An IC chip mounting apparatus , comprising: an ejection unit configured to eject an adhesive toward a reference position (Pref) of each antenna (AN) of an antenna continuous body (AS), the antenna continuous body (AS) having a base material and plural inlay antennas (AN) continuously formed on the base material; a nozzle movable between a first position (PA) and a second position (PK), the nozzle being configured to suck an IC chip (C), when located at the first position (PA), and to place the IC chip (C) on the adhesive at the reference position (Pref) of each antenna (AN), when located at the second position (PK); an image acquisition unit (CA3) configured to acquire an image of the nozzle when the nozzle is located at a position between the first position (PA) and the second position (PK); a determination unit configured to determine whether an IC chip (C) is sucked by the nozzle while the nozzle is moved from the first position (PA) to the second position (PK), based on the image acquired by the image acquisition unit (CA3); a moving machine configured to move the nozzle away from the second position (PK) when it is determined by the determination unit that an IC chip (C) is not sucked by the nozzle ; a conveyor configured to convey the antenna continuous body (AS) on a conveying surface; a nozzle attachment to which the nozzle is attached; and a rotating unit (M31) configured to rotate the nozzle attachment , such that the nozzle moves, on a surface orthogonal to the conveying surface, along a circular track, and a moving direction of the nozzle at the second position (PK) matches a conveying direction (D1) of the antenna continuous body (AS), characterized in that the moving machine is configured to move the nozzle attachment in a width direction (D2) of the antenna continuous body (AS), when it is determined by the determination unit that an IC chip (C) is not sucked by the nozzle . an ejection unit configured to eject an adhesive toward a reference position (Pref) of each antenna (AN) of an antenna continuous body (AS), the antenna continuous body (AS) having a base material and plural inlay antennas (AN) continuously formed on the base material; a nozzle movable between a first position (PA) and a second position (PK), the nozzle being configured to suck an IC chip (C), when located at the first position (PA), and to place the IC chip (C) on the adhesive at the reference position (Pref) of each antenna (AN), when located at the second position (PK); an image acquisition unit (CA3) configured to acquire an image of the nozzle when the nozzle is located at a position between the first position (PA) and the second position (PK); a determination unit configured to determine whether an IC chip (C) is sucked by the nozzle while the nozzle is moved from the first position (PA) to the second position (PK), based on the image acquired by the image acquisition unit (CA3); a moving machine configured to move the nozzle away from the second position (PK) when it is determined by the determination unit that an IC chip (C) is not sucked by the nozzle ; a conveyor configured to convey the antenna continuous body (AS) on a conveying surface; a nozzle attachment to which the nozzle is attached; and a rotating unit (M31) configured to rotate the nozzle attachment , such that the nozzle moves, on a surface orthogonal to the conveying surface, along a circular track, and a moving direction of the nozzle at the second position (PK) matches a conveying direction (D1) of the antenna continuous body (AS), characterized in that the moving machine is configured to move the nozzle attachment in a width direction (D2) of the antenna continuous body (AS), when it is determined by the determination unit that an IC chip (C) is not sucked by the nozzle . <EOS>