A temperature sensing system comprising: an electronic component mounted to a first printed circuit board ; a temperature sensing element bonded to an exterior surface of the electronic component and configured to sense a temperature at an interior of the electronic component ; a flexible cable operatively connected to the temperature sensing element , wherein the flexible cable can be restrained by being folded upon itself or rolled up; and a second printed circuit board operatively connected to a distal end of the flexible cable , wherein a signal conditioning unit is mounted to the second printed circuit board , wherein at least one additional circuit element is mounted to the second printed circuit board , wherein the second printed circuit board is mounted to the first printed circuit board , and wherein the signal conditioning unit is configured to: receive a signal from the temperature sensing element ; and output a signal indicative of the temperature at the interior of the electronic component , wherein the flexible cable comprises a flat and flexible plastic film with multiple metallic conductors, a printed circuit board (PCB) layer is bonded to the temperature sensing element , and a heat conductive bonding layer is thermally connected to the temperature sensing element through the PCB layer with a heat conductive vertical interconnect access . an electronic component mounted to a first printed circuit board ; a temperature sensing element bonded to an exterior surface of the electronic component and configured to sense a temperature at an interior of the electronic component ; a flexible cable operatively connected to the temperature sensing element , wherein the flexible cable can be restrained by being folded upon itself or rolled up; and a second printed circuit board operatively connected to a distal end of the flexible cable , wherein a signal conditioning unit is mounted to the second printed circuit board , wherein at least one additional circuit element is mounted to the second printed circuit board , wherein the second printed circuit board is mounted to the first printed circuit board , and wherein the signal conditioning unit is configured to: receive a signal from the temperature sensing element ; and output a signal indicative of the temperature at the interior of the electronic component , wherein the flexible cable comprises a flat and flexible plastic film with multiple metallic conductors, a printed circuit board (PCB) layer is bonded to the temperature sensing element , and a heat conductive bonding layer is thermally connected to the temperature sensing element through the PCB layer with a heat conductive vertical interconnect access . receive a signal from the temperature sensing element ; and output a signal indicative of the temperature at the interior of the electronic component , wherein the flexible cable comprises a flat and flexible plastic film with multiple metallic conductors, a printed circuit board (PCB) layer is bonded to the temperature sensing element , and a heat conductive bonding layer is thermally connected to the temperature sensing element through the PCB layer with a heat conductive vertical interconnect access . <EOS>