A radiant heat circuit board for mounting a plurality of heat generating devices , the radiant heat circuit board comprising: a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached; a first insulation layer disposed on the metal plate and exposing the integrated metal projection , and a second insulation layer disposed on the first insulation layer and exposing the integrated metal projection , a plurality of electrode pads disposed on the first insulation layer , the plurality of electrode pads applying a voltage into each of the heat generating devices , wherein the plurality of heat generating devices are attached on the one integrated metal projection ; wherein the integrated metal projection extends between the heat generating device and the adjacent heat generating device ; wherein each of the plurality of electrode pads comprises: a first electrode pad disposed on one side of the integrated metal projection and receiving a first voltage, a second electrode pad separated from the first electrode pad , receiving a second voltage and disposed on the one side of the integrated metal projection with the first electrode pad ; and a connection part connecting the second electrode pad to an adjacent first electrode pad , wherein the first electrode pad and the second electrode pad are exposed by the second insulation layer , and wherein the connection part is buried by the second insulation layer . a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached; a first insulation layer disposed on the metal plate and exposing the integrated metal projection , and a second insulation layer disposed on the first insulation layer and exposing the integrated metal projection , a plurality of electrode pads disposed on the first insulation layer , the plurality of electrode pads applying a voltage into each of the heat generating devices , wherein the plurality of heat generating devices are attached on the one integrated metal projection ; wherein the integrated metal projection extends between the heat generating device and the adjacent heat generating device ; wherein each of the plurality of electrode pads comprises: a first electrode pad disposed on one side of the integrated metal projection and receiving a first voltage, a second electrode pad separated from the first electrode pad , receiving a second voltage and disposed on the one side of the integrated metal projection with the first electrode pad ; and a connection part connecting the second electrode pad to an adjacent first electrode pad , a first electrode pad disposed on one side of the integrated metal projection and receiving a first voltage, a second electrode pad separated from the first electrode pad , receiving a second voltage and disposed on the one side of the integrated metal projection with the first electrode pad ; and a connection part connecting the second electrode pad to an adjacent first electrode pad , wherein the first electrode pad and the second electrode pad are exposed by the second insulation layer , and wherein the connection part is buried by the second insulation layer . <EOS>