A method of forming a print head , the method comprising the steps of: forming a heater chip by, defining via zones having peripheries on a substrate, forming heaters along the entire peripheries of the via zones , forming traces that electrically connect to each of the heaters , and after forming the heaters and the traces , forming vias in only a selected portion of the via zones that comprises a subset of the via zones ; forming a channel layer on the heater chip by, forming a first layer on the heater chip , forming flow channels in the first layer from the vias to only those heaters on the heater chip that are disposed along the selected portion of the via zones , and forming bubble chambers in the first layer around only those heaters on the heater chip that are disposed along the selected portion of the via zones ; and forming a nozzle plate on the channel layer by, forming a second layer on the first layer, and forming nozzles in the second layer above only those heaters on the heater chip that are disposed along the selected portion of the via zones , wherein the method is characterized in further comprising: forming a memory circuit in the heater chip , wherein the memory circuit contains information in regard to a configuration of the selected portion. forming a heater chip by, defining via zones having peripheries on a substrate, forming heaters along the entire peripheries of the via zones , forming traces that electrically connect to each of the heaters , and after forming the heaters and the traces , forming vias in only a selected portion of the via zones that comprises a subset of the via zones ; defining via zones having peripheries on a substrate, forming heaters along the entire peripheries of the via zones , forming traces that electrically connect to each of the heaters , and after forming the heaters and the traces , forming vias in only a selected portion of the via zones that comprises a subset of the via zones ; forming a channel layer on the heater chip by, forming a first layer on the heater chip , forming flow channels in the first layer from the vias to only those heaters on the heater chip that are disposed along the selected portion of the via zones , and forming bubble chambers in the first layer around only those heaters on the heater chip that are disposed along the selected portion of the via zones ; and forming a first layer on the heater chip , forming flow channels in the first layer from the vias to only those heaters on the heater chip that are disposed along the selected portion of the via zones , and forming bubble chambers in the first layer around only those heaters on the heater chip that are disposed along the selected portion of the via zones ; and forming a nozzle plate on the channel layer by, forming a second layer on the first layer, and forming nozzles in the second layer above only those heaters on the heater chip that are disposed along the selected portion of the via zones , forming a second layer on the first layer, and forming nozzles in the second layer above only those heaters on the heater chip that are disposed along the selected portion of the via zones , wherein the method is characterized in further comprising: forming a memory circuit in the heater chip , wherein the memory circuit contains information in regard to a configuration of the selected portion. forming a memory circuit in the heater chip , wherein the memory circuit contains information in regard to a configuration of the selected portion. <EOS>