Socket assembly comprising: a thermally conductive base frame for holding a light emitter package to a support structure, the light emitter package having a light emitter substrate with a light emitting element mounted thereto, wherein the base frame comprises a base that is configured to be mounted to the support structure and is further configured to mechanically engage the light emitter substrate of the light emitter package , so that the light emitter package is attachable to the support structure with a pre-determined holding force; at least one electrical contact element for electrically contacting said light emitter package ; and an isolator printed circuit board, PCB, comprising a plurality of electrically conductive leads, wherein the electrical contact element is arranged on the isolator PCB and configured to electrically connect the isolator PCB to the light emitter substrate , the isolator PCB being configured to be electrically connected to an electrical power supply for supplying electrical power to the light emitting element ; wherein the isolator PCB has a first surface and a second surface , the second surface being in heat transmitting contact with the base frame , such that the base frame is configured to absorb heat from the isolator PCB , and wherein the socket assembly further comprises at least one electronic component , which is arranged on said first surface of the isolator PCB and is electrically connectable to said light emitting element , wherein the socket assembly further comprises a cover that includes an opening that is configured to expose the light emitting element , the cover comprising a retention feature that cooperates with a retention member of the base frame to mechanically connect the cover to the base frame , wherein the retention member passes through the isolator PCB . a thermally conductive base frame for holding a light emitter package to a support structure, the light emitter package having a light emitter substrate with a light emitting element mounted thereto, wherein the base frame comprises a base that is configured to be mounted to the support structure and is further configured to mechanically engage the light emitter substrate of the light emitter package , so that the light emitter package is attachable to the support structure with a pre-determined holding force; at least one electrical contact element for electrically contacting said light emitter package ; and an isolator printed circuit board, PCB, comprising a plurality of electrically conductive leads, wherein the electrical contact element is arranged on the isolator PCB and configured to electrically connect the isolator PCB to the light emitter substrate , the isolator PCB being configured to be electrically connected to an electrical power supply for supplying electrical power to the light emitting element ; wherein the isolator PCB has a first surface and a second surface , the second surface being in heat transmitting contact with the base frame , such that the base frame is configured to absorb heat from the isolator PCB , and wherein the socket assembly further comprises at least one electronic component , which is arranged on said first surface of the isolator PCB and is electrically connectable to said light emitting element , wherein the socket assembly further comprises a cover that includes an opening that is configured to expose the light emitting element , the cover comprising a retention feature that cooperates with a retention member of the base frame to mechanically connect the cover to the base frame , wherein the retention member passes through the isolator PCB . <EOS>