A method of joining comprising: bringing a BMG material to a temperature lower than the crystallization temperature of the BMG material which includes bringing a BMG material to a temperature greater than or equal to the glass transition temperature of the BMG material and lower than the crystallization temperature of the BMG material; depositing the BMG material onto a first substrate with interlock surface features such that the BMG material interlocks with the interlock surface features of the substrate; and joining a second substrate to the BMG material, wherein the second substrate includes interlock surface features such that the BMG material interlocks with the interlock surface features of both the first and second substrates, joining the first and second substrates together to produce a fully amorphous joint between the first and second substrates, further comprising forming the interlock surface features on a surface of at least one of the first or second substrates, wherein forming the interlock surface features includes forming interlock surface features with receptacles for BMG material that narrow in a direction going deeper within the substrate, wherein forming the interlock surface features includes forming interlock surface features with receptacles for BMG material that form: (i) a repeating pattern of substantially identical triangular receptacles, or (ii) an alternating pattern of two sets of different triangular receptacles, or (iii) a repeating pattern of substantially identical truncated triangular receptacles with truncated triangular teeth separating each respective adjacent pair of the receptacles. bringing a BMG material to a temperature lower than the crystallization temperature of the BMG material which includes bringing a BMG material to a temperature greater than or equal to the glass transition temperature of the BMG material and lower than the crystallization temperature of the BMG material; depositing the BMG material onto a first substrate with interlock surface features such that the BMG material interlocks with the interlock surface features of the substrate; and joining a second substrate to the BMG material, wherein the second substrate includes interlock surface features such that the BMG material interlocks with the interlock surface features of both the first and second substrates, joining the first and second substrates together to produce a fully amorphous joint between the first and second substrates, further comprising forming the interlock surface features on a surface of at least one of the first or second substrates, wherein forming the interlock surface features includes forming interlock surface features with receptacles for BMG material that narrow in a direction going deeper within the substrate, wherein forming the interlock surface features includes forming interlock surface features with receptacles for BMG material that form: (i) a repeating pattern of substantially identical triangular receptacles, or (ii) an alternating pattern of two sets of different triangular receptacles, or (iii) a repeating pattern of substantially identical truncated triangular receptacles with truncated triangular teeth separating each respective adjacent pair of the receptacles. (i) a repeating pattern of substantially identical triangular receptacles, or (ii) an alternating pattern of two sets of different triangular receptacles, or (iii) a repeating pattern of substantially identical truncated triangular receptacles with truncated triangular teeth separating each respective adjacent pair of the receptacles. <EOS>