mhurhangee/patent-ind-claim-en huggingface dataset:
A burring method, comprising: a placement process of disposing a sheet-shaped workpiece formed with a through hole such that a punch is positioned on one sheet thickness direction side of the workpiece and a pad is positioned on the opposite side to the one sheet thickness direction side of the workpiece; and an extrusion process of forming a flange by moving the punch toward the opposite side relative to the workpiece and extruding a peripheral rim of the through hole in the workpiece with the punch in a state in which the peripheral rim of the through hole is pressed by the punch and the pad in the sheet thickness direction of the workpiece, until an end of the peripheral rim of the through hole comes out from between the punch and the pad. a placement process of disposing a sheet-shaped workpiece formed with a through hole such that a punch is positioned on one sheet thickness direction side of the workpiece and a pad is positioned on the opposite side to the one sheet thickness direction side of the workpiece; and an extrusion process of forming a flange by moving the punch toward the opposite side relative to the workpiece and extruding a peripheral rim of the through hole in the workpiece with the punch in a state in which the peripheral rim of the through hole is pressed by the punch and the pad in the sheet thickness direction of the workpiece, until an end of the peripheral rim of the through hole comes out from between the punch and the pad.
A surface light-emission type semiconductor light-emitting device , the device comprising: a first semiconductor layer ; a light-emitting layer provided on the first semiconductor layer ; a second semiconductor layer provided on the light-emitting layer ; an uneven structure provided on the second semiconductor layer , the uneven structure includes a plurality of protrusions , and recesses next to said protrusions, and the plurality of protrusions are arranged at a constant periodicity in a direction along an upper surface of the second semiconductor layer so that a photonic crystal structure is configured by the plurality of protrusions , a first metal layer covering the uneven structure ; and a second metal layer provided between the uneven structure and the first metal layer , the second metal layer being provided on one of a bottom surface of the recesses , an upper surface of the protrusions , or a side surface of the protrusions , a reflectance of the second metal layer for light radiated from the light-emitting layer being less than a reflectance of the first metal layer for the light. a first semiconductor layer ; a light-emitting layer provided on the first semiconductor layer ; a second semiconductor layer provided on the light-emitting layer ; an uneven structure provided on the second semiconductor layer , the uneven structure includes a plurality of protrusions , and recesses next to said protrusions, and the plurality of protrusions are arranged at a constant periodicity in a direction along an upper surface of the second semiconductor layer so that a photonic crystal structure is configured by the plurality of protrusions , a first metal layer covering the uneven structure ; and a second metal layer provided between the uneven structure and the first metal layer , the second metal layer being provided on one of a bottom surface of the recesses , an upper surface of the protrusions , or a side surface of the protrusions , a reflectance of the second metal layer for light radiated from the light-emitting layer being less than a reflectance of the first metal layer for the light.
An injection system, comprising: a container configured to contain a pharmaceutical product, the container having a proximal end, a distal end, and an inner surface extending between the proximal end and the distal end; a plunger positioned within the container and having a surface that slidably engages the inner surface of the container; a plunger rod connected to the plunger , the plunger rod extending from the plunger such that at least a portion of the plunger rod is positioned externally to the proximal end of the container ; and a housing at least partially surrounding the container ; characterized in that it further comprises a plunger rod cover removably coupled to the housing and enclosing the portion of the plunger rod positioned externally to the container , the plunger rod cover being configured to be removed from the housing to allow access to the plunger rod , wherein removal of the plunger rod cover moves the container from an inactivated position to an activated position; and a driver positioned at the proximal end of the container and configured to transduce rotation of the plunger rod cover relative to the housing into linear movement of the container relative to the housing . a container configured to contain a pharmaceutical product, the container having a proximal end, a distal end, and an inner surface extending between the proximal end and the distal end; a plunger positioned within the container and having a surface that slidably engages the inner surface of the container; a plunger rod connected to the plunger , the plunger rod extending from the plunger such that at least a portion of the plunger rod is positioned externally to the proximal end of the container ; and a housing at least partially surrounding the container ; characterized in that it further comprises a plunger rod cover removably coupled to the housing and enclosing the portion of the plunger rod positioned externally to the container , the plunger rod cover being configured to be removed from the housing to allow access to the plunger rod , wherein removal of the plunger rod cover moves the container from an inactivated position to an activated position; and a driver positioned at the proximal end of the container and configured to transduce rotation of the plunger rod cover relative to the housing into linear movement of the container relative to the housing .
