A method for soldering at least one component with at least one carrier element , wherein the at least one component has at least one connecting surface , wherein the at least one carrier element has at least one contact surface , wherein the at least one connecting surface and the at least one contact surface are designed to be soldered together, wherein the method comprises the following steps: - Applying a first solder containing a first flux with a first liquidus temperature (T1) to the at least one connecting surface , - Remelting the first solder on the at least one connecting surface at a remelting temperature, which is higher than the first liquidus temperature (T1) of the first solder , wherein the remelted first solder forms a solder deposit , characterized by the following steps: - Applying a second solder containing a second flux with a second liquidus temperature (T2) to the at least one contact surface , wherein the second solder has a different composition to the first solder , wherein the first liquidus temperature (T1) is different from the second liquidus temperature (T2) and is up to 20 K higher than the second liquidus temperature (T2), - Positioning the at least one component relative to the at least one carrier element in such a way that the at least one connecting surface is facing the at least one contact surface , - Heating the at least one component and the at least one carrier element in a soldering oven to a specified soldering temperature in such a way that a first time period (Δt1) from when the second liquidus temperature (T2) is reached until when the first liquidus temperature (T1) is reached lasts for up to 25 s, wherein the second solder melts during the first time period (Δt1) while the first solder remains solid, - Soldering the at least one connecting surface to the at least one contact surface in a soldering oven for a second time period (Δt2) at the specified soldering temperature (T3), which is above the first liquidus temperature (T1) and the second liquidus temperature (T2). - Applying a first solder containing a first flux with a first liquidus temperature (T1) to the at least one connecting surface , - Remelting the first solder on the at least one connecting surface at a remelting temperature, which is higher than the first liquidus temperature (T1) of the first solder , wherein the remelted first solder forms a solder deposit , - Applying a second solder containing a second flux with a second liquidus temperature (T2) to the at least one contact surface , wherein the second solder has a different composition to the first solder , wherein the first liquidus temperature (T1) is different from the second liquidus temperature (T2) and is up to 20 K higher than the second liquidus temperature (T2), - Positioning the at least one component relative to the at least one carrier element in such a way that the at least one connecting surface is facing the at least one contact surface , - Heating the at least one component and the at least one carrier element in a soldering oven to a specified soldering temperature in such a way that a first time period (Δt1) from when the second liquidus temperature (T2) is reached until when the first liquidus temperature (T1) is reached lasts for up to 25 s, wherein the second solder melts during the first time period (Δt1) while the first solder remains solid, - Soldering the at least one connecting surface to the at least one contact surface in a soldering oven for a second time period (Δt2) at the specified soldering temperature (T3), which is above the first liquidus temperature (T1) and the second liquidus temperature (T2). <EOS>