A computer-implemented method for providing a quality metric suitable for improving overlay control in a semiconductor wafer fabrication, comprising: Acquiring a plurality of overlay metrology measurement signals from a plurality of metrology targets distributed across one or more fields of a wafer of a lot of wafers, each overlay metrology measurement signal corresponding with a metrology target of the plurality of metrology targets, the plurality of overlay metrology measurement signals acquired utilizing a first measurement recipe; Determining a plurality of overlay estimates for each of the plurality of overlay metrology measurement signals by applying a plurality of overlay algorithms to each overlay metrology measurement signal, each overlay estimate determined utilizing one of the overlay algorithms, wherein the plurality of overlay algorithms are guaranteed to give the same overlay estimate if the metrology measurement signal is perfectly symmetric; Generating a plurality of overlay estimate distributions by generating an overlay estimate distribution for each of the plurality of overlay metrology measurement signals from the plurality of metrology targets utilizing the plurality of overlay estimates; and generating a first plurality of quality metrics utilizing the generated plurality of overlay estimate distributions, wherein each quality metric corresponds with one overlay estimate distribution of the generated plurality of overlay estimate distributions, each quality metric is a function of a width of a corresponding generated overlay estimate distribution which vanishes for a perfectly symmetric overlay metrology measurement signal and which is approximately proportional to the inaccuracy for an asymmetric overlay metrology measurement signal. Acquiring a plurality of overlay metrology measurement signals from a plurality of metrology targets distributed across one or more fields of a wafer of a lot of wafers, each overlay metrology measurement signal corresponding with a metrology target of the plurality of metrology targets, the plurality of overlay metrology measurement signals acquired utilizing a first measurement recipe; Determining a plurality of overlay estimates for each of the plurality of overlay metrology measurement signals by applying a plurality of overlay algorithms to each overlay metrology measurement signal, each overlay estimate determined utilizing one of the overlay algorithms, wherein the plurality of overlay algorithms are guaranteed to give the same overlay estimate if the metrology measurement signal is perfectly symmetric; Generating a plurality of overlay estimate distributions by generating an overlay estimate distribution for each of the plurality of overlay metrology measurement signals from the plurality of metrology targets utilizing the plurality of overlay estimates; and generating a first plurality of quality metrics utilizing the generated plurality of overlay estimate distributions, wherein each quality metric corresponds with one overlay estimate distribution of the generated plurality of overlay estimate distributions, each quality metric is a function of a width of a corresponding generated overlay estimate distribution which vanishes for a perfectly symmetric overlay metrology measurement signal and which is approximately proportional to the inaccuracy for an asymmetric overlay metrology measurement signal. <EOS>