A LED lamp (100 comprising: - a metal body with a cylindric lumen; - a printed circuit board with a plurality of installation holes ; - a LED disposed within the metal body near a distal end of the metal body, the LED electrically coupled to a top layer of the printed circuit board; - wiring providing energy to the LED, wherein the wiring is coupled to the printed circuit board at the plurality of installation holes , and wherein the wiring extends from a proximal end of the metal body; wherein the multi-layer printed circuit board is fitted within the cylindric lumen near the distal end of the metal body , and wherein the multi-layer printed circuit board is configured to facilitate dissipation of heat from the LED , the multi-layer printed circuit board further comprising: - a middle metal layer sandwiched between a first layer of PCB material and a second layer of PCB material , wherein the middle metal layer is configured to collect heat and to conduct heat towards the wiring ; and - a bottom metal layer disposed at or near the face of the printed circuit board that faces towards the proximal end of the metal body , wherein the bottom metal layer is configured to collect diffused heat; wherein the proximal end of the cylindric lumen is filled with heat conducting filling configured to conduct heat collected by the bottom metal layer towards the metal body , characterized in that the bottom metal layer comprises two solder pad parts and a heat conducting part electrically uncoupled from the two solder pads , wherein the heat conducting part covers majority of the area of the bottom metal layer not covered by the solder pads , and wherein the heat conducting part is configured to collect diffused heat from the printed circuit board and to conduct the received diffused heat away from the printed circuit board via the heat conducting filling . - a metal body with a cylindric lumen; - a printed circuit board with a plurality of installation holes ; - a LED disposed within the metal body near a distal end of the metal body, the LED electrically coupled to a top layer of the printed circuit board; - wiring providing energy to the LED, wherein the wiring is coupled to the printed circuit board at the plurality of installation holes , and wherein the wiring extends from a proximal end of the metal body; wherein the multi-layer printed circuit board is fitted within the cylindric lumen near the distal end of the metal body , and wherein the multi-layer printed circuit board is configured to facilitate dissipation of heat from the LED , the multi-layer printed circuit board further comprising: - a middle metal layer sandwiched between a first layer of PCB material and a second layer of PCB material , wherein the middle metal layer is configured to collect heat and to conduct heat towards the wiring ; and - a bottom metal layer disposed at or near the face of the printed circuit board that faces towards the proximal end of the metal body , wherein the bottom metal layer is configured to collect diffused heat; wherein the proximal end of the cylindric lumen is filled with heat conducting filling configured to conduct heat collected by the bottom metal layer towards the metal body , - a middle metal layer sandwiched between a first layer of PCB material and a second layer of PCB material , wherein the middle metal layer is configured to collect heat and to conduct heat towards the wiring ; and - a bottom metal layer disposed at or near the face of the printed circuit board that faces towards the proximal end of the metal body , wherein the bottom metal layer is configured to collect diffused heat; <EOS>