A method for manufacturing a multispectral filter for electromagnetic radiation, said filter including at least two colour filters (Fi), each filter including a first reflective layer , a second reflective layer , and a layer of dielectric material of Fabry-Perot cavity between the first reflective layer and the second reflective layer , the thickness of the dielectric layer of both colour filters being different and each of both filters (Fi) facing a photoelectric transducer , said method including the following steps of: - Depositing a resin layer on a substrate , called the handle substrate; - Three-dimensionally structuring the resin layer by lithography so as to obtain at least two resin patterns of different heights, at least one of the patterns having a maximum reference height (Hmax), the height being measured perpendicularly to the plane of the substrate ; - Depositing a layer made of the dielectric material intended to form the dielectric patterns of the Fabry-Perot cavities, said layer of dielectric material covering the entire resin patterns by having an upper surface , each point of which is located at a height relative to the handle substrate greater than the maximum reference height (Hmax); - Planarising by removal of the dielectric material with a selective stop at the top of the highest resin pattern; - Transferring the planarised face of the handle substrate to the upper face of a substrate , called the carrier substrate, including at least two photoelectric transducers , each of said patterns facing a photoelectric transducer, a reflective layer intended to form the first reflective layer of both colour filters being positioned at the transfer interface between the handle substrate and the carrier substrate; - Removing the handle substrate ; - Removing the resin so as to release at least two dielectric patterns of Fabry-Perot cavities of different thicknesses on the surface; - Depositing a reflective layer onto the at least two dielectric patterns of Fabry-Perot cavity, forming the second reflective layer of both colour filters. - Depositing a resin layer on a substrate , called the handle substrate; - Three-dimensionally structuring the resin layer by lithography so as to obtain at least two resin patterns of different heights, at least one of the patterns having a maximum reference height (Hmax), the height being measured perpendicularly to the plane of the substrate ; - Depositing a layer made of the dielectric material intended to form the dielectric patterns of the Fabry-Perot cavities, said layer of dielectric material covering the entire resin patterns by having an upper surface , each point of which is located at a height relative to the handle substrate greater than the maximum reference height (Hmax); - Planarising by removal of the dielectric material with a selective stop at the top of the highest resin pattern; - Transferring the planarised face of the handle substrate to the upper face of a substrate , called the carrier substrate, including at least two photoelectric transducers , each of said patterns facing a photoelectric transducer, a reflective layer intended to form the first reflective layer of both colour filters being positioned at the transfer interface between the handle substrate and the carrier substrate; - Removing the handle substrate ; - Removing the resin so as to release at least two dielectric patterns of Fabry-Perot cavities of different thicknesses on the surface; - Depositing a reflective layer onto the at least two dielectric patterns of Fabry-Perot cavity, forming the second reflective layer of both colour filters. <EOS>