A method for manufacturing an electronic component comprising providing a reaction curable silicone gel (L2) having a loss tangent tanδ at 23°C to 100°C in a range from 0.01 to 1.00 measured according to the description and formed from a curable silicone composition comprising a mixture of a linear organopolysiloxane having at least two curing reactive groups in the molecule and a resinous or branched organopolysiloxane having at least two curing reactive groups in the molecule; an organohydrogenpolysiloxane having two or more Si-H bonds in the molecule, and a curing agent; said method further comprising steps (I) to (IV) below: Step (I): Creating a laminate of an electronic component (L1-E), the reaction-curable silicone gel, and a sheet-like member having a silicone-based adhesive layer, Step (II): Subjecting the electronic component (L1-E) to one or more types of chemical or physical processing after step (I), Step (III): Curing the reaction-curable silicone gel after step (II) thereby providing a cured product which conjoins with the sheet-like member of the laminate to form a conjoined product, and Step (IV): Separating the sheet-like member and the cured product of the reaction-curable silicone gel (conjoined product) substantially simultaneously from the electronic component (L1-E) after step (III). providing a reaction curable silicone gel (L2) having a loss tangent tanδ at 23°C to 100°C in a range from 0.01 to 1.00 measured according to the description and formed from a curable silicone composition comprising a mixture of a linear organopolysiloxane having at least two curing reactive groups in the molecule and a resinous or branched organopolysiloxane having at least two curing reactive groups in the molecule; an organohydrogenpolysiloxane having two or more Si-H bonds in the molecule, and a curing agent; said method further comprising steps (I) to (IV) below: Step (I): Creating a laminate of an electronic component (L1-E), the reaction-curable silicone gel, and a sheet-like member having a silicone-based adhesive layer, Step (II): Subjecting the electronic component (L1-E) to one or more types of chemical or physical processing after step (I), Step (III): Curing the reaction-curable silicone gel after step (II) thereby providing a cured product which conjoins with the sheet-like member of the laminate to form a conjoined product, and Step (IV): Separating the sheet-like member and the cured product of the reaction-curable silicone gel (conjoined product) substantially simultaneously from the electronic component (L1-E) after step (III). Step (I): Creating a laminate of an electronic component (L1-E), the reaction-curable silicone gel, and a sheet-like member having a silicone-based adhesive layer, Step (II): Subjecting the electronic component (L1-E) to one or more types of chemical or physical processing after step (I), Step (III): Curing the reaction-curable silicone gel after step (II) thereby providing a cured product which conjoins with the sheet-like member of the laminate to form a conjoined product, and Step (IV): Separating the sheet-like member and the cured product of the reaction-curable silicone gel (conjoined product) substantially simultaneously from the electronic component (L1-E) after step (III). <EOS>