An inverter for an electrically driven vehicle , comprising - three power semiconductor modules with (i) two switching elements and (ii) a support element having an upper surface on which terminals for contacting the switching elements are arranged, a lower surface opposite the upper surface , and side surfaces circumferentially connecting the upper surface and the lower surface; and - a cooling device with (i) a cooling channel through which a cooling fluid can be guided along the underside of a respective carrier element , (ii) a receiving device in which the power semiconductor modules are arranged side by side such that side faces of a pair of adjacent power semiconductor modules face each other, (iii) a sealing device which prevents the cooling fluid from escaping from the cooling device , and (iv) a pressing device which exerts a pressing force on the sealing device by clamping the receiving device , characterized in that that the cooling device comprises supporting devices each associated with one of the pairs and supporting the pair against a bottom of the cooling channel upon application of the pressing force, each supporting device comprising a plurality of supporting elements arranged along the opposite side surfaces of the pair and each extending within the cooling channel from the bottom to the undersides of the pair, so that in each case two adjacent support elements and the bottom delimit partial cooling channels of the cooling channel in sections. - three power semiconductor modules with (i) two switching elements and (ii) a support element having an upper surface on which terminals for contacting the switching elements are arranged, a lower surface opposite the upper surface , and side surfaces circumferentially connecting the upper surface and the lower surface; and (i) two switching elements and (ii) a support element having an upper surface on which terminals for contacting the switching elements are arranged, a lower surface opposite the upper surface , and side surfaces circumferentially connecting the upper surface and the lower surface; and - a cooling device with (i) a cooling channel through which a cooling fluid can be guided along the underside of a respective carrier element , (ii) a receiving device in which the power semiconductor modules are arranged side by side such that side faces of a pair of adjacent power semiconductor modules face each other, (iii) a sealing device which prevents the cooling fluid from escaping from the cooling device , and (iv) a pressing device which exerts a pressing force on the sealing device by clamping the receiving device , characterized in that that the cooling device comprises supporting devices each associated with one of the pairs and supporting the pair against a bottom of the cooling channel upon application of the pressing force, each supporting device comprising a plurality of supporting elements arranged along the opposite side surfaces of the pair and each extending within the cooling channel from the bottom to the undersides of the pair, so that in each case two adjacent support elements and the bottom delimit partial cooling channels of the cooling channel in sections. (i) a cooling channel through which a cooling fluid can be guided along the underside of a respective carrier element , (ii) a receiving device in which the power semiconductor modules are arranged side by side such that side faces of a pair of adjacent power semiconductor modules face each other, (iii) a sealing device which prevents the cooling fluid from escaping from the cooling device , and (iv) a pressing device which exerts a pressing force on the sealing device by clamping the receiving device , <EOS>