A quality management apparatus that is adapted to manage a surface mounting line comprising a solder printing apparatus configured to print solder on a printed circuit board, a mounter configured to dispose an electronic component on the printed circuit board, a first inspection apparatus configured to inspect a solder printing state and an electronic component disposition state, a reflow furnace configured to solder the electronic component, and a second inspection apparatus configured to inspect a bonding state of the electronic component and the printed circuit board, the quality management apparatus comprising: a defective factor estimator configured to extract, when the second inspection apparatus detects a defect, an inspection item being determined from a measurement result that is estimated to be associated with a defect in inspection items being determined from measurement results inspected with the first inspection apparatus ; a quality determination unit configured to acquire a distribution being determined from measurement results in the estimated inspection item as an inspection result corresponding to the extracted inspection item from the first inspection apparatus , and to determine whether the inspection result indicates an abnormality based on whether values of said distribution being determined from measurement results exceed an abnormal determination criterion; and a parameter changer configured to decide a parameter to be changed and a content of the parameter in parameters used in the solder printing apparatus or the mounter when the inspection result indicates the abnormality, wherein, when one of an excessive amount on an upper limit side of the abnormal determination criterion and an excessive amount on a lower limit side is larger than the other in the acquired distribution being determined from measurement results the parameter changer decides the parameter to be changed and the content of the parameter such that the distribution being determined from measurement results is moved in a direction in which ununiformity of the excessive amount is solved. a defective factor estimator configured to extract, when the second inspection apparatus detects a defect, an inspection item being determined from a measurement result that is estimated to be associated with a defect in inspection items being determined from measurement results inspected with the first inspection apparatus ; a quality determination unit configured to acquire a distribution being determined from measurement results in the estimated inspection item as an inspection result corresponding to the extracted inspection item from the first inspection apparatus , and to determine whether the inspection result indicates an abnormality based on whether values of said distribution being determined from measurement results exceed an abnormal determination criterion; and a parameter changer configured to decide a parameter to be changed and a content of the parameter in parameters used in the solder printing apparatus or the mounter when the inspection result indicates the abnormality, wherein, when one of an excessive amount on an upper limit side of the abnormal determination criterion and an excessive amount on a lower limit side is larger than the other in the acquired distribution being determined from measurement results the parameter changer decides the parameter to be changed and the content of the parameter such that the distribution being determined from measurement results is moved in a direction in which ununiformity of the excessive amount is solved. <EOS>