A multi-beam chip integration module , comprising a first printing board , at least one set of first-type chips , and at least one set of second-type chips , wherein the at least one set of first-type chips is surface mounted to a first side of the first printing board , wherein the at least one set of second-type chips is surface mounted to a second side of the first printing board , and wherein the second side of the first printing board is an opposite side parallel to the first side of the first printing board ; wherein the first-type chips are multi-beam channel chips, while the second-type chips are multi-beam synthesis network chips; the number of the multi-beam synthesis network chips being 1, and the number of the multi-beam channel chips being 4; wherein each set of multi-beam channel chips are respectively connected to different pins in the multi-beam synthesis network chip through a multilayer network constructed by different beam channels in the first printed board ; wherein signal pins in each set of multi-beam channel chips are respectively connected to different radio frequency signal channels in the first printed board, so as to be connected to corresponding antenna units; wherein the multi-beam synthesis network chip is configured to perform network synthesis or decomposition of input and output signals of the multi-beam channel chips; wherein there are two layers of multi-beam synthesis network chips, wherein the multi-beam synthesis network chips of the lower layer are respectively connected to corresponding multi-beam channel chips, and the multi-beam synthesis network chips of the upper layer are respectively connected to an external control device and multi-beam synthesis network chips of the lower layer. wherein the at least one set of first-type chips is surface mounted to a first side of the first printing board , wherein the at least one set of second-type chips is surface mounted to a second side of the first printing board , and wherein the second side of the first printing board is an opposite side parallel to the first side of the first printing board ; wherein the first-type chips are multi-beam channel chips, while the second-type chips are multi-beam synthesis network chips; the number of the multi-beam synthesis network chips being 1, and the number of the multi-beam channel chips being 4; wherein each set of multi-beam channel chips are respectively connected to different pins in the multi-beam synthesis network chip through a multilayer network constructed by different beam channels in the first printed board ; wherein signal pins in each set of multi-beam channel chips are respectively connected to different radio frequency signal channels in the first printed board, so as to be connected to corresponding antenna units; wherein the multi-beam synthesis network chip is configured to perform network synthesis or decomposition of input and output signals of the multi-beam channel chips; wherein there are two layers of multi-beam synthesis network chips, wherein the multi-beam synthesis network chips of the lower layer are respectively connected to corresponding multi-beam channel chips, and the multi-beam synthesis network chips of the upper layer are respectively connected to an external control device and multi-beam synthesis network chips of the lower layer. <EOS>