A method of manufacturing a first component carrier and a second component carrier , the method comprising: providing a separation component comprising a first separation surface and a second separation surface being opposed to the first separation surface ; coupling a first base structure having a first cavity with the first separation surface ; coupling a second base structure having a second cavity with the second separation surface ; placing a first electronic component in the first cavity ; connecting the first base structure with the first electronic component to form the first component carrier ; placing a second electronic component in the second cavity ; connecting the second base structure with the second electronic component to form the second component carrier ; separating the first component carrier from the first separation surface of the separation component ; separating the second component carrier from the second separation surface of the separation component ; forming a first electrically insulating layer on the first separation surface before coupling the first base structure with the first separation surface , and afterwards attaching the first base structure on the first electrically insulating layer ; and forming a second electrically insulating layer on the second separation surface before coupling the second base structure with the second separation surface , and afterwards attaching the second base structure on the second electrically insulating layer ; characterized in that the electrically insulating layers have a larger area size than the separation component and the separation component is laminated at the sides with the electrically insulating layers , such that the sidewalls of the separation component are covered. providing a separation component comprising a first separation surface and a second separation surface being opposed to the first separation surface ; coupling a first base structure having a first cavity with the first separation surface ; coupling a second base structure having a second cavity with the second separation surface ; placing a first electronic component in the first cavity ; connecting the first base structure with the first electronic component to form the first component carrier ; placing a second electronic component in the second cavity ; connecting the second base structure with the second electronic component to form the second component carrier ; separating the first component carrier from the first separation surface of the separation component ; separating the second component carrier from the second separation surface of the separation component ; forming a first electrically insulating layer on the first separation surface before coupling the first base structure with the first separation surface , and afterwards attaching the first base structure on the first electrically insulating layer ; and forming a second electrically insulating layer on the second separation surface before coupling the second base structure with the second separation surface , and afterwards attaching the second base structure on the second electrically insulating layer ; characterized in that the electrically insulating layers have a larger area size than the separation component and the separation component is laminated at the sides with the electrically insulating layers , such that the sidewalls of the separation component are covered. <EOS>