A method for assembling a radio base station housing arrangement, the radio base station housing arrangement comprising: - a radio base station housing , - a heat conducting mounting structure for mounting of at least one electronic module , and - an electronic module for a radio base station or a network server or a work-station or a high-power rectifier or a circuit board with an electro-magnetic configuration, wherein the electronic module is to be mounted to the heat conducting mounting structure , said heat conducting mounting structure comprising: - at least one first surface area of a wall , the first surface area facing a second surface area of the electronic module ; - at least one cavity means embedded in the wall , the cavity means being placed at a distance from the first surface area , said cavity means being configured to receive a cooling means , wherein the cooling means is a thermosyphon loop comprising: - a condenser ; - a cooling device ; and - a cooling material configured to be circulated in the cavity means and the condenser ; and - at least one attachment means at the first surface area configured to attach to the electronic module , wherein the attachment means transfers heat energy from the electronic module to the heat conducting mounting structure ; the method comprising the step of inserting the heat conducting mounting structure from a top opening of the radio base station housing with the condenser and the cooling device situated on top and outside the radio base station housing . - a radio base station housing , - a heat conducting mounting structure for mounting of at least one electronic module , and - an electronic module for a radio base station or a network server or a work-station or a high-power rectifier or a circuit board with an electro-magnetic configuration, wherein the electronic module is to be mounted to the heat conducting mounting structure , said heat conducting mounting structure comprising: - at least one first surface area of a wall , the first surface area facing a second surface area of the electronic module ; - at least one cavity means embedded in the wall , the cavity means being placed at a distance from the first surface area , said cavity means being configured to receive a cooling means , wherein the cooling means is a thermosyphon loop comprising: - a condenser ; - a cooling device ; and - a cooling material configured to be circulated in the cavity means and the condenser ; and - at least one attachment means at the first surface area configured to attach to the electronic module , wherein the attachment means transfers heat energy from the electronic module to the heat conducting mounting structure ; - at least one first surface area of a wall , the first surface area facing a second surface area of the electronic module ; - at least one cavity means embedded in the wall , the cavity means being placed at a distance from the first surface area , said cavity means being configured to receive a cooling means , wherein the cooling means is a thermosyphon loop comprising: - a condenser ; - a cooling device ; and - a cooling material configured to be circulated in the cavity means and the condenser ; and - a condenser ; - a cooling device ; and - a cooling material configured to be circulated in the cavity means and the condenser ; and - at least one attachment means at the first surface area configured to attach to the electronic module , wherein the attachment means transfers heat energy from the electronic module to the heat conducting mounting structure ; <EOS>