A stencil printer for printing viscous materials on electronic substrates , the stencil printer comprising: - a frame ; - an electronic substrate support coupled to the frame , the electronic substrate support being configured to support an electronic substrate and move the electronic substrate between a lowered position and a raised position; - a stencil shuttle assembly coupled to the frame , the stencil shuttle assembly being configured to support a stencil and to move the stencil in an x-axis direction between a first position in which the stencil is positioned toward a front of the stencil printer and a second position in which the stencil is positioned toward a back of the stencil printer , the stencil shuttle assembly further being configured to move the stencil in a y-axis direction to align the stencil ; - a print head coupled to the frame , the print head being configured to engage the stencil to dispense a material onto the substrate during a print stroke; and - a wiper to remove material from the stencil as the stencil is translated away from the substrate by the stencil shuttle assembly , wherein the stencil shuttle assembly , when the stencil is translated away from the substrate , is configured to move the stencil in the y-axis direction, characterized in that the stencil shuttle assembly is configured to move the stencil in the y-axis direction in an oscillating manner, wherein the stencil shuttle assembly includes a staging frame configured to receive and secure the stencil thereto, and a stencil shuttle coupled to the frame and to the staging frame to move the staging frame and the stencil , wherein the stencil shuttle assembly further includes a first actuator configured to move the staging frame with respect to the stencil shuttle in a first direction, a second actuator configured to move the staging frame with respect to the stencil shuttle in a second direction, the second direction being generally perpendicular to the first direction, and a third actuator configured to move the staging frame with respect to the stencil shuttle in the first direction, the first, second and third actuators being configured to align the stencil and configured to move the stencil in the y-axis direction when translating the stencil , and wherein the first, second and third actuators are energized individually or in a synchronized manner to generate a dual action wiping motion, which increases relative motion between wiper paper of the stencil wiper and a bottom surface of the stencil . - a frame ; - an electronic substrate support coupled to the frame , the electronic substrate support being configured to support an electronic substrate and move the electronic substrate between a lowered position and a raised position; - a stencil shuttle assembly coupled to the frame , the stencil shuttle assembly being configured to support a stencil and to move the stencil in an x-axis direction between a first position in which the stencil is positioned toward a front of the stencil printer and a second position in which the stencil is positioned toward a back of the stencil printer , the stencil shuttle assembly further being configured to move the stencil in a y-axis direction to align the stencil ; - a print head coupled to the frame , the print head being configured to engage the stencil to dispense a material onto the substrate during a print stroke; and - a wiper to remove material from the stencil as the stencil is translated away from the substrate by the stencil shuttle assembly , <EOS>