An electronic component inspection method comprising: irradiating a reflected light (Lr) on at least a lead terminal of an electronic component that has a component body and the lead terminal that extends from the component body , from the side of a back face opposite to a terminal face which is a mounting face of the electronic component ; capturing an image of the electronic component under irradiation of light, from the side of the mounting face; and controlling processing related to inspection of the electronic component , on the basis of the captured image of the electronic component , characterized in that a part of the lead terminal and a part of the component body are arranged apart from each other, and so as to form an overlapping area when viewed from the side of the mounting face, and wherein the method further comprises: inserting a reflective plate into the overlapping area of the component body and the lead terminal at a level of height between the component body and the lead terminal , irradiating an irradiation light (L) emitted from a light source on the terminal face of the lead terminal , reflecting, from the side of the back face, the irradiation light (L) on the reflective plate so as to convert the irradiation light (L) to the reflected light (Lr), and irradiating the reflected light (Lr) on at least the lead terminal from the side of the back face. irradiating a reflected light (Lr) on at least a lead terminal of an electronic component that has a component body and the lead terminal that extends from the component body , from the side of a back face opposite to a terminal face which is a mounting face of the electronic component ; capturing an image of the electronic component under irradiation of light, from the side of the mounting face; and controlling processing related to inspection of the electronic component , on the basis of the captured image of the electronic component , characterized in that a part of the lead terminal and a part of the component body are arranged apart from each other, and so as to form an overlapping area when viewed from the side of the mounting face, and wherein the method further comprises: inserting a reflective plate into the overlapping area of the component body and the lead terminal at a level of height between the component body and the lead terminal , irradiating an irradiation light (L) emitted from a light source on the terminal face of the lead terminal , reflecting, from the side of the back face, the irradiation light (L) on the reflective plate so as to convert the irradiation light (L) to the reflected light (Lr), and irradiating the reflected light (Lr) on at least the lead terminal from the side of the back face. inserting a reflective plate into the overlapping area of the component body and the lead terminal at a level of height between the component body and the lead terminal , irradiating an irradiation light (L) emitted from a light source on the terminal face of the lead terminal , reflecting, from the side of the back face, the irradiation light (L) on the reflective plate so as to convert the irradiation light (L) to the reflected light (Lr), and irradiating the reflected light (Lr) on at least the lead terminal from the side of the back face. <EOS>