A force sensing probe for sensing snap-in and/or pull-off force of a liquid droplet brought into and/or separated from contact with a hydrophobic sample surface , respectively, the force sensing probe comprising: a sensing tip ; a sensor element connected to the sensing tip, capable of sensing sub-micronewton forces with sensing resolution less than a micronewton acting on the sensing tip in a measurement direction defined relative to the force sensing probe; and a droplet holding plate having a first main surface and a hydrophilic second main surface connected via a peripheral edge surface , and being attached via the first main surface to the sensing tip perpendicularly relative to the measurement direction for receiving and holding a liquid droplet as attached to the second main surface; the droplet holding plate comprising an electrically conductive surface layer , characterized in that the first and the second main surfaces and the peripheral edge surface are defined by the surface layer, and wherein the droplet holding plate has a maximum diameter of less than or equal to 1 mm. a sensing tip ; a sensor element connected to the sensing tip, capable of sensing sub-micronewton forces with sensing resolution less than a micronewton acting on the sensing tip in a measurement direction defined relative to the force sensing probe; and a droplet holding plate having a first main surface and a hydrophilic second main surface connected via a peripheral edge surface , and being attached via the first main surface to the sensing tip perpendicularly relative to the measurement direction for receiving and holding a liquid droplet as attached to the second main surface; the droplet holding plate comprising an electrically conductive surface layer , characterized in that the first and the second main surfaces and the peripheral edge surface are defined by the surface layer, and wherein the droplet holding plate has a maximum diameter of less than or equal to 1 mm.
A method for preparing a transglucosylated steviol glycoside which method comprises contacting a steviol glycoside with sugar in presence of a Lactobacillus mali microorganism or culture thereof.
A method for separating components in a corona discharge zone, said method including: (a) passing an air stream containing water molecules between at least one ionizing electrode and at least one non-ionizing electrode ; (b) applying high voltage to said electrodes to create a corona discharge zone consisting of a plasma region wherein ozone is formed and a dark region where predominantly hydrogen peroxide is formed; (c) dividing the air flow entering the corona discharge zone into two separate air flows, a first of which passes through the corona discharge plasma region, and a second of which passes through the dark corona discharge region; and (d) applying a negative pressure gradient to the plasma region only so as to remove the ozone and thereby prevent escape of the ozone in the first air flow into an enclosed atmosphere; characterized by: (e) supporting the ionizing electrode at the upper end of a chamber whose inner wall surface serves as the non-ionizing electrode with a non-ionizing part of the ionizing electrode in coaxial alignment with a hollow air-channel dimensioned to cover the whole area of the plasma region so that a tip of the ionizing electrode protrudes out of an open lower end of the air-channel into the chamber, and (f) applying a unipolar negative or positive corona discharge between the ionizing electrode and the non-ionizing electrode . (a) passing an air stream containing water molecules between at least one ionizing electrode and at least one non-ionizing electrode ; (b) applying high voltage to said electrodes to create a corona discharge zone consisting of a plasma region wherein ozone is formed and a dark region where predominantly hydrogen peroxide is formed; (c) dividing the air flow entering the corona discharge zone into two separate air flows, a first of which passes through the corona discharge plasma region, and a second of which passes through the dark corona discharge region; and (d) applying a negative pressure gradient to the plasma region only so as to remove the ozone and thereby prevent escape of the ozone in the first air flow into an enclosed atmosphere; (e) supporting the ionizing electrode at the upper end of a chamber whose inner wall surface serves as the non-ionizing electrode with a non-ionizing part of the ionizing electrode in coaxial alignment with a hollow air-channel dimensioned to cover the whole area of the plasma region so that a tip of the ionizing electrode protrudes out of an open lower end of the air-channel into the chamber, and (f) applying a unipolar negative or positive corona discharge between the ionizing electrode and the non-ionizing electrode .
A polyphenylene sulfide resin composition obtained by mixing 100 parts by weight of a polyphenylene sulfide resin with 0.01 to 10 parts by weight of an organosilane compound, which is an alkoxysilane compound having an isocyanate group, and 0.01 to 5 parts by weight of a metal salt of phosphorus oxoacid, wherein a tensile elongation at break, which is measured in accordance with ASTM-D638 under the conditions of a tensile speed of 10 mm/min and an ambient temperature of 23°C after treating at 200°C for 500 hours using an ASTM No. 4 dumbbell obtained by injection molding the composition, is 100 or more.
