Process for fabricating a device for detecting electromagnetic radiation, the detecting device comprising: - a substrate comprising a readout circuit ; - at least one thermal detector resting on the substrate , and connected to the readout circuit , comprising a detecting element (80; 60) suspended above the substrate by at least one supporting pillar ; the process comprising the following steps: o depositing, on the substrate , a first sacrificial layer (72.1); o producing, on the first sacrificial layer (72.1), at least one intermediate pad intended to form a jut , the intermediate pad being made of at least one material sensitive to a chemical etchant used subsequently to etch sacrificial layers (71, 72.1, 72.2, 73); o depositing, on the first sacrificial layer (72.1) and the intermediate pad , a second sacrificial layer (72.2); o producing, by locally etching the first and second sacrificial layers (72.1, 72.2), at least one vertical orifice that is bounded transversely by a lateral border , said orifice being positioned so that a segment of the intermediate pad protrudes into the vertical orifice , thus forming a jut ; o carrying out conformal deposition, on the lateral border of the vertical orifice , of a layer of interest that is intended to form the supporting pillar , which layer of interest then defines an empty internal space of the supporting pillar , the jut causing a local break in the continuity of the layer of interest , forming a lateral through-aperture in the supporting pillar ; o depositing a sacrificial filling layer , so as to fill the empty internal space of the supporting pillar ; o producing, on the second sacrificial layer (72.2) and the sacrificial filling layer , the detecting element (80; 60), which rests on and in contact with the supporting pillar ; o suspending the detecting element (80; 60), by etching said sacrificial layers (72.1, 72.2, 73) and the intermediate pad using said etchant, the sacrificial filling layer then being etched through the lateral through-aperture . - a substrate comprising a readout circuit ; - at least one thermal detector resting on the substrate , and connected to the readout circuit , comprising a detecting element (80; 60) suspended above the substrate by at least one supporting pillar ; o depositing, on the substrate , a first sacrificial layer (72.1); o producing, on the first sacrificial layer (72.1), at least one intermediate pad intended to form a jut , the intermediate pad being made of at least one material sensitive to a chemical etchant used subsequently to etch sacrificial layers (71, 72.1, 72.2, 73); o depositing, on the first sacrificial layer (72.1) and the intermediate pad , a second sacrificial layer (72.2); o producing, by locally etching the first and second sacrificial layers (72.1, 72.2), at least one vertical orifice that is bounded transversely by a lateral border , said orifice being positioned so that a segment of the intermediate pad protrudes into the vertical orifice , thus forming a jut ; o carrying out conformal deposition, on the lateral border of the vertical orifice , of a layer of interest that is intended to form the supporting pillar , which layer of interest then defines an empty internal space of the supporting pillar , the jut causing a local break in the continuity of the layer of interest , forming a lateral through-aperture in the supporting pillar ; o depositing a sacrificial filling layer , so as to fill the empty internal space of the supporting pillar ; o producing, on the second sacrificial layer (72.2) and the sacrificial filling layer , the detecting element (80; 60), which rests on and in contact with the supporting pillar ; o suspending the detecting element (80; 60), by etching said sacrificial layers (72.1, 72.2, 73) and the intermediate pad using said etchant, the sacrificial filling layer then being etched through the lateral through-aperture . <EOS>