A device, comprising: a substrate (205; 513; 745) having a first contact pad at a first side of the substrate (205; 513; 745); a sidewall ; a lid (101; 801) attached by the sidewall to the first side of the substrate (205; 513; 745), wherein the lid (101; 801) is separated from the substrate (205; 513; 745) by an interior cavity that is bounded by the sidewall , the lid (101; 801) and the substrate (205; 513; 745); a control chip (221, 231; 515, 529; 731) disposed on the first side of the substrate (205; 513; 745) and extending from the substrate (205; 513; 745) into the interior cavity , the control chip (221, 231; 515, 529; 731) in electrical communication with the first contact pad; a sensor (111, 113; 407; 703) attached, at a first side, to the lid (101; 801), the sensor (111, 113; 407; 703) having a sensor cavity and extending from the lid (101; 801) into the interior cavity , the sensor (111, 113; 407; 703) having a mounting pad (233; 531; 727, 733, 743), and the internal cavity acting as a back volume for the sensor (111, 113; 407; 703) while the sensor cavity acting as front volume, wherein the sensor (111, 113; 407; 703) is vertically spaced apart from the control chip (221, 231; 515, 529; 731) by an air gap, and wherein the sensor (111, 113; 407; 703) is aligned at least partially over the control chip (221, 231; 515, 529; 731); and an interconnect (123; 421, 423; 721, 723) having a first end mounted on the mounting pad (233; 531; 727, 733, 743), the interconnect (123; 421, 423; 721, 723) extending through the interior cavity and making electrical contact, at a second end of the interconnect (123; 421, 423; 721, 723) opposite the first end, with the first contact pad, wherein the interconnect (123; 421, 423; 721, 723) is spaced apart from the sidewall . a substrate (205; 513; 745) having a first contact pad at a first side of the substrate (205; 513; 745); a sidewall ; a lid (101; 801) attached by the sidewall to the first side of the substrate (205; 513; 745), wherein the lid (101; 801) is separated from the substrate (205; 513; 745) by an interior cavity that is bounded by the sidewall , the lid (101; 801) and the substrate (205; 513; 745); a control chip (221, 231; 515, 529; 731) disposed on the first side of the substrate (205; 513; 745) and extending from the substrate (205; 513; 745) into the interior cavity , the control chip (221, 231; 515, 529; 731) in electrical communication with the first contact pad; a sensor (111, 113; 407; 703) attached, at a first side, to the lid (101; 801), the sensor (111, 113; 407; 703) having a sensor cavity and extending from the lid (101; 801) into the interior cavity , the sensor (111, 113; 407; 703) having a mounting pad (233; 531; 727, 733, 743), and the internal cavity acting as a back volume for the sensor (111, 113; 407; 703) while the sensor cavity acting as front volume, wherein the sensor (111, 113; 407; 703) is vertically spaced apart from the control chip (221, 231; 515, 529; 731) by an air gap, and wherein the sensor (111, 113; 407; 703) is aligned at least partially over the control chip (221, 231; 515, 529; 731); and an interconnect (123; 421, 423; 721, 723) having a first end mounted on the mounting pad (233; 531; 727, 733, 743), the interconnect (123; 421, 423; 721, 723) extending through the interior cavity and making electrical contact, at a second end of the interconnect (123; 421, 423; 721, 723) opposite the first end, with the first contact pad, wherein the interconnect (123; 421, 423; 721, 723) is spaced apart from the sidewall . <EOS>