Electronics module , comprising: a printed circuit board , a first component , which is arranged on a component side of the printed circuit board and electrically contact-connected thereto, a contact element , which has a first surface and a second surface averted from the first surface and which, by way of the first surface , is arranged on the printed circuit board and electrically contact-connected thereto, a protective compound , which is arranged on the component side of the printed circuit board and which encapsulates the first component , wherein the contact element is partially embedded in the protective compound in such a way that lateral flanks of the contact element are at least partially circumferentially covered by the protective compound and the second surface of the contact element protrudes from the protective compound such that it is exposed, a second component , which is fastened to the contact element and is electrically connected to the printed circuit board via this second component, wherein the second component has at least one electrical connection conductor , which is embedded in a plastics sheathing and has a connection portion which is oriented parallel to the second surface of the contact element and is electrically connected to the contact element , wherein the second surface of the contact element rests flat against the connection portion or against a contact body connected to the connection portion , characterized in that the plastics sheathing of the second component has a first cutout on its side facing the printed circuit board , through which cutout the connection portion or the contact body of the second component connected to the connection portion is accessible, and in that the plastics sheathing of the second component has a second cutout on its side averted from the printed circuit board , through which cutout the connection portion or the contact body of the second component connected to the connection portion is accessible. a printed circuit board , a first component , which is arranged on a component side of the printed circuit board and electrically contact-connected thereto, a contact element , which has a first surface and a second surface averted from the first surface and which, by way of the first surface , is arranged on the printed circuit board and electrically contact-connected thereto, a protective compound , which is arranged on the component side of the printed circuit board and which encapsulates the first component , wherein the contact element is partially embedded in the protective compound in such a way that lateral flanks of the contact element are at least partially circumferentially covered by the protective compound and the second surface of the contact element protrudes from the protective compound such that it is exposed, a second component , which is fastened to the contact element and is electrically connected to the printed circuit board via this second component, wherein the second component has at least one electrical connection conductor , which is embedded in a plastics sheathing and has a connection portion which is oriented parallel to the second surface of the contact element and is electrically connected to the contact element , wherein the second surface of the contact element rests flat against the connection portion or against a contact body connected to the connection portion , characterized in that the plastics sheathing of the second component has a first cutout on its side facing the printed circuit board , through which cutout the connection portion or the contact body of the second component connected to the connection portion is accessible, and in that the plastics sheathing of the second component has a second cutout on its side averted from the printed circuit board , through which cutout the connection portion or the contact body of the second component connected to the connection portion is accessible. <EOS>