A method for 3D inspection of packaged semiconductor devices, each packaged semiconductor device comprising a main body having a top surface, a bottom surface, and a plurality of sidewalls vertically extending between the top surface and the bottom surface of the device in a z-axis direction, the method comprising: capturing a 3D profile image of the device bottom surface and generating a corresponding bottom surface 3D profile image dataset while (a) the device top surface freely rests upon a first device seating surface and the device is not subjected to external compressive forces other than the force of gravity, or (b) the device top surface is held by a first suction tip by way of suction force and forcible compression of the top surface of the device against a first reference structure distinct from the first suction tip is avoided; capturing a 3D profile image of the device top surface and generating a corresponding top surface 3D profile image dataset while (c) the device bottom surface freely rests upon the first or a second device seating surface and the device is not subjected to external compressive forces other than the force of gravity, or (d) the device bottom surface is held by the first or a second suction tip by way of suction force and forcible compression of the bottom surface of the device against each of the first reference structure and a second reference structure distinct from the second suction tip is avoided; capturing a plurality of sidewall images of the device and generating a corresponding sidewall image dataset; and generating a 3D composite image dataset corresponding to a 3D digital reconstruction or estimation of the device based upon or using the bottom surface 3D profile image dataset, the top surface 3D profile image dataset, and the sidewall image dataset. capturing a 3D profile image of the device bottom surface and generating a corresponding bottom surface 3D profile image dataset while (a) the device top surface freely rests upon a first device seating surface and the device is not subjected to external compressive forces other than the force of gravity, or (b) the device top surface is held by a first suction tip by way of suction force and forcible compression of the top surface of the device against a first reference structure distinct from the first suction tip is avoided; capturing a 3D profile image of the device top surface and generating a corresponding top surface 3D profile image dataset while (c) the device bottom surface freely rests upon the first or a second device seating surface and the device is not subjected to external compressive forces other than the force of gravity, or (d) the device bottom surface is held by the first or a second suction tip by way of suction force and forcible compression of the bottom surface of the device against each of the first reference structure and a second reference structure distinct from the second suction tip is avoided; capturing a plurality of sidewall images of the device and generating a corresponding sidewall image dataset; and generating a 3D composite image dataset corresponding to a 3D digital reconstruction or estimation of the device based upon or using the bottom surface 3D profile image dataset, the top surface 3D profile image dataset, and the sidewall image dataset. <EOS>