mhurhangee/patent-ind-claim-en huggingface dataset:
A method, comprising: determining , by an Evolved NodeB, eNB, for one or more user equipments, UEs, a set of listen before talk, LBT, parameters associated with an unlicensed frequency band, wherein the set of LBT parameters comprises a common carrier sensing duration for the one or more UEs and a common backoff duration for the one or more UEs; and determining , by the eNB, at least one uplink grant in the unlicensed frequency band for at least one of the one or more UEs, said uplink grant associated with resources comprising one or more resource blocks, wherein the at least one uplink grant schedules at most one of the one or more UEs to each of the one or more resource blocks; transmitting , by the eNB, the set of LBT parameters and the at least one uplink grant: performing, by each of the UEs, carrier sensing and a backoff process based in the LBT parameters before any transmissions; and receiving , by the eNB, transmissions over said resources associated with the at least one uplink grant. determining , by an Evolved NodeB, eNB, for one or more user equipments, UEs, a set of listen before talk, LBT, parameters associated with an unlicensed frequency band, wherein the set of LBT parameters comprises a common carrier sensing duration for the one or more UEs and a common backoff duration for the one or more UEs; and determining , by the eNB, at least one uplink grant in the unlicensed frequency band for at least one of the one or more UEs, said uplink grant associated with resources comprising one or more resource blocks, wherein the at least one uplink grant schedules at most one of the one or more UEs to each of the one or more resource blocks; transmitting , by the eNB, the set of LBT parameters and the at least one uplink grant: performing, by each of the UEs, carrier sensing and a backoff process based in the LBT parameters before any transmissions; and receiving , by the eNB, transmissions over said resources associated with the at least one uplink grant. performing, by each of the UEs, carrier sensing and a backoff process based in the LBT parameters before any transmissions; and receiving , by the eNB, transmissions over said resources associated with the at least one uplink grant.
An electronic device , comprising: an inverted-F antenna ; a housing , wherein the housing comprises a peripheral conductive housing member that runs around edges of the housing ; an antenna ground plane (G) for the inverted-F antenna , wherein a segment (12-1) of the peripheral conductive housing member forms a resonating element arm for the inverted-F antenna , and wherein the antenna ground plane (G) and the segment (12-1) of the peripheral conductive housing member are separated by a gap ; characterized by : a conductive shorting path that bridges the gap and couples the segment (12-1) of the peripheral conductive housing member to the antenna ground plane (G), wherein the conductive shorting path comprises a flex circuit that is attached to the segment (12-1) of the peripheral conductive housing member , the flex circuit comprises a flexible polymer substrate that bridges the gap , the flex circuit further comprises a conductive trace , and the conductive shorting path further comprises a solder pad that electrically connects the conductive trace to the segment (12-1) of the peripheral conductive housing member . an inverted-F antenna ; a housing , wherein the housing comprises a peripheral conductive housing member that runs around edges of the housing ; an antenna ground plane (G) for the inverted-F antenna , wherein a segment (12-1) of the peripheral conductive housing member forms a resonating element arm for the inverted-F antenna , and wherein the antenna ground plane (G) and the segment (12-1) of the peripheral conductive housing member are separated by a gap ; characterized by : a conductive shorting path that bridges the gap and couples the segment (12-1) of the peripheral conductive housing member to the antenna ground plane (G), wherein the conductive shorting path comprises a flex circuit that is attached to the segment (12-1) of the peripheral conductive housing member , the flex circuit comprises a flexible polymer substrate that bridges the gap , the flex circuit further comprises a conductive trace , and the conductive shorting path further comprises a solder pad that electrically connects the conductive trace to the segment (12-1) of the peripheral conductive housing member .
A thermal transfer recording medium comprising: a heat-resistant lubricating layer on one surface of a base material; and an undercoat layer and a dye layer in that order on the other surface of the base material, wherein the undercoat layer includes a copolymer of a polyester having a sulfonic acid group and an acrylic polymer having at least one of a glycidyl group and a carboxyl group, polyvinylpyrrolidone, and an oxazoline group-containing polymer; and a binder resin of the dye layer is an acid-modified polyvinyl acetoacetal resin or an epoxy-modified polyvinyl acetoacetal resin. a copolymer of a polyester having a sulfonic acid group and an acrylic polymer having at least one of a glycidyl group and a carboxyl group, polyvinylpyrrolidone, and an oxazoline group-containing polymer; and
An information processing device comprising: a voltage detection unit configured to monitor a voltage value of a signal output to a predetermined terminal of a connector at a predetermined timing; characterized in that : a signal control unit configured to stop output of the signal if the voltage value after a predetermined time elapses from when the voltage value detected by the voltage detection unit exceeds a first value does not exceed a second value greater than the first value.
