mhurhangee/patent-ind-claim-en huggingface dataset:
An implant comprising a unitary body including an intramedullary portion connected to an extramedullary portion , the unitary body configured to attach a first bone section to a second bone section, wherein the intramedullary portion has a first longitudinal axis and is configured for insertion into the first bone section, the intramedullary portion including at least one first fastener aperture having an aperture axis oriented obliquely relative to the first longitudinal axis , wherein the extramedullary portion is configured to abut a surface of the second bone section and includes at least one second fastener aperture disposed to transversely receive a bone fastener inserted in the second bone section, the extramedullary portion having a second longitudinal axis offset from the first longitudinal axis , and wherein the extramedullary portion has a first side facing radially inward toward the first longitudinal axis and one second side facing radially outward from the first longitudinal axis , the second side having a concave surface adapted to engage a curved bone surface. wherein the intramedullary portion has a first longitudinal axis and is configured for insertion into the first bone section, the intramedullary portion including at least one first fastener aperture having an aperture axis oriented obliquely relative to the first longitudinal axis , wherein the extramedullary portion is configured to abut a surface of the second bone section and includes at least one second fastener aperture disposed to transversely receive a bone fastener inserted in the second bone section, the extramedullary portion having a second longitudinal axis offset from the first longitudinal axis , and wherein the extramedullary portion has a first side facing radially inward toward the first longitudinal axis and one second side facing radially outward from the first longitudinal axis , the second side having a concave surface adapted to engage a curved bone surface.
A method for manufacturing a light-absorbing substrate having a surface with depressions and projections, the method comprising: a first step of irradiating a substrate with a laser light (L) so as to form a plurality of modified regions arranged two-dimensionally along a surface of the substrate within the substrate and cause at least one of each modified region and a fracture generated from the modified region to reach the surface of the substrate ; and a second step of etching the surface of the substrate after the first step so as to form depressions and projections on the surface of the substrate , characterized in that in the first step, the substrate is irradiated with the laser light (L) a plurality of times while changing the distance between the surface of the substrate and a converging point (P) of the laser light (L) so as to form the respective modified regions . a first step of irradiating a substrate with a laser light (L) so as to form a plurality of modified regions arranged two-dimensionally along a surface of the substrate within the substrate and cause at least one of each modified region and a fracture generated from the modified region to reach the surface of the substrate ; and a second step of etching the surface of the substrate after the first step so as to form depressions and projections on the surface of the substrate , characterized in that in the first step, the substrate is irradiated with the laser light (L) a plurality of times while changing the distance between the surface of the substrate and a converging point (P) of the laser light (L) so as to form the respective modified regions .
An optoelectronic semiconductor chip, comprising a plurality of semiconductor function regions arranged on a common carrier layer , and a contact structure for making electrical contact with the optoelectronic semiconductor chip, wherein - semiconductor function regions comprise an active zone provided for radiation generation or for generation reception and based on a III-V-semiconductor material, - an insulation structure is arranged between the carrier layer and the contact structure and electrically insulates the contact structure from a counter-contact structure arranged on a side of the carrier layer opposite to the semiconductor function regions, - the semiconductor function regions are connected in a parallel or series-parallel connection during operation of the semiconductor chip, - at least one of the semiconductor function regions is a defect region , - the contact structure is electrically conductively connected to at least one of the semiconductor function regions, and - the contact structure is formed such that it can be electrically isolated or is electrically isolated from the defect region. - semiconductor function regions comprise an active zone provided for radiation generation or for generation reception and based on a III-V-semiconductor material, - an insulation structure is arranged between the carrier layer and the contact structure and electrically insulates the contact structure from a counter-contact structure arranged on a side of the carrier layer opposite to the semiconductor function regions, - the semiconductor function regions are connected in a parallel or series-parallel connection during operation of the semiconductor chip, - at least one of the semiconductor function regions is a defect region , - the contact structure is electrically conductively connected to at least one of the semiconductor function regions, and - the contact structure is formed such that it can be electrically isolated or is electrically isolated from the defect region.
