A method of manufacturing a light emitting device , the method comprising: mounting a plurality of light emitting elements on a collective substrate ; arranging at least one light transmissive member for each light emitting device on an upper surface of each of the plurality of light emitting elements ; arranging a first protruding member that surrounds the plurality of light emitting elements on an upper surface of the collective substrate ; arranging a second protruding member between the plurality of light emitting elements on the upper surface of the collective substrate ; after the arranging the first protruding member and the second protruding member , forming a cover member that covers an upper end of the second protruding member , the light emitting elements , and a lateral surface of the at least one light transmissive member in a region surrounded by the first protruding member ; and singulating the light emitting devices by dividing the cover member , the second protruding member , and the collective substrate at a portion including the second protruding member ; wherein an upper end of the second protruding member is located in the region surrounded by the first protruding member so as to be lower than an upper end of the first protruding member but higher than the upper surface of each of the light emitting elements , wherein the second protruding member is harder than the cover member , characterized in that the upper end of the first protruding member is located lower than an upper surface of the at least one light transmissive member , wherein a resin material is used for the first protruding member , and wherein a resin material is used for the second protruding member . mounting a plurality of light emitting elements on a collective substrate ; arranging at least one light transmissive member for each light emitting device on an upper surface of each of the plurality of light emitting elements ; arranging a first protruding member that surrounds the plurality of light emitting elements on an upper surface of the collective substrate ; arranging a second protruding member between the plurality of light emitting elements on the upper surface of the collective substrate ; after the arranging the first protruding member and the second protruding member , forming a cover member that covers an upper end of the second protruding member , the light emitting elements , and a lateral surface of the at least one light transmissive member in a region surrounded by the first protruding member ; and singulating the light emitting devices by dividing the cover member , the second protruding member , and the collective substrate at a portion including the second protruding member ; wherein an upper end of the second protruding member is located in the region surrounded by the first protruding member so as to be lower than an upper end of the first protruding member but higher than the upper surface of each of the light emitting elements , wherein the second protruding member is harder than the cover member , characterized in that the upper end of the first protruding member is located lower than an upper surface of the at least one light transmissive member , wherein a resin material is used for the first protruding member , and wherein a resin material is used for the second protruding member . <EOS>