A system comprising: a substrate; three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702); and an interconnect hub (318c; 518; 618; 752) physically coupled to the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702), the interconnect hub (318c; 518; 618; 752) comprising: a first side; a second side opposite the first side to couple with the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702), and wherein the second side includes a plurality of electrical couplings to electrically couple at least one of the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702) to another of the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702); wherein the electrical couplings are to facilitate data transfer between at least a subset of the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702); wherein a corner of the second side of the interconnect hub (318c; 518; 618; 752) is to physically couple with a corner of the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702); wherein the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702) are tiled dies; and characterized in that the interconnect hub (318c; 518; 618; 752) is positioned between the tiled dies and the substrate. a substrate; three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702); and an interconnect hub (318c; 518; 618; 752) physically coupled to the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702), the interconnect hub (318c; 518; 618; 752) comprising: a first side; a second side opposite the first side to couple with the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702), and wherein the second side includes a plurality of electrical couplings to electrically couple at least one of the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702) to another of the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702); wherein the electrical couplings are to facilitate data transfer between at least a subset of the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702); wherein a corner of the second side of the interconnect hub (318c; 518; 618; 752) is to physically couple with a corner of the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702); wherein the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702) are tiled dies; and characterized in that the interconnect hub (318c; 518; 618; 752) is positioned between the tiled dies and the substrate. a first side; a second side opposite the first side to couple with the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702), and wherein the second side includes a plurality of electrical couplings to electrically couple at least one of the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702) to another of the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702); wherein the electrical couplings are to facilitate data transfer between at least a subset of the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702); wherein a corner of the second side of the interconnect hub (318c; 518; 618; 752) is to physically couple with a corner of the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702); wherein the three or more dies (202, 204, 206, 208; 302c, 304c; 502; 602; 702) are tiled dies; and characterized in that the interconnect hub (318c; 518; 618; 752) is positioned between the tiled dies and the substrate. <EOS>