Powder bed deposition additive manufacturing machine , this additive manufacturing machine comprising a working plane comprising a working zone allowing an overlay of different powder layers to be received, a powder dispensing device , a powder spreading device and a beam emitted by a source and making it possible to selectively fuse a layer of additive manufacturing powder spread over the working zone, the working zone being defined by a manufacturing sleeve and a manufacturing plate , the sleeve extending vertically under the working plane and emerging in the working plane , the manufacturing plate sliding vertically inside the manufacturing sleeve under the effect of an actuator such as a power cylinder, the powder dispensing device comprising a powder intake allowing powder to be delivered on top of the working plane, the powder dispensing device comprising a powder tank movably mounted above the working plane and that can be displaced to under the powder intake so as to be filled with powder, the bottom part of the tank comprising a powder dispensing point (P1), and the powder dispensing device comprising a control device controlling the flow of powder via the powder dispensing point during a displacement of the tank, the powder dispensing device allowing at least one bead of powder to be deposited on the working plane and the powder spreading device allowing a bead of powder deposited by the dispensing device to be spread over the working zone , the tank being mounted on a weighing sensor , the additive manufacturing machine is characterized in that , the spreading device taking the form of a scraper or of a roller mounted on a carriage , the tank is mounted to move by translation on the carriage of the powder spreading device , the carriage being mounted to move by translation in a longitudinal horizontal direction (DL) above the working plane and at least one working zone , and the tank being mounted to move by translation in the transverse direction (DT) on the carriage of the powder spreading device , the transversal direction (DT) being at right angles to the longitudinal direction (DL).
An electronic device comprising: an electronic component ; a resin molded body in which the electronic component is embedded and fixed; and a flexible substrate , the resin molded body supporting the flexible substrate , characterized in that : a part of the flexible substrate is embedded in the resin molded body , a surface of the resin molded body includes an exposed surface at which the electronic component is exposed, a surface of the flexible substrate includes a continuous surface flush with and continuous with the exposed surface , and the electronic device further comprises an interconnection (30a-c) formed on the exposed surface and on the continuous surface , wherein the interconnection (30a-c) is connected to the electronic component . an electronic component ; a resin molded body in which the electronic component is embedded and fixed; and a flexible substrate , the resin molded body supporting the flexible substrate , characterized in that : a part of the flexible substrate is embedded in the resin molded body , a surface of the resin molded body includes an exposed surface at which the electronic component is exposed, a surface of the flexible substrate includes a continuous surface flush with and continuous with the exposed surface , and the electronic device further comprises an interconnection (30a-c) formed on the exposed surface and on the continuous surface , wherein the interconnection (30a-c) is connected to the electronic component . a part of the flexible substrate is embedded in the resin molded body , a surface of the resin molded body includes an exposed surface at which the electronic component is exposed, a surface of the flexible substrate includes a continuous surface flush with and continuous with the exposed surface , and the electronic device further comprises an interconnection (30a-c) formed on the exposed surface and on the continuous surface , wherein the interconnection (30a-c) is connected to the electronic component .
An apparatus for measuring at least one of color and trash in a fiber sample , the apparatus comprising: a light emitting diode light source for generating an incident light that is directed toward the fiber sample , and reflected by the fiber sample , thereby producing a reflected light , a sensor for receiving the reflected light and producing a signal, and characterized by further comprising a controller for controlling the light source and the sensor , and at least one of receiving and adjusting the signal, and means (106a-106c) for conditioning at least one of the incident light , the reflected light and the signal to compensate for differences between measurements taken by the light emitting diode light source and a xenon light source. a light emitting diode light source for generating an incident light that is directed toward the fiber sample , and reflected by the fiber sample , thereby producing a reflected light , a sensor for receiving the reflected light and producing a signal, and characterized by further comprising a controller for controlling the light source and the sensor , and at least one of receiving and adjusting the signal, and means (106a-106c) for conditioning at least one of the incident light , the reflected light and the signal to compensate for differences between measurements taken by the light emitting diode light source and a xenon light source.
A process for directional solidification of a cast part comprising: energizing a primary induction coil within a chamber having a mold containing a material ; generating an electromagnetic field with the primary induction coil within the chamber , wherein said electromagnetic field partially leaks through a susceptor coupled to said chamber between said primary induction coil and said mold ; controlling a component of a magnetic flux leakage with a shield material coupled to the mold ; and casting the material within the mold ; characterised by further comprising a reservoir coupled to said mold , said reservoir configured to contain said shield material . energizing a primary induction coil within a chamber having a mold containing a material ; generating an electromagnetic field with the primary induction coil within the chamber , wherein said electromagnetic field partially leaks through a susceptor coupled to said chamber between said primary induction coil and said mold ; controlling a component of a magnetic flux leakage with a shield material coupled to the mold ; and casting the material within the mold ; characterised by further comprising a reservoir coupled to said mold , said reservoir configured to contain said shield material .
