A semiconductor device comprising: a substrate (B); a semiconductor element (S) that is mounted on the substrate (B) a lead terminal (L2) that is connected to a conductor layer (D2) on the substrate (B) via a conductive bonding material (H2); a connector (X) that is connected to a control electrode (TG) of the semiconductor element (S) and the conductor layer (D2) on the substrate (B) via conductive bonding materials (HG, HX); and a sealing portion that seals the substrate (B), the semiconductor element (S), and the connector (X), characterized in that the (X) includes: a reference portion (Xc) a first inclined portion (Xb) that is inclined downward from one end of the reference portion; a bent portion (Xa) that is connected to the first inclined portion (Xb) and bent so as to project downward; and a second inclined portion (Xe) that is inclined downward from the other end of the reference portion, and wherein the connector (X) is connected to the control electrode (TG) via a conductive bonding material (HG) in a state where a lower end of the bent portion is in contact with the surface of the control electrode (TG); electrode, and furthermore, the connector (X) is connected to the conductor layer (D2) via a conductive bonding material (HX) in a state where a tip of the second inclined portion (Xf) is in contact with the surface of the conductor layer (D2) on the substrate (B). a substrate (B); a semiconductor element (S) that is mounted on the substrate (B) a lead terminal (L2) that is connected to a conductor layer (D2) on the substrate (B) via a conductive bonding material (H2); a connector (X) that is connected to a control electrode (TG) of the semiconductor element (S) and the conductor layer (D2) on the substrate (B) via conductive bonding materials (HG, HX); and a sealing portion that seals the substrate (B), the semiconductor element (S), and the connector (X), characterized in that the (X) includes: a reference portion (Xc) a first inclined portion (Xb) that is inclined downward from one end of the reference portion; a bent portion (Xa) that is connected to the first inclined portion (Xb) and bent so as to project downward; and a second inclined portion (Xe) that is inclined downward from the other end of the reference portion, and wherein the connector (X) is connected to the control electrode (TG) via a conductive bonding material (HG) in a state where a lower end of the bent portion is in contact with the surface of the control electrode (TG); electrode, and furthermore, the connector (X) is connected to the conductor layer (D2) via a conductive bonding material (HX) in a state where a tip of the second inclined portion (Xf) is in contact with the surface of the conductor layer (D2) on the substrate (B). a reference portion (Xc) a first inclined portion (Xb) that is inclined downward from one end of the reference portion; a bent portion (Xa) that is connected to the first inclined portion (Xb) and bent so as to project downward; and a second inclined portion (Xe) that is inclined downward from the other end of the reference portion, and wherein the connector (X) is connected to the control electrode (TG) via a conductive bonding material (HG) in a state where a lower end of the bent portion is in contact with the surface of the control electrode (TG); electrode, and furthermore, the connector (X) is connected to the conductor layer (D2) via a conductive bonding material (HX) in a state where a tip of the second inclined portion (Xf) is in contact with the surface of the conductor layer (D2) on the substrate (B). <EOS>