An anisotropic conductive film for anisotropically conductively connecting a terminal of a first electronic component and a terminal of a second electronic component, the anisotropic conductive film comprising: a conductive particle-containing layer, which contains (i) an adhesive layer-forming component, wherein the adhesive layer-forming component contains a crystalline resin, wherein the crystalline resin contains at least two crystalline resins including a first crystalline resin and a second crystalline resin, and wherein the adhesive layer-forming component further contains an amorphous resin, and wherein a ratio of a mass of the first crystalline resin to a mass of the second crystalline resin is from 25:75 to 75:25, wherein a ratio (X):(Y) is from 25:75 to 75:25, where (X) is a sum of a mass of the first crystalline resin and a mass of the second crystalline resin and (Y) is a mass of the amorphous resin, and (ii) conductive particles, wherein the conductive particle-containing layer has two endothermic peaks in differential scanning calorimetry where endothermic peak temperatures are measured under conditions that a measuring temperature range is from 10°C to 250°C and a heating speed is 10°C/min, wherein T2 is 30°C or higher, and T4-T2 is greater than 0°C but 80°C or less, where T2 is a temperature of the endothermic peak present at a lower temperature side, and T4 is a temperature of the endothermic peak present at a higher temperature side, wherein the first crystalline resin contains a crystalline polyester, the second crystalline resin contains a crystalline polyurethane resin, and the amorphous resin contains an amorphous polyester resin. a conductive particle-containing layer, which contains (i) an adhesive layer-forming component, wherein the adhesive layer-forming component contains a crystalline resin, wherein the crystalline resin contains at least two crystalline resins including a first crystalline resin and a second crystalline resin, and wherein the adhesive layer-forming component further contains an amorphous resin, and wherein a ratio of a mass of the first crystalline resin to a mass of the second crystalline resin is from 25:75 to 75:25, wherein a ratio (X):(Y) is from 25:75 to 75:25, where (X) is a sum of a mass of the first crystalline resin and a mass of the second crystalline resin and (Y) is a mass of the amorphous resin, and (ii) conductive particles, (i) an adhesive layer-forming component, wherein the adhesive layer-forming component contains a crystalline resin, wherein the crystalline resin contains at least two crystalline resins including a first crystalline resin and a second crystalline resin, and wherein the adhesive layer-forming component further contains an amorphous resin, and wherein a ratio of a mass of the first crystalline resin to a mass of the second crystalline resin is from 25:75 to 75:25, wherein a ratio (X):(Y) is from 25:75 to 75:25, where (X) is a sum of a mass of the first crystalline resin and a mass of the second crystalline resin and (Y) is a mass of the amorphous resin, and (ii) conductive particles, wherein the conductive particle-containing layer has two endothermic peaks in differential scanning calorimetry where endothermic peak temperatures are measured under conditions that a measuring temperature range is from 10°C to 250°C and a heating speed is 10°C/min, wherein T2 is 30°C or higher, and T4-T2 is greater than 0°C but 80°C or less, where T2 is a temperature of the endothermic peak present at a lower temperature side, and T4 is a temperature of the endothermic peak present at a higher temperature side, <EOS>