Method for surface-treating at least one surface of a part , which method is characterized in that it comprises at least: - a measurement step, during which movement means , to which the part is secured at the level of a support forming part of the movement means , are moved at a speed of movement that varies according to the local geometry of the part , along a predetermined trajectory and, in a controlled manner, by a management and control unit , relative to deposition means which are not ejecting any substance , and during which a set of instantaneous velocities (v1, v2, v3, v4, v5), over at least a fraction of the surface of the part , is determined by means of a measurement sensor controlled by the management and control unit , then data representative of this set of instantaneous velocities (v1, v2, v3, v4, v5) are transmitted and recorded in a computer , - a signal processing step, subsequent to the measurement step, during which a microcontroller determines, from the data representative of the set of instantaneous velocities (v1, v2, v3, v4, v5) that were previously transmitted by the computer to the microcontroller , a pulse train signal (S) representative of a set of frequencies of ejection of a substance to be deposited by the deposition means on said at least a fraction of the surface of the part , and records the pulse train signal (S) in a storage memory of the microcontroller , - a deposition step, subsequent to the signal processing step, during which the movement means are moved in a controlled manner, by the management and control unit relative to the deposition means , along the determined trajectory, and during which, in a synchronized manner, the microcontroller transmits the pulse train signal (S) to the deposition means , and the deposition means eject at least one substance according to the received pulse train signal (S) in order to deposit the substance on said at least a fraction of the surface of the part . - a measurement step, during which movement means , to which the part is secured at the level of a support forming part of the movement means , are moved at a speed of movement that varies according to the local geometry of the part , along a predetermined trajectory and, in a controlled manner, by a management and control unit , relative to deposition means which are not ejecting any substance , and during which a set of instantaneous velocities (v1, v2, v3, v4, v5), over at least a fraction of the surface of the part , is determined by means of a measurement sensor controlled by the management and control unit , then data representative of this set of instantaneous velocities (v1, v2, v3, v4, v5) are transmitted and recorded in a computer , - a signal processing step, subsequent to the measurement step, during which a microcontroller determines, from the data representative of the set of instantaneous velocities (v1, v2, v3, v4, v5) that were previously transmitted by the computer to the microcontroller , a pulse train signal (S) representative of a set of frequencies of ejection of a substance to be deposited by the deposition means on said at least a fraction of the surface of the part , and records the pulse train signal (S) in a storage memory of the microcontroller , - a deposition step, subsequent to the signal processing step, during which the movement means are moved in a controlled manner, by the management and control unit relative to the deposition means , along the determined trajectory, and during which, in a synchronized manner, the microcontroller transmits the pulse train signal (S) to the deposition means , and the deposition means eject at least one substance according to the received pulse train signal (S) in order to deposit the substance on said at least a fraction of the surface of the part . <EOS>