A colorimetric sensor, comprising: a first material deposited on a substrate; and a layer of sensing particles on a surface of the first material, wherein the sensing particles comprise sensing species dispersed into porous host structures, such that at least a portion of the sensing particles is exposed to an ambient environment, wherein the first material attaches the sensing particles to the substrate. a first material deposited on a substrate; and a layer of sensing particles on a surface of the first material, wherein the sensing particles comprise sensing species dispersed into porous host structures, such that at least a portion of the sensing particles is exposed to an ambient environment, wherein the first material attaches the sensing particles to the substrate.
Infrared heater having at least one infrared emitter that is arranged in a housing , wherein the housing has a front plate , characterised in that at least three infrared emitters are provided, wherein a first infrared emitter is oriented parallel to the front plate and a second and a third infrared emitter are oriented at a slant relative to the front plate , wherein the infrared emitters have a planar emission surface and emit the major portion of the infrared radiation that occurs in the direction of the front plate .
An adhesive composition comprising: a (meth)acrylate-based resin; and a polymer having a melting temperature (Tm) of 53°C or higher and 58°C or less as measured using a differential scanning calorimetry (DSC), wherein the polymer is a copolymer of a monofunctional polysiloxane and one type of monomer, wherein the polymer having a melting temperature of 53°C or higher and 58°C or less comprises, based on 100 parts by weight of the polymer having a melting temperature of 53°C or higher and 58°C or less, the monofunctional polysiloxane in greater than or equal to 10 parts by weight and less than or equal to 40 parts by weight, and the monomer in greater than or equal to 60 parts by weight and less than or equal to 90 parts by weight, and wherein the monomer is represented by the following Chemical Formula 1: in Chemical Formula 1, X is N or O; R1 is hydrogen or a methyl group; and n is an integer of 10 to 30. a (meth)acrylate-based resin; and a polymer having a melting temperature (Tm) of 53°C or higher and 58°C or less as measured using a differential scanning calorimetry (DSC), wherein the polymer is a copolymer of a monofunctional polysiloxane and one type of monomer, wherein the polymer having a melting temperature of 53°C or higher and 58°C or less comprises, based on 100 parts by weight of the polymer having a melting temperature of 53°C or higher and 58°C or less, the monofunctional polysiloxane in greater than or equal to 10 parts by weight and less than or equal to 40 parts by weight, and the monomer in greater than or equal to 60 parts by weight and less than or equal to 90 parts by weight, and wherein the monomer is represented by the following Chemical Formula 1: in Chemical Formula 1, X is N or O; R1 is hydrogen or a methyl group; and n is an integer of 10 to 30.
Process for the manufacturing of a diene, preferably a conjugated diene, more preferably 1,3-butadiene, comprising the dehydration of at least one alkenol in the presence of at least one catalytic material comprising at least one silica (SiO 2 ) and alumina (Al 2 O 3 ) based acid catalyst, preferably a silica-alumina (SiO 2 -Al 2 O 3 ), said catalyst having a content of alumina lower than or equal to 12% by weight, preferably ranging from from 0,1% by weight to 10% by weight, referred to the total weight of the catalyst; wherein: (a) said acid catalyst based on silica (SiO 2 ) and alumina (Al 2 O 3 ) is obtained by means of incipient wetness impregnation wherein the volume of a solution of a metal, such as aluminium, having an appropriate concentration is equal to or slightly lower than that of the pore volume of a solid support, e.g. silica ; or (b) said catalytic material comprises at least one binder selected from alumina (Al 2 O 3 ), silica (SiO 2 ), zirconium oxide, titanium oxide, preferably from silica (SiO 2 ) or alumina (Al 2 O 3 ), even more preferably alumina (Al 2 O 3 ). (a) said acid catalyst based on silica (SiO 2 ) and alumina (Al 2 O 3 ) is obtained by means of incipient wetness impregnation wherein the volume of a solution of a metal, such as aluminium, having an appropriate concentration is equal to or slightly lower than that of the pore volume of a solid support, e.g. silica ; or (b) said catalytic material comprises at least one binder selected from alumina (Al 2 O 3 ), silica (SiO 2 ), zirconium oxide, titanium oxide, preferably from silica (SiO 2 ) or alumina (Al 2 O 3 ), even more preferably alumina (Al 2 O 3 ).
A sulfonate-based compound represented by the following Formula 1: in Formula 1, A1 to A4 are F, R1 is hydrogen, L is S, Z1 to Z4 are each independently the same as or different from each other, and are each independently a halogen group, R2 is one of the elements of Group 1 of the periodic table, n is an integer of 0 or more, m is an integer of 0 or more, p is an integer of 1 or more, and {(n × p) + (m × p)} is an integer of 3 to 10. A1 to A4 are F, R1 is hydrogen, L is S, Z1 to Z4 are each independently the same as or different from each other, and are each independently a halogen group, R2 is one of the elements of Group 1 of the periodic table, n is an integer of 0 or more, m is an integer of 0 or more, p is an integer of 1 or more, and {(n × p) + (m × p)} is an integer of 3 to 10.
