A stack type sensor package structure, comprising: a substrate having an upper surface and a lower surface opposite to the upper surface , wherein the substrate includes a plurality of solder pads arranged on the upper surface ; at least one semiconductor chip mounted on the substrate ; a frame fixed on the upper surface of the substrate and surrounded by the solder pads , wherein the at least one semiconductor chip is in a space defined by the frame and the substrate and does not contact the frame , and the frame has a bearing plane above the at least one semiconductor chip ; a sensor chip having a top surface and a bottom surface opposite to the top surface , the sensor chip including a plurality of connecting pads arranged on the top surface thereof, wherein a size of the sensor chip is larger than that of the at least one semiconductor chip , and the bottom surface of the sensor chip is fixed on the bearing plane ; a plurality of wires each having a first end and a second end opposite to the first end, wherein the first ends of the wires are respectively connected to the solder pads , and the second ends of the wires are respectively connected to the connecting pads ; a transparent layer having a first surface and a second surface opposite to the first surface , wherein the second surface has a central region and a ring-shaped supported region encircling the central region ; a support having a ring-shaped structure; characterized in that said support is disposed on at least one of the top surface of the sensor chip and the bearing surface of the frame , wherein a top end of the support abuts against the supported region of the transparent layer ; and a package compound disposed on the upper surface of the substrate and covering a lateral side of the frame , at least part of a lateral side of the transparent layer , and a lateral side of the support , wherein at least part of each of the wires is embedded in the package compound , wherein at least part of the support is disposed on the top surface of the sensor chip , and covers the connecting pads and a part of each of the wires . a substrate having an upper surface and a lower surface opposite to the upper surface , wherein the substrate includes a plurality of solder pads arranged on the upper surface ; at least one semiconductor chip mounted on the substrate ; a frame fixed on the upper surface of the substrate and surrounded by the solder pads , wherein the at least one semiconductor chip is in a space defined by the frame and the substrate and does not contact the frame , and the frame has a bearing plane above the at least one semiconductor chip ; a sensor chip having a top surface and a bottom surface opposite to the top surface , the sensor chip including a plurality of connecting pads arranged on the top surface thereof, wherein a size of the sensor chip is larger than that of the at least one semiconductor chip , and the bottom surface of the sensor chip is fixed on the bearing plane ; a plurality of wires each having a first end and a second end opposite to the first end, wherein the first ends of the wires are respectively connected to the solder pads , and the second ends of the wires are respectively connected to the connecting pads ; a transparent layer having a first surface and a second surface opposite to the first surface , wherein the second surface has a central region and a ring-shaped supported region encircling the central region ; a support having a ring-shaped structure; <EOS>