A copper chemical mechanical polishing (CMP) composition comprising: a) 0.0025 wt.% to 25 wt.% abrasive selected from the group consisting of colloidal silica or high purity colloidal silica; colloidal silica particles doped with one or more metal oxides within the lattice of the colloidal silica; colloidal aluminum oxide; colloidal and photoactive titanium dioxide; cerium oxide; colloidal cerium oxide; nano-sized inorganic metal oxide particles; nano-sized diamond particles; nano-sized silicon nitride particles; mono-modal, bi-modal, multi-modal colloidal abrasive particles; organic polymer-based soft abrasive; surface-coated or modified abrasive; composite particles; and combinations thereof; b) 0.1 wt. % to 18.0 wt. % tris chelators wherein the first tris chelator is an organic amine selected from the group consisting of ethylenediamine, propylenediamine, and butylenediamine; and wherein the second and third chelators are two different amino acids, two different amino acid derivatives, or combinations of one amino acid with one amino acid derivative; c) 0.005 wt.% to 0.5 wt.% corrosion inhibitor selected from the group consisting of 1,2,4-triazole, benzotriazole and benzotriazole derivatives, tetrazole and tetrazole derivatives, imidazole and imidazole derivatives, benzimidazole and benzimidazole derivatives, pyrazole and pyrazole derivatives, and combinations thereof; d) 0.0005 wt.% to 0.25 wt.% organic quaternary ammonium salt which is a choline salt formed between choline and other anionic counter ions; e) 0.1 wt.% to 10 wt.% oxidizing agent; f) 0.0001 wt.% to 0.05 wt.% biocide; g) 0 wt.% to 1 wt.% pH adjusting agent; and h) water; wherein the composition has a pH in the range of from 3.0 to 12.0; wherein the amino acid or the amino acid derivative is selected from the group consisting of glycine, D-alanine, L-alanine, DL-alanine, beta-alanine, valine, leucine, isoleucine, phenylamine, proline, serine, threonine, tyrosine, glutamine, asparanine, glutamic acid, aspartic acid, tryptophan, histidine, arginine, lysine, methionine, cysteine, iminodiacetic acid, and combinations thereof. a) 0.0025 wt.% to 25 wt.% abrasive selected from the group consisting of colloidal silica or high purity colloidal silica; colloidal silica particles doped with one or more metal oxides within the lattice of the colloidal silica; colloidal aluminum oxide; colloidal and photoactive titanium dioxide; cerium oxide; colloidal cerium oxide; nano-sized inorganic metal oxide particles; nano-sized diamond particles; nano-sized silicon nitride particles; mono-modal, bi-modal, multi-modal colloidal abrasive particles; organic polymer-based soft abrasive; surface-coated or modified abrasive; composite particles; and combinations thereof; b) 0.1 wt. % to 18.0 wt. % tris chelators wherein the first tris chelator is an organic amine selected from the group consisting of ethylenediamine, propylenediamine, and butylenediamine; and wherein the second and third chelators are two different amino acids, two different amino acid derivatives, or combinations of one amino acid with one amino acid derivative; c) 0.005 wt.% to 0.5 wt.% corrosion inhibitor selected from the group consisting of 1,2,4-triazole, benzotriazole and benzotriazole derivatives, tetrazole and tetrazole derivatives, imidazole and imidazole derivatives, benzimidazole and benzimidazole derivatives, pyrazole and pyrazole derivatives, and combinations thereof; d) 0.0005 wt.% to 0.25 wt.% organic quaternary ammonium salt which is a choline salt formed between choline and other anionic counter ions; e) 0.1 wt.% to 10 wt.% oxidizing agent; f) 0.0001 wt.% to 0.05 wt.% biocide; g) 0 wt.% to 1 wt.% pH adjusting agent; and h) water; wherein the composition has a pH in the range of from 3.0 to 12.0; wherein wherein the composition has a pH in the range of from 3.0 to 12.0; wherein <EOS>