An ultrasound probe , comprising: a transducer stack ; a backing block including a first surface, a second surface opposite the first surface, and a side extending between the first and second surfaces; a flexible circuit, the flexible circuit including: a central portion disposed between the transducer stack and the backing block; a wing portion coupled to the central portion, the wing portion configured to fold adjacent to the side of the backing block; a first heat cover disposed below the central portion and adjacent to the first surface of the backing block wherein the first heat cover is configured to dissipate heat from the transducer stack to the backing block; and a second heat cover disposed over the wing portion, wherein the second heat cover is configured to dissipate heat from the transducer stack; a bolster plate in thermal contact with the second heat cover to dissipate heat from the second heat cover; a handle heat spreader in thermal contact with the bolster plate, wherein the handle heat spreader is configured to dissipate heat from the bolster plate; and a probe housing configured to at least partially enclose the transducer stack, backing block, flexible circuit, bolster plate, and handle heat spreader; wherein the handle heat spreader is coupled to an interior surface of the probe housing. a transducer stack ; a backing block including a first surface, a second surface opposite the first surface, and a side extending between the first and second surfaces; a flexible circuit, the flexible circuit including: a central portion disposed between the transducer stack and the backing block; a wing portion coupled to the central portion, the wing portion configured to fold adjacent to the side of the backing block; a first heat cover disposed below the central portion and adjacent to the first surface of the backing block wherein the first heat cover is configured to dissipate heat from the transducer stack to the backing block; and a second heat cover disposed over the wing portion, wherein the second heat cover is configured to dissipate heat from the transducer stack; a central portion disposed between the transducer stack and the backing block; a wing portion coupled to the central portion, the wing portion configured to fold adjacent to the side of the backing block; a first heat cover disposed below the central portion and adjacent to the first surface of the backing block wherein the first heat cover is configured to dissipate heat from the transducer stack to the backing block; and a second heat cover disposed over the wing portion, wherein the second heat cover is configured to dissipate heat from the transducer stack; a bolster plate in thermal contact with the second heat cover to dissipate heat from the second heat cover; a handle heat spreader in thermal contact with the bolster plate, wherein the handle heat spreader is configured to dissipate heat from the bolster plate; and a probe housing configured to at least partially enclose the transducer stack, backing block, flexible circuit, bolster plate, and handle heat spreader; wherein the handle heat spreader is coupled to an interior surface of the probe housing. <EOS>