A laser processing method using an angle or a channel as a material to be processed, the angle or channel being composed of a plurality of planes and having a predetermined plate thickness, and cutting the material with a laser beam in a direction intersecting an axis about which the material is rotated to form a product having a predetermined shape, the method comprising the steps of: for a development view representing the plurality of planes developed into a plane, setting an outer corner between the planes adjacent to each other as a development auxiliary line and setting ranges corresponding to plate thicknesses in the planes of the material as plate thickness regions between the development auxiliary line and a pair of plate thickness lines sandwiching the development auxiliary line; sequentially selecting each of the plurality of planes as a target plane and setting a region in an adjacent plane adjacent to the target plane as an evaluation region, the region in the adjacent plane including at least a range surrounded by the development auxiliary line and the plate thickness line located in the adjacent plane; calculating the position of the extremity of a profile of the product in the axial direction in the evaluation region; setting a first line segment in the target plane, the first line segment passing through the calculated position of the extremity and extending in the direction orthogonal to the axis; determining whether the first line segment interferes with the product; in one of the plurality of target planes where the first line segment does not interfere with the product, locating a processing area to form a notch or a hole in a region between the first line segment and the profile of the product; in the target plane where the processing area is located, allocating a trajectory for laser beam cutting to form a notch or a hole in the processing area and forming a notch or a hole in the material; and in the target plane where the processing area is not located, allocating a trajectory for laser beam cutting to cut the material along the profile of the product and cutting the material along the profile of the product. for a development view representing the plurality of planes developed into a plane, setting an outer corner between the planes adjacent to each other as a development auxiliary line and setting ranges corresponding to plate thicknesses in the planes of the material as plate thickness regions between the development auxiliary line and a pair of plate thickness lines sandwiching the development auxiliary line; sequentially selecting each of the plurality of planes as a target plane and setting a region in an adjacent plane adjacent to the target plane as an evaluation region, the region in the adjacent plane including at least a range surrounded by the development auxiliary line and the plate thickness line located in the adjacent plane; calculating the position of the extremity of a profile of the product in the axial direction in the evaluation region; setting a first line segment in the target plane, the first line segment passing through the calculated position of the extremity and extending in the direction orthogonal to the axis; determining whether the first line segment interferes with the product; in one of the plurality of target planes where the first line segment does not interfere with the product, locating a processing area to form a notch or a hole in a region between the first line segment and the profile of the product; in the target plane where the processing area is located, allocating a trajectory for laser beam cutting to form a notch or a hole in the processing area and forming a notch or a hole in the material; and in the target plane where the processing area is not located, allocating a trajectory for laser beam cutting to cut the material along the profile of the product and cutting the material along the profile of the product. <EOS>