A board work machine comprising: a cutting device provided with (A) a fixed section in which is formed a first through-hole and (B) a movable section configured to slide with respect to the fixed section and in which is formed a second through-hole configured to overlap the first through-hole in the vertical direction in a state that virtually matches, the cutting device being configured to cut a lead of a leaded component by the lead being inserted into the first through-hole and the second through-hole that are in an overlapping state and the movable section being slid; a moving device configured to move the cutting device ; and a recognition device configured to recognize a position of an upper through-hole that is an upper-positioned through-hole of the first through-hole and the second through-hole that are in the overlapping state, based on image data of one of the fixed section in the vertical direction in a state that virtually matches and the movable section in which the uppermost through-hole is formed, wherein an internal surface of the upper through-hole is a tapered surface configured with a diameter that gets smaller going down, characterized in that: a recognition mark for recognizing the position of the upper through-hole is formed on the one of the fixed section and the movable section in which the upper through-hole is formed, and the recognition device is configured to recognize the position of the upper through-hole based on image data of the recognition mark . a cutting device provided with (A) a fixed section in which is formed a first through-hole and (B) a movable section configured to slide with respect to the fixed section and in which is formed a second through-hole configured to overlap the first through-hole in the vertical direction in a state that virtually matches, the cutting device being configured to cut a lead of a leaded component by the lead being inserted into the first through-hole and the second through-hole that are in an overlapping state and the movable section being slid; a moving device configured to move the cutting device ; and a recognition device configured to recognize a position of an upper through-hole that is an upper-positioned through-hole of the first through-hole and the second through-hole that are in the overlapping state, based on image data of one of the fixed section in the vertical direction in a state that virtually matches and the movable section in which the uppermost through-hole is formed, wherein an internal surface of the upper through-hole is a tapered surface configured with a diameter that gets smaller going down, characterized in that: a recognition mark for recognizing the position of the upper through-hole is formed on the one of the fixed section and the movable section in which the upper through-hole is formed, and the recognition device is configured to recognize the position of the upper through-hole based on image data of the recognition mark . a recognition mark for recognizing the position of the upper through-hole is formed on the one of the fixed section and the movable section in which the upper through-hole is formed, and the recognition device is configured to recognize the position of the upper through-hole based on image data of the recognition mark . <EOS>