A user equipment configured to communicate with other devices across a wireless communication network comprising a plurality of radio coverage cells, said user equipment being configured to respond to receipt of a message from said network, said message comprising a wait time, to not transmit a connection request until after expiry of said wait time; wherein said user equipment is configured during said wait time to receive paging requests from said network; and is configured to respond to at least some of said paging requests, said user equipment being configured to select said at least some of said paging requests to respond to in dependence upon paging information received from said network, said paging information indicating which paging requests should be responded to and which can be ignored.
A kinesthetic device that simulates flight, comprising a base unit which includes a base seat ; a swing unit which includes a swing support structure pivoted at the base seat and a swing actuator used to control the swing angle of the swing support structure ; and a flip unit which includes a riding seat pivoted at the swing support structure , a flip support structure disposed between the swing support structure and the riding seat , and a flip actuator used to control the flipping angle of the riding seat ; characterized in that the swing actuator is provided with a swing motor disposed at the base seat , a swing rotation rod disposed at the swing motor , and a swing push-and-pull rod disposed between the swing rotation rod and the swing support structure .
A system for automated de-icing of an aircraft comprising: a mobile platform , the mobile platform including a set of wheels ; a contamination removal apparatus mounted to the mobile platform for delivering contamination removal treatment to the aircraft; and; a processor for receiving instructions associated with the contamination removal treatment from an external party and for controlling the mobile platform and contamination removal apparatus to deliver the contamination removal treatment; wherein the mobile platform includes a swerve drive for controlling movement of the set of wheels ; and wherein the mobile platform is configured to travel an outline of the aircraft while the contamination removal treatment to the aircraft is being delivered. a mobile platform , the mobile platform including a set of wheels ; a contamination removal apparatus mounted to the mobile platform for delivering contamination removal treatment to the aircraft; and; a processor for receiving instructions associated with the contamination removal treatment from an external party and for controlling the mobile platform and contamination removal apparatus to deliver the contamination removal treatment; wherein the mobile platform includes a swerve drive for controlling movement of the set of wheels ; and wherein the mobile platform is configured to travel an outline of the aircraft while the contamination removal treatment to the aircraft is being delivered.
A solar cell, comprising: a substrate having a front surface and a rear surface opposite to the front surface , wherein the substrate includes a base and an emitter ; a first passivation layer , a second passivation layer and a third passivation layer formed on the front surface ; and a tunneling oxide layer and a doped conductive layer formed on the rear surface and in a direction away from the rear surface , wherein the rear surface is a non-pyramid textured surface, and wherein the doped conductive layer and the substrate have a doping element of a same conductivity type; wherein the front surface is a pyramid textured surface, the first passivation layer is configured to cover the emitter and includes a dielectric material, the second passivation layer is formed between the first passivation layer and the third passivation layer and includes a first silicon nitride Si m N n material, a ratio of n/m ranges from 0.5 to 1, the third passivation layer includes a silicon oxynitride SiO i N j material, and a ratio of j/i ranges from 0.1 to 0.6; wherein the first passivation layer has a thickness ranged from 3nm to 10nm in a direction perpendicular to the front surface , the dielectric material is an aluminum oxide Al x O y material, and a ratio of y/x ranges from 1.1 to 1.5; and wherein the y/x, n/m, and j/i refer to atomic ratios. a substrate having a front surface and a rear surface opposite to the front surface , wherein the substrate includes a base and an emitter ; a first passivation layer , a second passivation layer and a third passivation layer formed on the front surface ; and a tunneling oxide layer and a doped conductive layer formed on the rear surface and in a direction away from the rear surface , wherein the rear surface is a non-pyramid textured surface, and wherein the doped conductive layer and the substrate have a doping element of a same conductivity type; wherein the front surface is a pyramid textured surface, the first passivation layer is configured to cover the emitter and includes a dielectric material, the second passivation layer is formed between the first passivation layer and the third passivation layer and includes a first silicon nitride Si m N n material, a ratio of n/m ranges from 0.5 to 1, the third passivation layer includes a silicon oxynitride SiO i N j material, and a ratio of j/i ranges from 0.1 to 0.6; wherein the first passivation layer has a thickness ranged from 3nm to 10nm in a direction perpendicular to the front surface , the dielectric material is an aluminum oxide Al x O y material, and a ratio of y/x ranges from 1.1 to 1.5; and wherein the y/x, n/m, and j/i refer to atomic ratios.
