Method for producing a device comprising: - providing a conductive layer between a substrate and a protective layer , - depositing a first lithography resin layer above or on the protective layer such that the protective layer is comprised between the conductive layer and the first resin layer , - a first lithography comprising: a) removing, in at least one removal area of the first lithography, the superimposition of the first resin layer , the protective layer and the conductive layer , and b) preserving, in at least one preservation area of the first lithography, the superimposition of the first resin layer , the protective layer and the conductive layer , and - depositing, at least on the at least one preservation area of the first lithography, preferably on the at least one removal area and on the at least one preservation area of the first lithography, a second lithography resin layer without removing the first resin layer of the at least one preservation area of the first lithography, and - a second lithography comprising: a) removing, in at least one removal area of the second lithography, the superimposition of the second resin , the first resin and the protective layer , but not the conductive layer , b) preserving, in at least one preservation area of the second lithography, the superimposition of the second resin , the first resin , the protective layer and the conductive layer . - providing a conductive layer between a substrate and a protective layer , - depositing a first lithography resin layer above or on the protective layer such that the protective layer is comprised between the conductive layer and the first resin layer , - a first lithography comprising: a) removing, in at least one removal area of the first lithography, the superimposition of the first resin layer , the protective layer and the conductive layer , and b) preserving, in at least one preservation area of the first lithography, the superimposition of the first resin layer , the protective layer and the conductive layer , and a) removing, in at least one removal area of the first lithography, the superimposition of the first resin layer , the protective layer and the conductive layer , and b) preserving, in at least one preservation area of the first lithography, the superimposition of the first resin layer , the protective layer and the conductive layer , and - depositing, at least on the at least one preservation area of the first lithography, preferably on the at least one removal area and on the at least one preservation area of the first lithography, a second lithography resin layer without removing the first resin layer of the at least one preservation area of the first lithography, and - a second lithography comprising: a) removing, in at least one removal area of the second lithography, the superimposition of the second resin , the first resin and the protective layer , but not the conductive layer , b) preserving, in at least one preservation area of the second lithography, the superimposition of the second resin , the first resin , the protective layer and the conductive layer . a) removing, in at least one removal area of the second lithography, the superimposition of the second resin , the first resin and the protective layer , but not the conductive layer , b) preserving, in at least one preservation area of the second lithography, the superimposition of the second resin , the first resin , the protective layer and the conductive layer . <EOS>