Method for producing an electronic sensor module for measuring at least one measured value, in particular for a transmission controller, wherein the method comprises the following steps: providing a printed circuit board element ; providing a sensor element ; providing a sensor carrier having a sensor receptacle for holding the sensor element , wherein the sensor receptacle has alignment elements (91-94) for aligning the sensor element in the sensor receptacle , wherein the sensor carrier has electric connecting lines between solder pads (62-69) of the sensor receptacle and electric solder pads of a printed circuit board element contact side of the sensor carrier , wherein the sensor receptacle is formed on a side of the sensor carrier that faces away from the printed circuit board element contact side ; applying first solder material to electric solder pads of the printed circuit board element and/or to the electric solder pads of the printed circuit board element contact side of the sensor carrier ; arranging the sensor carrier with the electric solder pads of the printed circuit board element contact side on the electric solder pads of the printed circuit board element to produce a respective electric connection between the connecting line and the printed circuit board element via the first solder material; applying second solder material to electric connecting elements (71-78) of the sensor element and/or to the solder pads (62-69) of the sensor receptacle ; arranging the sensor element in the sensor receptacle in such a way that the second solder material produces a respective electric connection between the electric connecting elements (71-78) of the sensor element and the solder pads (62-69) of the sensor receptacle via the second solder material; and reflow-soldering the first solder material and the second solder material in a common reflow soldering process. providing a printed circuit board element ; providing a sensor element ; providing a sensor carrier having a sensor receptacle for holding the sensor element , wherein the sensor receptacle has alignment elements (91-94) for aligning the sensor element in the sensor receptacle , wherein the sensor carrier has electric connecting lines between solder pads (62-69) of the sensor receptacle and electric solder pads of a printed circuit board element contact side of the sensor carrier , wherein the sensor receptacle is formed on a side of the sensor carrier that faces away from the printed circuit board element contact side ; applying first solder material to electric solder pads of the printed circuit board element and/or to the electric solder pads of the printed circuit board element contact side of the sensor carrier ; arranging the sensor carrier with the electric solder pads of the printed circuit board element contact side on the electric solder pads of the printed circuit board element to produce a respective electric connection between the connecting line and the printed circuit board element via the first solder material; applying second solder material to electric connecting elements (71-78) of the sensor element and/or to the solder pads (62-69) of the sensor receptacle ; arranging the sensor element in the sensor receptacle in such a way that the second solder material produces a respective electric connection between the electric connecting elements (71-78) of the sensor element and the solder pads (62-69) of the sensor receptacle via the second solder material; and reflow-soldering the first solder material and the second solder material in a common reflow soldering process. <EOS>