A communication apparatus, comprising: a bottom case and a printed circuit board mounted on the bottom case , the communication apparatus further comprising a heat-conductive mounting strip , the printed circuit board being mounted on the bottom case by means of the heat-conductive mounting strip , wherein a lower end surface of the heat-conductive mounting strip is connected to the bottom case , and an upper end surface of the heat-conductive mounting strip is connected to the printed circuit board , wherein the printed circuit board is welded with a component which generates heat, the printed circuit board comprises a device arranging area and a device prohibition area which is provided around the device arranging area and located at an edge of the printed circuit board and the heat-conductive mounting strip is connected to the device prohibition area of the printed circuit board , wherein a surface of the device prohibition area of the printed circuit board is laid with a heat conductive layer , the heat conductive layer is laid on the edge of the bottom of the printed circuit board and is brought into surface contact with the heat-conductive mounting strip , and the heat conductive layer is connected to a ground layer copper sheet in the printed circuit board through a first heat dissipation via hole , and wherein a welding part between the component and the printed circuit board is provided with a second heat dissipation via hole , and the component is connected to the ground layer copper sheet in the printed circuit board through the second heat dissipation via hole , characterized in that a recess is provided on the printed circuit board , the heat-conductive mounting strip comprises: a support portion and a connecting portion , the printed circuit board is supported on the support portion , and the connecting portion passes through the recess and then is connected with a radiator on the printed circuit board , so that the heat-conductive mounting strip provides surface contact with the bottom case for both the printed circuit board and the radiator at the same time, wherein the radiator is coupled to components which are mainly cooled by the radiator . wherein the printed circuit board is welded with a component which generates heat, the printed circuit board comprises a device arranging area and a device prohibition area which is provided around the device arranging area and located at an edge of the printed circuit board and the heat-conductive mounting strip is connected to the device prohibition area of the printed circuit board , wherein a surface of the device prohibition area of the printed circuit board is laid with a heat conductive layer , the heat conductive layer is laid on the edge of the bottom of the printed circuit board and is brought into surface contact with the heat-conductive mounting strip , and the heat conductive layer is connected to a ground layer copper sheet in the printed circuit board through a first heat dissipation via hole , and wherein a welding part between the component and the printed circuit board is provided with a second heat dissipation via hole , and the component is connected to the ground layer copper sheet in the printed circuit board through the second heat dissipation via hole , characterized in that a recess is provided on the printed circuit board , the heat-conductive mounting strip comprises: a support portion and a connecting portion , the printed circuit board is supported on the support portion , and the connecting portion passes through the recess and then is connected with a radiator on the printed circuit board , so that the heat-conductive mounting strip provides surface contact with the bottom case for both the printed circuit board and the radiator at the same time, wherein the radiator is coupled to components which are mainly cooled by the radiator . <EOS>