An electronic component , comprising: a package that houses an electronic device , wherein the package includes a base body having a central region to which the electronic device is fixed and a peripheral region located at a side of an outer edge of the base body with respect to the central region in a first direction (X), a lid body that faces the electronic device to form a space between the base body and the lid body in a second direction (Z), the second direction (Z) being perpendicular to the first direction (X), wherein the space has a dimension in the second direction (Z) defined by a distance (D6) between an inner surface of the lid body and a front surface of the electronic device facing the lid body , and a frame body that encloses at least the space between the base body and the lid body , wherein the frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body , and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body , in the first direction (X) from the inner edge of the frame body toward the outer edge of the frame body , wherein the first portion is arranged between the peripheral region of the base body and the lid body in the second direction (Z), wherein the second portion has a greater length (W4) in the first direction (X) than a length (W2) of the first portion in the first direction (X), wherein the frame body has a greater thermal conductivity than a thermal conductivity of the lid body , and wherein a thickness (T4) of the first portion in the second direction (Z) is less than the length (W2) of the first portion in the first direction (X). a package that houses an electronic device , wherein the package includes a base body having a central region to which the electronic device is fixed and a peripheral region located at a side of an outer edge of the base body with respect to the central region in a first direction (X), a lid body that faces the electronic device to form a space between the base body and the lid body in a second direction (Z), the second direction (Z) being perpendicular to the first direction (X), wherein the space has a dimension in the second direction (Z) defined by a distance (D6) between an inner surface of the lid body and a front surface of the electronic device facing the lid body , and a frame body that encloses at least the space between the base body and the lid body , wherein the frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body , and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body , in the first direction (X) from the inner edge of the frame body toward the outer edge of the frame body , wherein the first portion is arranged between the peripheral region of the base body and the lid body in the second direction (Z), wherein the second portion has a greater length (W4) in the first direction (X) than a length (W2) of the first portion in the first direction (X), wherein the frame body has a greater thermal conductivity than a thermal conductivity of the lid body , and wherein a thickness (T4) of the first portion in the second direction (Z) is less than the length (W2) of the first portion in the first direction (X). <EOS>