Laser cutting apparatus for shielded leads , in particular for laser cutting of shielding wires and/or shielding foils at shielded leads , comprising the following features: - provision is made of at least one laser device which is embodied to produce a laser beam ; - provision is made of a ring mirror device having a circumferential mirrored wall , which delimits a cutting chamber and through which a central axis passes; - a shielded lead to be cut by the laser beam is disposable along the central axis in the cutting chamber , - the circumferential mirrored wall is embodied to reflect the laser beam in the direction of the shielded lead , wherein the circumferential mirrored wall extends through 360° about the central axis ; - provision is moreover made of a laser beam deflection apparatus which is embodied to guide the laser beam in such a way that the laser beam enters into the cutting chamber through a laser entry opening and strikes the circumferential mirrored wall ; - the laser beam deflection apparatus is further embodied to guide the laser beam in such a way that the latter moves on a trajectory along the circumferential mirrored wall through 360° about the central axis , as a result of which the shielded lead , which is disposable in the region of the central axis within the cutting chamber , is cuttable along the entire circumference thereof by the laser beam which is reflected at the circumferential mirrored wall ; characterized by the following features: - provision is made of a telescope device which is disposed in the beam path of the laser beam ; - provision is made of a control device ; - the control device is embodied to drive the telescope device and the laser device ; - the control device is embodied to drive the telescope device in such a way that the focusing of the laser beam is altered in such a way that the latter: a) is focusable on the shielded lead with a reduced diameter; and b) is focusable on the shielded lead with an increased diameter. - provision is made of at least one laser device which is embodied to produce a laser beam ; - provision is made of a ring mirror device having a circumferential mirrored wall , which delimits a cutting chamber and through which a central axis passes; - a shielded lead to be cut by the laser beam is disposable along the central axis in the cutting chamber , - the circumferential mirrored wall is embodied to reflect the laser beam in the direction of the shielded lead , wherein the circumferential mirrored wall extends through 360° about the central axis ; - provision is moreover made of a laser beam deflection apparatus which is embodied to guide the laser beam in such a way that the laser beam enters into the cutting chamber through a laser entry opening and strikes the circumferential mirrored wall ; - the laser beam deflection apparatus is further embodied to guide the laser beam in such a way that the latter moves on a trajectory along the circumferential mirrored wall through 360° about the central axis , as a result of which the shielded lead , which is disposable in the region of the central axis within the cutting chamber , is cuttable along the entire circumference thereof by the laser beam which is reflected at the circumferential mirrored wall ; - provision is made of a telescope device which is disposed in the beam path of the laser beam ; - provision is made of a control device ; - the control device is embodied to drive the telescope device and the laser device ; - the control device is embodied to drive the telescope device in such a way that the focusing of the laser beam is altered in such a way that the latter: a) is focusable on the shielded lead with a reduced diameter; and b) is focusable on the shielded lead with an increased diameter. a) is focusable on the shielded lead with a reduced diameter; and b) is focusable on the shielded lead with an increased diameter. <EOS>