An electronic device substrate , comprising: a base substrate ; an organic encapsulation layer being on the base substrate and comprising a main part and an edge part ; and a padding structure being provided on the base substrate and protruding from the base substrate , wherein the edge part of the organic encapsulation layer at least partially covers the padding structure ; and a part that is comprised by the padding structure and is away from the main part of the organic encapsulation layer has a height with respect to the base substrate greater than a height of another part that is comprised by the padding structure and is close to the main part of the organic encapsulation layer with respect to the base substrate ; characterized in that the electronic device substrate comprises an operation region (D1) and a non-operation region (D2); the main part of the organic encapsulation layer is in the operation region (D1); and the edge part of the organic encapsulation layer is in the non-operation region (D2); in the direction perpendicular to the base substrate and in the arrangement direction from the operation region (D1) to the non-operation region (D2), the sectional structure of the padding structure comprises a wedge structure; as a part of the wedge structure is closer to the organic encapsulation layer , a height of the part of the wedge structure is smaller; and the slope angle (β) of an inclined surface of the padding structure is equal to the included angle (α) between an upper surface of the edge part of the organic encapsulation layer and a material that is on the base substrate and supports a lower surface of the edge part of the organic encapsulation layer . a base substrate ; an organic encapsulation layer being on the base substrate and comprising a main part and an edge part ; and a padding structure being provided on the base substrate and protruding from the base substrate , wherein the edge part of the organic encapsulation layer at least partially covers the padding structure ; and a part that is comprised by the padding structure and is away from the main part of the organic encapsulation layer has a height with respect to the base substrate greater than a height of another part that is comprised by the padding structure and is close to the main part of the organic encapsulation layer with respect to the base substrate ; characterized in that the electronic device substrate comprises an operation region (D1) and a non-operation region (D2); the main part of the organic encapsulation layer is in the operation region (D1); and the edge part of the organic encapsulation layer is in the non-operation region (D2); in the direction perpendicular to the base substrate and in the arrangement direction from the operation region (D1) to the non-operation region (D2), the sectional structure of the padding structure comprises a wedge structure; as a part of the wedge structure is closer to the organic encapsulation layer , a height of the part of the wedge structure is smaller; and the slope angle (β) of an inclined surface of the padding structure is equal to the included angle (α) between an upper surface of the edge part of the organic encapsulation layer and a material that is on the base substrate and supports a lower surface of the edge part of the organic encapsulation layer . <EOS>