A method for fabricating a microelectronic module, comprising: embedding a sinter-bonded heat dissipation structure in a module substrate by: applying a sinter precursor material containing metal particles into a cavity provided in the module substrate ; and sintering the sinter precursor material at a maximum processing temperature less than a melt point of the metal particles to produce a sintered metal body bonded to the module substrate ; and attaching a microelectronic device and a heatsink to the module substrate before, after, or concurrent with sintering, the heatsink thermally coupled to the microelectronic device through the sinter-bonded heat dissipation structure ), wherein embedding the sinter-bonded heat dissipation structure in the module substrate further comprises: positioning a thermal conduit in the cavity , the thermal conduit comprising one of a slug having a thermal conductivity exceeding the thermal conductivity of the module substrate and an elongated heat pipe configured for transferring heat from a first end portion to a second end portion of the elongated heat pipe ; and forming the sintered metal body to bond the thermal conduit to the module substrate . embedding a sinter-bonded heat dissipation structure in a module substrate by: applying a sinter precursor material containing metal particles into a cavity provided in the module substrate ; and sintering the sinter precursor material at a maximum processing temperature less than a melt point of the metal particles to produce a sintered metal body applying a sinter precursor material containing metal particles into a cavity provided in the module substrate ; and sintering the sinter precursor material at a maximum processing temperature less than a melt point of the metal particles to produce a sintered metal body bonded to the module substrate ; and attaching a microelectronic device and a heatsink to the module substrate before, after, or concurrent with sintering, the heatsink thermally coupled to the microelectronic device through the sinter-bonded heat dissipation structure ), wherein embedding the sinter-bonded heat dissipation structure in the module substrate further comprises: positioning a thermal conduit in the cavity , the thermal conduit comprising one of a slug having a thermal conductivity exceeding the thermal conductivity of the module substrate and an elongated heat pipe configured for transferring heat from a first end portion to a second end portion of the elongated heat pipe ; and attaching a microelectronic device and a heatsink to the module substrate before, after, or concurrent with sintering, the heatsink thermally coupled to the microelectronic device through the sinter-bonded heat dissipation structure ), wherein embedding the sinter-bonded heat dissipation structure in the module substrate further comprises: positioning a thermal conduit in the cavity , the thermal conduit comprising one of a slug having a thermal conductivity exceeding the thermal conductivity of the module substrate and an elongated heat pipe configured for transferring heat from a first end portion to a second end portion of the elongated heat pipe ; and forming the sintered metal body to bond the thermal conduit to the module substrate . <EOS>