A method of forming a flexible array of piezoelectric micromechanical ultrasonic transducers, PMUTs, comprising: providing a carrier configured to support the flexible array of PMUTs; providing a release layer configured to adhere the flexible array of PMUTs to the carrier ; forming the flexible array of PMUTs over the release layer , comprising: for each PMUT in the flexible array of PMUTs, laminating a first polymer layer configured to support the PMUT; depositing, over the first polymer layer , a sacrificial material configured to pattern a cavity of the PMUT; depositing a mechanical layer configured to provide planarization to the PMUT; depositing, over the mechanical layer , a first electrode configured to be coupled to a circuit ground plane; depositing a piezoelectric layer configured to separate the first electrode and a second electrode ; depositing the second electrode configured to be coupled to a signal; and creating patterns on the first electrode , the piezoelectric material , and the second electrode configured to route control signals of the PMUT; and removing the release layer to separate the flexible array of PMUTs from the carrier . providing a carrier configured to support the flexible array of PMUTs; providing a release layer configured to adhere the flexible array of PMUTs to the carrier ; forming the flexible array of PMUTs over the release layer , comprising: for each PMUT in the flexible array of PMUTs, laminating a first polymer layer configured to support the PMUT; depositing, over the first polymer layer , a sacrificial material configured to pattern a cavity of the PMUT; depositing a mechanical layer configured to provide planarization to the PMUT; depositing, over the mechanical layer , a first electrode configured to be coupled to a circuit ground plane; depositing a piezoelectric layer configured to separate the first electrode and a second electrode ; depositing the second electrode configured to be coupled to a signal; and creating patterns on the first electrode , the piezoelectric material , and the second electrode configured to route control signals of the PMUT; and removing the release layer to separate the flexible array of PMUTs from the carrier . for each PMUT in the flexible array of PMUTs, laminating a first polymer layer configured to support the PMUT; depositing, over the first polymer layer , a sacrificial material configured to pattern a cavity of the PMUT; depositing a mechanical layer configured to provide planarization to the PMUT; depositing, over the mechanical layer , a first electrode configured to be coupled to a circuit ground plane; depositing a piezoelectric layer configured to separate the first electrode and a second electrode ; depositing the second electrode configured to be coupled to a signal; and creating patterns on the first electrode , the piezoelectric material , and the second electrode configured to route control signals of the PMUT; and laminating a first polymer layer configured to support the PMUT; depositing, over the first polymer layer , a sacrificial material configured to pattern a cavity of the PMUT; depositing a mechanical layer configured to provide planarization to the PMUT; depositing, over the mechanical layer , a first electrode configured to be coupled to a circuit ground plane; depositing a piezoelectric layer configured to separate the first electrode and a second electrode ; depositing the second electrode configured to be coupled to a signal; and creating patterns on the first electrode , the piezoelectric material , and the second electrode configured to route control signals of the PMUT; and removing the release layer to separate the flexible array of PMUTs from the carrier . <EOS>