A method of bonding a second object to a first object , the method comprising the steps of: - providing the first object , the first object comprising a thermoplastic liquefiable material in a solid state; - providing the second object , the second object comprising a surface portion that has a coupling structure with an undercut and/or is capable of being deformed to comprise such a coupling structure with an undercut, whereby the second object is capable of making a positive-fit connection with the first object; - pressing the second object against the first object by a tool that is in physical contact with a coupling-in structure of the second object while mechanical vibrations are coupled into the tool, - continuing the step of pressing and coupling vibrations into the tool until a flow portion of the thermoplastic material of the first object is liquefied and flows into the coupling structure of the second object, - letting the thermoplastic material of the first object re-solidify to yield a positive-fit connection between the first and second objects by the liquefied and re-solidified flow portion interpenetrating the coupling structure, characterized in that the coupling structure comprises a plurality of laterally spaced openings open to a distal side, which openings define an undercut with respect to axial directions, wherein flowing of the flow portion comprises flowing backwards into the openings defining the undercut, wherein a distal portion of the openings is embedded in the first object during the method. - providing the first object , the first object comprising a thermoplastic liquefiable material in a solid state; - providing the second object , the second object comprising a surface portion that has a coupling structure with an undercut and/or is capable of being deformed to comprise such a coupling structure with an undercut, whereby the second object is capable of making a positive-fit connection with the first object; - pressing the second object against the first object by a tool that is in physical contact with a coupling-in structure of the second object while mechanical vibrations are coupled into the tool, - continuing the step of pressing and coupling vibrations into the tool until a flow portion of the thermoplastic material of the first object is liquefied and flows into the coupling structure of the second object, - letting the thermoplastic material of the first object re-solidify to yield a positive-fit connection between the first and second objects by the liquefied and re-solidified flow portion interpenetrating the coupling structure, characterized in that the coupling structure comprises a plurality of laterally spaced openings open to a distal side, which openings define an undercut with respect to axial directions, wherein flowing of the flow portion comprises flowing backwards into the openings defining the undercut, wherein a distal portion of the openings is embedded in the first object during the method.
A method of treating soil, the method comprising providing the soil with a glucosinolate-secreting plant or a seed thereof and contacting said soil with a myrosinase-secreting yeast of the Cryptococcus genus or a spore thereof.
A weighted duvet for applying stimulating pressure to one or more duvet users comprising: - a first edge positioned opposite a second edge and a third edge positioned opposite a fourth edge ; - a first fabric layer , a second fabric layer ; - at least one duvet section in the central weighted zone of the weighted duvet ; - at least one weight element placed between said first and said second fabric layer and within said at least one duvet section ; wherein the weighted duvet further comprises a first lightweight zone adjacent to and spanning the length of said first edge and a second light weight zone adjacent to and spanning the length of said second edge , characterised in that the first lightweight zone extends at least 10 cm from the first edge and the second lightweight zone extends at least 10 cm from the second edge . - a first edge positioned opposite a second edge and a third edge positioned opposite a fourth edge ; - a first fabric layer , a second fabric layer ; - at least one duvet section in the central weighted zone of the weighted duvet ; - at least one weight element placed between said first and said second fabric layer and within said at least one duvet section ; wherein the weighted duvet further comprises a first lightweight zone adjacent to and spanning the length of said first edge and a second light weight zone adjacent to and spanning the length of said second edge , characterised in that the first lightweight zone extends at least 10 cm from the first edge and the second lightweight zone extends at least 10 cm from the second edge .
Method for the preparation of compound of formula (I); the method comprises a reaction REAC1, wherein compound of formula (II) is reacted with 2-bromoheptafluoropropane in the presence of sodium dithionite, in a solvent SOLV1 and in the presence of a catalyst CAT1; wherein the reaction mixture of REAC1 has only one liquid phase; R is CF 3 or methyl; SOLV1 is selected from the group consisting of methyl acetate, ethyl acetate, butyl acetate, propyl acetate, isopropyl acetate, tert-butylacetate, dimethyl carbonate, diethyl carbonate, acetone, 2-butanone, ethylene glycol, acetonitrile, propionitrile, valeronitrile, 1,4-dioxane, tetrahydrofuran, 2-methyl tetrahydrofuran, 1,2-dimethoxyethane, methyl tert-butyl ether, sulfolane, and mixtures thereof; CAT1 is selected from the group consisting of formic acid, acetic acid, propionic acid, benzoic acid, sulfuric acid, hydrochloric acid, sodium hydrogen sulfate, potassium hydrogen sulfate, tetramethylammonium hydrogen sulfate, tetrabutylammonium hydrogen sulfate, NaH 2 PO 4 , Na 2 HPO 4 , KH 2 PO 4 , K 2 HPO 4 , Bu 4 NH 2 PO 4 , sulfamic acid, pyridinium hydrochloride, methane sulfonic acid, toluene sulfonic acid, and mixtures thereof.
