A sensor module comprising: a substrate having a top surface and a back surface , the top surface extending in a first direction (x) and a second direction (y) perpendicular to the first direction (x); a sensor element mounted on the top surface of the substrate ; an external terminal formed on the back surface of the substrate ; and a case fixed to the substrate so as to cover the sensor element, wherein the case has a top plate part having first and second edges extending in the first direction (x), having third and fourth edges extending in the second direction (y), and having a plurality of through holes , and wherein the top plate part has a center area and an outside area each having no through holes and a through hole formation area having the plurality of through holes , the through hole formation area being positioned so as to surround the center area , the outside area being positioned so as to surround the through hole formation area , the through hole formation area has a ring shape, characterized in that a center position of the center area coincides with the center position of the top plate part and the through hole formation area includes four linear parts (41B 1 ) and four corner parts (41B 2 ), wherein at least three through holes are arranged in each of the linear parts (41B 1 ) and each corner part (41B 2 ) connecting two linear parts (41B 1 ), and wherein each corner part (41B 2 ) is positioned in the vicinity of a corner portion of the top plate part and constitutes a clearance area having no through holes , thereby a space between adjacent two through holes belonging to different linear parts (41B 1 ) is greater than a space between adjacent two through holes belonging to the same linear part (41B 1 ), and at least one of the through holes overlaps the sensor element as viewed in a third direction (z) perpendicular to the first and second directions (x, y). a substrate having a top surface and a back surface , the top surface extending in a first direction (x) and a second direction (y) perpendicular to the first direction (x); a sensor element mounted on the top surface of the substrate ; an external terminal formed on the back surface of the substrate ; and a case fixed to the substrate so as to cover the sensor element, wherein the case has a top plate part having first and second edges extending in the first direction (x), having third and fourth edges extending in the second direction (y), and having a plurality of through holes , and wherein the top plate part has a center area and an outside area each having no through holes and a through hole formation area having the plurality of through holes , the through hole formation area being positioned so as to surround the center area , the outside area being positioned so as to surround the through hole formation area , the through hole formation area has a ring shape, a center position of the center area coincides with the center position of the top plate part and the through hole formation area includes four linear parts (41B 1 ) and four corner parts (41B 2 ), wherein at least three through holes are arranged in each of the linear parts (41B 1 ) and each corner part (41B 2 ) connecting two linear parts (41B 1 ), and wherein each corner part (41B 2 ) is positioned in the vicinity of a corner portion of the top plate part and constitutes a clearance area having no through holes , thereby a space between adjacent two through holes belonging to different linear parts (41B 1 ) is greater than a space between adjacent two through holes belonging to the same linear part (41B 1 ), and at least one of the through holes overlaps the sensor element as viewed in a third direction (z) perpendicular to the first and second directions (x, y). <EOS>