An image detector (100; 110; 120; 130; 200; 300; 400; 500) comprising: • a sensor (101; 111; 121; 131; 201; 301; 401; 501) produced on a first monolithic substrate comprising: ∘ a set of pixels (P(i,j)) organized in a matrix in rows (Li) and columns (Cj) and configured so as to generate signals as a function of a radiation striking the detector (100; 200; 300; 400), ∘ column conductors (Yj), each linking the pixels (Pi,j) of a same column (Cj) and intended to convey the signals generated by the pixels, ∘ at least one bump contact situated at the periphery of the first substrate and outside of the matrix of pixels (P(i,j)) and linked to the column conductors (Cj), ∘ at least two column conductors (Yj) connected together on the first substrate outside of the matrix of pixels (P(i,j)) and the column conductors (Yj) connected together converge toward the at least one bump contact , and the image detector (100; 110, 120; 130; 200; 300; 400; 500) comprises row conductors (Xi), each linking the pixels (P(i,j)) of a same row (Li), and a row addressing block linked to the row conductors (Xi), characterized in that the image detector (100; 110, 120; 130; 200; 300; 400; 500) further comprises at least one row conductor (Zi) per row (Li), in that the row conductors (Xi) are connected to the columns of odd ranks, in that the at least one further row conductor (Zi) is connected to the columns of even ranks making it possible to individually read each pixel (P(i,j)). • a sensor (101; 111; 121; 131; 201; 301; 401; 501) produced on a first monolithic substrate comprising: ∘ a set of pixels (P(i,j)) organized in a matrix in rows (Li) and columns (Cj) and configured so as to generate signals as a function of a radiation striking the detector (100; 200; 300; 400), ∘ column conductors (Yj), each linking the pixels (Pi,j) of a same column (Cj) and intended to convey the signals generated by the pixels, ∘ at least one bump contact situated at the periphery of the first substrate and outside of the matrix of pixels (P(i,j)) and linked to the column conductors (Cj), ∘ at least two column conductors (Yj) connected together on the first substrate outside of the matrix of pixels (P(i,j)) and the column conductors (Yj) connected together converge toward the at least one bump contact , and the image detector (100; 110, 120; 130; 200; 300; 400; 500) comprises row conductors (Xi), each linking the pixels (P(i,j)) of a same row (Li), and a row addressing block linked to the row conductors (Xi), ∘ a set of pixels (P(i,j)) organized in a matrix in rows (Li) and columns (Cj) and configured so as to generate signals as a function of a radiation striking the detector (100; 200; 300; 400), ∘ column conductors (Yj), each linking the pixels (Pi,j) of a same column (Cj) and intended to convey the signals generated by the pixels, ∘ at least one bump contact situated at the periphery of the first substrate and outside of the matrix of pixels (P(i,j)) and linked to the column conductors (Cj), ∘ at least two column conductors (Yj) connected together on the first substrate outside of the matrix of pixels (P(i,j)) and the column conductors (Yj) connected together converge toward the at least one bump contact , and the image detector (100; 110, 120; 130; 200; 300; 400; 500) comprises row conductors (Xi), each linking the pixels (P(i,j)) of a same row (Li), and a row addressing block linked to the row conductors (Xi), <EOS>