An Antenna-in-Package, AiP, comprising: an interface layer comprising at least an antenna layer and an insulating layer disposed under the antenna layer , wherein the antenna layer comprising a first antenna region and a second antenna region spaced apart from the first antenna region; an integrated circuit die disposed on the interface layer , wherein the integrated circuit die is interposed between the first antenna region and the second antenna region, wherein the first antenna region is disposed adjacent to a first edge of the integrated circuit die , and the second antenna region is disposed adjacent to a second edge of the integrated circuit die , which is opposite to the first edge; and a plurality of solder balls disposed on a bottom surface of the interface layer wherein the first antenna region comprises a first antenna element, a second antenna element extending along a first direction, a feeding network electrically connecting the first antenna element and the second antenna element to the integrated circuit die ; wherein the first antenna element and the second antenna element are two folded dipole antenna elements arranged in parallel with each other, characterized in that the feeding network is divided into two integral portions: a longitudinal portion extending along a second direction and a lateral portion extending along the first direction; and in that a distance L 1 between the first antenna element and the lateral portion of the feeding network is greater than a distance L 2 between the second antenna element and the lateral portion of the feeding network. an interface layer comprising at least an antenna layer and an insulating layer disposed under the antenna layer , wherein the antenna layer comprising a first antenna region and a second antenna region spaced apart from the first antenna region; an integrated circuit die disposed on the interface layer , wherein the integrated circuit die is interposed between the first antenna region and the second antenna region, wherein the first antenna region is disposed adjacent to a first edge of the integrated circuit die , and the second antenna region is disposed adjacent to a second edge of the integrated circuit die , which is opposite to the first edge; and a plurality of solder balls disposed on a bottom surface of the interface layer wherein the first antenna region comprises a first antenna element, a second antenna element extending along a first direction, a feeding network electrically connecting the first antenna element and the second antenna element to the integrated circuit die ; wherein the first antenna element and the second antenna element are two folded dipole antenna elements arranged in parallel with each other, characterized in that the feeding network is divided into two integral portions: a longitudinal portion extending along a second direction and a lateral portion extending along the first direction; and in that a distance L 1 between the first antenna element and the lateral portion of the feeding network is greater than a distance L 2 between the second antenna element and the lateral portion of the feeding network. a longitudinal portion extending along a second direction and a lateral portion extending along the first direction; and in that a distance L 1 between the first antenna element and the lateral portion of the feeding network is greater than a distance L 2 between the second antenna element and the lateral portion of the feeding network. <EOS>