A coil device , comprising: a base (50, 50A 50B); a cover facing the base (50, 50A 50B) and forming a receiving space (R) between the base (50, 50A 50B) and the cover ; a casing disposed inside the receiving space (R) and containing a coil therein; a substrate disposed inside the receiving space (R) and having a through hole passing through the substrate along a facing direction of the base and the cover ; and a support portion (A, A1, A2, B, B1, B2) disposed in the through hole , wherein the support portion (A, A1, A2, B, B1, B2) has a strength greater than a strength of the substrate , wherein the support portion (A, A1, A2, B, B1, B2) has a height greater than a thickness of the substrate , wherein the substrate includes: a first substrate disposed between the cover and the casing ; and a second substrate disposed between the casing and the base , wherein the support portion (A, A1, A2) disposed in the through hole of the first substrate is formed by at least one of a first protrusion formed on the cover and protruding toward the casing and a second protrusion formed on the casing and protruding toward the cover , and wherein the support portion (B, B1, B2) disposed in the through hole of the second substrate is formed by at least one of a third protrusion formed on the casing and protruding toward the base and a fourth protrusion formed on the base and protruding toward the casing . a base (50, 50A 50B); a cover facing the base (50, 50A 50B) and forming a receiving space (R) between the base (50, 50A 50B) and the cover ; a casing disposed inside the receiving space (R) and containing a coil therein; a substrate disposed inside the receiving space (R) and having a through hole passing through the substrate along a facing direction of the base and the cover ; and a support portion (A, A1, A2, B, B1, B2) disposed in the through hole , wherein the support portion (A, A1, A2, B, B1, B2) has a strength greater than a strength of the substrate , wherein the support portion (A, A1, A2, B, B1, B2) has a height greater than a thickness of the substrate , wherein the substrate includes: a first substrate disposed between the cover and the casing ; and a second substrate disposed between the casing and the base , wherein the support portion (A, A1, A2) disposed in the through hole of the first substrate is formed by at least one of a first protrusion formed on the cover and protruding toward the casing and a second protrusion formed on the casing and protruding toward the cover , and wherein the support portion (B, B1, B2) disposed in the through hole of the second substrate is formed by at least one of a third protrusion formed on the casing and protruding toward the base and a fourth protrusion formed on the base and protruding toward the casing . a first substrate disposed between the cover and the casing ; and a second substrate disposed between the casing and the base , wherein the support portion (A, A1, A2) disposed in the through hole of the first substrate is formed by at least one of a first protrusion formed on the cover and protruding toward the casing and a second protrusion formed on the casing and protruding toward the cover , and wherein the support portion (B, B1, B2) disposed in the through hole of the second substrate is formed by at least one of a third protrusion formed on the casing and protruding toward the base and a fourth protrusion formed on the base and protruding toward the casing . <EOS>