Method for separating at least one solid body portion from a solid body, at least comprising the following steps: modifying the crystal lattice of the solid body by means of a laser, wherein a plurality of modifications are created in the crystal lattice, wherein as a result of the modifications, the crystal lattice begins tearing in at least a portion of each of the regions surrounding the modifications, wherein a detachment region is defined by the tears in the region of the modifications, wherein the laser beam penetrates into the preferably at least partially transparent solid body via a polished surface, wherein the tears are undercritical and extend less than 5 mm in the solid body, wherein the undercritical tears predominantly extend in the same plane, with the plane being aligned in parallel with a surface of the solid body and the laser beams penetrating into the solid body via the surface, wherein the solid body comprises or consists of silicon carbide (SiC), wherein the solid body is an ingot, separating the solid body along the detachment region into at least two constituent parts, wherein the solid body portion to be detached is thinner than the solid body reduced by the solid body portion, wherein the polished surface is part of the solid body portion to be detached. modifying the crystal lattice of the solid body by means of a laser, wherein a plurality of modifications are created in the crystal lattice, wherein as a result of the modifications, the crystal lattice begins tearing in at least a portion of each of the regions surrounding the modifications, wherein a detachment region is defined by the tears in the region of the modifications, wherein the laser beam penetrates into the preferably at least partially transparent solid body via a polished surface, wherein the tears are undercritical and extend less than 5 mm in the solid body, wherein the undercritical tears predominantly extend in the same plane, with the plane being aligned in parallel with a surface of the solid body and the laser beams penetrating into the solid body via the surface, wherein the solid body comprises or consists of silicon carbide (SiC), wherein the solid body is an ingot, wherein a plurality of modifications are created in the crystal lattice, wherein as a result of the modifications, the crystal lattice begins tearing in at least a portion of each of the regions surrounding the modifications, wherein a detachment region is defined by the tears in the region of the modifications, wherein the laser beam penetrates into the preferably at least partially transparent solid body via a polished surface, wherein the tears are undercritical and extend less than 5 mm in the solid body, wherein the undercritical tears predominantly extend in the same plane, with the plane being aligned in parallel with a surface of the solid body and the laser beams penetrating into the solid body via the surface, wherein the solid body comprises or consists of silicon carbide (SiC), wherein the solid body is an ingot, separating the solid body along the detachment region into at least two constituent parts, wherein the solid body portion to be detached is thinner than the solid body reduced by the solid body portion, wherein the polished surface is part of the solid body portion to be detached. wherein the solid body portion to be detached is thinner than the solid body reduced by the solid body portion, wherein the polished surface is part of the solid body portion to be detached. <EOS>