An inkjet head comprising: a pressure chamber-forming plate in which a plurality of pressure chambers each communicating with a nozzle are formed in a first direction (x); a vibration plate that defines one surface of each pressure chamber and allows for deformation of a defining region thereof; a piezoelectric element formed by stacking a first electrode layer , a piezoelectric layer , and a second electrode layer in a region corresponding to the pressure chamber in an order from a surface of the vibration plate , which is opposite to the pressure chamber ; a circuit board that is arranged at an interval from the vibration plate , with a plurality of bump electrodes interposed therebetween, and outputs a signal for driving the piezoelectric element ; an adhesive agent that bonds the pressure chamber-forming plate and the circuit board ; an individual metallic layer part of which is stacked on the first electrode layer , which is formed outside of the one end of the piezoelectric element ; a common metallic layer stacked on the second electrode layer , wherein an element end on at least one side of the piezoelectric element is formed outside of the defining region and covered by the adhesive agent in a second direction (y) orthogonal to the first direction (x); the bump electrode includes an individual bump electrode and a common bump electrode ; the individual bump electrode is electrically connected with the individual metallic layer on the piezoelectric layer formed in a region outside of the defining region ; and the common bump electrode is electrically connected with the common metallic layer on the piezoelectric layer formed in a region outside of the defining region . a pressure chamber-forming plate in which a plurality of pressure chambers each communicating with a nozzle are formed in a first direction (x); a vibration plate that defines one surface of each pressure chamber and allows for deformation of a defining region thereof; a piezoelectric element formed by stacking a first electrode layer , a piezoelectric layer , and a second electrode layer in a region corresponding to the pressure chamber in an order from a surface of the vibration plate , which is opposite to the pressure chamber ; a circuit board that is arranged at an interval from the vibration plate , with a plurality of bump electrodes interposed therebetween, and outputs a signal for driving the piezoelectric element ; an adhesive agent that bonds the pressure chamber-forming plate and the circuit board ; an individual metallic layer part of which is stacked on the first electrode layer , which is formed outside of the one end of the piezoelectric element ; a common metallic layer stacked on the second electrode layer , wherein an element end on at least one side of the piezoelectric element is formed outside of the defining region and covered by the adhesive agent in a second direction (y) orthogonal to the first direction (x); the bump electrode includes an individual bump electrode and a common bump electrode ; the individual bump electrode is electrically connected with the individual metallic layer on the piezoelectric layer formed in a region outside of the defining region ; and the common bump electrode is electrically connected with the common metallic layer on the piezoelectric layer formed in a region outside of the defining region . <EOS>