A superconducting coil , comprising: a first pancake coil and a second pancake coil that are formed by winding a superconducting wire, are stacked in a thickness direction, and are adjacent to each other; a cooling substrate that is provided in contact with an end surface of the first pancake coil , the cooling substrate being interposed between the first pancake coil and the second pancake coil , the cooling substrate being formed of a plurality of cooling plates , the cooling plates overlapping each other, the cooling plates being separable from each other, a bonding element that bonds the first pancake coil and one of the cooling plates to each other, and a bonding element that bonds the second pancake coil and one of the cooling plates to each other, wherein an upper cooling plate of the superconducting coil is disposed on an uppermost surface of the first pancake coil , one of the cooling plates of the cooling substrate is disposed on a lowermost surface of the first pancake coil , one of the cooling plates of the cooling substrate is disposed on an uppermost surface of the second pancake coil , a lower cooling plate of the superconducting coil is disposed on a lowermost surface of the second pancake coil , each of the cooling plates of the cooling substrate is a plate formed of a metal material, the cooling plates of the cooling substrate are stacked such that the cooling plates of the cooling substrate surface-wide contact with each other, and the first pancake coil and the second pancake coil are separable from each other by separation between the cooling plates of the cooling substrate . a first pancake coil and a second pancake coil that are formed by winding a superconducting wire, are stacked in a thickness direction, and are adjacent to each other; a cooling substrate that is provided in contact with an end surface of the first pancake coil , the cooling substrate being interposed between the first pancake coil and the second pancake coil , the cooling substrate being formed of a plurality of cooling plates , the cooling plates overlapping each other, the cooling plates being separable from each other, a bonding element that bonds the first pancake coil and one of the cooling plates to each other, and a bonding element that bonds the second pancake coil and one of the cooling plates to each other, wherein an upper cooling plate of the superconducting coil is disposed on an uppermost surface of the first pancake coil , one of the cooling plates of the cooling substrate is disposed on a lowermost surface of the first pancake coil , one of the cooling plates of the cooling substrate is disposed on an uppermost surface of the second pancake coil , a lower cooling plate of the superconducting coil is disposed on a lowermost surface of the second pancake coil , each of the cooling plates of the cooling substrate is a plate formed of a metal material, the cooling plates of the cooling substrate are stacked such that the cooling plates of the cooling substrate surface-wide contact with each other, and the first pancake coil and the second pancake coil are separable from each other by separation between the cooling plates of the cooling substrate . <EOS>