An image pickup device comprising: a first structural body and a second structural body that are layered, the first structural body including a pixel array unit in which a pixel that performs photoelectric conversion is two-dimensionally arrayed, the second structural body being positioned below the first structural body , the second structural body including an input circuit unit that inputs a predetermined signal from an outside of the device, an output circuit unit that outputs a pixel signal output from the pixel to the outside of the device, and a signal processing circuit; an output unit and an input unit that are arranged below the pixel array unit of the first structural body , the output unit including the output circuit unit , a first through-via connected to the output circuit unit and penetrating through a semiconductor substrate constituting a part of the second structural body , and a signal output external terminal that connects the output circuit unit to the outside of the device via the first through-via, the input unit including the input circuit unit , a second through-via connected to the input circuit unit and penetrating through the semiconductor substrate, and a signal input external terminal that connects the input circuit unit to the outside of the device via the second through-via; a substrate connected to the signal output external terminal and the signal input external terminal ; a circuit board connected to a first surface of the substrate , the first surface facing a second surface of the substrate to which the signal output external terminal and the signal input external terminal are connected; characterized in that the image pickup device further comprises a glass substrate positioned above the first structural body ; and a lens barrel , wherein the lens barrel is placed on the glass substrate . a first structural body and a second structural body that are layered, the first structural body including a pixel array unit in which a pixel that performs photoelectric conversion is two-dimensionally arrayed, the second structural body being positioned below the first structural body , the second structural body including an input circuit unit that inputs a predetermined signal from an outside of the device, an output circuit unit that outputs a pixel signal output from the pixel to the outside of the device, and a signal processing circuit; an output unit and an input unit that are arranged below the pixel array unit of the first structural body , the output unit including the output circuit unit , a first through-via connected to the output circuit unit and penetrating through a semiconductor substrate constituting a part of the second structural body , and a signal output external terminal that connects the output circuit unit to the outside of the device via the first through-via, the input unit including the input circuit unit , a second through-via connected to the input circuit unit and penetrating through the semiconductor substrate, and a signal input external terminal that connects the input circuit unit to the outside of the device via the second through-via; a substrate connected to the signal output external terminal and the signal input external terminal ; a circuit board connected to a first surface of the substrate , the first surface facing a second surface of the substrate to which the signal output external terminal and the signal input external terminal are connected; characterized in that the image pickup device further comprises a glass substrate positioned above the first structural body ; and a lens barrel , wherein the lens barrel is placed on the glass substrate . <EOS>