A heat dissipation device for an electronic device, comprising: a heat conductor , including a heat dissipation side and a heat absorption side opposite to each other; wherein the heat absorption side is formed by at least two contact planes (S1, S2); wherein the at least two contact planes (S1, S2) are arranged in parallel to each other, and a height difference (D1 or D2) exists between the at least two contact planes (S1, S2); wherein the at least two contact planes (S1, S2) are configured to move relative to each other, so as to change the height difference (D1 or D2), the heat conductor comprises at least two blocks , the at least two blocks respectively correspond to a respective one of the at least two contact planes (S1, S2), and two of the at least two blocks are connected through a sliding guide structure , so as to move relative to each other to change the height difference (D1 or D2); wherein said two of the at least two blocks respectively include a joint surface , the two joint surfaces are in contact with each other, the sliding guide structure is a combination of a guide groove and a guide rail , the guide groove and the guide rail are respectively disposed on the joint surfaces of said two of the at least two blocks , and directions in which the guide groove and the guide rail extend are perpendicular to the at least two contact planes (S1, S2); wherein the heat-dissipation device further comprises a heat-conducting member which has two ends respectively connected to said two of the at least two blocks and the heat-conducting member is deformable to match the movement between said two of the at least two blocks relative to each other. a heat conductor , including a heat dissipation side and a heat absorption side opposite to each other; wherein the heat absorption side is formed by at least two contact planes (S1, S2); wherein the at least two contact planes (S1, S2) are arranged in parallel to each other, and a height difference (D1 or D2) exists between the at least two contact planes (S1, S2); wherein the at least two contact planes (S1, S2) are configured to move relative to each other, so as to change the height difference (D1 or D2), the heat conductor comprises at least two blocks , the at least two blocks respectively correspond to a respective one of the at least two contact planes (S1, S2), and two of the at least two blocks are connected through a sliding guide structure , so as to move relative to each other to change the height difference (D1 or D2); wherein said two of the at least two blocks respectively include a joint surface , the two joint surfaces are in contact with each other, the sliding guide structure is a combination of a guide groove and a guide rail , the guide groove and the guide rail are respectively disposed on the joint surfaces of said two of the at least two blocks , and directions in which the guide groove and the guide rail extend are perpendicular to the at least two contact planes (S1, S2); wherein the heat-dissipation device further comprises a heat-conducting member which has two ends respectively connected to said two of the at least two blocks and the heat-conducting member is deformable to match the movement between said two of the at least two blocks relative to each other. <EOS>