A processing method of an LED display module, wherein the processing method of the LED display module comprising following steps: acquiring a first LED chip emitting blue light and a second LED chip emitting blue light, a wavelength of the first LED chip being smaller than a wavelength of the second LED chip ; placing the first LED chip on a first temporary substrate with a front surface of the first LED chip facing upward, and placing the second LED chip on a second temporary substrate with a front surface of second LED chip facing upward; packaging a bottom and a side of the first LED chip with a first reflective adhesive , and packaging a bottom and a side of the second LED chip with a second reflective adhesive ; packaging the front surface of the first LED chip with a first isolation layer , and packaging the front surface of the second LED chip with a second isolation layer ; removing the first temporary substrate to obtain a first package containing the first LED chip , and removing the second temporary substrate to obtain a second package containing the second LED chip , a height of the second package being greater than a height of the first package ; and fixing a plurality of display units to a substrate , each of the plurality of display units comprising two first packages and one second package ; spraying a red quantum layer on a front surface of one of the two first packages to obtain a red quantum package; spraying a green quantum layer on a front surface of the other one of the two first packages to obtain a green quantum package; and a front surface of the red quantum package, a front surface of the green quantum package and a front surface of the second package being flush. acquiring a first LED chip emitting blue light and a second LED chip emitting blue light, a wavelength of the first LED chip being smaller than a wavelength of the second LED chip ; placing the first LED chip on a first temporary substrate with a front surface of the first LED chip facing upward, and placing the second LED chip on a second temporary substrate with a front surface of second LED chip facing upward; packaging a bottom and a side of the first LED chip with a first reflective adhesive , and packaging a bottom and a side of the second LED chip with a second reflective adhesive ; packaging the front surface of the first LED chip with a first isolation layer , and packaging the front surface of the second LED chip with a second isolation layer ; removing the first temporary substrate to obtain a first package containing the first LED chip , and removing the second temporary substrate to obtain a second package containing the second LED chip , a height of the second package being greater than a height of the first package ; and fixing a plurality of display units to a substrate , each of the plurality of display units comprising two first packages and one second package ; spraying a red quantum layer on a front surface of one of the two first packages to obtain a red quantum package; spraying a green quantum layer on a front surface of the other one of the two first packages to obtain a green quantum package; and a front surface of the red quantum package, a front surface of the green quantum package and a front surface of the second package being flush. <EOS>