An integrated circuit (IC) package comprising: a die ; a housing to house the die; secondary leads (304a-f), at least some of the secondary leads (304b-d) attached to the die, at least one of the secondary leads comprising a first recessed portion at a first end of the secondary lead and a first outside portion being substantially flat and extending away from the housing, the first outside portion comprising a second end provided as a terminal end of the secondary lead, opposite the first end, the second end having a top surface, a bottom surface and side surfaces substantially perpendicular to the top and bottom surfaces, the second end being stepped to a wider width than a width of a portion of the secondary lead between the first end and the second end to form corners extending substantially perpendicularly between the top and bottom surfaces; and a curved component attached to the die and having two primary leads substantially flat and extending away from the housing, each primary lead located at a respective end of the curved component, the curved component comprising a second recessed portion , wherein at least one of the first recessed portion or the second recessed portion forms a locking mechanism with the housing , wherein at least one surface of the at least one secondary lead forms a bottom surface of the package, and the at least one surface is substantially flat whereby the corners extend substantially perpendicularly from the bottom surface of the package to contribute to effective soldering by facilitating solder wicking when the secondary lead is soldered to a circuit board, and wherein at least one surface of the curved component forms a bottom surface of the package. a die ; a housing to house the die; secondary leads (304a-f), at least some of the secondary leads (304b-d) attached to the die, at least one of the secondary leads comprising a first recessed portion at a first end of the secondary lead and a first outside portion being substantially flat and extending away from the housing, the first outside portion comprising a second end provided as a terminal end of the secondary lead, opposite the first end, the second end having a top surface, a bottom surface and side surfaces substantially perpendicular to the top and bottom surfaces, the second end being stepped to a wider width than a width of a portion of the secondary lead between the first end and the second end to form corners extending substantially perpendicularly between the top and bottom surfaces; and a curved component attached to the die and having two primary leads substantially flat and extending away from the housing, each primary lead located at a respective end of the curved component, the curved component comprising a second recessed portion , wherein at least one of the first recessed portion or the second recessed portion forms a locking mechanism with the housing , wherein at least one surface of the at least one secondary lead forms a bottom surface of the package, and the at least one surface is substantially flat whereby the corners extend substantially perpendicularly from the bottom surface of the package to contribute to effective soldering by facilitating solder wicking when the secondary lead is soldered to a circuit board, and wherein at least one surface of the curved component forms a bottom surface of the package. <EOS>