Method for fabricating at least one three-dimensional solid-state layer , in particular for use as wafer, and/or at least one three-dimensional solid-state body comprising the following steps: providing a workpiece for detaching the at least one solid-state layer and/or the at least one solid-state body , wherein the workpiece has a first planar surface portion and a second planar surface portion , wherein the first planar surface portion is aligned substantially or exactly parallel to the second planar surface portion , wherein the workpiece has at least one exposed surface, wherein the exposed surface is formed by the second planar surface portion, producing defects by means of laser beams of a laser within the workpiece , wherein the laser beams penetrate into the solid-state body via the second planar surface portion , wherein the defects predefine at least one crack guiding layer , wherein the crack guiding layer describes at least one three-dimensional contour, attaching or producing a receiving layer at the exposed surface of the workpiece to form a composite structure, regulating the temperature of the receiving layer in order to produce stresses within the workpiece , wherein the stresses cause crack propagation within the workpiece , wherein, as a result of the crack propagation, a three-dimensional solid-state layer or a three-dimensional solid-state body is separated from the workpiece along the crack guiding layer , wherein a surface of the solid-state layer or of the solid-state body corresponds to the three-dimensional contour of the crack guiding layer , wherein the shape of the crack guiding layer has, at least in sections, the contour of a three-dimensionally predetermined object resulting from a mathematically determinable shaped body, in particular of a lens or of a parallelepiped. providing a workpiece for detaching the at least one solid-state layer and/or the at least one solid-state body , wherein the workpiece has a first planar surface portion and a second planar surface portion , wherein the first planar surface portion is aligned substantially or exactly parallel to the second planar surface portion , wherein the workpiece has at least one exposed surface, wherein the exposed surface is formed by the second planar surface portion, producing defects by means of laser beams of a laser within the workpiece , wherein the laser beams penetrate into the solid-state body via the second planar surface portion , wherein the defects predefine at least one crack guiding layer , wherein the crack guiding layer describes at least one three-dimensional contour, attaching or producing a receiving layer at the exposed surface of the workpiece to form a composite structure, regulating the temperature of the receiving layer in order to produce stresses within the workpiece , wherein the stresses cause crack propagation within the workpiece , wherein, as a result of the crack propagation, a three-dimensional solid-state layer or a three-dimensional solid-state body is separated from the workpiece along the crack guiding layer , wherein a surface of the solid-state layer or of the solid-state body corresponds to the three-dimensional contour of the crack guiding layer , wherein the shape of the crack guiding layer has, at least in sections, the contour of a three-dimensionally predetermined object resulting from a mathematically determinable shaped body, in particular of a lens or of a parallelepiped. <EOS>