A semiconductor package comprising a package main body and an electrically conductive thin film that covers the package main body , wherein: the package main body comprises: a lead frame that comprises first terminals and a die pad ; two or more integrated circuit chips that are disposed on the die pad ; one electrically conductive post that is disposed on the die pad ; wires that connect the first terminals and the integrated circuit chips electrically; and a molded member that seals the lead frame , the integrated circuit chips , the electrically conductive post , and the wires ; the electrically conductive post is disposed in a central region on a mounting surface of the die pad ; each of the integrated circuit chips is disposed in a peripheral region that surrounds the central region on the mounting surface; an upper surface , a bottom surface , and side surfaces of the package main body are formed by the molded member ; the electrically conductive post is exposed through the upper surface of the package main body ; the die pad is exposed through the bottom surface of the package main body ; the lead frame further comprises second terminals that are different than the first terminals ; the second terminals are exposed through the side surfaces of the package main body ; and the electrically conductive thin film is electrically connected to both the electrically conductive post and the second terminals in a state in which the electrically conductive thin film covers the upper surface and the side surfaces of the package main body . the package main body comprises: a lead frame that comprises first terminals and a die pad ; two or more integrated circuit chips that are disposed on the die pad ; one electrically conductive post that is disposed on the die pad ; wires that connect the first terminals and the integrated circuit chips electrically; and a molded member that seals the lead frame , the integrated circuit chips , the electrically conductive post , and the wires ; a lead frame that comprises first terminals and a die pad ; two or more integrated circuit chips that are disposed on the die pad ; one electrically conductive post that is disposed on the die pad ; wires that connect the first terminals and the integrated circuit chips electrically; and a molded member that seals the lead frame , the integrated circuit chips , the electrically conductive post , and the wires ; the electrically conductive post is disposed in a central region on a mounting surface of the die pad ; each of the integrated circuit chips is disposed in a peripheral region that surrounds the central region on the mounting surface; an upper surface , a bottom surface , and side surfaces of the package main body are formed by the molded member ; the electrically conductive post is exposed through the upper surface of the package main body ; the die pad is exposed through the bottom surface of the package main body ; the lead frame further comprises second terminals that are different than the first terminals ; the second terminals are exposed through the side surfaces of the package main body ; and the electrically conductive thin film is electrically connected to both the electrically conductive post and the second terminals in a state in which the electrically conductive thin film covers the upper surface and the side surfaces of the package main body . <EOS>