The process for manufacturing an hybrid timepiece component, comprising the following steps: - providing a substrate , at least the upper surface of which is conductive; - forming a resist mold on top of the upper surface of the substrate , the mold comprising at least one material-free zone on top of the substrate ; - structuring at least one wafer of a first micromachinable material so as to form at least one through-opening within the wafer , said structured wafer being intended to form a first part of the hybrid timepiece component and depositing the at least one wafer on top of the resist mold formed in the preceding step or conversely positioning at least one wafer of a first micromachinable material on top of the resist mold formed in the preceding step and structuring the at least one wafer so as to form at least one through-opening of the at least one wafer , the at least one through-opening being at least partially superposed on a material-free zone of the resist mold formed in the preceding step; - forming a resist mold on top of the wafer , comprising material-free zones that extend from the upper surface of the substrate to the upper surface of the stack, in particular at a through-opening of the wafer ; - depositing a metal or an alloy by electroforming so that the metal extends through the through-opening and over the two upper and lower faces of the wafer from the upper surface of the substrate to the top of the wafer , so that the metal extends as a single piece resulting from one and the same electroforming step, the electroformed metal being intended to form a second part of the hybrid timepiece component; - releasing the hybrid timepiece component by the removal of the substrate ; - removing the resist molds before or after the removal of the substrate 10. - providing a substrate , at least the upper surface of which is conductive; - forming a resist mold on top of the upper surface of the substrate , the mold comprising at least one material-free zone on top of the substrate ; - structuring at least one wafer of a first micromachinable material so as to form at least one through-opening within the wafer , said structured wafer being intended to form a first part of the hybrid timepiece component and depositing the at least one wafer on top of the resist mold formed in the preceding step or conversely positioning at least one wafer of a first micromachinable material on top of the resist mold formed in the preceding step and structuring the at least one wafer so as to form at least one through-opening of the at least one wafer , the at least one through-opening being at least partially superposed on a material-free zone of the resist mold formed in the preceding step; - forming a resist mold on top of the wafer , comprising material-free zones that extend from the upper surface of the substrate to the upper surface of the stack, in particular at a through-opening of the wafer ; - depositing a metal or an alloy by electroforming so that the metal extends through the through-opening and over the two upper and lower faces of the wafer from the upper surface of the substrate to the top of the wafer , so that the metal extends as a single piece resulting from one and the same electroforming step, the electroformed metal being intended to form a second part of the hybrid timepiece component; - releasing the hybrid timepiece component by the removal of the substrate ; - removing the resist molds before or after the removal of the substrate 10. <EOS>