A module for facilitating an increased flow of cooling air, comprising a chassis in which circuitry is housed, and a front panel associated with said chassis, wherein said module is configured with one or more airflow openings which facilitate a flow of cooling air into a chassis interior and which are ensured of remaining unblocked, wherein the front panel is formed with one or more inclined surfaces to define at least a part of a corresponding passageway through which air crossing a portion of the front panel is flowable, characterized in that the module is a power supply module and the housed circuitry is circuitry of the power supply module and in that the one or more airflow openings are recessed airflow openings being recessed from one of the inclined surfaces, the one or more airflow openings facilitating flow of vertical inflow air into the chassis interior, wherein each of the inclined surfaces is formed with a groove extending along a long dimension of the front panel and in fluid communication with the one or more recessed airflow openings through which the cooling air is flowable, the front panel further comprising an additional surface in the groove which is recessed from a corresponding inclined surface and is formed with the one or more recessed airflow openings, wherein at least one of the inclined surfaces in vertical cross section extends from an interface of the chassis and front panel to a vertical edge of a vertically oriented front element of the front panel formed with a plurality of vertically spaced unrecessed air flow openings enabling horizontal air inflow and which is vertically and laterally spaced from the interface, wherein- the at least one inclined surface extends downwardly from the interface and the one or more recessed airflow openings through which the vertical inflow air is receivable are upwardly facing; or the at least one inclined surface extends upwardly from the interface and the one or more recessed airflow openings through which the vertical inflow air is receivable are downwardly facing. wherein said module is configured with one or more airflow openings which facilitate a flow of cooling air into a chassis interior and which are ensured of remaining unblocked, wherein the front panel is formed with one or more inclined surfaces to define at least a part of a corresponding passageway through which air crossing a portion of the front panel is flowable, characterized in that the module is a power supply module and the housed circuitry is circuitry of the power supply module and in that the one or more airflow openings are recessed airflow openings being recessed from one of the inclined surfaces, the one or more airflow openings facilitating flow of vertical inflow air into the chassis interior, wherein each of the inclined surfaces is formed with a groove extending along a long dimension of the front panel and in fluid communication with the one or more recessed airflow openings through which the cooling air is flowable, the front panel further comprising an additional surface in the groove which is recessed from a corresponding inclined surface and is formed with the one or more recessed airflow openings, wherein at least one of the inclined surfaces in vertical cross section extends from an interface of the chassis and front panel to a vertical edge of a vertically oriented front element of the front panel formed with a plurality of vertically spaced unrecessed air flow openings enabling horizontal air inflow and which is vertically and laterally spaced from the interface, wherein- the at least one inclined surface extends downwardly from the interface and the one or more recessed airflow openings through which the vertical inflow air is receivable are upwardly facing; or the at least one inclined surface extends upwardly from the interface and the one or more recessed airflow openings through which the vertical inflow air is receivable are downwardly facing. <EOS>