A film formation device (1A; 1B) for forming a metal film, comprising at least: a positive electrode ; a solid electrolyte membrane formed on a surface of the positive electrode , the solid electrolyte membrane configured to be disposed between the positive electrode and a substrate (B) to serve as a negative electrode; and a power supply unit adapted to apply a voltage across the positive electrode and the substrate (B), to deposit metal on a surface of the substrate (B) from metal ions contained in the solid electrolyte membrane , so that a metal film made of the metal is formed, wherein the positive electrode is made of a porous body configured to allow a solution containing the metal ions to pass therethrough and to supply the metal ions to the solid electrolyte membrane , and the film formation device for forming a metal film is characterized by further comprising a pressure unit adapted to move the positive electrode toward the substrate (B), thereby pressing the solid electrolyte membrane against the substrate on which a film is to be formed, characterized in that the film formation device (1A; 1B) further comprises a conducting portion that is formed in a manner surrounding a film formation region (E) of the substrate (B) during formation of the film, the conducting portion being adapted to electrically connect a negative electrode of the power supply unit and the substrate (B), wherein the solid electrolyte membrane has a shape that conforms to a shape of the film formation region (E) of the substrate (B), an insulator is further disposed on the positive electrode in a manner surrounding the solid electrolyte membrane , and the conducting portion includes a plurality of conducting protrusions that are disposed on the insulator in a manner protruding toward the substrate (B) from a surface of the insulator . a positive electrode ; a solid electrolyte membrane formed on a surface of the positive electrode , the solid electrolyte membrane configured to be disposed between the positive electrode and a substrate (B) to serve as a negative electrode; and a power supply unit adapted to apply a voltage across the positive electrode and the substrate (B), to deposit metal on a surface of the substrate (B) from metal ions contained in the solid electrolyte membrane , so that a metal film made of the metal is formed, wherein the positive electrode is made of a porous body configured to allow a solution containing the metal ions to pass therethrough and to supply the metal ions to the solid electrolyte membrane , and the film formation device for forming a metal film is characterized by further comprising a pressure unit adapted to move the positive electrode toward the substrate (B), thereby pressing the solid electrolyte membrane against the substrate on which a film is to be formed, characterized in that the film formation device (1A; 1B) further comprises a conducting portion that is formed in a manner surrounding a film formation region (E) of the substrate (B) during formation of the film, the conducting portion being adapted to electrically connect a negative electrode of the power supply unit and the substrate (B), wherein the solid electrolyte membrane has a shape that conforms to a shape of the film formation region (E) of the substrate (B), an insulator is further disposed on the positive electrode in a manner surrounding the solid electrolyte membrane , and the conducting portion includes a plurality of conducting protrusions that are disposed on the insulator in a manner protruding toward the substrate (B) from a surface of the insulator . <EOS>