A method of forming a bend of a predetermined bend angle in a shape memory alloy wire, the method comprising: applying a bend stress sufficient to over-bend a portion of a wire comprising a nickel-titanium alloy by an amount ranging from 85% to 105%, where the wire includes from about 40% to 46% cold work; and releasing the bend stress, thereby forming a bend having a predetermined bend angle in the wire. applying a bend stress sufficient to over-bend a portion of a wire comprising a nickel-titanium alloy by an amount ranging from 85% to 105%, where the wire includes from about 40% to 46% cold work; and releasing the bend stress, thereby forming a bend having a predetermined bend angle in the wire.
A pump arrangement , configured to be used with a breast pump device comprising an expression kit designed to subject a breast of a user of the device to a pressure profile and to receive milk expressed from the breast, the pump arrangement comprising: - a pump element configured to create the pressure profile in the expression kit , the pump having a suction side and a discharge side, - a system of air conduits , including an expression kit air conduit designed to allow for air connection of the expression kit to the pump arrangement and connected between the expression kit and the suction side of the pump element, - a volume element configured to store vacuum in the pump arrangement , and - a storage switching mechanism arranged between the suction side of the pump arrangement and hence the expression kit air conduit and the volume element , configured to switch between a position of direct connection of the expression kit air conduit to the volume element at a bypass position with respect to the pump element and a position of disconnection of the expression kit air conduit from the volume element , - an environment switching mechanism arranged between the suction side of the pump and hence the expression kit air conduit and the environment of the pump arrangement , configured to switch between a position of connection of the expression kit air conduit to the environment of the pump arrangement and a position of disconnection of the expression kit air conduit from the environment of the pump arrangement . - a pump element configured to create the pressure profile in the expression kit , the pump having a suction side and a discharge side, - a system of air conduits , including an expression kit air conduit designed to allow for air connection of the expression kit to the pump arrangement and connected between the expression kit and the suction side of the pump element, - a volume element configured to store vacuum in the pump arrangement , and - a storage switching mechanism arranged between the suction side of the pump arrangement and hence the expression kit air conduit and the volume element , configured to switch between a position of direct connection of the expression kit air conduit to the volume element at a bypass position with respect to the pump element and a position of disconnection of the expression kit air conduit from the volume element , - an environment switching mechanism arranged between the suction side of the pump and hence the expression kit air conduit and the environment of the pump arrangement , configured to switch between a position of connection of the expression kit air conduit to the environment of the pump arrangement and a position of disconnection of the expression kit air conduit from the environment of the pump arrangement .
A method of operating a power distribution system including a power converter having a maximum power demand threshold, comprising: identifying a high power transient demand in the set of solid state switching elements ; upon identification of the high power transient demand, raising a maximum current for the respective solid state switching element associated with the high power transient demand to prevent tripping of the respective solid state switching element ; receiving , in a controller module , a set of present power demands from a set of solid state switching elements ; summating the set of present power demands in the controller module ; comparing the summated set of present power demands with the maximum power demand threshold; and when the summated set of present power demands exceeds the maximum power demand threshold, limiting a maximum current for at least a subset of solid state switching elements ; wherein the set of solid state switching elements are connected downstream of the power converter ; wherein the limiting limits a total actual power supplied by the power converter to less than or equal to the maximum power demand threshold. identifying a high power transient demand in the set of solid state switching elements ; upon identification of the high power transient demand, raising a maximum current for the respective solid state switching element associated with the high power transient demand to prevent tripping of the respective solid state switching element ; receiving , in a controller module , a set of present power demands from a set of solid state switching elements ; summating the set of present power demands in the controller module ; comparing the summated set of present power demands with the maximum power demand threshold; and when the summated set of present power demands exceeds the maximum power demand threshold, limiting a maximum current for at least a subset of solid state switching elements ; wherein the set of solid state switching elements are connected downstream of the power converter ; wherein the limiting limits a total actual power supplied by the power converter to less than or equal to the maximum power demand threshold.
