A method for heating a pumpable composition comprising individually distinguishable edible inclusions comprising the steps of: a) providing a pumpable composition comprising from 2% to 7% (w/w) of starch, at least 20% (w/w) individually distinguishable edible inclusions, and optionally sugar or sugar substitute; b) applying a first ohmic heating treatment to the composition in a continuous ohmic heater, wherein the composition has at the end of the first ohmic heating treatment a temperature ranging from 60°C to 95°C; c) applying a first holding step to the composition in the absence of ohmic heating, wherein the temperature of the composition at the end of the first holding step is at most 5°C lower compared to the temperature of the composition at the end of the first ohmic heating treatment; d) applying a second ohmic heating treatment to the composition in a continuous ohmic heater, wherein the composition has at the end of the second ohmic heating treatment a temperature ranging from 75°C to 110°C and wherein the temperature of the composition at the end of the second ohmic heating treatment is at least 5°C higher compared to the temperature of the composition at the end of the first ohmic heating treatment; e) applying a second holding step to the composition in the absence of ohmic heating, wherein the temperature of the composition at the end of the second holding step is at most 5°C lower compared to the temperature of the composition at the end of the second ohmic heating treatment; f) optionally cooling the composition to a temperature ranging from 4°C to 45°C; and g) optionally packing the composition; wherein steps a) to e) are performed as a continuous process with an initial back pressure of at least 4 bar. a) providing a pumpable composition comprising from 2% to 7% (w/w) of starch, at least 20% (w/w) individually distinguishable edible inclusions, and optionally sugar or sugar substitute; b) applying a first ohmic heating treatment to the composition in a continuous ohmic heater, wherein the composition has at the end of the first ohmic heating treatment a temperature ranging from 60°C to 95°C; c) applying a first holding step to the composition in the absence of ohmic heating, wherein the temperature of the composition at the end of the first holding step is at most 5°C lower compared to the temperature of the composition at the end of the first ohmic heating treatment; d) applying a second ohmic heating treatment to the composition in a continuous ohmic heater, wherein the composition has at the end of the second ohmic heating treatment a temperature ranging from 75°C to 110°C and wherein the temperature of the composition at the end of the second ohmic heating treatment is at least 5°C higher compared to the temperature of the composition at the end of the first ohmic heating treatment; e) applying a second holding step to the composition in the absence of ohmic heating, wherein the temperature of the composition at the end of the second holding step is at most 5°C lower compared to the temperature of the composition at the end of the second ohmic heating treatment; f) optionally cooling the composition to a temperature ranging from 4°C to 45°C; and g) optionally packing the composition; <EOS>