An imaging device , comprising a lens group ; and an integrated assembly forming a solid state image sensor for the imaging device , the integrated assembly comprising: a pixel array mounted in the integrated assembly; an optical assembly comprising one or more transparent materials mounted with the pixel array in the integrated assembly; and a light shield arranged to block light at a periphery of the integrated assembly, wherein a part of the light shield is disposed on at least one of the one or more transparent materials , the optical assembly comprises a glass substrate and an infrared filter formed directly on the glass substrate , the glass substrate is bonded by a transparent adhesive to an imaging surface of the pixel array without forming a cavity between the glass substrate and the pixel array , the light shield is formed on a periphery of the infrared filter such that in a direction of light incident on the pixel array first the light shield , second the infrared filter , and third the glass substrate is formed, the end portion of the light shield and an end portion of the solid state image sensor are lying on a same plane, and in the direction of light incidence first the lens group is formed and then the infrared filter is formed. a lens group ; and an integrated assembly forming a solid state image sensor for the imaging device , the integrated assembly comprising: a pixel array mounted in the integrated assembly; an optical assembly comprising one or more transparent materials mounted with the pixel array in the integrated assembly; and a light shield arranged to block light at a periphery of the integrated assembly, wherein a part of the light shield is disposed on at least one of the one or more transparent materials , the optical assembly comprises a glass substrate and an infrared filter formed directly on the glass substrate , the glass substrate is bonded by a transparent adhesive to an imaging surface of the pixel array without forming a cavity between the glass substrate and the pixel array , the light shield is formed on a periphery of the infrared filter such that in a direction of light incident on the pixel array first the light shield , second the infrared filter , and third the glass substrate is formed, the end portion of the light shield and an end portion of the solid state image sensor are lying on a same plane, and in the direction of light incidence first the lens group is formed and then the infrared filter is formed. a pixel array mounted in the integrated assembly; an optical assembly comprising one or more transparent materials mounted with the pixel array in the integrated assembly; and a light shield arranged to block light at a periphery of the integrated assembly, wherein a part of the light shield is disposed on at least one of the one or more transparent materials , the optical assembly comprises a glass substrate and an infrared filter formed directly on the glass substrate , the glass substrate is bonded by a transparent adhesive to an imaging surface of the pixel array without forming a cavity between the glass substrate and the pixel array , the light shield is formed on a periphery of the infrared filter such that in a direction of light incident on the pixel array first the light shield , second the infrared filter , and third the glass substrate is formed, the end portion of the light shield and an end portion of the solid state image sensor are lying on a same plane, and in the direction of light incidence first the lens group is formed and then the infrared filter is formed. <EOS>