A light emitting device package comprising: a body comprising a cavity with an opened topside, the body comprising a ceramic material; a heat dissipation member between a bottom surface of the cavity and a lower surface of the body ; a plurality of electrodes on the bottom surface of the cavity ; a plurality of pads disposed on the lower surface of the body and electrically connected to at least one of the electrodes ; a light emitting diode (LED) disposed on a first electrode of the electrodes disposed on the bottom surface of the cavity , the light emitting diode being electrically connected to the electrodes ; and a buffer layer (L1,101,103,104) disposed between the heat dissipation member and at least one of the pads and having a thickness thinner than a thickness of the heat dissipation member , wherein the body is formed of the ceramic material and is disposed around the heat dissipation member , the first electrode is disposed on the heat dissipation member and is electrically connected to the light emitting diode , an area of a lower surface of the heat dissipation member is smaller than an area of a top surface of one second pad of the plurality of pads, said second pad being disposed at a centre region of the lower surface of the body , and is greater than the top surface area of the heat dissipation member, the buffer layer (L1,101,103,104) has a width wider than the width of the lower surface of the heat dissipation member , the buffer layer (L1,101,103,104) makes contact with the lower surface of the heat dissipation member and a top surface of the second pad of the plurality of pads which connects to the first electrode , and a top surface of the buffer layer (L1,101,103,104) is rougher than a lower surface of the buffer layer (L1,101,103,104). a body comprising a cavity with an opened topside, the body comprising a ceramic material; a heat dissipation member between a bottom surface of the cavity and a lower surface of the body ; a plurality of electrodes on the bottom surface of the cavity ; a plurality of pads disposed on the lower surface of the body and electrically connected to at least one of the electrodes ; a light emitting diode (LED) disposed on a first electrode of the electrodes disposed on the bottom surface of the cavity , the light emitting diode being electrically connected to the electrodes ; and a buffer layer (L1,101,103,104) disposed between the heat dissipation member and at least one of the pads and having a thickness thinner than a thickness of the heat dissipation member , wherein the body is formed of the ceramic material and is disposed around the heat dissipation member , the first electrode is disposed on the heat dissipation member and is electrically connected to the light emitting diode , an area of a lower surface of the heat dissipation member is smaller than an area of a top surface of one second pad of the plurality of pads, said second pad being disposed at a centre region of the lower surface of the body , and is greater than the top surface area of the heat dissipation member, the buffer layer (L1,101,103,104) has a width wider than the width of the lower surface of the heat dissipation member , the buffer layer (L1,101,103,104) makes contact with the lower surface of the heat dissipation member and a top surface of the second pad of the plurality of pads which connects to the first electrode , and a top surface of the buffer layer (L1,101,103,104) is rougher than a lower surface of the buffer layer (L1,101,103,104). <EOS>