An exit assist method executed using an exit assist controller configured to control a subject vehicle to move from an exit start position to a target exit position along an exit route, the exit assist method comprising: determining whether or not an adjacent parked vehicle is present in an adjacent parking space to the exit start position; and when the adjacent parked vehicle is present, setting the target exit position in accordance with an existence/nonexistence of the adjacent parked vehicle in a direction of right and left side of the subject vehicle , characterized in that the target exit position, when the adjacent parked vehicle is present, is set further in accordance with whether a driveway on which the target exit position is set is a right-side traffic or a left-side traffic and a direction of an exit whether the subject vehicle exits forward or backward. determining whether or not an adjacent parked vehicle is present in an adjacent parking space to the exit start position; and when the adjacent parked vehicle is present, setting the target exit position in accordance with an existence/nonexistence of the adjacent parked vehicle in a direction of right and left side of the subject vehicle , characterized in that the target exit position, when the adjacent parked vehicle is present, is set further in accordance with whether a driveway on which the target exit position is set is a right-side traffic or a left-side traffic and a direction of an exit whether the subject vehicle exits forward or backward.
A veterinary drug composition for use in controlling heartworm infestation in a non-human animal subject, wherein said composition is in the form of a collar, and wherein said composition is administered topically at least twice a year up to around once a year to said non-human animal subject and comprises an amount of 0.45 % by weight of ivermectin, relative to the total weight of the composition.
Treatment unit comprising: - a clarifier tank configured to contain waste water, and provided with a bottom portion in which a through aperture is made; - an accumulation container disposed below said tank and connected to said through aperture , said accumulation container being configured to receive and contain the solid portion decanted from said waste water coming from said tank , and provided with a discharge aperture to allow the discharge of said solid portion; - a first closing device associated with said through aperture of said tank and configured to selectively separate said tank from said accumulation container ; and - a second closing device associated with the discharge aperture of said accumulation container and configured to allow the selective discharge of said solid portion, wherein said discharge aperture has a cross section size equal to, or greater than, the maximum cross section size of said accumulation container , wherein said accumulation container defines an accumulation compartment , for said solid portion, characterized in that said accumulation compartment has a conical cross section shape with a taper that opens toward said discharge aperture , and in that said discharge aperture is made in correspondence with the bottom of said accumulation container . - a clarifier tank configured to contain waste water, and provided with a bottom portion in which a through aperture is made; - an accumulation container disposed below said tank and connected to said through aperture , said accumulation container being configured to receive and contain the solid portion decanted from said waste water coming from said tank , and provided with a discharge aperture to allow the discharge of said solid portion; - a first closing device associated with said through aperture of said tank and configured to selectively separate said tank from said accumulation container ; and - a second closing device associated with the discharge aperture of said accumulation container and configured to allow the selective discharge of said solid portion, wherein said discharge aperture has a cross section size equal to, or greater than, the maximum cross section size of said accumulation container , wherein said accumulation container defines an accumulation compartment , for said solid portion, characterized in that said accumulation compartment has a conical cross section shape with a taper that opens toward said discharge aperture , and in that said discharge aperture is made in correspondence with the bottom of said accumulation container .
A polypeptide comprising 16 repeats of a sequence set forth in SEQ ID No. 1, the repeats of the sequence are directly linked, wherein the polypeptide does not comprise a sequence set forth in SEQ ID No. 2.
An uplink transmission method, comprising: sending (S301), by a network device, first scheduling information to a first terminal and a second terminal, wherein the first scheduling information comprises indication information of a sidelink transmission parameter and indication information of a first uplink transmission parameter, the sidelink transmission parameter is used by the first terminal to send first data to the second terminal, and the first uplink transmission parameter is used by the second terminal to send the first data to the network device; and receiving (S303), by the network device, the first data from the second terminal. sending (S301), by a network device, first scheduling information to a first terminal and a second terminal, wherein the first scheduling information comprises indication information of a sidelink transmission parameter and indication information of a first uplink transmission parameter, the sidelink transmission parameter is used by the first terminal to send first data to the second terminal, and the first uplink transmission parameter is used by the second terminal to send the first data to the network device; and receiving (S303), by the network device, the first data from the second terminal.