An induction heating device, comprising: a case ; a working coil (WCA) disposed inside the case , the working coil comprising a conducting wire that is annularly wound; a base plate that is disposed vertically below the working coil (WCA), the base plate having an upper surface that supports the working coil (WCA); an indicator substrate support that is coupled to the case and that is disposed vertically below the base plate ; an indicator substrate that is disposed on an upper surface of the indicator substrate support , that is disposed vertically below the base plate , and that is spaced apart from the base plate , characterised by an inverter substrate (IV_PCB) disposed at a lower surface of the indicator substrate support , the inverter substrate (IV_PCB) comprising an inverter configured to apply a resonance current to the working coil (WCA) through a switching operation; and a resonance substrate (R_PCB) that is disposed at the lower surface of the indicator substrate support and that is connected to the working coil (WCA), the resonance substrate (R_PCB) comprising a resonance capacitor (RC) configured to generate the resonance current based on the switching operation of the inverter, wherein the base plate defines a plate hole at a position corresponding to an annular inner side of the working coil (WCA), the indicator substrate defines a substrate hole at a position corresponding to the plate hole , and the indicator substrate support defines a support hole at a position corresponding to the substrate hole , wherein the plate hole , the substrate hole , and the support hole are arranged along a height direction of the case , and wherein the working coil (WCA) comprises: a common terminal (WCT_C) connected to a connector; and an individual terminal (WCT_P) connected to the resonance capacitor (RC) through the plate hole , the substrate hole , and the support hole . a case ; a working coil (WCA) disposed inside the case , the working coil comprising a conducting wire that is annularly wound; a base plate that is disposed vertically below the working coil (WCA), the base plate having an upper surface that supports the working coil (WCA); an indicator substrate support that is coupled to the case and that is disposed vertically below the base plate ; an indicator substrate that is disposed on an upper surface of the indicator substrate support , that is disposed vertically below the base plate , and that is spaced apart from the base plate , characterised by an inverter substrate (IV_PCB) disposed at a lower surface of the indicator substrate support , the inverter substrate (IV_PCB) comprising an inverter configured to apply a resonance current to the working coil (WCA) through a switching operation; and a resonance substrate (R_PCB) that is disposed at the lower surface of the indicator substrate support and that is connected to the working coil (WCA), the resonance substrate (R_PCB) comprising a resonance capacitor (RC) configured to generate the resonance current based on the switching operation of the inverter, wherein the base plate defines a plate hole at a position corresponding to an annular inner side of the working coil (WCA), the indicator substrate defines a substrate hole at a position corresponding to the plate hole , and the indicator substrate support defines a support hole at a position corresponding to the substrate hole , wherein the plate hole , the substrate hole , and the support hole are arranged along a height direction of the case , and wherein the working coil (WCA) comprises: a common terminal (WCT_C) connected to a connector; and an individual terminal (WCT_P) connected to the resonance capacitor (RC) through the plate hole , the substrate hole , and the support hole . a common terminal (WCT_C) connected to a connector; and an individual terminal (WCT_P) connected to the resonance capacitor (RC) through the plate hole , the substrate hole , and the support hole . <EOS>