An electric device , wherein the electric device comprises: a first component carrier structure comprising a first magnet structure and a first connection structure ; a second component carrier structure comprising a second magnet structure and a second connection structure ; wherein the first component carrier structure comprises a stack comprising at least one electrically insulating layer structure and/or at least one electrically conductive layer structure ; wherein the second component carrier structure comprises a stack comprising at least one electrically insulating layer structure and/or at least one electrically conductive layer structure ; wherein the first magnet structure and the second magnet structure are configured for, upon attaching the first component carrier structure and the second component carrier structure to one another so that the first connection structure is connected to the second connection structure with direct physical contact to one another, holding the first component carrier structure and the second component carrier structure together by an attracting magnetic force between the first magnet structure and the second magnet structure ; wherein at least one of the first magnet structure and the second magnet structure is embedded in a respective cavity in a surface portion of the respective component carrier structure ; and wherein at least one of the first connection structure and the second connection structure are formed separately from, respectively, the first magnet structure and the second magnet structure , characterized in that at least one of the first component carrier structure and the second component carrier structure is configured as a printed circuit board comprising one or more surface mounted components . a first component carrier structure comprising a first magnet structure and a first connection structure ; a second component carrier structure comprising a second magnet structure and a second connection structure ; wherein the first component carrier structure comprises a stack comprising at least one electrically insulating layer structure and/or at least one electrically conductive layer structure ; wherein the second component carrier structure comprises a stack comprising at least one electrically insulating layer structure and/or at least one electrically conductive layer structure ; wherein the first magnet structure and the second magnet structure are configured for, upon attaching the first component carrier structure and the second component carrier structure to one another so that the first connection structure is connected to the second connection structure with direct physical contact to one another, holding the first component carrier structure and the second component carrier structure together by an attracting magnetic force between the first magnet structure and the second magnet structure ; wherein at least one of the first magnet structure and the second magnet structure is embedded in a respective cavity in a surface portion of the respective component carrier structure ; and wherein at least one of the first connection structure and the second connection structure are formed separately from, respectively, the first magnet structure and the second magnet structure , characterized in that at least one of the first component carrier structure and the second component carrier structure is configured as a printed circuit board comprising one or more surface mounted components . <EOS>