An active energy ray curable composition comprising: a polymerizable compound composition comprising dicyclopentenyl acrylate, wherein, when the active energy ray curable composition is formed into a film having an average thickness of 10 μm on a substrate and, after a lapse of 15 seconds, the film is irradiated with an active energy ray having a light quantity of 1,500 mJ/cm 2 to become a cured product, the cured product satisfies the following conditions and : when the substrate is a polypropylene substrate, the cured product has a glass transition temperature of 60°C or more; and when the substrate is a polycarbonate substrate, an adhesion between the polycarbonate substrate and the cured product is 70 or more, the adhesion being measured according to a cross-cut adhesion test defined in Japanese Industrial Standards K5400, and wherein the polymerizable compound composition further includes: (i) a polymerizable compound (A) capable of dissolving the polycarbonate substrate, selected from the group consisting of tetrahydrofurfuryl acrylate, benzyl acrylate, cyclohexyl acrylate, acryloyl morpholine, diethylene glycol diacrylate, diethylene glycol dimethacrylate and 1,4-butanediol diacrylate; and (ii) a polyfunctional polymerizable compound (C) having at least two polymerizable ethylenic unsaturated double bonds a polymerizable compound composition comprising dicyclopentenyl acrylate, wherein, when the active energy ray curable composition is formed into a film having an average thickness of 10 μm on a substrate and, after a lapse of 15 seconds, the film is irradiated with an active energy ray having a light quantity of 1,500 mJ/cm 2 to become a cured product, the cured product satisfies the following conditions and : when the substrate is a polypropylene substrate, the cured product has a glass transition temperature of 60°C or more; and when the substrate is a polycarbonate substrate, an adhesion between the polycarbonate substrate and the cured product is 70 or more, the adhesion being measured according to a cross-cut adhesion test defined in Japanese Industrial Standards K5400, and wherein the polymerizable compound composition further includes: (i) a polymerizable compound (A) capable of dissolving the polycarbonate substrate, selected from the group consisting of tetrahydrofurfuryl acrylate, benzyl acrylate, cyclohexyl acrylate, acryloyl morpholine, diethylene glycol diacrylate, diethylene glycol dimethacrylate and 1,4-butanediol diacrylate; and (ii) a polyfunctional polymerizable compound (C) having at least two polymerizable ethylenic unsaturated double bonds when the substrate is a polypropylene substrate, the cured product has a glass transition temperature of 60°C or more; and when the substrate is a polycarbonate substrate, an adhesion between the polycarbonate substrate and the cured product is 70 or more, the adhesion being measured according to a cross-cut adhesion test defined in Japanese Industrial Standards K5400, and wherein the polymerizable compound composition further includes: (i) a polymerizable compound (A) capable of dissolving the polycarbonate substrate, selected from the group consisting of tetrahydrofurfuryl acrylate, benzyl acrylate, cyclohexyl acrylate, acryloyl morpholine, diethylene glycol diacrylate, diethylene glycol dimethacrylate and 1,4-butanediol diacrylate; and (ii) a polyfunctional polymerizable compound (C) having at least two polymerizable ethylenic unsaturated double bonds (i) a polymerizable compound (A) capable of dissolving the polycarbonate substrate, selected from the group consisting of tetrahydrofurfuryl acrylate, benzyl acrylate, cyclohexyl acrylate, acryloyl morpholine, diethylene glycol diacrylate, diethylene glycol dimethacrylate and 1,4-butanediol diacrylate; and (ii) a polyfunctional polymerizable compound (C) having at least two polymerizable ethylenic unsaturated double bonds <EOS>