A multi-LED chip comprising: an array of LEDs (10A-10C) arranged to transmit LED emissions through a plurality of light-transmissive portions of a substrate; a plurality of light segregation elements (176, 176A-176C, 196A-196C) arranged at least partially within the substrate, wherein light segregation elements of the plurality of light segregation elements (176, 176A-176C, 196A-196C) are arranged between different light-transmissive portions of the plurality of light-transmissive portions , the plurality of light segregation elements (176, 176A-176C, 196A-196C) is configured to reduce passage of LED emissions between the different light-transmissive portions , and the plurality of light-transmissive portions is configured to be illuminated by the array of LEDs (10A-10C) to define a plurality of pixels that includes a plurality of border portions, wherein each pixel of the plurality of pixels includes at least one border portion of the plurality of border portions; and a plurality of inter-pixel light spreading regions (177, 177A-177C, 197A-197C), configured to transmit light through border portions of the plurality of border portions to enhance inter-pixel illumination at light-emitting surface portions of the multi-LED chip , that are registered with or proximate to the plurality of light segregation elements (176, 176A-176C, 196A-196C); wherein each light-transmissive portion of the plurality of light-transmissive portions of the substrate is separated from at least one other light-transmissive portion of the plurality of light-transmissive portions of the substrate by a gap (179, 179A-179C) that: (i) has a width and a depth, (ii) is partially filled with a light segregation element of the plurality of light segregation elements (176, 176A-176C, 196A-196C), and (iii) is partially filled with at least one light-transmissive material defining an inter-pixel light spreading region of the plurality of inter-pixel light spreading regions (177, 177A-177C, 197A-197C). an array of LEDs (10A-10C) arranged to transmit LED emissions through a plurality of light-transmissive portions of a substrate; a plurality of light segregation elements (176, 176A-176C, 196A-196C) arranged at least partially within the substrate, wherein light segregation elements of the plurality of light segregation elements (176, 176A-176C, 196A-196C) are arranged between different light-transmissive portions of the plurality of light-transmissive portions , the plurality of light segregation elements (176, 176A-176C, 196A-196C) is configured to reduce passage of LED emissions between the different light-transmissive portions , and the plurality of light-transmissive portions is configured to be illuminated by the array of LEDs (10A-10C) to define a plurality of pixels that includes a plurality of border portions, wherein each pixel of the plurality of pixels includes at least one border portion of the plurality of border portions; and a plurality of inter-pixel light spreading regions (177, 177A-177C, 197A-197C), configured to transmit light through border portions of the plurality of border portions to enhance inter-pixel illumination at light-emitting surface portions of the multi-LED chip , that are registered with or proximate to the plurality of light segregation elements (176, 176A-176C, 196A-196C); wherein each light-transmissive portion of the plurality of light-transmissive portions of the substrate is separated from at least one other light-transmissive portion of the plurality of light-transmissive portions of the substrate by a gap (179, 179A-179C) that: (i) has a width and a depth, (ii) is partially filled with a light segregation element of the plurality of light segregation elements (176, 176A-176C, 196A-196C), and (iii) is partially filled with at least one light-transmissive material defining an inter-pixel light spreading region of the plurality of inter-pixel light spreading regions (177, 177A-177C, 197A-197C). <EOS>