SMD-enabled thermopile infrared sensor for contactless temperature measurement, as a hotspot or for gesture detection, having at least one miniaturized thermopile pixel on a monolithically integrated sensor chip arranged in a hermetically sealed housing consisting of an at least partially non-metallic housing substrate and a housing lid , with a gas or gas mixture being located in the housing and with an aperture opening having been introduced into the housing lid opposite the at least one thermopile pixel , the said aperture opening being closed-off using a focusing lens which focuses the radiation of objects onto the at least one thermopile pixel on the housing substrate , the housing substrate consisting of a ceramic material provided with a cutout with a central plane base plate and side walls for accommodating the sensor chip , the housing lid having angled side edges that support themselves in a hermetically sealed fashion on the side walls of the housing substrate , the housing lid in the region of the focusing lens having either, on the inner side, an arching with a shape based on the outer shape of the focusing lens or an indentation adjoining an elevation of the housing lid , in either case for fixing the focusing lens in its position above the at least one thermopile pixel , a multiplicity of metallic connections in the form of conductor tracks being applied to the housing substrate from the top side to the bottom side, the metallic connections ending in internal contact pads on the top side of the housing substrate and in contact faces for a surface mount on the bottom side of the housing substrate , and a monolithic signal processing unit , together with measuring devices for voltage and temperature references and an interface for communication with external electronics of a mobile apparatus, being integrated in the same sensor chip next to the at least one thermopile pixel ; and with the entire housing height of housing substrate and housing lid being no more than 3 mm. the housing substrate consisting of a ceramic material provided with a cutout with a central plane base plate and side walls for accommodating the sensor chip , the housing lid having angled side edges that support themselves in a hermetically sealed fashion on the side walls of the housing substrate , the housing lid in the region of the focusing lens having either, on the inner side, an arching with a shape based on the outer shape of the focusing lens or an indentation adjoining an elevation of the housing lid , in either case for fixing the focusing lens in its position above the at least one thermopile pixel , a multiplicity of metallic connections in the form of conductor tracks being applied to the housing substrate from the top side to the bottom side, the metallic connections ending in internal contact pads on the top side of the housing substrate and in contact faces for a surface mount on the bottom side of the housing substrate , and a monolithic signal processing unit , together with measuring devices for voltage and temperature references and an interface for communication with external electronics of a mobile apparatus, being integrated in the same sensor chip next to the at least one thermopile pixel ; and with the entire housing height of housing substrate and housing lid being no more than 3 mm. <EOS>