A printed circuit board assembly having a printed circuit board , said printed circuit board having a first side , a second side and a contact hole , a sleeve-type via being provided in the contact hole , an annular ring (35; 36) being associated with said sleeve-type via on at least one side (33; 34), said annular ring (35; 36) being disposed on the first side or on the second side of the printed circuit board and electrically connected to said sleeve-type via , said annular ring (35; 36) at least in sections comprising an annular ring edge , said printed circuit board module comprising a solder resist layer , the solder resist layer extending at least in sections from outside the annular ring edge over the annular ring edge to an outer region of the annular ring (35; 36), wherein an inner region , which is not covered by the solder resist layer , remains on the annular ring (35; 36), further comprising a component (12; 242) having a contact pin and a solder (51; 53), said contact pin being at least partially disposed in said sleeve-type via , and said solder (51; 53) being mechanically and electrically connected to the contact pin and to the inner region of the annular ring (35; 36). wherein a nickel-containing layer is applied to at least one annular ring (35; 36) and a gold-containing layer is applied to the nickel-containing layer, wherein the nickel-containing layer and the gold-containing layer extend at least in sections into the inner region and into the outer region , wherein a protective layer made of casting resin is provided on at least one side (21; 22) of the printed circuit board to ensure protection of the printed circuit board . said printed circuit board having a first side , a second side and a contact hole , a sleeve-type via being provided in the contact hole , an annular ring (35; 36) being associated with said sleeve-type via on at least one side (33; 34), said annular ring (35; 36) being disposed on the first side or on the second side of the printed circuit board and electrically connected to said sleeve-type via , said annular ring (35; 36) at least in sections comprising an annular ring edge , said printed circuit board module comprising a solder resist layer , the solder resist layer extending at least in sections from outside the annular ring edge over the annular ring edge to an outer region of the annular ring (35; 36), wherein an inner region , which is not covered by the solder resist layer , remains on the annular ring (35; 36), further comprising a component (12; 242) having a contact pin and a solder (51; 53), said contact pin being at least partially disposed in said sleeve-type via , and said solder (51; 53) being mechanically and electrically connected to the contact pin and to the inner region of the annular ring (35; 36). wherein a nickel-containing layer is applied to at least one annular ring (35; 36) and a gold-containing layer is applied to the nickel-containing layer, wherein the nickel-containing layer and the gold-containing layer extend at least in sections into the inner region and into the outer region , wherein a protective layer made of casting resin is provided on at least one side (21; 22) of the printed circuit board to ensure protection of the printed circuit board . <EOS>