An apparatus , comprising: a flexible substrate comprising a plurality of conductive traces terminating at a peripheral edge of the flexible substrate; an active display portion disposed on an upper surface of the flexible substrate and electrically coupled to the conductive traces of the flexible substrate, the peripheral edge of the flexible substrate comprising a protruding region that extends beyond a peripheral edge of the active display portion; a plurality of conductive bonding pads affixed at the protruding region and coupled to the plurality of the conductive traces; a flexible circuit comprising a plurality of conductors electrically coupled to the plurality of bonding pads; wherein the plurality of conductors are electrically coupled to the plurality of bonding pads at locations on or below a lower surface of the flexible substrate; characterised in that : wherein the protruding region of the flexible substrate folds back on itself; wherein the plurality of bonding pads are affixed to a folded-back portion (302") of the protruding region; wherein the plurality of bonding pads extend from the conductive traces of the flexible substrate, curve around a bend of the folded-back portion of the protruding region, and extend along the folded-back portion of the protruding region; and wherein the plurality of conductors of the flexible circuit are electrically coupled to the plurality of bonding pads at the folded-back portion of the protruding region. a flexible substrate comprising a plurality of conductive traces terminating at a peripheral edge of the flexible substrate; an active display portion disposed on an upper surface of the flexible substrate and electrically coupled to the conductive traces of the flexible substrate, the peripheral edge of the flexible substrate comprising a protruding region that extends beyond a peripheral edge of the active display portion; a plurality of conductive bonding pads affixed at the protruding region and coupled to the plurality of the conductive traces; a flexible circuit comprising a plurality of conductors electrically coupled to the plurality of bonding pads; wherein the plurality of conductors are electrically coupled to the plurality of bonding pads at locations on or below a lower surface of the flexible substrate; characterised in that : wherein the protruding region of the flexible substrate folds back on itself; wherein the plurality of bonding pads are affixed to a folded-back portion (302") of the protruding region; wherein the plurality of bonding pads extend from the conductive traces of the flexible substrate, curve around a bend of the folded-back portion of the protruding region, and extend along the folded-back portion of the protruding region; and wherein the plurality of conductors of the flexible circuit are electrically coupled to the plurality of bonding pads at the folded-back portion of the protruding region. wherein the protruding region of the flexible substrate folds back on itself; wherein the plurality of bonding pads are affixed to a folded-back portion (302") of the protruding region; wherein the plurality of bonding pads extend from the conductive traces of the flexible substrate, curve around a bend of the folded-back portion of the protruding region, and extend along the folded-back portion of the protruding region; and wherein the plurality of conductors of the flexible circuit are electrically coupled to the plurality of bonding pads at the folded-back portion of the protruding region. <EOS>