A device for producing a joined card with a light-transparent window, with a film joining unit for joining a carrier film to a single-layer or multi-layer card substrate , and with a punching unit , which has a die holder fixed to a punching stand , on which a first die is present, to which a first punch for punching the card substrate is assigned, and on which a second die is present, to which a second punch , which can be moved coaxially to the first punch and is formed with the same contour as the latter, is assigned for punching a window substrate , the first die being arranged in a displacement direction of the punches at a distance with respect to the second die , wherein the punching unit is adjustable perpendicularly with respect to the direction of adjustment of the punches at least between a punching position and a joining position, wherein, in the punching position, the first punch and the first die are positioned relative to the card substrate in such a way that they create an opening in the card substrate during the adjusting movement of the first punch , wherein the second punch and the second die are positioned relative to the window substrate in such a way that these punch out a window part adapted to the dimensions of the opening from the window substrate during the adjusting movement of the second punch in order to insert the window part into the opening by the simultaneous movement of the first punch together with the second punch , and wherein, in the joining position, a region present on the first die is present as an abutment for a pressure plate of the film joining unit . with a film joining unit for joining a carrier film to a single-layer or multi-layer card substrate , and with a punching unit , which has a die holder fixed to a punching stand , on which a first die is present, to which a first punch for punching the card substrate is assigned, and on which a second die is present, to which a second punch , which can be moved coaxially to the first punch and is formed with the same contour as the latter, is assigned for punching a window substrate , the first die being arranged in a displacement direction of the punches at a distance with respect to the second die , which has a die holder fixed to a punching stand , on which a first die is present, to which a first punch for punching the card substrate is assigned, and on which a second die is present, to which a second punch , which can be moved coaxially to the first punch and is formed with the same contour as the latter, is assigned for punching a window substrate , the first die being arranged in a displacement direction of the punches at a distance with respect to the second die , wherein the punching unit is adjustable perpendicularly with respect to the direction of adjustment of the punches at least between a punching position and a joining position, wherein, in the punching position, the first punch and the first die are positioned relative to the card substrate in such a way that they create an opening in the card substrate during the adjusting movement of the first punch , wherein the second punch and the second die are positioned relative to the window substrate in such a way that these punch out a window part adapted to the dimensions of the opening from the window substrate during the adjusting movement of the second punch in order to insert the window part into the opening by the simultaneous movement of the first punch together with the second punch , and wherein, in the joining position, a region present on the first die is present as an abutment for a pressure plate of the film joining unit . <EOS>