A method of device packaging of an RF device comprising the steps of: - Providing a leadframe comprising a base with an upper surface and a connection lead ; - Mounting at least one semiconductor device die on the upper surface of the base , either before or after the moulding process; - Placing a first film and a second film over the leads , base and the one or more semiconductor device dies , if any,, wherein the first film is arranged for a top portion of a mould and the second film is arranged for a bottom portion of the mould; - Applying pressure and heat to the films so that they are sealed around the base , the leads and the one or more semiconductor dies , if any, such that a first cavity is created around the at least one semiconductor device die and a second set of cavities is created at top and bottom of the leads , where the leads overlap the base and between the leads and the base ; - Providing said assembly of base , leads , one or more semiconductor dies , if any, and films into a moulding machine, such that a top portion of the mould is arranged to the first film and a bottom portion of the mould is arranged to the second film ; - Injecting moulding compound into the second cavities , thus electrically isolating the leads from the base , and curing the moulding compound, to obtain a device manufactured by film assisted moulding; - Releasing the device from the moulding machine; - Wirebonding the semiconductor device die to the lead , Wherein the connection lead comprising a portion arranged horizontally with respect to the upper surface of the base portion for external connection and an angled tip portion for connection of a wirebond to the at least one semiconductor device die , which angled tip portion is arranged to seal against the first film during moulding of the device. - Providing a leadframe comprising a base with an upper surface and a connection lead ; - Mounting at least one semiconductor device die on the upper surface of the base , either before or after the moulding process; - Placing a first film and a second film over the leads , base and the one or more semiconductor device dies , if any,, wherein the first film is arranged for a top portion of a mould and the second film is arranged for a bottom portion of the mould; - Applying pressure and heat to the films so that they are sealed around the base , the leads and the one or more semiconductor dies , if any, such that a first cavity is created around the at least one semiconductor device die and a second set of cavities is created at top and bottom of the leads , where the leads overlap the base and between the leads and the base ; - Providing said assembly of base , leads , one or more semiconductor dies , if any, and films into a moulding machine, such that a top portion of the mould is arranged to the first film and a bottom portion of the mould is arranged to the second film ; - Injecting moulding compound into the second cavities , thus electrically isolating the leads from the base , and curing the moulding compound, to obtain a device manufactured by film assisted moulding; - Releasing the device from the moulding machine; - Wirebonding the semiconductor device die to the lead , <EOS>