A method of fabricating an optical filter disposed on a substrate , the optical filter comprising: a multilayer stack of a plurality of dielectric layers and a plurality of metal layers , stacked in alternation with the dielectric layers on the substrate and surrounded by the dielectric layers, and wherein each metal layer has a tapered edge extending along an entire periphery of the metal layer that is protectively covered along the entire periphery of the metal layer by at least one of the one or more dielectric layers, and wherein the one or more metal layers are not adjacent, with respect to a length of the substrate, to any other metal layer; wherein the optical filter is formed by a lift-off process comprising the steps of: providing the substrate ; applying a photoresist layer having a bilayer structure including a top layer and a bottom release layer onto the substrate ; patterning the photoresist layer to uncover a region of the substrate where the optical filter is to be disposed in such a manner that an overhang is formed in the patterned photoresist layer surrounding the filter region; forming the optical filter in the filter region with a non-continuous coating on the top layer of the photoresist layer having a thickness that is less than 70% of the thickness of the bottom release layer of the photoresist layer ; and lifting the photoresist layer with a clean lift-off to provide the multilayer stack coating without breakage . wherein each metal layer has a tapered edge extending along an entire periphery of the metal layer that is protectively covered along the entire periphery of the metal layer by at least one of the one or more dielectric layers, and wherein the one or more metal layers are not adjacent, with respect to a length of the substrate, to any other metal layer; wherein the optical filter is formed by a lift-off process comprising the steps of: providing the substrate ; applying a photoresist layer having a bilayer structure including a top layer and a bottom release layer onto the substrate ; patterning the photoresist layer to uncover a region of the substrate where the optical filter is to be disposed in such a manner that an overhang is formed in the patterned photoresist layer surrounding the filter region; forming the optical filter in the filter region with a non-continuous coating on the top layer of the photoresist layer having a thickness that is less than 70% of the thickness of the bottom release layer of the photoresist layer ; and lifting the photoresist layer with a clean lift-off to provide the multilayer stack coating without breakage . providing the substrate ; applying a photoresist layer having a bilayer structure including a top layer and a bottom release layer onto the substrate ; patterning the photoresist layer to uncover a region of the substrate where the optical filter is to be disposed in such a manner that an overhang is formed in the patterned photoresist layer surrounding the filter region; forming the optical filter in the filter region with a non-continuous coating on the top layer of the photoresist layer having a thickness that is less than 70% of the thickness of the bottom release layer of the photoresist layer ; and lifting the photoresist layer with a clean lift-off to provide the multilayer stack coating without breakage . <EOS>