A touch sensor assembly comprising: a sensor printed circuit board (PCB) including: an insulating substrate ; and a conductive layer forming a printed circuit on a top surface of the insulating substrate , wherein a sensor support portion having a circular shape hole which passes through at least the conductive layer and the insulating substrate is formed in the sensor PCB ; a touch sensor including: a circular metal plate provided at an upper side of the conductive layer ; and a ceramic disc provided at a top surface of the metal plate ; a conductive foil covering the conductive layer and the touch sensor ; and elastic members installed at a bottom surface of the sensor PCB corresponding to an outer side of the sensor support portion to support the sensor PCB , configured to be compressed by touch pressure applied to the touch sensor , wherein the touch sensor is a piezo sensor, disposed on an upper surface of the sensor PCB , wherein the metal plate is placed to cover the sensor support portion , wherein the sensor support portion has a diameter less than the diameter of the metal plate and greater than the diameter of the ceramic disc , such that the metal plate is configured to be deformed by a touch pressure applied to the touch sensor , and wherein the conductive foil has a conductive line which is formed on a bottom surface thereof configured to allow a current to flow to the touch sensor . a sensor printed circuit board (PCB) including: an insulating substrate ; and a conductive layer forming a printed circuit on a top surface of the insulating substrate , wherein a sensor support portion having a circular shape hole which passes through at least the conductive layer and the insulating substrate is formed in the sensor PCB ; an insulating substrate ; and a conductive layer forming a printed circuit on a top surface of the insulating substrate , wherein a sensor support portion having a circular shape hole which passes through at least the conductive layer and the insulating substrate is formed in the sensor PCB ; a touch sensor including: a circular metal plate provided at an upper side of the conductive layer ; and a ceramic disc provided at a top surface of the metal plate ; a circular metal plate provided at an upper side of the conductive layer ; and a ceramic disc provided at a top surface of the metal plate ; a conductive foil covering the conductive layer and the touch sensor ; and elastic members installed at a bottom surface of the sensor PCB corresponding to an outer side of the sensor support portion to support the sensor PCB , configured to be compressed by touch pressure applied to the touch sensor , wherein the touch sensor is a piezo sensor, disposed on an upper surface of the sensor PCB , wherein the metal plate is placed to cover the sensor support portion , wherein the sensor support portion has a diameter less than the diameter of the metal plate and greater than the diameter of the ceramic disc , such that the metal plate is configured to be deformed by a touch pressure applied to the touch sensor , and wherein the conductive foil has a conductive line which is formed on a bottom surface thereof configured to allow a current to flow to the touch sensor . <EOS>