A sensor device, comprising: a unit having at least one type of power supply portion selected from a power generation portion and a wireless power supply portion, a sensor portion that is configured to detect target information and to output a signal, a logic portion that is configured to perform determination based on the signal, and a wireless communication portion that is configured to transmit a result of the determination to an outside; and a sealing material that covers at least a part of an outer periphery of the unit , wherein the respective portions are formed on a plurality of semiconductor substrates, the semiconductor substrates on which the respective portions are formed are laminated, and the respective portions are electrically connected to each other; wherein the wireless communication portion , the power supply portion , the logic portion and the sensor portion are stacked in this order in a vertical direction such that the portions overlap each other, wherein the semiconductor substrate having the sensor portion and a semiconductor substrate having an energy generation portion are stacked on the semiconductor substrate having a logic portion ; the energy generation portion being configured to generate at least one type of energy selected from sound, vibration, electromagnetic waves, and heat; and wherein the sensor portion is configured to perform detection using energy output from the energy generation portion and the energy generation portion is configured to generate a plurality of energy generation pulses with which detection of the sensor portion is synchronized. a unit having at least one type of power supply portion selected from a power generation portion and a wireless power supply portion, a sensor portion that is configured to detect target information and to output a signal, a logic portion that is configured to perform determination based on the signal, and a wireless communication portion that is configured to transmit a result of the determination to an outside; and a sealing material that covers at least a part of an outer periphery of the unit , wherein the respective portions are formed on a plurality of semiconductor substrates, the semiconductor substrates on which the respective portions are formed are laminated, and the respective portions are electrically connected to each other; wherein the wireless communication portion , the power supply portion , the logic portion and the sensor portion are stacked in this order in a vertical direction such that the portions overlap each other, wherein the semiconductor substrate having the sensor portion and a semiconductor substrate having an energy generation portion are stacked on the semiconductor substrate having a logic portion ; the energy generation portion being configured to generate at least one type of energy selected from sound, vibration, electromagnetic waves, and heat; and wherein the sensor portion is configured to perform detection using energy output from the energy generation portion and the energy generation portion is configured to generate a plurality of energy generation pulses with which detection of the sensor portion is synchronized. <EOS>