A cooling system for use in a vehicle with a power electronics assembly comprising an array of line-replaceable units , said cooling system comprising: a first manifold coupled in flow communication with the array of line-replaceable units ; and a fluid supply coupled in flow communication with said first manifold , said fluid supply configured to channel cooling fluid towards said first manifold such that the cooling fluid is discharged towards the line-replaceable units in the array substantially simultaneously; characterized by further comprising: a second manifold coupled in flow communication with the array of line-replaceable units , wherein said second manifold is configured to collect the cooling fluid discharged towards the line-replaceable units , the collected cooling fluid comprising a flow of vaporized cooling liquid and a flow of residual cooling fluid remaining in liquid form, the second manifold being configured to recycle the flow of residual liquid towards the fluid supply ; and a condenser coupled in flow communication with said second manifold via a return line which is configured to receive the flow of vaporized cooling fluid and channel it towards the condenser , wherein said condenser is configured to: receive the flow of vaporized cooling fluid from said second manifold through said return line , condense the vaporized cooling fluid and form condensed cooling fluid, and recycle the condensed cooling fluid towards the fluid supply . a first manifold coupled in flow communication with the array of line-replaceable units ; and a fluid supply coupled in flow communication with said first manifold , said fluid supply configured to channel cooling fluid towards said first manifold such that the cooling fluid is discharged towards the line-replaceable units in the array substantially simultaneously; characterized by further comprising: a second manifold coupled in flow communication with the array of line-replaceable units , wherein said second manifold is configured to collect the cooling fluid discharged towards the line-replaceable units , the collected cooling fluid comprising a flow of vaporized cooling liquid and a flow of residual cooling fluid remaining in liquid form, the second manifold being configured to recycle the flow of residual liquid towards the fluid supply ; and a condenser coupled in flow communication with said second manifold via a return line which is configured to receive the flow of vaporized cooling fluid and channel it towards the condenser , wherein said condenser is configured to: receive the flow of vaporized cooling fluid from said second manifold through said return line , condense the vaporized cooling fluid and form condensed cooling fluid, and recycle the condensed cooling fluid towards the fluid supply . a second manifold coupled in flow communication with the array of line-replaceable units , wherein said second manifold is configured to collect the cooling fluid discharged towards the line-replaceable units , the collected cooling fluid comprising a flow of vaporized cooling liquid and a flow of residual cooling fluid remaining in liquid form, the second manifold being configured to recycle the flow of residual liquid towards the fluid supply ; and a condenser coupled in flow communication with said second manifold via a return line which is configured to receive the flow of vaporized cooling fluid and channel it towards the condenser , wherein said condenser is configured to: receive the flow of vaporized cooling fluid from said second manifold through said return line , condense the vaporized cooling fluid and form condensed cooling fluid, and recycle the condensed cooling fluid towards the fluid supply . receive the flow of vaporized cooling fluid from said second manifold through said return line , condense the vaporized cooling fluid and form condensed cooling fluid, and recycle the condensed cooling fluid towards the fluid supply . <EOS>