An electronic circuit component mounting system comprising: a mounter main body ; (a) a circuit substrate conveying and holding device held on the mounter main body that is configured to convey and fix and hold a circuit substrate , (b) a head main body that is configured to be moved with respect to the mounter main body by a head moving device to any position on a movement plane inside the mounter main body , (c) at least one head-side feeder held on the head main body that is configured to supply electronic circuit components , (d) a mounting device that is configured to receive the electronic circuit component from the head-side feeder and to mount the electronic circuit components on a circuit substrate held by the circuit substrate conveying and holding device using multiple component holding tools provided on the head main body , (e) a first control device that is configured to control the circuit substrate conveying and holding device , the head moving device , the head-side feeders , and the mounting device , and characterized by (f) a second control device that is configured to perform control such that, while a component holding tool from the multiple component holding tools positioned at a component mounting position is contacting an electronic circuit component and while the electronic circuit component is contacting the circuit substrate , another component holding tool from the multiple component holding tools positioned at a component pickup position of a component supplied from the head-side feeder and an electronic component are brought into contact with each other, and the electronic circuit component and the head-side feeder are brought into contact with each other. (a) a circuit substrate conveying and holding device held on the mounter main body that is configured to convey and fix and hold a circuit substrate , (b) a head main body that is configured to be moved with respect to the mounter main body by a head moving device to any position on a movement plane inside the mounter main body , (c) at least one head-side feeder held on the head main body that is configured to supply electronic circuit components , (d) a mounting device that is configured to receive the electronic circuit component from the head-side feeder and to mount the electronic circuit components on a circuit substrate held by the circuit substrate conveying and holding device using multiple component holding tools provided on the head main body , (e) a first control device that is configured to control the circuit substrate conveying and holding device , the head moving device , the head-side feeders , and the mounting device , and characterized by (f) a second control device that is configured to perform control such that, while a component holding tool from the multiple component holding tools positioned at a component mounting position is contacting an electronic circuit component and while the electronic circuit component is contacting the circuit substrate , another component holding tool from the multiple component holding tools positioned at a component pickup position of a component supplied from the head-side feeder and an electronic component are brought into contact with each other, and the electronic circuit component and the head-side feeder are brought into contact with each other. <EOS>