An integrated multilayer structure for use in sensing applications, the multilayer structure comprising: at least one molded or cast plastic layer having a first and an opposing second side ; a first film layer on the first side and a second film layer on the second side of said plastic layer , wherein the first film layer and the second film layer are sections of a film, or of a first film and a second film, respectively; the first film layer on the first side of said molded or cast plastic layer being provided with reactance sensing electronics for sensing, such as projected capacitance or inductance, of one or more selected target quantities and/or qualities, and conversion thereof into representative electrical signals, the sensing electronics comprising at least one sensing element (30A; 30B), such as an sensing electrode or a sensing coil, optionally printed upon the film layer, and an electrical connection for connecting the sensing element (30A; 30B) to an associated control circuitry ; the second film layer on the second side of said molded or cast plastic layer having a sensing area superimposed with the sensing element (30A; 30B) of the sensing electronics; characterized in that the electrical distance between the second film layer on the second side of said molded or cast plastic layer and the sensing element (30A; 30B) being locally reduced by at least one physical feature at the position of the sensing area of the second film layer to improve the associated sensing sensitivity, wherein the at least one physical feature is: - an electrically conductive element (60B. 60C) molded or cast into the plastic layer and connected to the sensing element , or - a recess into the molded or cast plastic layer ; wherein the at least one physical feature (60A, 60B. 60C) is arranged on the first side of said molded or cast plastic layer and adjacent relative to the sensing element (30A; 30B). at least one molded or cast plastic layer having a first and an opposing second side ; a first film layer on the first side and a second film layer on the second side of said plastic layer , wherein the first film layer and the second film layer are sections of a film, or of a first film and a second film, respectively; the first film layer on the first side of said molded or cast plastic layer being provided with reactance sensing electronics for sensing, such as projected capacitance or inductance, of one or more selected target quantities and/or qualities, and conversion thereof into representative electrical signals, the sensing electronics comprising at least one sensing element (30A; 30B), such as an sensing electrode or a sensing coil, optionally printed upon the film layer, and an electrical connection for connecting the sensing element (30A; 30B) to an associated control circuitry ; the second film layer on the second side of said molded or cast plastic layer having a sensing area superimposed with the sensing element (30A; 30B) of the sensing electronics; characterized in that the electrical distance between the second film layer on the second side of said molded or cast plastic layer and the sensing element (30A; 30B) being locally reduced by at least one physical feature at the position of the sensing area of the second film layer to improve the associated sensing sensitivity, wherein the at least one physical feature is: - an electrically conductive element (60B. 60C) molded or cast into the plastic layer and connected to the sensing element , or - a recess into the molded or cast plastic layer ; - an electrically conductive element (60B. 60C) molded or cast into the plastic layer and connected to the sensing element , or - a recess into the molded or cast plastic layer ; wherein the at least one physical feature (60A, 60B. 60C) is arranged on the first side of said molded or cast plastic layer and adjacent relative to the sensing element (30A; 30B). <EOS>