A polyorganosiloxane release coating composition comprising: (A) a polydiorganosiloxane of unit formula: (R 1 2 R 2 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 1 R 3 SiO 2/2 ) c (R 3 2 SiO 2/2 ) d , where each R 1 is an independently selected alkyl group of 1 to 18 carbon atoms, each R 2 is an independently selected alkenyl group of 2 to 18 carbon atoms, each R 3 is an independently selected aryl group of 5 to 20 carbon atoms, subscript a has an average value of 2, subscript b > 0, subscript c ≥ 0, subscript d ≥ 0 with the proviso that a quantity (c + d) > 0, and a quantity (a + b + c + d) is sufficient to give the polydiorganosiloxane a number average molecular weight ≥ 3,000 g/mol; (B) a polyorganosilicate resin having silicon bonded alkenyl groups, (C) a polyalkylhydrogensiloxane, having at least two silicon-bonded hydrogen atoms per a molecule, where the polyalkylhydrogensiloxane is present in an amount sufficient to provide 0.8 mole to 5 moles of silicon-bonded hydrogen atoms per mole of alkenyl groups in starting materials (A) and (B); (D) a hydrosilylation reaction catalyst in a catalytic amount; (E) a hydrosilylation reaction inhibitor, in an amount of 0.001 part by weight to 2 parts by weight, per 100 parts by weight of starting materials (A) and (B); (F) an anchorage additive, selected from the group consisting of (F-1) vinyltriacetoxysilane, (F-2) glycidoxypropyltrimethoxysilane, (F-3) a combination of (F-1) and (F-2), (F-4) a combination of (F-3) and a polydimethylsiloxane terminated with hydroxyl groups, methoxy groups, or terminated with both a hydroxy group and a methoxy group, and (F-5) 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, in an amount of 0.01 part by weight to 10 parts by weight per 100 parts by weight of starting materials (A) and (B); and optionally (G) a solvent; where the composition is free of polydiorganosiloxanes that do not have silicon bonded aryl groups, other than starting material (A). (A) a polydiorganosiloxane of unit formula: (R 1 2 R 2 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 1 R 3 SiO 2/2 ) c (R 3 2 SiO 2/2 ) d , where each R 1 is an independently selected alkyl group of 1 to 18 carbon atoms, each R 2 is an independently selected alkenyl group of 2 to 18 carbon atoms, each R 3 is an independently selected aryl group of 5 to 20 carbon atoms, subscript a has an average value of 2, subscript b > 0, subscript c ≥ 0, subscript d ≥ 0 with the proviso that a quantity (c + d) > 0, and a quantity (a + b + c + d) is sufficient to give the polydiorganosiloxane a number average molecular weight ≥ 3,000 g/mol; (B) a polyorganosilicate resin having silicon bonded alkenyl groups, (C) a polyalkylhydrogensiloxane, having at least two silicon-bonded hydrogen atoms per a molecule, where the polyalkylhydrogensiloxane is present in an amount sufficient to provide 0.8 mole to 5 moles of silicon-bonded hydrogen atoms per mole of alkenyl groups in starting materials (A) and (B); (D) a hydrosilylation reaction catalyst in a catalytic amount; (E) a hydrosilylation reaction inhibitor, in an amount of 0.001 part by weight to 2 parts by weight, per 100 parts by weight of starting materials (A) and (B); (F) an anchorage additive, selected from the group consisting of (F-1) vinyltriacetoxysilane, (F-2) glycidoxypropyltrimethoxysilane, (F-3) a combination of (F-1) and (F-2), (F-4) a combination of (F-3) and a polydimethylsiloxane terminated with hydroxyl groups, methoxy groups, or terminated with both a hydroxy group and a methoxy group, and (F-5) 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, in an amount of 0.01 part by weight to 10 parts by weight per 100 parts by weight of starting materials (A) and (B); and optionally (G) a solvent; where the composition is free of polydiorganosiloxanes that do not have silicon bonded aryl groups, other than starting material (A). <EOS>