An electromagnetic interference (EMI) grounding protection method for a connector assembly using a multi-directional conductive housing with an over-molded silicone seal , the grounding protection method comprising the steps of: mounting said multi-directional conductive housing along with said over-molded silicone seal onto a metallic device by a bolt secured into a metallic compression limiter which is inside a side aperture of the conductive housing , passing a plurality of pads extending from a substantially flat bottom-end portion of a base portion of said multi-directional conductive housing through slits passing through a base of said silicone seal , wherein said pads contact the metallic device , the silicone seal being located between said multi-directional conductive housing and said metallic device , conducting said EMI generated by a source toward a metallic braided shield , said metallic braided shield being secured and mounted onto said multi-directional conductive housing by a metallic clamp ; and conducting said EMI through: a first EMI path from said metallic braided shield to said metallic clamp and to said multi-directional conductive housing , and thereafter conducting said EMI from said multi-directional conductive housing to said metallic compression limiter and to the bolt , and ultimately to the metallic device , and a second EMI path from said metallic braided shield to said metallic clamp and to said multi-directional conductive housing ; and thereafter conducting said EMI from said multi-directional conductive housing and through said pads , and ultimately to the metallic device . mounting said multi-directional conductive housing along with said over-molded silicone seal onto a metallic device by a bolt secured into a metallic compression limiter which is inside a side aperture of the conductive housing , passing a plurality of pads extending from a substantially flat bottom-end portion of a base portion of said multi-directional conductive housing through slits passing through a base of said silicone seal , wherein said pads contact the metallic device , the silicone seal being located between said multi-directional conductive housing and said metallic device , conducting said EMI generated by a source toward a metallic braided shield , said metallic braided shield being secured and mounted onto said multi-directional conductive housing by a metallic clamp ; and conducting said EMI through: a first EMI path from said metallic braided shield to said metallic clamp and to said multi-directional conductive housing , and thereafter conducting said EMI from said multi-directional conductive housing to said metallic compression limiter and to the bolt , and ultimately to the metallic device , and a second EMI path from said metallic braided shield to said metallic clamp and to said multi-directional conductive housing ; and thereafter conducting said EMI from said multi-directional conductive housing and through said pads , and ultimately to the metallic device . a first EMI path from said metallic braided shield to said metallic clamp and to said multi-directional conductive housing , and thereafter conducting said EMI from said multi-directional conductive housing to said metallic compression limiter and to the bolt , and ultimately to the metallic device , and a second EMI path from said metallic braided shield to said metallic clamp and to said multi-directional conductive housing ; and thereafter conducting said EMI from said multi-directional conductive housing and through said pads , and ultimately to the metallic device . <EOS>