , and the first air outlet and the second air outlet are located on two opposite sides of the side wall ; a first heat conduction member , having one end disposed at the first fan and the other end located at a position on a side of the upper surface corresponding to the first heat source ; and a second heat conduction member , having one end disposed at the second fan and the other end located on a side of the lower surface and abutting against the second heat source . a housing , comprising: a first case , comprising an upper surface and a lower surface that are opposite to each other, a through hole , and a side wall , wherein the through hole runs through the upper surface and the lower surface , and the side wall extends away from the upper surface along a contour of the lower surface ; and a second case , disposed at an end of the side wall away from the upper surface ; a first case , comprising an upper surface and a lower surface that are opposite to each other, a through hole , and a side wall , wherein the through hole runs through the upper surface and the lower surface , and the side wall extends away from the upper surface along a contour of the lower surface ; and a second case , disposed at an end of the side wall away from the upper surface ; a first heat source , disposed in the housing and corresponding to the through hole ; a second heat source , disposed in the housing ; and a heat dissipation module , comprising: a first fan , comprising a first air outlet , wherein the first fan is disposed on one side of the first case ; a second fan , comprising a second air outlet , wherein the second fan is disposed on the other side of the first case and is adjacent to the second heat source , and the first air outlet and the second air outlet are located on two opposite sides of the side wall ; a first heat conduction member , having one end disposed at the first fan and the other end located at a position on a side of the upper surface corresponding to the first heat source ; and a second heat conduction member , having one end disposed at the second fan and the other end located on a side of the lower surface and abutting against the second heat source . a first fan , comprising a first air outlet , wherein the first fan is disposed on one side of the first case ; a second fan , comprising a second air outlet , wherein the second fan is disposed on the other side of the first case and is adjacent to the second heat source , and the first air outlet and the second air outlet are located on two opposite sides of the side wall ; a first heat conduction member , having one end disposed at the first fan and the other end located at a position on a side of the upper surface corresponding to the first heat source ; and a second heat conduction member , having one end disposed at the second fan and the other end located on a side of the lower surface and abutting against the second heat source . <EOS>