Turbine comprising a turbine wheel , wherein the turbine wheel having a first channel running along an axis of rotation of the turbine wheel and a second channel running substantially in a radial direction, for guiding of the fluidic drive medium having an inlet and an outlet for the fluidic drive medium, wherein the inlet is in fluidic connection with the first channel and the outlet is directed substantially in a tangential direction of the turbine wheel , wherein the turbine has a fluid nozzle in the outlet , characterized in that a metal and/or ceramic reinforcement is arranged in at least one section of a wall of the first and/or second channel, and the entire wall of the first channel and/or of the second channel has a metal reinforcement and the metal reinforcement in the first channel has a recess in a connection area with the second channel into which the metal reinforcement of the second channel is inserted and / or in which the metal reinforcement of the second channel is welded, soldered or crimped to the metal reinforcement in the first channel.
Resistor for a control valve comprising: - a plurality of modules , comprising one or more annular discs stacked to each other, each module being provided with inlet openings and outlet openings in fluid communication through radial passages , changes of direction and axial passages formed inside of said annular discs , - a lower plate and an upper plate between which the plurality of modules is interposed, - fastening means which stably connect the lower plate and the upper plate and the plurality of modules , the resistor having inter-modular axial passages which bring into fluid communication the radial passages and the axial passages of different modules of said plurality of modules at any percentage of shutter stroke , wherein said annular discs have indentations in correspondence of the outlet openings , wherein the height of the radial passages upstream of the inter-modular axial passages is greater than the height of the radial passages downstream of the inter-modular axial passages , the resistor being characterized in that the height of the axial passages upstream of the inter-modular axial passages is greater than the height of the axial passages downstream of the inter-modular axial passages . - a plurality of modules , comprising one or more annular discs stacked to each other, each module being provided with inlet openings and outlet openings in fluid communication through radial passages , changes of direction and axial passages formed inside of said annular discs , - a lower plate and an upper plate between which the plurality of modules is interposed, - fastening means which stably connect the lower plate and the upper plate and the plurality of modules , the resistor having inter-modular axial passages which bring into fluid communication the radial passages and the axial passages of different modules of said plurality of modules at any percentage of shutter stroke , wherein the height of the radial passages upstream of the inter-modular axial passages is greater than the height of the radial passages downstream of the inter-modular axial passages , the resistor being characterized in that the height of the axial passages upstream of the inter-modular axial passages is greater than the height of the axial passages downstream of the inter-modular axial passages .
A method of forming a matched capacitor pair , comprising the steps of: forming a plurality of fin structures in a semiconductor substrate, each fin structure having a first side surface and a second side surface, the first side surface and the second side surface opposing each other relative to the respective fin structure; forming a plurality of trenches between the fin structures of the plurality of fin structures in the semiconductor substrate; forming a plurality of isolation layers within the plurality of trenches; forming a plurality of first insulator structures adjacent to the first side surfaces of the fin structures and a plurality of second insulator structures adjacent to the second side surfaces of the fin structures ; forming a first plurality of conductor structures adjacent to the first insulator structures and second insulator structures ; forming a second plurality of conductor structures adjacent to the first insulator structures and second insulator structures ; forming a first bridge structure connecting the conductor structures of the first plurality of conductor structures ; and forming a second bridge structure connecting the conductor structures of the second plurality of conductor structures ; wherein the conductor structures of the first and second plurality of conductor structures are disposed between the fin structures such that an alternating array of the conductor structures and the fin structures is formed, wherein the first and second conductor structures are alternately arranged with respect to each other. forming a plurality of fin structures in a semiconductor substrate, each fin structure having a first side surface and a second side surface, the first side surface and the second side surface opposing each other relative to the respective fin structure; forming a plurality of trenches between the fin structures of the plurality of fin structures in the semiconductor substrate; forming a plurality of isolation layers within the plurality of trenches; forming a plurality of first insulator structures adjacent to the first side surfaces of the fin structures and a plurality of second insulator structures adjacent to the second side surfaces of the fin structures ; forming a first plurality of conductor structures adjacent to the first insulator structures and second insulator structures ; forming a second plurality of conductor structures adjacent to the first insulator structures and second insulator structures ; forming a first bridge structure connecting the conductor structures of the first plurality of conductor structures ; and forming a second bridge structure connecting the conductor structures of the second plurality of conductor structures ; wherein the conductor structures of the first and second plurality of conductor structures are disposed between the fin structures such that an alternating array of the conductor structures and the fin structures is formed, wherein the first and second conductor structures are alternately arranged with respect to each other.
A method for the production of a recombinant protein, said method comprising culturing a mammalian host cell expressing said recombinant protein in cell culture medium supplemented, on day 5 after the start of the culture, with at least one feed comprising an effective amount of valeric acid, wherein the concentration of the valeric acid supplement in the cell culture medium is about 1 mM to 2 mM.