A method for manufacturing a fiber-reinforced composite material wherein a fiber-reinforced substrate containing a reinforcing fiber (A) and a thermosetting resin (B) is sandwiched between release films (C) to constitute a layered material, and the layered material is pressed in a mold heated to molding temperature to thereby cure the thermosetting resin (B), wherein the method satisfies the following (i), (ii), and (iii) or (i), (ii), and (iv): (i) the fiber-reinforced composite material has at least 1 bent part, (ii) the molding temperature is 130 to 180°C, and pressure application time is 0.5 to 20 minutes, (iii) the release film (C) has a thermal contraction rate satisfying the following expressions and : 0 < Ta ≤ 20 and 1 ≤ Ta − Tb ≤ 20 Ta: the thermal contraction rate (%) of the release film (C) measured by using a thermomechanical analyzer at the temperature the same as the molding temperature Tb: the thermal contraction rate (%) of the release film (C) measured by using a thermomechanical analyzer at a temperature 30°C lower than the molding temperature, and (iv) hardness of the fiber-reinforced substrate and the hardness of the release film (C) measured by using a durometer corresponding to JIS-K-7215, type A satisfy the following expressions and : 0.8 ≤ Hrc / Hrf ≤ 1.2 1 < Hhc / Hhf < 1.5 Hrc: hardness of the release film (C) at 30°C, Hrf: hardness of the fiber-reinforced substrate at 30°C, Hhc: hardness of the release film (C) at the molding temperature, Hhf: hardness of the fiber-reinforced substrate at the molding temperature. (i) the fiber-reinforced composite material has at least 1 bent part, (ii) the molding temperature is 130 to 180°C, and pressure application time is 0.5 to 20 minutes, (iii) the release film (C) has a thermal contraction rate satisfying the following expressions and : 0 < Ta ≤ 20 and 1 ≤ Ta − Tb ≤ 20 Ta: the thermal contraction rate (%) of the release film (C) measured by using a thermomechanical analyzer at the temperature the same as the molding temperature Tb: the thermal contraction rate (%) of the release film (C) measured by using a thermomechanical analyzer at a temperature 30°C lower than the molding temperature, and Ta: the thermal contraction rate (%) of the release film (C) measured by using a thermomechanical analyzer at the temperature the same as the molding temperature Tb: the thermal contraction rate (%) of the release film (C) measured by using a thermomechanical analyzer at a temperature 30°C lower than the molding temperature, and (iv) hardness of the fiber-reinforced substrate and the hardness of the release film (C) measured by using a durometer corresponding to JIS-K-7215, type A satisfy the following expressions and : 0.8 ≤ Hrc / Hrf ≤ 1.2 1 < Hhc / Hhf < 1.5 Hrc: hardness of the release film (C) at 30°C, Hrf: hardness of the fiber-reinforced substrate at 30°C, Hhc: hardness of the release film (C) at the molding temperature, Hhf: hardness of the fiber-reinforced substrate at the molding temperature. Hrc: hardness of the release film (C) at 30°C, Hrf: hardness of the fiber-reinforced substrate at 30°C, Hhc: hardness of the release film (C) at the molding temperature, Hhf: hardness of the fiber-reinforced substrate at the molding temperature. <EOS>