An electronic device comprising: an insulative substrate ; a first conductor layer and a second conductor layer provided on the insulative substrate ; an electronic element provided on the second conductor layer ; a first terminal connected to the first conductor layer ; a connector that electrically connects a front surface of the electronic element and the first conductor layer ; a sealing part that seals the first conductor layer , the second conductor layer , the electronic element and the connector inside, characterized in that the connector has a head part connected to the front surface of the electronic element via a conductive adhesive and a proximal end part connected to the first conductor layer via a conductive adhesive , the head part has a second projection part protruding toward a side of an electronic element from a facing surface facing the front surface of the electronic element , and a first projection part protruding from the second projection part toward the side of the electronic element , in a state where the first projection part comes into point contact with the front surface of the electronic element , and the conductive adhesive is bonded to the second projection part and is bonded to the facing surface of the head part around the second projection part , the head part is connected to the front surface of the electronic element , the proximal end part has a plurality of protrusion parts protruding from a facing surface facing the first conductor layer to a side of the first conductor layer , and the proximal end part is connected to the first conductor layer in a state where the plurality of the protrusion parts are in contact with the first conductor layer and the conductive adhesive is bonded to the facing surface of the proximal end part . an insulative substrate ; a first conductor layer and a second conductor layer provided on the insulative substrate ; an electronic element provided on the second conductor layer ; a first terminal connected to the first conductor layer ; a connector that electrically connects a front surface of the electronic element and the first conductor layer ; a sealing part that seals the first conductor layer , the second conductor layer , the electronic element and the connector inside, characterized in that the connector has a head part connected to the front surface of the electronic element via a conductive adhesive and a proximal end part connected to the first conductor layer via a conductive adhesive , the head part has a second projection part protruding toward a side of an electronic element from a facing surface facing the front surface of the electronic element , and a first projection part protruding from the second projection part toward the side of the electronic element , in a state where the first projection part comes into point contact with the front surface of the electronic element , and the conductive adhesive is bonded to the second projection part and is bonded to the facing surface of the head part around the second projection part , the head part is connected to the front surface of the electronic element , the proximal end part has a plurality of protrusion parts protruding from a facing surface facing the first conductor layer to a side of the first conductor layer , and the proximal end part is connected to the first conductor layer in a state where the plurality of the protrusion parts are in contact with the first conductor layer and the conductive adhesive is bonded to the facing surface of the proximal end part . <EOS>