An implantable biocompatible component that is implantable in the human body and that incorporates, as packaged in hermetically sealed manner, an element of the type selected from the group comprising a sensor for measuring a physiological parameter, a micro-electro-mechanical system (MEMS), and an electronic circuit, said component comprising: - a base substrate made of silicon or quartz, having the element on one of its faces, and provided with metal pads that are biocompatible with the outside environment, and that are formed on a free surface of the same substrate , said pads being electrically connected to the element by electrical connections integrated into the substrate; and - a cover that is made of silicon or quartz and that covers and peripherally closes the substrate in hermetically sealed manner, on the same side as the face that integrates the element; said component being essentially devoid of any metal casing for insulating the element from the outside environment, and devoid of any separate insulating feedthroughs for electrical connection to the element; said implantable biocompatible component being characterized in that : - said element is an active element integrated into said substrate ; - said metal pads are situated on a face of the substrate that is opposite from the face on which said integrated active element is situated, and they are apparent on the outside of said component and coated with deposits procuring biocompatibility; - the substrate is provided with through holes or "vias" for connecting said metal pads to conductors in contact with said integrated active element , said vias being vias etched through the substrate and filled with a metal; and - said cover is a closure layer that is formed directly on the substrate by using a technique of the Thin Film Packaging (TFP) type and that is provided with a cavity left in its inside face, facing the integrated active element . - a base substrate made of silicon or quartz, having the element on one of its faces, and provided with metal pads that are biocompatible with the outside environment, and that are formed on a free surface of the same substrate , said pads being electrically connected to the element by electrical connections integrated into the substrate; and - a cover that is made of silicon or quartz and that covers and peripherally closes the substrate in hermetically sealed manner, on the same side as the face that integrates the element; - said element is an active element integrated into said substrate ; - said metal pads are situated on a face of the substrate that is opposite from the face on which said integrated active element is situated, and they are apparent on the outside of said component and coated with deposits procuring biocompatibility; - the substrate is provided with through holes or "vias" for connecting said metal pads to conductors in contact with said integrated active element , said vias being vias etched through the substrate and filled with a metal; and - said cover is a closure layer that is formed directly on the substrate by using a technique of the Thin Film Packaging (TFP) type and that is provided with a cavity left in its inside face, facing the integrated active element . <EOS>