Method for mounting an electrical component on a substrate , wherein in the method • the component has a bottom side facing towards the substrate and has a top side situated opposite said bottom side, • the bottom side of the component is mechanically connected to the assembly provided by the substrate by formation of a joining connection , • the top side of the component and a mounting side of the substrate are mechanically connected by way of a contacting structure by formation of joining connections , • the joining connections that are formed during the joining process are situated in at least two different joining levels , • the contacting structure is constructed in the form of conductor paths running on the inner side of a cover , wherein • the cover , during the mounting process, traverses the component , • the cover , during the mounting process, is placed onto the mounting side of the substrate , wherein mechanical contacting is generated between the contacting structure and the substrate within a first joining level which is provided by the mounting side of the substrate , wherein the bottom side of the component is situated within the first joining level , • wherein, during the mounting process, on the inner side of the cover , electrical contacting is generated between the contacting structure and the component within a second joining level at the level of the top side of the component, wherein the top side of the component is situated within the second joining level , characterized in that • the substrate , the component and the cover are assembled before • all the joining connections on the component in the first joining level and on the component in the second joining level are completed in one and the same working step by way of a temperature increase or a temperature and pressure increase, wherein the cover is designed as a component produced by technology of the "Low Temperature Co-Fired Ceramics" type, LTCC component, or as a component produced by technology of the "Moulded Interconnect Device" type, MID component. • the component has a bottom side facing towards the substrate and has a top side situated opposite said bottom side, • the bottom side of the component is mechanically connected to the assembly provided by the substrate by formation of a joining connection , • the top side of the component and a mounting side of the substrate are mechanically connected by way of a contacting structure by formation of joining connections , • the joining connections that are formed during the joining process are situated in at least two different joining levels , • the contacting structure is constructed in the form of conductor paths running on the inner side of a cover , wherein • the cover , during the mounting process, traverses the component , • the cover , during the mounting process, is placed onto the mounting side of the substrate , wherein mechanical contacting is generated between the contacting structure and the substrate within a first joining level which is provided by the mounting side of the substrate , wherein the bottom side of the component is situated within the first joining level , • wherein, during the mounting process, on the inner side of the cover , electrical contacting is generated between the contacting structure and the component within a second joining level at the level of the top side of the component, wherein the top side of the component is situated within the second joining level , characterized in that • the substrate , the component and the cover are assembled before • all the joining connections on the component in the first joining level and on the component in the second joining level are completed in one and the same working step by way of a temperature increase or a temperature and pressure increase, <EOS>