An apparatus for supporting a light-emitting diode, LED, comprising: an alignment apparatus comprising a first element and a second element , wherein the first element is attached to the second element by at least one attachment portion , and wherein an air gap is defined between the first element and the second element and the attachment portion ; an LED circuit board comprising a first major surface and a second major surface opposing the first major surface, the first major surface comprising a first contact pad and a second contact pad , each of the first contact pad and the second contact pad configured to receive a respective connector from the light-emitting diode , the second major surface comprising a first area , a second area , and a third area; wherein the first area of the second major surface of the LED circuit board is configured to engage, at a portion of the first area , a first pin of a light emitting diode driving circuit and the second area of the second major surface of the LED circuit board is configured to engage, at a portion of the second area , a second pin of the light emitting diode driving circuit , characterized in that the alignment apparatus includes an alignment aperture in the first element for receiving the LED, wherein the alignment aperture is sized and shaped according to a size and shape of the LED to receive and align the LED , and a substrate is attached to the LED circuit board across the third area of the second major surface, wherein the circuit board and the substrate are disposed between the first element and the second element with a portion of the substrate visible through the air gap of the alignment apparatus . an alignment apparatus comprising a first element and a second element , wherein the first element is attached to the second element by at least one attachment portion , and wherein an air gap is defined between the first element and the second element and the attachment portion ; an LED circuit board comprising a first major surface and a second major surface opposing the first major surface, the first major surface comprising a first contact pad and a second contact pad , each of the first contact pad and the second contact pad configured to receive a respective connector from the light-emitting diode , the second major surface comprising a first area , a second area , and a third area; wherein the first area of the second major surface of the LED circuit board is configured to engage, at a portion of the first area , a first pin of a light emitting diode driving circuit and the second area of the second major surface of the LED circuit board is configured to engage, at a portion of the second area , a second pin of the light emitting diode driving circuit , characterized in that the alignment apparatus includes an alignment aperture in the first element for receiving the LED, wherein the alignment aperture is sized and shaped according to a size and shape of the LED to receive and align the LED , and a substrate is attached to the LED circuit board across the third area of the second major surface, wherein the circuit board and the substrate are disposed between the first element and the second element with a portion of the substrate visible through the air gap of the alignment apparatus . <EOS>