An integrated circuit, in the following referred to as IC, package, comprising: a package substrate ; a first IC die having, on a top side thereof, first interconnects of a plurality of interconnects and first inter-die contacts of a plurality of inter-die contacts , the first interconnects electrically and mechanically coupled to a top side of the package substrate; a second IC die having, on a top side thereof, second interconnects of the plurality of interconnects and second inter-die contacts of the plurality of inter-die contacts , the second interconnects electrically and mechanically coupled to the top side of the package substrate; a bridge module disposed between the first interconnects and the second interconnects , a backside of the bridge module being spaced apart from the package substrate and not extending beyond a height of the plurality of interconnects , the bridge module including: bridge interconnects on a top side of the bridge module , the bridge interconnects mechanically and electrically coupled to the plurality of inter-die contacts ; and one or more layers of conductive interconnect disposed on the top side of the bridge module configured to route signals between the first IC and the second IC; an underfill disposed between each of the first IC die , the second IC die , and the back side of the bridge module and the top side of the package substrate ; and a molding compound encapsulating the IC die , the IC die , and the bridge module . a package substrate ; a first IC die having, on a top side thereof, first interconnects of a plurality of interconnects and first inter-die contacts of a plurality of inter-die contacts , the first interconnects electrically and mechanically coupled to a top side of the package substrate; a second IC die having, on a top side thereof, second interconnects of the plurality of interconnects and second inter-die contacts of the plurality of inter-die contacts , the second interconnects electrically and mechanically coupled to the top side of the package substrate; a bridge module disposed between the first interconnects and the second interconnects , a backside of the bridge module being spaced apart from the package substrate and not extending beyond a height of the plurality of interconnects , the bridge module including: bridge interconnects on a top side of the bridge module , the bridge interconnects mechanically and electrically coupled to the plurality of inter-die contacts ; and one or more layers of conductive interconnect disposed on the top side of the bridge module configured to route signals between the first IC and the second IC; bridge interconnects on a top side of the bridge module , the bridge interconnects mechanically and electrically coupled to the plurality of inter-die contacts ; and one or more layers of conductive interconnect disposed on the top side of the bridge module configured to route signals between the first IC and the second IC; an underfill disposed between each of the first IC die , the second IC die , and the back side of the bridge module and the top side of the package substrate ; and a molding compound encapsulating the IC die , the IC die , and the bridge module . <EOS>