A method of manufacturing a light-emitting module , the method comprising: providing a plurality of light-emitting segments bonded to a board with an adhesive sheet interposed therebetween, wherein the board has a first surface on which a circuit pattern and a bottomed hole (18a1) formed in each of wiring pads continuous with the circuit pattern are provided; and the plurality of light-emitting segments are connected to a second surface of the board with the adhesive sheet interposed therebetween and each comprising a plurality of light-emitting devices that are aligned; supplying electrically conductive paste into the bottomed hole (18a1) through an opening (M1) of a mask (MK) while supplying the electrically conductive paste on a portion (18a11) of a surface around the bottomed hole (18a1) in each of the wiring pads ; and performing thermal compression to the electrically conductive paste on the portion (18a11) of the surface of each of the wiring pads , and hardening the electrically conductive paste such that a thickness of the electrically conductive paste on the portion (18a11) is smaller than the electrically conductive paste at the timing of being disposed through the opening (M1) of the mask (MK), and hardening the electrically conductive paste supplied into the bottomed hole (18a1), wherein the bottomed hole (18a1) and at least one additional bottomed hole (18a1) are formed in the each of the wiring pads , and wherein the opening of the mask (MK) is arranged to overlap with at least a portion of each of the bottomed holes (18a1) in the wiring pads and at least a portion of the portion in the surface of each of the wiring pads as seen in a top view, so as to respectively extend over the bottomed holes (18a1) in the supplying step. providing a plurality of light-emitting segments bonded to a board with an adhesive sheet interposed therebetween, wherein the board has a first surface on which a circuit pattern and a bottomed hole (18a1) formed in each of wiring pads continuous with the circuit pattern are provided; and the plurality of light-emitting segments are connected to a second surface of the board with the adhesive sheet interposed therebetween and each comprising a plurality of light-emitting devices that are aligned; the board has a first surface on which a circuit pattern and a bottomed hole (18a1) formed in each of wiring pads continuous with the circuit pattern are provided; and the plurality of light-emitting segments are connected to a second surface of the board with the adhesive sheet interposed therebetween and each comprising a plurality of light-emitting devices that are aligned; supplying electrically conductive paste into the bottomed hole (18a1) through an opening (M1) of a mask (MK) while supplying the electrically conductive paste on a portion (18a11) of a surface around the bottomed hole (18a1) in each of the wiring pads ; and performing thermal compression to the electrically conductive paste on the portion (18a11) of the surface of each of the wiring pads , and hardening the electrically conductive paste such that a thickness of the electrically conductive paste on the portion (18a11) is smaller than the electrically conductive paste at the timing of being disposed through the opening (M1) of the mask (MK), and hardening the electrically conductive paste supplied into the bottomed hole (18a1), wherein the bottomed hole (18a1) and at least one additional bottomed hole (18a1) are formed in the each of the wiring pads , and wherein the opening of the mask (MK) is arranged to overlap with at least a portion of each of the bottomed holes (18a1) in the wiring pads and at least a portion of the portion in the surface of each of the wiring pads as seen in a top view, so as to respectively extend over the bottomed holes (18a1) in the supplying step. <EOS>