A method for additive manufacturing comprising: • at a build tray arranged over a build window and containing a resin reservoir of a resin, heating the resin reservoir toward a target bulk resin temperature less than a heat deflection temperature of the resin in a photocured state, the target bulk resin temperature corresponding to a target viscosity of the resin in a liquid state (S110); • at a build chamber containing a gaseous environment and encompassing the build tray and the build window , heating the gaseous environment toward a target chamber temperature less than the heat deflection temperature of the resin in the photocured state (S120); • at a resin interface between a surface of the build window and the resin reservoir, heating an interface layer of the resin reservoir toward a target reaction temperature, the target reaction temperature corresponding to a target crosslinking density of the resin in the photocured state (S130); and • for a first build cycle, in response to the resin reservoir exhibiting a first temperature proximal the target bulk resin temperature, in response to the gaseous environment exhibiting a second temperature proximal the target chamber temperature, and in response to the interface layer exhibiting a third temperature proximal the target reaction temperature: ∘ at the resin interface, selectively photocuring a first volume of the resin reservoir to form a first layer of a build adhered to a build platform (S140); and ∘ retracting the build platform from the build window (S150). • at a build tray arranged over a build window and containing a resin reservoir of a resin, heating the resin reservoir toward a target bulk resin temperature less than a heat deflection temperature of the resin in a photocured state, the target bulk resin temperature corresponding to a target viscosity of the resin in a liquid state (S110); • at a build chamber containing a gaseous environment and encompassing the build tray and the build window , heating the gaseous environment toward a target chamber temperature less than the heat deflection temperature of the resin in the photocured state (S120); • at a resin interface between a surface of the build window and the resin reservoir, heating an interface layer of the resin reservoir toward a target reaction temperature, the target reaction temperature corresponding to a target crosslinking density of the resin in the photocured state (S130); and • for a first build cycle, in response to the resin reservoir exhibiting a first temperature proximal the target bulk resin temperature, in response to the gaseous environment exhibiting a second temperature proximal the target chamber temperature, and in response to the interface layer exhibiting a third temperature proximal the target reaction temperature: ∘ at the resin interface, selectively photocuring a first volume of the resin reservoir to form a first layer of a build adhered to a build platform (S140); and ∘ retracting the build platform from the build window (S150). ∘ at the resin interface, selectively photocuring a first volume of the resin reservoir to form a first layer of a build adhered to a build platform (S140); and ∘ retracting the build platform from the build window (S150). <EOS>