A method of manufacturing an electronic device comprising a liquid cooling system , the method comprising obtaining an electronic device comprising a chip or a chip package comprising a chip , providing a liquid cooling system for cooling the electronic device , the liquid cooling system comprising: - an inlet plenum comprising a coolant feeding channel oriented parallel with the plane of a main surface to be cooled of the chip and a plurality of inlet cooling channels fluidically connected to the coolant feeding channel and arranged vertically for impinging a liquid coolant directly on said main surface of the chip , when the liquid cooling system is mounted to the chip or a chip package and is in operation, - an outlet plenum comprising a coolant removal channel and a plurality of outlet cooling channels arranged vertically for guiding the liquid coolant, after impinging of the coolant on the main surface to be cooled of the chip , towards the coolant removing channel for removal of the liquid coolant from the liquid cooling system , the vertically oriented inlet cooling channels being parallel to the vertically oriented outlet cooling channels and being separated by a thermally isolating material, - the liquid cooling system further comprises at least one cavity wherein a plurality of inlet and outlet cooling channels end, the at least one cavity also being arranged for allowing interaction between the liquid coolant provided through the inlet cooling channels and the main surface of the chip , the cavity thus comprising a heat transfer region , said providing a liquid cooling system being such that direct impinging of coolant on the chip surface occurs during operation, the method characterized in that : providing the liquid cooling system comprises directly forming the liquid cooling system on the chip or chip package of the electronic device . - an inlet plenum comprising a coolant feeding channel oriented parallel with the plane of a main surface to be cooled of the chip and a plurality of inlet cooling channels fluidically connected to the coolant feeding channel and arranged vertically for impinging a liquid coolant directly on said main surface of the chip , when the liquid cooling system is mounted to the chip or a chip package and is in operation, - an outlet plenum comprising a coolant removal channel and a plurality of outlet cooling channels arranged vertically for guiding the liquid coolant, after impinging of the coolant on the main surface to be cooled of the chip , towards the coolant removing channel for removal of the liquid coolant from the liquid cooling system , the vertically oriented inlet cooling channels being parallel to the vertically oriented outlet cooling channels and being separated by a thermally isolating material, - the liquid cooling system further comprises at least one cavity wherein a plurality of inlet and outlet cooling channels end, the at least one cavity also being arranged for allowing interaction between the liquid coolant provided through the inlet cooling channels and the main surface of the chip , the cavity thus comprising a heat transfer region , said providing a liquid cooling system being such that direct impinging of coolant on the chip surface occurs during operation, the method characterized in that : providing the liquid cooling system comprises directly forming the liquid cooling system on the chip or chip package of the electronic device . <EOS>