A cooling system , comprising: a container having an open upper part and being configured to receive a dielectric cooling liquid and to receive one or more electronic components immersed in the dielectric cooling liquid ; a first pump configured to cause a circulation of a first fraction of the dielectric cooling liquid in the container for convection cooling of the one or more electronic components ; a second pump configured to cause directing a second fraction of the dielectric cooling liquid toward at least one of the one or more electronic components for direct cooling of the at least one of the one or more electronic components ; a manifold fluidly connected to an outlet of the second pump for receiving the second fraction of the dielectric cooling liquid from the second pump ; and one or more outlet pipes fluidly connected to the manifold , each outlet pipe being configured to bring a portion of the second fraction of the dielectric cooling liquid in thermal contact with a corresponding electronic component ; characterized in that the cooling system further comprises: a first piping arrangement comprising: an inlet configured to withdraw the first fraction of the dielectric cooling liquid from the open upper part of the container , and an outlet fluidly connected to an inlet of the first pump ; and a second piping arrangement comprising: an inlet fluidly connected to an outlet of the first pump , and an outlet configured to return the first fraction of the dielectric cooling liquid to a lower part of the container . a container having an open upper part and being configured to receive a dielectric cooling liquid and to receive one or more electronic components immersed in the dielectric cooling liquid ; a first pump configured to cause a circulation of a first fraction of the dielectric cooling liquid in the container for convection cooling of the one or more electronic components ; a second pump configured to cause directing a second fraction of the dielectric cooling liquid toward at least one of the one or more electronic components for direct cooling of the at least one of the one or more electronic components ; a manifold fluidly connected to an outlet of the second pump for receiving the second fraction of the dielectric cooling liquid from the second pump ; and one or more outlet pipes fluidly connected to the manifold , each outlet pipe being configured to bring a portion of the second fraction of the dielectric cooling liquid in thermal contact with a corresponding electronic component ; characterized in that the cooling system further comprises: a first piping arrangement comprising: an inlet configured to withdraw the first fraction of the dielectric cooling liquid from the open upper part of the container , and an outlet fluidly connected to an inlet of the first pump ; and a second piping arrangement comprising: an inlet fluidly connected to an outlet of the first pump , and an outlet configured to return the first fraction of the dielectric cooling liquid to a lower part of the container . an inlet configured to withdraw the first fraction of the dielectric cooling liquid from the open upper part of the container , and an outlet fluidly connected to an inlet of the first pump ; and a second piping arrangement comprising: an inlet fluidly connected to an outlet of the first pump , and an outlet configured to return the first fraction of the dielectric cooling liquid to a lower part of the container . an inlet fluidly connected to an outlet of the first pump , and an outlet configured to return the first fraction of the dielectric cooling liquid to a lower part of the container . <EOS>