A sensing device , comprising: a sensing module configured to obtain measurement data of an object to be measured; a first processing module coupled to the sensing module and configured to receive the measurement data of the object to be measured from the sensing module for further processing; a probe member configured to at least partially accommodate the sensing module ; a handle member ; and a power module coupled to the sensing module and the first processing module , and configured to produce a supply voltage based on a magnetic field, the magnetic field being generated by an electromagnetic device , so as to power the sensing module and the first processing module, wherein the power module includes a first inductance coil for inductively coupling with a second inductance coil to produce said supply voltage, the second inductance coil being a heating coil included in the electromagnetic device and energized to generate said magnetic field for heating the object to be measured; characterized in that the handle member comprises: a first housing configured to connect to the probe member and at least partially accommodate the first processing module; and a second housing configured to connect to the first housing and at least partially accommodate the power module ; wherein the first inductance coil of the power module is disposed within the second housing , and the first housing has a bending portion configured to enable the probe member and the second housing to form an angle, wherein the bending portion is adapted to enable the first inductance coil accommodated within the second housing and the second inductance coil of the electromagnetic device to be substantially aligned, such that the first inductance coil can produce larger induced voltage from the magnetic field generated by the second inductance coil . a sensing module configured to obtain measurement data of an object to be measured; a first processing module coupled to the sensing module and configured to receive the measurement data of the object to be measured from the sensing module for further processing; a probe member configured to at least partially accommodate the sensing module ; a handle member ; and a power module coupled to the sensing module and the first processing module , and configured to produce a supply voltage based on a magnetic field, the magnetic field being generated by an electromagnetic device , so as to power the sensing module and the first processing module, wherein the power module includes a first inductance coil for inductively coupling with a second inductance coil to produce said supply voltage, the second inductance coil being a heating coil included in the electromagnetic device and energized to generate said magnetic field for heating the object to be measured; characterized in that the handle member comprises: a first housing configured to connect to the probe member and at least partially accommodate the first processing module; and a second housing configured to connect to the first housing and at least partially accommodate the power module ; a first housing configured to connect to the probe member and at least partially accommodate the first processing module; and a second housing configured to connect to the first housing and at least partially accommodate the power module ; wherein the first inductance coil of the power module is disposed within the second housing , and the first housing has a bending portion configured to enable the probe member and the second housing to form an angle, wherein the bending portion is adapted to enable the first inductance coil accommodated within the second housing and the second inductance coil of the electromagnetic device to be substantially aligned, such that the first inductance coil can produce larger induced voltage from the magnetic field generated by the second inductance coil . <EOS>