A printed circuit board arrangement (100; 200; 400) comprising: a printed circuit board (110; 210; 410) having a first side (111; 211; 411) and a second side (112; 212; 412) and an electrical connection (113; 213;4 13) electrically connecting a first conductive layer (117; 217; 417) and a second conductive layer (117; 217; 417) of the printed circuit board (110; 210; 410), the electrical connection (113; 213; 413) comprises: a passage (116; 216; 416) extending through the printed circuit board (110; 210; 410) from the first side (111; 211; 411) to the second side (112; 212; 412) of the printed circuit board (110; 210; 410) between the first conductive layer (117; 217; 417) and the second conductive layer (117; 217; 417), electrically conducting material (114; 214; 414) formed on walls (115; 215; 415) of the passage (116; 216; 416), said electrically conducting material (114; 214; 414) forming a first path, electrically connecting the first conductive layer (117; 217; 417) with the second conductive layer (117;217;417),and at least one first ball (120; 220; 420) enclosed by the passage (116; 216; 416), said at least one first ball (120; 220; 420) being electrically conducting, said at least one first ball (120; 220;4 20) having a diameter which is equal to or smaller than the length and diameter of the passage (116; 216; 416), wherein the passage is filled or partially filled with solder so as to achieve a low ohmic/resistance contact between the at least one first ball and the wall; wherein the at least one first ball (120; 220; 420) forms part of a second electrical path between the first conductive layer (117; 217; 417) and second conductive layer (117; 217; 417) of the printed circuit board (110; 210; 410), said second electrical path having a lower resistance than the first path, characterized in that , said at least one first ball (120; 220; 420) comprises one or a plurality of grooves, notches and/or channels for improving outgassing, ventilation and/or wetting. a passage (116; 216; 416) extending through the printed circuit board (110; 210; 410) from the first side (111; 211; 411) to the second side (112; 212; 412) of the printed circuit board (110; 210; 410) between the first conductive layer (117; 217; 417) and the second conductive layer (117; 217; 417), electrically conducting material (114; 214; 414) formed on walls (115; 215; 415) of the passage (116; 216; 416), said electrically conducting material (114; 214; 414) forming a first path, electrically connecting the first conductive layer (117; 217; 417) with the second conductive layer (117;217;417),and at least one first ball (120; 220; 420) enclosed by the passage (116; 216; 416), said at least one first ball (120; 220; 420) being electrically conducting, said at least one first ball (120; 220;4 20) having a diameter which is equal to or smaller than the length and diameter of the passage (116; 216; 416), wherein the passage is filled or partially filled with solder so as to achieve a low ohmic/resistance contact between the at least one first ball and the wall; wherein the at least one first ball (120; 220; 420) forms part of a second electrical path between the first conductive layer (117; 217; 417) and second conductive layer (117; 217; 417) of the printed circuit board (110; 210; 410), said second electrical path having a lower resistance than the first path, characterized in that , said at least one first ball (120; 220; 420) comprises one or a plurality of grooves, notches and/or channels for improving outgassing, ventilation and/or wetting. <EOS>