An electronic device , characterized by : a heat-generating structure including a substrate , an electronic component disposed on said substrate , and at least one electronic element disposed on said substrate and spaced apart from said electronic component ; a heat dissipation structure including: a heat dissipation unit that includes a heat dissipation body and an anti-corrosion layer formed on said heat dissipation body , a liquid metal layer disposed between said electronic component and said heat dissipation body and abutting against said anti-corrosion layer , a blocking member that is disposed between said substrate and said anti-corrosion layer , that is connected to said substrate , and that surrounds said liquid metal layer and said electronic component , a fixing adhesive that is disposed on said substrate and that is located between said electronic component and said blocking member , an insulation layer disposed between said substrate and said anti-corrosion layer ; characterized by a cushioning adhesive disposed between said blocking member and said anti-corrosion layer ; and an insulation glue disposed between said insulation layer and said substrate and encapsulating said at least one electronic element ; wherein said insulation layer extends from said blocking member to said fixing adhesive and covers said insulation glue , and said cushioning adhesive is clamped between said insulation layer and said anti-corrosion layer . a heat-generating structure including a substrate , an electronic component disposed on said substrate , and at least one electronic element disposed on said substrate and spaced apart from said electronic component ; a heat dissipation structure including: a heat dissipation unit that includes a heat dissipation body and an anti-corrosion layer formed on said heat dissipation body , a liquid metal layer disposed between said electronic component and said heat dissipation body and abutting against said anti-corrosion layer , a blocking member that is disposed between said substrate and said anti-corrosion layer , that is connected to said substrate , and that surrounds said liquid metal layer and said electronic component , a fixing adhesive that is disposed on said substrate and that is located between said electronic component and said blocking member , an insulation layer disposed between said substrate and said anti-corrosion layer ; characterized by a cushioning adhesive disposed between said blocking member and said anti-corrosion layer ; and a heat dissipation unit that includes a heat dissipation body and an anti-corrosion layer formed on said heat dissipation body , a liquid metal layer disposed between said electronic component and said heat dissipation body and abutting against said anti-corrosion layer , a blocking member that is disposed between said substrate and said anti-corrosion layer , that is connected to said substrate , and that surrounds said liquid metal layer and said electronic component , a fixing adhesive that is disposed on said substrate and that is located between said electronic component and said blocking member , an insulation layer disposed between said substrate and said anti-corrosion layer ; characterized by a cushioning adhesive disposed between said blocking member and said anti-corrosion layer ; and an insulation glue disposed between said insulation layer and said substrate and encapsulating said at least one electronic element ; wherein said insulation layer extends from said blocking member to said fixing adhesive and covers said insulation glue , and said cushioning adhesive is clamped between said insulation layer and said anti-corrosion layer . <EOS>