A sensor package structure, comprising: a substrate ; a sensor chip disposed on the substrate and electrically coupled to the substrate , wherein a top surface of the sensor chip includes a sensing region , a spacing region surrounding the sensing region , and a carrying region surrounding the spacing region ; a ring-shaped support disposed on the carrying region of the sensor chip ; a light permeable board having a first surface , a second surface opposite to the first surface , and an outer lateral side , wherein the second surface of the light permeable board is disposed on the ring-shaped support , and the light permeable board , the ring-shaped support , and the substrate jointly surround and form an enclosed space (E), wherein a ring-shaped notch recessed from the first surface of the light permeable board includes a platform surface and a wall surface that connects with the platform surface , and wherein the platform surface is at least partially arranged above the ring-shaped support , the wall surface is arranged above the spacing region , and the outer lateral side of the light permeable board is arranged between the second surface and the platform surface ; and an opaque package body formed on the substrate , wherein the opaque package body contacts the outer lateral side of the light permeable board and the ring-shaped support , and a part of the opaque package body is filled into the ring-shaped notch and is defined as a light shielding portion , and wherein the opaque package body covers the platform surface , the first surface is at least partially exposed from the opaque package body , and an inner lateral side of the ring-shaped support is arranged in a projection area formed by orthogonally projecting the platform surface onto the top surface of the sensor chip . a substrate ; a sensor chip disposed on the substrate and electrically coupled to the substrate , wherein a top surface of the sensor chip includes a sensing region , a spacing region surrounding the sensing region , and a carrying region surrounding the spacing region ; a ring-shaped support disposed on the carrying region of the sensor chip ; a light permeable board having a first surface , a second surface opposite to the first surface , and an outer lateral side , wherein the second surface of the light permeable board is disposed on the ring-shaped support , and the light permeable board , the ring-shaped support , and the substrate jointly surround and form an enclosed space (E), wherein a ring-shaped notch recessed from the first surface of the light permeable board includes a platform surface and a wall surface that connects with the platform surface , and wherein the platform surface is at least partially arranged above the ring-shaped support , the wall surface is arranged above the spacing region , and the outer lateral side of the light permeable board is arranged between the second surface and the platform surface ; and an opaque package body formed on the substrate , wherein the opaque package body contacts the outer lateral side of the light permeable board and the ring-shaped support , and a part of the opaque package body is filled into the ring-shaped notch and is defined as a light shielding portion , and wherein the opaque package body covers the platform surface , the first surface is at least partially exposed from the opaque package body , and an inner lateral side of the ring-shaped support is arranged in a projection area formed by orthogonally projecting the platform surface onto the top surface of the sensor chip . <EOS>