An imaging apparatus comprising: an imaging optical system including at least one optical element ; a holding member holding the imaging optical system ; an image sensor configured to capture a subject image formed by the imaging optical system ; a substrate having the image sensor mounted thereon; a substrate portion including the image sensor and the substrate as one unit; and a bonding member fixing the substrate portion to the holding member , the bonding member being partly in contact with a surface of the substrate portion , and at at least two positions in a part of the surface of the substrate portion in contact with the bonding member , the surface of the substrate portion faces different directions, wherein the bonding member includes a first bonding member and a second bonding member different from the first bonding member , the first bonding member and the second bonding member are respectively in contact with a first contact portion and a second contact portion of the surface of the substrate portion , the second contact portion being different from the first contact portion, the first bonding member and the second bonding member are respectively in contact with a third contact portion and a fourth contact portion of the holding member , the fourth contact portion being different from the third contact portion, and a direction from the first contact portion to the third contact portion and a direction from the second contact portion to the fourth contact portion are different, characterized in that the first bonding member and the second bonding member differ from each other in a shrinkage ratio in curing or an elastic modulus after curing, the first bonding member has a lower shrinkage ratio or elastic modulus than the second bonding member , and a volume of the first bonding member between the first contact portion and the third contact portion is larger than a volume of the second bonding member between the second contact portion and the fourth contact portion. an imaging optical system including at least one optical element ; a holding member holding the imaging optical system ; an image sensor configured to capture a subject image formed by the imaging optical system ; a substrate having the image sensor mounted thereon; a substrate portion including the image sensor and the substrate as one unit; and a bonding member fixing the substrate portion to the holding member , the bonding member being partly in contact with a surface of the substrate portion , and at at least two positions in a part of the surface of the substrate portion in contact with the bonding member , the surface of the substrate portion faces different directions, wherein the bonding member includes a first bonding member and a second bonding member different from the first bonding member , the first bonding member and the second bonding member are respectively in contact with a first contact portion and a second contact portion of the surface of the substrate portion , the second contact portion being different from the first contact portion, the first bonding member and the second bonding member are respectively in contact with a third contact portion and a fourth contact portion of the holding member , the fourth contact portion being different from the third contact portion, and a direction from the first contact portion to the third contact portion and a direction from the second contact portion to the fourth contact portion are different, characterized in that the first bonding member and the second bonding member differ from each other in a shrinkage ratio in curing or an elastic modulus after curing, the first bonding member has a lower shrinkage ratio or elastic modulus than the second bonding member , and a volume of the first bonding member between the first contact portion and the third contact portion is larger than a volume of the second bonding member between the second contact portion and the fourth contact portion. <EOS>