A surface coating film for integral molding with a fiber impregnated resin, the film comprising: a base material film B; and an easily adhesive layer A provided on the base material film B, the base material film B including an easily molded layer b1 adjacent to the easily adhesive layer A and a flat layer b2, wherein the easily adhesive layer A has a thickness of 30 nm to 250 nm, wherein the thickness of the easily adhesive layer A is calculated from an image and scale, the image being obtained by preparing a sample in which the surface coating film according to the present invention is embedded with an epoxy resin; producing an ultrathin section by using a microtome after the sample is cured at normal temperature for one day; and observing a cross section of the ultrathin section with a TEM (transmission electron microscope); the base material film B has a thickness of 50 μm to 500 μm; and the easily molded layer b1 and the flat layer b2 satisfy each of the following formula 1 and formula 2: 3 ≤ ratio (EHb2/EHb1) of storage modulus EHb2 of the flat layer b2 at 150°C to storage modulus EHb1 of the easily molded layer b1 at 150°C 1000 MPa ≤ storage modulus ELb1 of the easily molded layer b1 at 23°C wherein the storage modulus ELb1 of the easily molded layer b1 was measured at 23°C and a frequency of 1Hz using a dynamic viscoelasticity measurement device while pulling the easily molded layer b1 in the MD direction with a tension jig, wherein the storage modulus EHb1 of the easily molded layer b1 was measured in the same manner as the measurement of the storage modulus ELb1, except that a measurement temperature was 150°C, and wherein the storage modulus EHb2 of the easily molded layer b1 was measured in the same manner as the measurement of the storage modulus EHb1, except that the flat layer b2 was used instead of the easily molded layer b1. a base material film B; and an easily adhesive layer A provided on the base material film B, the base material film B including an easily molded layer b1 adjacent to the easily adhesive layer A and a flat layer b2, wherein an easily molded layer b1 adjacent to the easily adhesive layer A and a flat layer b2, wherein the easily adhesive layer A has a thickness of 30 nm to 250 nm, wherein the thickness of the easily adhesive layer A is calculated from an image and scale, the image being obtained by preparing a sample in which the surface coating film according to the present invention is embedded with an epoxy resin; producing an ultrathin section by using a microtome after the sample is cured at normal temperature for one day; and observing a cross section of the ultrathin section with a TEM (transmission electron microscope); the base material film B has a thickness of 50 μm to 500 μm; and the easily molded layer b1 and the flat layer b2 satisfy each of the following formula 1 and formula 2: 3 ≤ ratio (EHb2/EHb1) of storage modulus EHb2 of the flat layer b2 at 150°C to storage modulus EHb1 of the easily molded layer b1 at 150°C 1000 MPa ≤ storage modulus ELb1 of the easily molded layer b1 at 23°C wherein the storage modulus ELb1 of the easily molded layer b1 was measured at 23°C and a frequency of 1Hz using a dynamic viscoelasticity measurement device while pulling the easily molded layer b1 in the MD direction with a tension jig, wherein the storage modulus EHb1 of the easily molded layer b1 was measured in the same manner as the measurement of the storage modulus ELb1, except that a measurement temperature was 150°C, and wherein the storage modulus EHb2 of the easily molded layer b1 was measured in the same manner as the measurement of the storage modulus EHb1, except that the flat layer b2 was used instead of the easily molded layer b1. <EOS>