A method of levelling at least one flat side surface of coarse wood-chip boards (coarse chip wood-based panels), the method comprising the following steps in the order indicated: a) providing at least one coarse wood-chip board, said coarse wood-chip board having at least one flat side surface with a plurality of unevennesses, depressions, cavities, holes and/or voids (blowholes); then b) applying at least one hot-melt adhesive in the form of a hot-melt adhesive melt to the flat side surface of the coarse wood-chip board, wherein b1) first, the hot-melt adhesive melt is applied in such a way that the unevennesses, depressions, cavities, holes and/or voids are filled and/or backfilled with the hot-melt adhesive, in particular with the formation of at least one hot-melt adhesive filling, preferably hot-melt adhesive levelling filling, wherein a levelling and/or equalization of the flat side surface is effected, and, b2) subsequently, the hot-melt adhesive melt is applied in such a way that the flat side surface and/or the hot-melt adhesive filling is additionally coated and/or filmed with the hot-melt adhesive melt at least partially and/or in sections, preferably over the entire surface, resulting in at least one hot-melt adhesive layer, in particular hot-melt adhesive covering layer, arranged on the flat side surface and/or on the hot-melt adhesive filling; wherein step b1) is carried out first, followed by cooling and solidification of the hot-melt adhesive, and then step b2) is carried out; c) cooling and solidification of the hot-melt adhesive melt after carrying out step b2). a) providing at least one coarse wood-chip board, said coarse wood-chip board having at least one flat side surface with a plurality of unevennesses, depressions, cavities, holes and/or voids (blowholes); then b) applying at least one hot-melt adhesive in the form of a hot-melt adhesive melt to the flat side surface of the coarse wood-chip board, wherein b1) first, the hot-melt adhesive melt is applied in such a way that the unevennesses, depressions, cavities, holes and/or voids are filled and/or backfilled with the hot-melt adhesive, in particular with the formation of at least one hot-melt adhesive filling, preferably hot-melt adhesive levelling filling, wherein a levelling and/or equalization of the flat side surface is effected, and, b2) subsequently, the hot-melt adhesive melt is applied in such a way that the flat side surface and/or the hot-melt adhesive filling is additionally coated and/or filmed with the hot-melt adhesive melt at least partially and/or in sections, preferably over the entire surface, resulting in at least one hot-melt adhesive layer, in particular hot-melt adhesive covering layer, arranged on the flat side surface and/or on the hot-melt adhesive filling; wherein step b1) is carried out first, followed by cooling and solidification of the hot-melt adhesive, and then step b2) is carried out; b1) first, the hot-melt adhesive melt is applied in such a way that the unevennesses, depressions, cavities, holes and/or voids are filled and/or backfilled with the hot-melt adhesive, in particular with the formation of at least one hot-melt adhesive filling, preferably hot-melt adhesive levelling filling, wherein a levelling and/or equalization of the flat side surface is effected, and, b2) subsequently, the hot-melt adhesive melt is applied in such a way that the flat side surface and/or the hot-melt adhesive filling is additionally coated and/or filmed with the hot-melt adhesive melt at least partially and/or in sections, preferably over the entire surface, resulting in at least one hot-melt adhesive layer, in particular hot-melt adhesive covering layer, arranged on the flat side surface and/or on the hot-melt adhesive filling; c) cooling and solidification of the hot-melt adhesive melt after carrying out step b2). <EOS>