An electronic system comprising: i. a substrate ; ii. electronic devices or device components supported by said substrate ; wherein said electronic devices or device components are free standing or tethered to said substrate ; iii. a containment chamber at least partially enclosing said electronic devices or device components ; wherein said containment chamber is an elastomer at least partially filled with a containment fluid or a low modulus solid; and an ultra low modulus layer; wherein the substrate is supported by said ultra low modulus layer; wherein the containment chamber comprises enclosing structures including a plurality of side walls (135A 135C) and a top wall at least partially enclosing said electronic devices or device components ; and wherein said substrate has a Young's modulus greater than a Young's modulus of said ultra low modulus layer and said containment fluid or said low modulus solid, wherein the containment chamber walls form a void space at least partially filled with the containment fluid or low modulus solid such that the electronic devices or device components are at least partially immersed in the containment fluid or low modulus solid; and adjacent electronic devices or device components of said electronic devices or device components are connected to one another by one or more electrical interconnects , and wherein said top wall has a Young's modulus greater than a Young's modulus of said containment fluid or said low modulus solid such that a Young's modulus profile of the system spatially varies along an axis substantially perpendicular to the ultra low modulus layer. i. a substrate ; ii. electronic devices or device components supported by said substrate ; wherein said electronic devices or device components are free standing or tethered to said substrate ; iii. a containment chamber at least partially enclosing said electronic devices or device components ; wherein said containment chamber is an elastomer at least partially filled with a containment fluid or a low modulus solid; and an ultra low modulus layer; wherein the substrate is supported by said ultra low modulus layer; wherein the containment chamber comprises enclosing structures including a plurality of side walls (135A 135C) and a top wall at least partially enclosing said electronic devices or device components ; and wherein said substrate has a Young's modulus greater than a Young's modulus of said ultra low modulus layer and said containment fluid or said low modulus solid, wherein the containment chamber walls form a void space at least partially filled with the containment fluid or low modulus solid such that the electronic devices or device components are at least partially immersed in the containment fluid or low modulus solid; and adjacent electronic devices or device components of said electronic devices or device components are connected to one another by one or more electrical interconnects , and wherein said top wall has a Young's modulus greater than a Young's modulus of said containment fluid or said low modulus solid such that a Young's modulus profile of the system spatially varies along an axis substantially perpendicular to the ultra low modulus layer. <EOS>