A microelectromechanical systems, MEMS, package , comprising: a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width; a seal ring assembly on an upper surface of the substrate, the seal ring assembly including an inner seal ring adjacent to at least one MEMS device and an outer seal ring adjacent at least one of the outer edges of the substrate, wherein one of the inner seal ring or outer seal ring is a continuous seal ring , and the other seal ring is a non-continuous seal ring ; and a window lid on the seal ring assembly defining a gap and a cavity region , the gap and the cavity region each formed between the substrate and the window lid; wherein the window lid comprises an inner lip extending from the ends of a lower surface of the window lid, the inner lip sealed against the seal assembly, wherein the gap is defined between the inner lip and the substrate ; wherein the at least one MEMS device includes an energy pixel array on the upper surface of the substrate, and at least one reference pixel on the upper surface of the substrate that provides a reference to the pixel array , wherein the cavity region contains the energy pixel array ; wherein the gap contains the reference pixel , the window lid and seal assembly thermally isolating the cavity region and the gap from an external environment surrounding the MEMS package and forming an infrared sensor device; wherein the inner seal ring and the outer seal ring each surround the cavity region ; wherein the seal ring assembly anchors the window lid to the substrate at the outer seal ring such that deflection of the window lid into the gap is reduced, wherein the seal ring assembly creates a hermetic seal that protects the gap from an external environment surrounding the MEMS package . a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width; a seal ring assembly on an upper surface of the substrate, the seal ring assembly including an inner seal ring adjacent to at least one MEMS device and an outer seal ring adjacent at least one of the outer edges of the substrate, wherein one of the inner seal ring or outer seal ring is a continuous seal ring , and the other seal ring is a non-continuous seal ring ; and a window lid on the seal ring assembly defining a gap and a cavity region , the gap and the cavity region each formed between the substrate and the window lid; wherein the window lid comprises an inner lip extending from the ends of a lower surface of the window lid, the inner lip sealed against the seal assembly, wherein the gap is defined between the inner lip and the substrate ; wherein the at least one MEMS device includes an energy pixel array on the upper surface of the substrate, and at least one reference pixel on the upper surface of the substrate that provides a reference to the pixel array , wherein the cavity region contains the energy pixel array ; wherein the gap contains the reference pixel , the window lid and seal assembly thermally isolating the cavity region and the gap from an external environment surrounding the MEMS package and forming an infrared sensor device; wherein the inner seal ring and the outer seal ring each surround the cavity region ; wherein the seal ring assembly anchors the window lid to the substrate at the outer seal ring such that deflection of the window lid into the gap is reduced, wherein the seal ring assembly creates a hermetic seal that protects the gap from an external environment surrounding the MEMS package . <EOS>