A method of manufacturing a display apparatus , the method comprising: providing a substrate ; forming a display unit having an opening portion (OP) in a display region (DA) over the substrate ; forming a thin film encapsulation layer to seal the display unit , the thin film encapsulation layer comprising an organic film and an inorganic film ; forming a touch electrode over the thin film encapsulation layer ; forming a touch insulating film covering the touch electrode such that the thin film encapsulation layer and the touch insulating film are sequentially stacked and formed over the substrate in the opening portion (OP); forming a touch contact hole (TCH) by removing a portion of the touch insulating film to expose a portion of the touch electrode ; and during the forming of the touch contact hole (TCH), removing a portion of the touch insulating film and a portion of the inorganic film formed in the opening portion (OP) to expose a portion of the substrate , further comprising forming a hole (H) in the substrate by removing a portion of the exposed portion of the substrate , wherein a width of the hole (H) is less than a width of the removed portions of the inorganic film and the touch insulating film in the opening portion (OP), wherein the inorganic film has a larger area than the organic film , and, wherein the touch insulating film and the inorganic film contact each other at an edge of the organic film in the opening portion (OP), wherein removing the portion of the touch insulating film and the portion of the inorganic film comprises removing a portion of the touch insulating film and the inorganic film contacting each other at the edge of the organic film in the opening portion (OP) during the forming of the touch contact hole (TCH). providing a substrate ; forming a display unit having an opening portion (OP) in a display region (DA) over the substrate ; forming a thin film encapsulation layer to seal the display unit , the thin film encapsulation layer comprising an organic film and an inorganic film ; forming a touch electrode over the thin film encapsulation layer ; forming a touch insulating film covering the touch electrode such that the thin film encapsulation layer and the touch insulating film are sequentially stacked and formed over the substrate in the opening portion (OP); forming a touch contact hole (TCH) by removing a portion of the touch insulating film to expose a portion of the touch electrode ; and during the forming of the touch contact hole (TCH), removing a portion of the touch insulating film and a portion of the inorganic film formed in the opening portion (OP) to expose a portion of the substrate , further comprising forming a hole (H) in the substrate by removing a portion of the exposed portion of the substrate , wherein a width of the hole (H) is less than a width of the removed portions of the inorganic film and the touch insulating film in the opening portion (OP), wherein the inorganic film has a larger area than the organic film , and, wherein the touch insulating film and the inorganic film contact each other at an edge of the organic film in the opening portion (OP), wherein removing the portion of the touch insulating film and the portion of the inorganic film comprises removing a portion of the touch insulating film and the inorganic film contacting each other at the edge of the organic film in the opening portion (OP) during the forming of the touch contact hole (TCH). <EOS>