A component mounting machine comprising: a component supply section , the component mounting machine being configured to pick up components (P) supplied from multiple component feeders arranged on the component supply section and mount the components on a board (B); a head provided with multiple nozzles configured to pick up the components (P); a raising and lowering device configured to individually raise and lower the multiple nozzles ; a moving device configured to move the head relative to the board (B) in a plane perpendicular to a raising and lowering direction of the nozzles ; and a control device configured to perform, as a pickup operation for causing the nozzle to pick up a component (P), a first pickup operation of controlling the moving device and the raising and lowering device so as to lower a single one of the nozzles above the component supply section to pick up one of the components (P) using that nozzle , and a second pickup operation of controlling the moving device and the raising and lowering device so as to simultaneously lower multiple of the nozzles above the component supply section to pick up multiple of the components (P) simultaneously using the multiple nozzles , wherein, in a case in which pickup operation and mounting operation is to be performed repeatedly for a same type of the component (P), initially the first pickup operation is performed for each of the multiple nozzles , and during the first pickup operation the control device is configured to learn a correction value for correcting a deviation of a pickup position of each of the components (P) picked up by the multiple nozzles , and when a size of the component (P) to be picked up is equal to or larger than a predetermined size, perform the second pickup operation using the learned correction value. a component supply section , the component mounting machine being configured to pick up components (P) supplied from multiple component feeders arranged on the component supply section and mount the components on a board (B); a head provided with multiple nozzles configured to pick up the components (P); a raising and lowering device configured to individually raise and lower the multiple nozzles ; a moving device configured to move the head relative to the board (B) in a plane perpendicular to a raising and lowering direction of the nozzles ; and a control device configured to perform, as a pickup operation for causing the nozzle to pick up a component (P), a first pickup operation of controlling the moving device and the raising and lowering device so as to lower a single one of the nozzles above the component supply section to pick up one of the components (P) using that nozzle , and a second pickup operation of controlling the moving device and the raising and lowering device so as to simultaneously lower multiple of the nozzles above the component supply section to pick up multiple of the components (P) simultaneously using the multiple nozzles , wherein, in a case in which pickup operation and mounting operation is to be performed repeatedly for a same type of the component (P), initially the first pickup operation is performed for each of the multiple nozzles , and during the first pickup operation the control device is configured to learn a correction value for correcting a deviation of a pickup position of each of the components (P) picked up by the multiple nozzles , and when a size of the component (P) to be picked up is equal to or larger than a predetermined size, perform the second pickup operation using the learned correction value. <EOS>