A method of manufacturing an electronic assembly, the method comprising: - obtaining (110; 610) a first substrate film for accommodating electronics, wherein the first substrate film defines a first side and an opposite side, - providing (120; 720), optionally through utilizing printed electronics technology such as screen printing, at least a first electrical contact pad onto a portion of the first substrate film on the first side of the first substrate film , and providing one or several electronics components (316-318) onto a portion of the first substrate film on the first side, wherein the first electrical contact pad is arranged in electrical connection to the one or several electronics components (316-318), - coupling an electrically conductive member (320; 520) to the first electrical contact pad , wherein the electrically conductive member (320; 520) is an elastic electrically conductive member, such as an electrically conductive spring connector, and, subsequently, - molding , such as injection molding, a second material layer onto the first side of the first substrate film to embed the elastic electrically conductive member (320; 520) and the one or several electronics components (316-318) in the second material layer utilizing a mold structure defining a cavity for molding, wherein the elastic electrically conductive member (320; 520) is arranged to extend during the molding from the first electrical contact pad through the cavity to be in contact with an element, such as a part of the mold structure or a film or a spacer or a conductor, on a different, preferably the opposite, side of the cavity with respect to the first electrical contact pad and to compress against the element, the element being on the first side of the first substrate film , for maintaining at least a part of the elastic electrically conductive member (320; 520) accessible after the molding to provide an electrical connection through the second material layer to the first electrical contact pad . - obtaining (110; 610) a first substrate film for accommodating electronics, wherein the first substrate film defines a first side and an opposite side, - providing (120; 720), optionally through utilizing printed electronics technology such as screen printing, at least a first electrical contact pad onto a portion of the first substrate film on the first side of the first substrate film , and providing one or several electronics components (316-318) onto a portion of the first substrate film on the first side, wherein the first electrical contact pad is arranged in electrical connection to the one or several electronics components (316-318), - coupling an electrically conductive member (320; 520) to the first electrical contact pad , wherein the electrically conductive member (320; 520) is an elastic electrically conductive member, such as an electrically conductive spring connector, and, subsequently, - molding , such as injection molding, a second material layer onto the first side of the first substrate film to embed the elastic electrically conductive member (320; 520) and the one or several electronics components (316-318) in the second material layer utilizing a mold structure defining a cavity for molding, wherein the elastic electrically conductive member (320; 520) is arranged to extend during the molding from the first electrical contact pad through the cavity to be in contact with an element, such as a part of the mold structure or a film or a spacer or a conductor, on a different, preferably the opposite, side of the cavity with respect to the first electrical contact pad and to compress against the element, the element being on the first side of the first substrate film , for maintaining at least a part of the elastic electrically conductive member (320; 520) accessible after the molding to provide an electrical connection through the second material layer to the first electrical contact pad . <EOS>