An active compression device , comprising: a controller assembly , wherein the controller assembly includes processing circuitry configured to receive a selection of a predetermined compression profile, and actuate one or more shape memory wires integrated into the active compression device to apply a predetermined pattern of compressions corresponding to the selected predetermined compression profile in response to receiving the selection of the hold compression profile; and wherein the processing circuitry is further configured to provide a predetermined amount of power to a first shape memory wire for a first predetermined amount of time, turn off the first shape memory wire for a second predetermined amount of time when the first predetermined amount of time ends, provide the predetermined amount of power to a second shape memory wire for the first predetermined amount of time when the second predetermined time ends, and turn off the second shape memory wire for the second predetermined amount of time when the first predetermined amount of time ends, the processing circuitry being further configured to receive a heat setting selection, set the second predetermine time to allow the first and second wires in the controller assembly to fully cool in response to the heat setting selection being a low heat setting, and set the second predetermined time to be less than the time to allow the first and second wires in the controller assembly to fully cool in response to the heat setting selection being a high heat setting, characterised in that , the compression profile is a push and hold compression profile and the first predetermined amount of time and the second predetermined amount of time are determined based on the push and hold compression profile and the heat setting selection. a controller assembly , wherein the controller assembly includes processing circuitry configured to receive a selection of a predetermined compression profile, and actuate one or more shape memory wires integrated into the active compression device to apply a predetermined pattern of compressions corresponding to the selected predetermined compression profile in response to receiving the selection of the hold compression profile; and wherein the processing circuitry is further configured to provide a predetermined amount of power to a first shape memory wire for a first predetermined amount of time, turn off the first shape memory wire for a second predetermined amount of time when the first predetermined amount of time ends, provide the predetermined amount of power to a second shape memory wire for the first predetermined amount of time when the second predetermined time ends, and turn off the second shape memory wire for the second predetermined amount of time when the first predetermined amount of time ends, the processing circuitry being further configured to receive a heat setting selection, set the second predetermine time to allow the first and second wires in the controller assembly to fully cool in response to the heat setting selection being a low heat setting, and set the second predetermined time to be less than the time to allow the first and second wires in the controller assembly to fully cool in response to the heat setting selection being a high heat setting, the compression profile is a push and hold compression profile and the first predetermined amount of time and the second predetermined amount of time are determined based on the push and hold compression profile and the heat setting selection. <EOS>