An integrated circuit configured to be integrated into a terminal device, comprising a bearer structure , a first radiation patch , a second radiation patch , and a radio frequency processing chip , wherein the first radiation patch, the second radiation patch, and the radio frequency processing chip are separately placed on different layers of the bearer structure, a first feed line is disposed in the bearer structure, and the radio frequency processing chip is configured to feed the first radiation patch by using the first feed line , a second feed line is disposed in the bearer structure, and the radio frequency processing chip is configured to feed the second radiation patch by using the second feed line , wherein the bearer structure comprises: a first bearer structure and a second bearer structure, the first bearer structure is configured to bear the first radiation patch, and the second bearer structure is configured to bear the second radiation patch; and a ground plane , wherein an opening is disposed on the ground plane, and the first feed line and the second feed line pass through the opening to feed the first radiation patch and the second radiation patch respectively, wherein the first radiation patch is located between the second radiation patch and the ground plane , the integrated circuit further comprising: a plurality of metal columns , wherein one end of each of the plurality of metal columns is connected to the ground plane , the other end is connected to the first radiation patch , the plurality of metal columns form an encirclement around the first radiation patch, and the second feed line passes through the encirclement. a second feed line is disposed in the bearer structure, and the radio frequency processing chip is configured to feed the second radiation patch by using the second feed line , wherein the bearer structure comprises: a first bearer structure and a second bearer structure, the first bearer structure is configured to bear the first radiation patch, and the second bearer structure is configured to bear the second radiation patch; and a ground plane , wherein an opening is disposed on the ground plane, and the first feed line and the second feed line pass through the opening to feed the first radiation patch and the second radiation patch respectively, wherein the first radiation patch is located between the second radiation patch and the ground plane , the integrated circuit further comprising: a plurality of metal columns , wherein one end of each of the plurality of metal columns is connected to the ground plane , the other end is connected to the first radiation patch , the plurality of metal columns form an encirclement around the first radiation patch, and the second feed line passes through the encirclement. a first bearer structure and a second bearer structure, the first bearer structure is configured to bear the first radiation patch, and the second bearer structure is configured to bear the second radiation patch; and a ground plane , wherein an opening is disposed on the ground plane, and the first feed line and the second feed line pass through the opening to feed the first radiation patch and the second radiation patch respectively, wherein the first radiation patch is located between the second radiation patch and the ground plane , the integrated circuit further comprising: a plurality of metal columns , wherein one end of each of the plurality of metal columns is connected to the ground plane , the other end is connected to the first radiation patch , the plurality of metal columns form an encirclement around the first radiation patch, and the second feed line passes through the encirclement. <EOS>