An electronic device comprising: a housing that includes: a first surface , a second surface facing the first surface, and a side surface surrounding a space between the first and second surfaces ; a printed circuit board, PCB, that is disposed inside the housing and includes at least one antenna unit; and a communication circuit that is disposed at least one of inside the PCB or between the PCB and the housing, wherein the PCB includes: a first substrate , a second substrate facing the first substrate , and a spacer disposed between the first and second substrates , the spacer including an opening extending from the first substrate to the second substrate , and wherein a side surface of an inner space of the opening of the spacer is plated or surrounded by a conductive material, wherein each of the at least one antenna unit includes: a first conductive member (124-1, 125-1) formed on the first substrate , a second conductive member (124-2, 125-2) formed on the second substrate and facing the first conductive member (124-1, 125-1) through the opening , and a feeder (124-3, 125-3) connecting the second conductive member (124-2, 125-2) to the communication circuit , and wherein the communication circuit is configured to feed to the feeder (124-3, 125-3) and is configured to at least one of transmit or receive a signal of a specified frequency band through an electrical path formed through the feeder (124-3, 125-3) and the second conductive member (124-2, 125-2). a housing that includes: a first surface , a second surface facing the first surface, and a side surface surrounding a space between the first and second surfaces ; a first surface , a second surface facing the first surface, and a side surface surrounding a space between the first and second surfaces ; a printed circuit board, PCB, that is disposed inside the housing and includes at least one antenna unit; and a communication circuit that is disposed at least one of inside the PCB or between the PCB and the housing, wherein the PCB includes: a first substrate , a second substrate facing the first substrate , and a spacer disposed between the first and second substrates , the spacer including an opening extending from the first substrate to the second substrate , and wherein a side surface of an inner space of the opening of the spacer is plated or surrounded by a conductive material, a first substrate , a second substrate facing the first substrate , and a spacer disposed between the first and second substrates , the spacer including an opening extending from the first substrate to the second substrate , and wherein a side surface of an inner space of the opening of the spacer is plated or surrounded by a conductive material, wherein each of the at least one antenna unit includes: a first conductive member (124-1, 125-1) formed on the first substrate , a second conductive member (124-2, 125-2) formed on the second substrate and facing the first conductive member (124-1, 125-1) through the opening , and a feeder (124-3, 125-3) connecting the second conductive member (124-2, 125-2) to the communication circuit , and a first conductive member (124-1, 125-1) formed on the first substrate , a second conductive member (124-2, 125-2) formed on the second substrate and facing the first conductive member (124-1, 125-1) through the opening , and a feeder (124-3, 125-3) connecting the second conductive member (124-2, 125-2) to the communication circuit , and wherein the communication circuit is configured to feed to the feeder (124-3, 125-3) and is configured to at least one of transmit or receive a signal of a specified frequency band through an electrical path formed through the feeder (124-3, 125-3) and the second conductive member (124-2, 125-2). <EOS>