A substrate processing method comprising: a processing liquid supplying step of supplying a processing liquid to a patterned surface of a substrate (W) having the patterned surface with projections and recesses ; a processing film forming step of solidifying or curing the processing liquid supplied to the patterned surface to form, so as to follow the projections and the recesses of the patterned surface , a processing film which holds an object to be removed present on the patterned surface ; and a removing step of supplying a dissolving and peeling liquid to the patterned surface to partially dissolve the processing film and peel the processing film from the patterned surface together with the object to be removed , thereby removing the processing film from the substrate (W), in a state where the object to be removed is held by the processing film , wherein the processing film forming step includes a step of forming the processing film such that a film thickness (D) of the processing film becomes thinner than a height (T1) of the projections and the recesses of the patterned surface in a thickness direction (T) of the substrate (W), the processing liquid has a solute having a first component and a second component lower in solubility in the dissolving and peeling liquid than the first component and a solvent which dissolves the solute, the processing film forming step includes a step of forming the processing film which has a first solid formed by the first component and a second solid formed by the second component, and the removing step includes a step of dissolving the first solid in the dissolving and peeling liquid and peeling the processing film after dissolving the first solid . a processing liquid supplying step of supplying a processing liquid to a patterned surface of a substrate (W) having the patterned surface with projections and recesses ; a processing film forming step of solidifying or curing the processing liquid supplied to the patterned surface to form, so as to follow the projections and the recesses of the patterned surface , a processing film which holds an object to be removed present on the patterned surface ; and a removing step of supplying a dissolving and peeling liquid to the patterned surface to partially dissolve the processing film and peel the processing film from the patterned surface together with the object to be removed , thereby removing the processing film from the substrate (W), in a state where the object to be removed is held by the processing film , wherein the processing film forming step includes a step of forming the processing film such that a film thickness (D) of the processing film becomes thinner than a height (T1) of the projections and the recesses of the patterned surface in a thickness direction (T) of the substrate (W), the processing liquid has a solute having a first component and a second component lower in solubility in the dissolving and peeling liquid than the first component and a solvent which dissolves the solute, the processing film forming step includes a step of forming the processing film which has a first solid formed by the first component and a second solid formed by the second component, and the removing step includes a step of dissolving the first solid in the dissolving and peeling liquid and peeling the processing film after dissolving the first solid . <EOS>