An information page of a security document including an information portion and a connecting portion for attachment to the security document , said information page comprising: a core layer having a net-like structure and flexibility, said core layer having a body portion and a connecting portion , an intermediate layer ; an IC module holding layer provided on a first surface of the body portion of the core layer via the intermediate layer ; an IC module housed in an IC module housing space of the IC module holding layer , characterized in that the connecting portion of the information page is constituted solely of the connecting portion of the core layer and in that the IC module includes a substrate , and an IC chip provided on the substrate , and the information page comprising an additional intermediate layer ; wherein: the first surface of the body portion of the core layer is bonded to a first surface of the intermediate layer ; a first surface of the IC module holding layer is bonded to a second surface of the intermediate layer ; a second surface of the IC module holding layer is bonded to the additional intermediate layer ; the IC module housing space is surrounded by the intermediate layer , the IC module holding layer and the additional intermediate layer ; and wherein the intermediate layer , the additional intermediate layer and the IC module holding layer are made of polycarbonate. a core layer having a net-like structure and flexibility, said core layer having a body portion and a connecting portion , an intermediate layer ; an IC module holding layer provided on a first surface of the body portion of the core layer via the intermediate layer ; an IC module housed in an IC module housing space of the IC module holding layer , characterized in that the connecting portion of the information page is constituted solely of the connecting portion of the core layer and in that the IC module includes a substrate , and an IC chip provided on the substrate , and the information page comprising an additional intermediate layer ; wherein: the first surface of the body portion of the core layer is bonded to a first surface of the intermediate layer ; a first surface of the IC module holding layer is bonded to a second surface of the intermediate layer ; a second surface of the IC module holding layer is bonded to the additional intermediate layer ; the IC module housing space is surrounded by the intermediate layer , the IC module holding layer and the additional intermediate layer ; and wherein the intermediate layer , the additional intermediate layer and the IC module holding layer are made of polycarbonate. the first surface of the body portion of the core layer is bonded to a first surface of the intermediate layer ; a first surface of the IC module holding layer is bonded to a second surface of the intermediate layer ; a second surface of the IC module holding layer is bonded to the additional intermediate layer ; the IC module housing space is surrounded by the intermediate layer , the IC module holding layer and the additional intermediate layer ; and wherein the intermediate layer , the additional intermediate layer and the IC module holding layer are made of polycarbonate. <EOS>