A piezoelectric wafer, comprising: a piezoelectric vibration piece ; a frame portion that supports the piezoelectric vibration piece ; and a coupling portion that couples the piezoelectric vibration piece to the frame portion , wherein the piezoelectric vibration piece comprises a base portion , vibrating units formed on a first side surface of the base portion , and a junction portion formed on a second side surface of the base portion , wherein the coupling portion has a break-off part formed in a width direction along an interface between the coupling portion and the junction portion of the piezoelectric vibration piece , the break-off part being configured for breaking off the piezoelectric vibration piece from the frame portion at the coupling portion , wherein the break-off part comprises: groove-shaped slits being formed by etching and extending along a width direction of the coupling portion on front and back surfaces of the coupling portion ; wherein the break-off part comprises at least one bridge being an unetched part having a flat surface and interposed between the groove-shaped slits , wherein the piezoelectric vibration piece further comprises an electrode (20c4,20c5) on at least one of front and back surfaces of the piezoelectric vibration piece , characterized in that the electrode (20c4,20c5) is extracted to the frame-portion by way of the flat surface of the at least one bridge . a piezoelectric vibration piece ; a frame portion that supports the piezoelectric vibration piece ; and a coupling portion that couples the piezoelectric vibration piece to the frame portion , wherein the piezoelectric vibration piece comprises a base portion , vibrating units formed on a first side surface of the base portion , and a junction portion formed on a second side surface of the base portion , wherein the coupling portion has a break-off part formed in a width direction along an interface between the coupling portion and the junction portion of the piezoelectric vibration piece , the break-off part being configured for breaking off the piezoelectric vibration piece from the frame portion at the coupling portion , wherein the break-off part comprises: groove-shaped slits being formed by etching and extending along a width direction of the coupling portion on front and back surfaces of the coupling portion ; wherein the break-off part comprises at least one bridge being an unetched part having a flat surface and interposed between the groove-shaped slits , wherein the piezoelectric vibration piece further comprises an electrode (20c4,20c5) on at least one of front and back surfaces of the piezoelectric vibration piece , characterized in that the electrode (20c4,20c5) is extracted to the frame-portion by way of the flat surface of the at least one bridge . groove-shaped slits being formed by etching and extending along a width direction of the coupling portion on front and back surfaces of the coupling portion ; wherein the break-off part comprises at least one bridge being an unetched part having a flat surface and interposed between the groove-shaped slits , wherein the piezoelectric vibration piece further comprises an electrode (20c4,20c5) on at least one of front and back surfaces of the piezoelectric vibration piece , characterized in that the electrode (20c4,20c5) is extracted to the frame-portion by way of the flat surface of the at least one bridge . <EOS>