A light-emitting diode display comprising: an auxiliary cathode (ACT) placed on a substrate (SUB); a passivation film covering the auxiliary cathode (ACT); a planarization film (OC) stacked on the passivation film (PAS); an under-cut opening (OH) formed in the passivation film (PAS) and the planarization film (OC), and exposing an end of the auxiliary cathode (ACT); a connecting terminal (CT) that makes contact with a top surface of the end of the auxiliary cathode exposed through the under-cut opening (OH), an end of the connecting terminal protruding into the under-cut opening (OH), the connecting terminal extending beyond the end of the auxiliary cathode (ACT); an under-area (UA) formed between the end of the connecting terminal (CT) and the end of the auxiliary cathode (ACT), whereby the under-area is a cave-like space in the under-cut opening (OH), formed by overetching the auxiliary cathode (ACT) under the connecting terminal (CT); a bank (BN) that lies on the planarization film (OC) and exposes the entire under-cut opening (OH) in a larger size than the under-cut opening (OH); an emission layer (OL) that covers a surface of the connecting terminal (CT) in the under-cut opening (OH), and is not applied to the under-area (UA) and exposes a side of the connecting terminal (CT) in the under-cut opening (OH); a cathode (CAT) that is stacked on the emission layer (OL), the cathode making contact with the side of the connecting terminal (CT) not covered by the emission layer (OL), and extending into the under-area (UA); and a dummy bank (BND) that comes into direct contact with the end of the auxiliary cathode (ACT) in the under-area (UA). an auxiliary cathode (ACT) placed on a substrate (SUB); a passivation film covering the auxiliary cathode (ACT); a planarization film (OC) stacked on the passivation film (PAS); an under-cut opening (OH) formed in the passivation film (PAS) and the planarization film (OC), and exposing an end of the auxiliary cathode (ACT); a connecting terminal (CT) that makes contact with a top surface of the end of the auxiliary cathode exposed through the under-cut opening (OH), an end of the connecting terminal protruding into the under-cut opening (OH), the connecting terminal extending beyond the end of the auxiliary cathode (ACT); an under-area (UA) formed between the end of the connecting terminal (CT) and the end of the auxiliary cathode (ACT), whereby the under-area is a cave-like space in the under-cut opening (OH), formed by overetching the auxiliary cathode (ACT) under the connecting terminal (CT); a bank (BN) that lies on the planarization film (OC) and exposes the entire under-cut opening (OH) in a larger size than the under-cut opening (OH); an emission layer (OL) that covers a surface of the connecting terminal (CT) in the under-cut opening (OH), and is not applied to the under-area (UA) and exposes a side of the connecting terminal (CT) in the under-cut opening (OH); a cathode (CAT) that is stacked on the emission layer (OL), the cathode making contact with the side of the connecting terminal (CT) not covered by the emission layer (OL), and extending into the under-area (UA); and a dummy bank (BND) that comes into direct contact with the end of the auxiliary cathode (ACT) in the under-area (UA). <EOS>