An electronic device, wherein the electronic device comprises: a housing ; a first electronic element ; a second electronic element ; and a buffer component , wherein the buffer component is connected to the housing , the first electronic element is located on a side that is of the buffer component and that is away from the housing , and the second electronic element is located on a side that is of the housing and that is away from the buffer component , wherein a recess is disposed in the buffer component , and at least a part of a front projection of the second electronic element in a thickness direction of the electronic device falls within a front projection of the recess in the thickness direction of the electronic device; wherein the recess comprises a first recess , the first recess is located on a side that is of the buffer component and that faces the second electronic element , and the recess is recessed away from the second electronic element ; wherein the housing is a middle frame of the electronic device; the buffer component is located between the first electronic element and the housing ; the housing is located between the buffer component and the second electronic element ; the recess is a groove structure, wherein a bottom of the groove is not penetrated; and in the thickness direction of the electronic device, a depth of the recess is m, and a thickness of the buffer component is n, wherein 0 < m < n, wherein the recess further comprises a second recess , and the second recess is located on a side that is of the buffer component and that is away from the second electronic element and faces the first electronic element , wherein the recess is recessed away from the first electronic element . a housing ; a first electronic element ; a second electronic element ; and a buffer component , wherein the buffer component is connected to the housing , the first electronic element is located on a side that is of the buffer component and that is away from the housing , and the second electronic element is located on a side that is of the housing and that is away from the buffer component , wherein a recess is disposed in the buffer component , and at least a part of a front projection of the second electronic element in a thickness direction of the electronic device falls within a front projection of the recess in the thickness direction of the electronic device; wherein the recess comprises a first recess , the first recess is located on a side that is of the buffer component and that faces the second electronic element , and the recess is recessed away from the second electronic element ; wherein the housing is a middle frame of the electronic device; the buffer component is located between the first electronic element and the housing ; the housing is located between the buffer component and the second electronic element ; the recess is a groove structure, wherein a bottom of the groove is not penetrated; and in the thickness direction of the electronic device, a depth of the recess is m, and a thickness of the buffer component is n, wherein 0 < m < n, wherein the recess further comprises a second recess , and the second recess is located on a side that is of the buffer component and that is away from the second electronic element and faces the first electronic element , wherein the recess is recessed away from the first electronic element . <EOS>