An electronic device comprising: a housing including a first surface, a second surface facing away from the first surface, and a side member surrounding a space between the first surface and the second surface; a display exposed through a substantial portion of the first surface of the housing; a first radiator forming a portion of the side member; a printed circuit board, PCB, positioned within the housing and including a ground layer; a communication circuit (141a; 143a) positioned on the PCB; and a conductive pattern having a length corresponding to a length of the first radiator, wherein: a first portion including one end of the conductive pattern is positioned adjacent to the first radiator; the other end of the conductive pattern is connected with the ground layer of the PCB; a rest portion of the conductive pattern except for the first portion is positioned to overlap with the ground layer, when viewed from above the first surface; and wherein the device is configured such that a current formed in the ground layer of the PCB by a current applied to the first radiator is guided by positioning the conductive pattern above the ground layer, thereby preventing a current from being leaked out or from being lost due to a stacked structure or an adjacent component. a housing including a first surface, a second surface facing away from the first surface, and a side member surrounding a space between the first surface and the second surface; a display exposed through a substantial portion of the first surface of the housing; a first radiator forming a portion of the side member; a printed circuit board, PCB, positioned within the housing and including a ground layer; a communication circuit (141a; 143a) positioned on the PCB; and a conductive pattern having a length corresponding to a length of the first radiator, wherein: a first portion including one end of the conductive pattern is positioned adjacent to the first radiator; the other end of the conductive pattern is connected with the ground layer of the PCB; a rest portion of the conductive pattern except for the first portion is positioned to overlap with the ground layer, when viewed from above the first surface; and wherein the device is configured such that a current formed in the ground layer of the PCB by a current applied to the first radiator is guided by positioning the conductive pattern above the ground layer, thereby preventing a current from being leaked out or from being lost due to a stacked structure or an adjacent component. a first portion including one end of the conductive pattern is positioned adjacent to the first radiator; the other end of the conductive pattern is connected with the ground layer of the PCB; a rest portion of the conductive pattern except for the first portion is positioned to overlap with the ground layer, when viewed from above the first surface; and wherein the device is configured such that a current formed in the ground layer of the PCB by a current applied to the first radiator is guided by positioning the conductive pattern above the ground layer, thereby preventing a current from being leaked out or from being lost due to a stacked structure or an adjacent component. <EOS>