An antenna packaging module, comprising: an antenna substrate , a first laminated circuit and a ground layer being disposed respectively on two opposite sides of the antenna substrate ; a radiator disposed on a side of the first laminated circuit away from the antenna substrate ; a second laminated circuit disposed on a side of the ground layer away from the antenna substrate , a side of the second laminated circuit away from the ground layer being configured to dispose a radio frequency chip ; a feed structure extending through the second laminated circuit , the ground layer , the antenna substrate and the first laminated circuit , the feed structure being configured to connect the radio frequency chip and the radiator ; and a conductive grid comprising a plurality of spaced conductive structures , the conductive structures extending through the antenna substrate and being connected with the ground layer , and a portion of the feed structure being disposed in a space formed by two adjacent conductive structures of the plurality of spaced conductive structures ; wherein the first laminated circuit comprises a first conductive layer adjacent to a side of the antenna substrate ; wherein each of the conductive structures comprises a conductive column extending through the antenna substrate and a conductive sheet disposed on the first conductive layer , and the conductive sheet is connected to the ground layer via the conductive column ; characterized in that , a shape of a cross section of the conductive column along a plane of the antenna substrate is the same as a shape of the conductive sheet connected to the conductive column . an antenna substrate , a first laminated circuit and a ground layer being disposed respectively on two opposite sides of the antenna substrate ; a radiator disposed on a side of the first laminated circuit away from the antenna substrate ; a second laminated circuit disposed on a side of the ground layer away from the antenna substrate , a side of the second laminated circuit away from the ground layer being configured to dispose a radio frequency chip ; a feed structure extending through the second laminated circuit , the ground layer , the antenna substrate and the first laminated circuit , the feed structure being configured to connect the radio frequency chip and the radiator ; and a conductive grid comprising a plurality of spaced conductive structures , the conductive structures extending through the antenna substrate and being connected with the ground layer , and a portion of the feed structure being disposed in a space formed by two adjacent conductive structures of the plurality of spaced conductive structures ; wherein the first laminated circuit comprises a first conductive layer adjacent to a side of the antenna substrate ; wherein each of the conductive structures comprises a conductive column extending through the antenna substrate and a conductive sheet disposed on the first conductive layer , and the conductive sheet is connected to the ground layer via the conductive column ; characterized in that , a shape of a cross section of the conductive column along a plane of the antenna substrate is the same as a shape of the conductive sheet connected to the conductive column . <EOS>