A semiconductor device comprising: a semiconductor chip having a length and a width, and a plurality of bond pads ; a first metallic cuboid containing copper, the cuboid having first and second surfaces of length and width approximately equal to the chip's length and width, the cuboid further having sides of a height ; a plurality of second metallic cuboids containing copper, the second cuboids having first and second surfaces, the second cuboids further having sides of a height substantially equal to the height of the first cuboid ; a layer of silver on the first surfaces of the first and second cuboids; the chip attached to the silver layer on the first surface of the first cuboid , the chip bond pads wire bonded to the silver layer on the first surfaces of the second cuboids , respectively; the second surfaces of the first and second cuboids aligned in a plane ; encapsulation compound adhering to and embedding the chip , the wire bonds , and the sides of the first and second cuboids, the compound forms a first surface above the embedded wires and a second surface aligned with the plane of the second surfaces of the first and second cuboids, characterized by a plurality of vias through the encapsulation compound from below the first to the second compound surfaces, the vias being distinct from the cuboids, the vias filled with metal comprising copper and the surfaces of both via ends having solderable layers thereon, and the via locations being selected for stacking of devices. a semiconductor chip having a length and a width, and a plurality of bond pads ; a first metallic cuboid containing copper, the cuboid having first and second surfaces of length and width approximately equal to the chip's length and width, the cuboid further having sides of a height ; a plurality of second metallic cuboids containing copper, the second cuboids having first and second surfaces, the second cuboids further having sides of a height substantially equal to the height of the first cuboid ; a layer of silver on the first surfaces of the first and second cuboids; the chip attached to the silver layer on the first surface of the first cuboid , the chip bond pads wire bonded to the silver layer on the first surfaces of the second cuboids , respectively; the second surfaces of the first and second cuboids aligned in a plane ; encapsulation compound adhering to and embedding the chip , the wire bonds , and the sides of the first and second cuboids, the compound forms a first surface above the embedded wires and a second surface aligned with the plane of the second surfaces of the first and second cuboids, characterized by a plurality of vias through the encapsulation compound from below the first to the second compound surfaces, the vias being distinct from the cuboids, the vias filled with metal comprising copper and the surfaces of both via ends having solderable layers thereon, and the via locations being selected for stacking of devices.
A method for an offshore hydraulic fracturing operation, gravel packing operation, or both comprising: preheating a viscoelastic surfactant gelled treating fluid to a temperature that is at least 60% of its peak viscosity temperature in degrees Fahrenheit to increase the viscosity of the viscoelastic surfactant gelled treating fluid, the composition of the viscoelastic surfactant gelled treating fluid comprising: an aqueous brine; and at least one viscoelastic surfactant added to the aqueous brine by a volume between 0.5% to 25% of the aqueous brine to increase the viscosity of the brine; and allowing the preheated, gelled treating fluid to cool during at least a portion of its delivery from the sea surface to a subterranean formation; and introducing the cooled, gelled treating fluid into the subterranean formation, the viscosity of the cooled, gelled treating fluid greater than its viscosity before being preheated and less than its viscosity at its peak viscosity temperature, where the cooled temperature condition is selected from the group consisting of an offshore operation where the temperature of the water is 150 °F (66 °C) or less; and when said method is a gravel packing operation, or both a hydrocarbon land-based operation where the temperature of the rock formation is 120 °F (49 °C) or less, where the peak viscosity temperature of the treating fluid is from 160 °F to 220 °F (71 °C to 104 °C). preheating a viscoelastic surfactant gelled treating fluid to a temperature that is at least 60% of its peak viscosity temperature in degrees Fahrenheit to increase the viscosity of the viscoelastic surfactant gelled treating fluid, the composition of the viscoelastic surfactant gelled treating fluid comprising: an aqueous brine; and at least one viscoelastic surfactant added to the aqueous brine by a volume between 0.5% to 25% of the aqueous brine to increase the viscosity of the brine; and an aqueous brine; and at least one viscoelastic surfactant added to the aqueous brine by a volume between 0.5% to 25% of the aqueous brine to increase the viscosity of the brine; and allowing the preheated, gelled treating fluid to cool during at least a portion of its delivery from the sea surface to a subterranean formation; and introducing the cooled, gelled treating fluid into the subterranean formation, the viscosity of the cooled, gelled treating fluid greater than its viscosity before being preheated and less than its viscosity at its peak viscosity temperature, where the cooled temperature condition is selected from the group consisting of an offshore operation where the temperature of the water is 150 °F (66 °C) or less; and when said method is a gravel packing operation, or both a hydrocarbon land-based operation where the temperature of the rock formation is 120 °F (49 °C) or less, where the peak viscosity temperature of the treating fluid is from 160 °F to 220 °F (71 °C to 104 °C).