A method of face-to-face type hybridization of a first microelectronic component provided on one connection surface with conductive inserts with a second microelectronic component provided on one of its face respective ductile conductive pads , method in which: ▪ each insert of the first component comprises: ∘ a hollow metal core formed of a bottom arranged on the connection surface and of a lateral wall protruding from said bottom, defining an internal surface of the insert , at least a portion of said internal surface being non-oxidized; and ∘ a metal layer substantially only covering the internal surface of the metal core and intended to be in contact with the pad associated with the insert, the metal layer comprising a first metal sub-layer non-oxidized over at least a portion of its surface, covering at least said non-oxidized portion of the internal surface of the core , the first sub-layer having a greater plasticity than the core , and a second sub-layer covering at least the first sub-layer over its non-oxidized portion and having a lower plasticity than the first sub-layer ; ▪ the pads of the second component are made of a material having a lower hardness than that of the metal core of the hollow inserts of the first component; ▪ the electro-mechanical connection of the first and the second microelectronic components consisting in inserting at ambient temperature the inserts of the first component , provided with their second metal sub-layer , into the pads of the second component. ▪ each insert of the first component comprises: ∘ a hollow metal core formed of a bottom arranged on the connection surface and of a lateral wall protruding from said bottom, defining an internal surface of the insert , at least a portion of said internal surface being non-oxidized; and ∘ a metal layer substantially only covering the internal surface of the metal core and intended to be in contact with the pad associated with the insert, the metal layer comprising a first metal sub-layer non-oxidized over at least a portion of its surface, covering at least said non-oxidized portion of the internal surface of the core , the first sub-layer having a greater plasticity than the core , and a second sub-layer covering at least the first sub-layer over its non-oxidized portion and having a lower plasticity than the first sub-layer ; ∘ a hollow metal core formed of a bottom arranged on the connection surface and of a lateral wall protruding from said bottom, defining an internal surface of the insert , at least a portion of said internal surface being non-oxidized; and ∘ a metal layer substantially only covering the internal surface of the metal core and intended to be in contact with the pad associated with the insert, the metal layer comprising a first metal sub-layer non-oxidized over at least a portion of its surface, covering at least said non-oxidized portion of the internal surface of the core , the first sub-layer having a greater plasticity than the core , and a second sub-layer covering at least the first sub-layer over its non-oxidized portion and having a lower plasticity than the first sub-layer ; ▪ the pads of the second component are made of a material having a lower hardness than that of the metal core of the hollow inserts of the first component; ▪ the electro-mechanical connection of the first and the second microelectronic components consisting in inserting at ambient temperature the inserts of the first component , provided with their second metal sub-layer , into the pads of the second component. <EOS>