A method for manufacturing a device for detecting electromagnetic radiation, including the following steps: - producing at least one thermal detector intended to detect electromagnetic radiation, resting on a substrate , and covered by a mineral sacrificial layer made of a mineral material capable of being removed by a first chemical etching; - producing at least one pad called getter : - partially extending over the mineral sacrificial layer , and being disposed at a distance from the thermal detector in a plane parallel to the substrate , - formed of a stack of portions of thin planar layers parallel to each other, including a protective portion (51.1) made of amorphous carbon capable of being removed by a second chemical etching and resting in contact with the mineral sacrificial layer , and at least one getter portion (52.1) made of a getter material resting in contact with the protective portion (51.1); - producing a thin encapsulation layer extending above the thermal detector, including an upper part (31.1) resting on the mineral sacrificial layer and covering an upper face and sides of the getter pad ; - producing at least a first vent through the thin encapsulation layer , located at a distance from the getter pad in a plane parallel to the substrate and opening onto the mineral sacrificial layer ; - removing the mineral sacrificial layer by the first chemical etching, thus freeing a surface of the protective portion ; - removing the protective portion by a second chemical etching, thus freeing a surface of the getter portion ; - depositing a thin sealing layer on the thin encapsulation layer , so as to close off at least the first vent . - producing at least one thermal detector intended to detect electromagnetic radiation, resting on a substrate , and covered by a mineral sacrificial layer made of a mineral material capable of being removed by a first chemical etching; - producing at least one pad called getter : - partially extending over the mineral sacrificial layer , and being disposed at a distance from the thermal detector in a plane parallel to the substrate , - formed of a stack of portions of thin planar layers parallel to each other, including a protective portion (51.1) made of amorphous carbon capable of being removed by a second chemical etching and resting in contact with the mineral sacrificial layer , and at least one getter portion (52.1) made of a getter material resting in contact with the protective portion (51.1); - partially extending over the mineral sacrificial layer , and being disposed at a distance from the thermal detector in a plane parallel to the substrate , - formed of a stack of portions of thin planar layers parallel to each other, including a protective portion (51.1) made of amorphous carbon capable of being removed by a second chemical etching and resting in contact with the mineral sacrificial layer , and at least one getter portion (52.1) made of a getter material resting in contact with the protective portion (51.1); - producing a thin encapsulation layer extending above the thermal detector, including an upper part (31.1) resting on the mineral sacrificial layer and covering an upper face and sides of the getter pad ; - producing at least a first vent through the thin encapsulation layer , located at a distance from the getter pad in a plane parallel to the substrate and opening onto the mineral sacrificial layer ; - removing the mineral sacrificial layer by the first chemical etching, thus freeing a surface of the protective portion ; - removing the protective portion by a second chemical etching, thus freeing a surface of the getter portion ; - depositing a thin sealing layer on the thin encapsulation layer , so as to close off at least the first vent . <EOS>