A component supply device arranged adjacent to a mounter having a mounting head that mounts components (W1) on a board which supplies the components to the mounter comprising: a wafer sheet replenishment section which replenishes a wafer sheet (W2) on which multiple components (W1) are arranged, and a wafer sheet conveyance section which conveys a wafer sheet (W2) supplied from the wafer sheet replenishment section ; wherein the wafer sheet conveyance section includes a table on which the wafer sheet (W2) is carried and a pickup head which picks up a component (W1) on the wafer sheet (W2) carried on the table ; wherein the pickup head includes multiple component supply side suction nozzles , and a switching mechanism which switches the multiple component supply side suction nozzles between a pickup position at which the tip of the multiple component supply side suction nozzles faces down and a transfer position at which the tip of the multiple component supply side suction nozzles faces up; wherein the arrangement of the multiple component supply side suction nozzles corresponds to the arrangement of multiple mounter side suction nozzles equipped on the mounting head of the mounter , wherein the pickup head further includes number one housing and number two housing which is rotatably supported with respect to the number one housing by a rotation axis and to which the multiple component supply side suction nozzles are attached; wherein the switching mechanism includes a rack and pinion mechanism which rotates the number two housing with respect to the number one housing ; and wherein an intake passage and a groove are provided inside the rotation axis , so that the multiple component supply side suction nozzles can be connected to a suction device via the intake passage and the groove . a wafer sheet replenishment section which replenishes a wafer sheet (W2) on which multiple components (W1) are arranged, and a wafer sheet conveyance section which conveys a wafer sheet (W2) supplied from the wafer sheet replenishment section ; wherein the wafer sheet conveyance section includes a table on which the wafer sheet (W2) is carried and a pickup head which picks up a component (W1) on the wafer sheet (W2) carried on the table ; wherein the pickup head includes multiple component supply side suction nozzles , and a switching mechanism which switches the multiple component supply side suction nozzles between a pickup position at which the tip of the multiple component supply side suction nozzles faces down and a transfer position at which the tip of the multiple component supply side suction nozzles faces up; wherein the arrangement of the multiple component supply side suction nozzles corresponds to the arrangement of multiple mounter side suction nozzles equipped on the mounting head of the mounter , wherein the pickup head further includes number one housing and number two housing which is rotatably supported with respect to the number one housing by a rotation axis and to which the multiple component supply side suction nozzles are attached; wherein the switching mechanism includes a rack and pinion mechanism which rotates the number two housing with respect to the number one housing ; and wherein an intake passage and a groove are provided inside the rotation axis , so that the multiple component supply side suction nozzles can be connected to a suction device via the intake passage and the groove . <EOS>