A heat dissipation apparatus , wherein the heat dissipation apparatus comprises a heat dissipation substrate , a heat dissipation component , and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate , and the heat dissipation fins are configured to dissipate heat on the heat dissipation substrate ; a first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate , there is a gap between a side surface of the heat dissipation component and the heat dissipation substrate , a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, the first side is disposed opposite to the second side, the first surface is disposed opposite to the second surface on the heat dissipation component ; and an area that is on the second side of the heat dissipation substrate and in which the heat dissipation component is not disposed is used to be attached to another to-be-heat-dissipated component, heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component, characterized in that a vacuum cavity (Q) is disposed in the heat dissipation component , working substance (W) is disposed in the vacuum cavity (Q), a volume of the working substance (W) is less than a volume of the vacuum cavity (Q), and the working substance (W) is used to dissipate heat for a to-be-heat-dissipated component; wherein the heat dissipation apparatus further comprises a protective housing fastened on the heat dissipation substrate , the protective housing covers the plurality of heat dissipation fins , anc another amount of the working substance (W) is disposed in a gap between the plurality of heat dissipation fins . a first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate , there is a gap between a side surface of the heat dissipation component and the heat dissipation substrate , a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, the first side is disposed opposite to the second side, the first surface is disposed opposite to the second surface on the heat dissipation component ; and an area that is on the second side of the heat dissipation substrate and in which the heat dissipation component is not disposed is used to be attached to another to-be-heat-dissipated component, heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component, characterized in that a vacuum cavity (Q) is disposed in the heat dissipation component , working substance (W) is disposed in the vacuum cavity (Q), a volume of the working substance (W) is less than a volume of the vacuum cavity (Q), and the working substance (W) is used to dissipate heat for a to-be-heat-dissipated component; wherein the heat dissipation apparatus further comprises a protective housing fastened on the heat dissipation substrate , the protective housing covers the plurality of heat dissipation fins , anc another amount of the working substance (W) is disposed in a gap between the plurality of heat dissipation fins . <EOS>