A heat pump device , comprising: a compression mechanism configured to compress refrigerant; a motor configured to drive the compression mechanism ; a shell housing the compression mechanism and the motor ; a discharge muffler being outside of the shell ; a first pipe connecting the compression mechanism to the discharge muffler ; a first heat exchanger including a refrigerant inlet , the first heat exchanger being configured to exchange heat between the refrigerant and a heating medium; and a second pipe connecting the discharge muffler to the refrigerant inlet of the first heat exchanger , the shell and the discharge muffler being spatially located next to each other, the discharge muffler and the first heat exchanger being spatially located next to each other, the discharge muffler being entirely located in a space between the shell and the first heat exchanger , characterized in that the shell includes a refrigerant inlet and a refrigerant outlet , the first heat exchanger includes a refrigerant outlet , and the heat pump device further comprises: a third pipe connecting the refrigerant outlet of the first heat exchanger to the refrigerant inlet of the shell ; a second heat exchanger including a refrigerant inlet , the second heat exchanger being configured to exchange heat between the refrigerant and the heating medium; and a fourth pipe connecting the refrigerant outlet of the shell to the refrigerant inlet of the second heat exchanger . a compression mechanism configured to compress refrigerant; a motor configured to drive the compression mechanism ; a shell housing the compression mechanism and the motor ; a discharge muffler being outside of the shell ; a first pipe connecting the compression mechanism to the discharge muffler ; a first heat exchanger including a refrigerant inlet , the first heat exchanger being configured to exchange heat between the refrigerant and a heating medium; and a second pipe connecting the discharge muffler to the refrigerant inlet of the first heat exchanger , the shell and the discharge muffler being spatially located next to each other, the discharge muffler and the first heat exchanger being spatially located next to each other, the discharge muffler being entirely located in a space between the shell and the first heat exchanger , characterized in that the shell includes a refrigerant inlet and a refrigerant outlet , the first heat exchanger includes a refrigerant outlet , and the heat pump device further comprises: a third pipe connecting the refrigerant outlet of the first heat exchanger to the refrigerant inlet of the shell ; a second heat exchanger including a refrigerant inlet , the second heat exchanger being configured to exchange heat between the refrigerant and the heating medium; and a fourth pipe connecting the refrigerant outlet of the shell to the refrigerant inlet of the second heat exchanger . a third pipe connecting the refrigerant outlet of the first heat exchanger to the refrigerant inlet of the shell ; a second heat exchanger including a refrigerant inlet , the second heat exchanger being configured to exchange heat between the refrigerant and the heating medium; and a fourth pipe connecting the refrigerant outlet of the shell to the refrigerant inlet of the second heat exchanger . <EOS>