An electronic device comprising: a housing including a first face configured to face a first direction; a printed circuit board including first and second board faces that are substantially parallel to the first face, and a side board face configured to face a second direction different from the first direction, the printed circuit board disposed within the housing; a first electronic component disposed in a first region of the first board face; a second electronic component disposed in a second region of the second board face that the second region at least partially overlaps with the first region when viewed from above the first board face or the second board face; a first conductive shield member including a first side wall formed to face the second direction to extend over at least a portion of the side board face, the first conductive shield member covering the first region; and a second conductive shield member including a second side wall formed to face the second direction to extend over at least a portion of the side board face, the second conductive shield member covering the second region, characterized in that the electronic device further comprises at least one bonding material formed between the first side wall and at least a portion of the side board face or between the second side wall and at least a portion of the side board face, and that the second side wall and the first side wall are matingly engaged with each other in at least a portion of the side board face or adjacent to at least the portion of the side board face and the bonding material seals a boundary between the first side wall and the second side wall. a housing including a first face configured to face a first direction; a printed circuit board including first and second board faces that are substantially parallel to the first face, and a side board face configured to face a second direction different from the first direction, the printed circuit board disposed within the housing; a first electronic component disposed in a first region of the first board face; a second electronic component disposed in a second region of the second board face that the second region at least partially overlaps with the first region when viewed from above the first board face or the second board face; a first conductive shield member including a first side wall formed to face the second direction to extend over at least a portion of the side board face, the first conductive shield member covering the first region; and a second conductive shield member including a second side wall formed to face the second direction to extend over at least a portion of the side board face, the second conductive shield member covering the second region, characterized in that the electronic device further comprises at least one bonding material formed between the first side wall and at least a portion of the side board face or between the second side wall and at least a portion of the side board face, and that the second side wall and the first side wall are matingly engaged with each other in at least a portion of the side board face or adjacent to at least the portion of the side board face and the bonding material seals a boundary between the first side wall and the second side wall. <EOS>