A radio frequency conduction test method, wherein the method comprises: moving (S11 10) a radio frequency test probe to a first pad of a board so as to allow a test signal on the first pad to be transmitted to the radio frequency test probe for testing, wherein the board comprises a radio frequency front-end circuit , a radio frequency back-end circuit , the first pad, a second pad , and a to-be-welded serial device ; the to-be-welded serial device is a device to be welded to the first pad and the second pad; the serial device is one or more components connected in series with another component; and the first pad is connected to the radio frequency front-end circuit, the second pad is connected to the radio frequency back-end circuit, and the radio frequency front-end circuit and the radio frequency back-end circuit are in an off state; after completion of the test, moving away (S1120) the radio frequency test probe and welding the serial device to the first pad and the second pad so as to enable the radio frequency front-end circuit and the radio frequency back-end circuit to be in an on state; and after the moving a radio frequency test probe to a first pad of a board, transmitting the test signal in the radio frequency test probe to a radio frequency test instrument via an impedance conversion apparatus and a directional coupler , wherein a straight-through output port of the directional coupler is connected to a first measurement port of the radio frequency test instrument, and a coupling output port of the directional coupler is connected to a second measurement port of the radio frequency test instrument. moving (S11 10) a radio frequency test probe to a first pad of a board so as to allow a test signal on the first pad to be transmitted to the radio frequency test probe for testing, wherein the board comprises a radio frequency front-end circuit , a radio frequency back-end circuit , the first pad, a second pad , and a to-be-welded serial device ; the to-be-welded serial device is a device to be welded to the first pad and the second pad; the serial device is one or more components connected in series with another component; and the first pad is connected to the radio frequency front-end circuit, the second pad is connected to the radio frequency back-end circuit, and the radio frequency front-end circuit and the radio frequency back-end circuit are in an off state; after completion of the test, moving away (S1120) the radio frequency test probe and welding the serial device to the first pad and the second pad so as to enable the radio frequency front-end circuit and the radio frequency back-end circuit to be in an on state; and after the moving a radio frequency test probe to a first pad of a board, transmitting the test signal in the radio frequency test probe to a radio frequency test instrument via an impedance conversion apparatus and a directional coupler , wherein a straight-through output port of the directional coupler is connected to a first measurement port of the radio frequency test instrument, and a coupling output port of the directional coupler is connected to a second measurement port of the radio frequency test instrument. <EOS>