A method for fabricating an electronic component, said method comprising: providing a first spool of an Ultra High Molecular Weight Polyethylene, UHMWPE, filament that has gone through a yarn drawing and heat treatment process and a second spool of a conductive circuit material having a melting point of 494,261 K (430 °F), on a three-dimensional printer ; feeding the UHMWPE filament from the first spool to a first head of the three-dimensional printer ; feeding the conductive circuit material from the second spool to a second head of the three-dimensional printer ; providing a computing device that is programmed to provide predetermined operating parameters for the three-dimensional printer ; and providing the predetermined operating parameters of the three-dimensional printer includes providing a head temperature for the first head that is in the range of 405,372 - 416,483 K (270 - 290 °F), and providing the predetermined operating parameters of the three-dimensional printer includes providing a head temperature for the second head that is approximately 494,261 K (430 °F), providing the predetermined operating parameters of the three-dimensional printer includes providing a constant feed rate for the UHMWPE filament and the circuit material such that a consistent pressure is provided when fabricating the electronic component, coextruding the UHMWPE and the circuit material to fabricate an electronic component using the three-dimensional printer , and wherein the circuit material is extruded into crevices that are designed into a substrate fabricated by the UHMWPE; allowing the electronic component to cool whereby the UHMWPE shrinks to hold the circuit material in place; wherein starting materials and materials in the completed electronic component consist of only the UHMWPE and the circuit material. providing a first spool of an Ultra High Molecular Weight Polyethylene, UHMWPE, filament that has gone through a yarn drawing and heat treatment process and a second spool of a conductive circuit material having a melting point of 494,261 K (430 °F), on a three-dimensional printer ; feeding the UHMWPE filament from the first spool to a first head of the three-dimensional printer ; feeding the conductive circuit material from the second spool to a second head of the three-dimensional printer ; providing a computing device that is programmed to provide predetermined operating parameters for the three-dimensional printer ; and providing the predetermined operating parameters of the three-dimensional printer includes providing a head temperature for the first head that is in the range of 405,372 - 416,483 K (270 - 290 °F), and providing the predetermined operating parameters of the three-dimensional printer includes providing a head temperature for the second head that is approximately 494,261 K (430 °F), providing the predetermined operating parameters of the three-dimensional printer includes providing a constant feed rate for the UHMWPE filament and the circuit material such that a consistent pressure is provided when fabricating the electronic component, coextruding the UHMWPE and the circuit material to fabricate an electronic component using the three-dimensional printer , and wherein the circuit material is extruded into crevices that are designed into a substrate fabricated by the UHMWPE; allowing the electronic component to cool whereby the UHMWPE shrinks to hold the circuit material in place; wherein starting materials and materials in the completed electronic component consist of only the UHMWPE and the circuit material. <EOS>