A photosensitive assembly, comprising: a circuit board ; a photosensitive chip electrically connected to the circuit board ; and a shaping member disposed on the circuit board , characterized in that a lower surface of the photosensitive chip is attached to the shaping member to form an accommodating space with the shaping member and the circuit board , wherein the circuit board has at least one opening formed therethrough and communicated with the accommodating space , and wherein the accommodating space and the opening are configured so that at least one suction device can be inserted into the accommodating space through the at least one opening and attached to the lower surface of the photosensitive chip , to cause the photosensitive chip to be bent downward by pulling force applied by the suction device ; wherein the shaping member comprises a first shaping piece and a second shaping piece attached to the top of the circuit board , wherein the first shaping piece is an attached piece and has a rectangular ring-like closed shape, and the accommodating space is formed by the first shaping piece with the photosensitive chip and the circuit board , and the second shaping piece is disposed on the circuit board and is located in the accommodating space , and there is a gap between the first shaping piece and the second shaping piece , and a height of the second shaping piece is lower than that of the first shaping piece ; wherein both an upper surface of the first shaping piece and an upper surface of the second shaping piece comprise an arc-shaped surface recessed downward and inward, and the lower surface of the photosensitive chip is attached to the arc-shaped surfaces which are configured so that when the photosensitive chip is bent downward, the lower surface adapted to a focal imaging plane of the photosensitive assembly is formed. a circuit board ; a photosensitive chip electrically connected to the circuit board ; and a shaping member disposed on the circuit board , characterized in that a lower surface of the photosensitive chip is attached to the shaping member to form an accommodating space with the shaping member and the circuit board , wherein the circuit board has at least one opening formed therethrough and communicated with the accommodating space , and wherein the accommodating space and the opening are configured so that at least one suction device can be inserted into the accommodating space through the at least one opening and attached to the lower surface of the photosensitive chip , to cause the photosensitive chip to be bent downward by pulling force applied by the suction device ; wherein the shaping member comprises a first shaping piece and a second shaping piece attached to the top of the circuit board , wherein the first shaping piece is an attached piece and has a rectangular ring-like closed shape, and the accommodating space is formed by the first shaping piece with the photosensitive chip and the circuit board , and the second shaping piece is disposed on the circuit board and is located in the accommodating space , and there is a gap between the first shaping piece and the second shaping piece , and a height of the second shaping piece is lower than that of the first shaping piece ; wherein both an upper surface of the first shaping piece and an upper surface of the second shaping piece comprise an arc-shaped surface recessed downward and inward, and the lower surface of the photosensitive chip is attached to the arc-shaped surfaces which are configured so that when the photosensitive chip is bent downward, the lower surface adapted to a focal imaging plane of the photosensitive assembly is formed. <EOS>