A wound dressing apparatus comprising: a wound contact layer comprising a proximal wound-facing face and a distal face, wherein the proximal wound-facing face is configured to be positioned in contact with a wound; at least one absorbent layer over the wound contact layer ; a cover layer configured to cover and form a seal over the wound contact layer and the at least one absorbent layer ; an electronics assembly comprising: an electronics unit comprising a negative pressure source; and a housing comprising: a plate or label; and a preshaped film, wherein the electronics unit is enclosed within the film and the plate or label of the housing, wherein the cover layer comprises at least one opening configured to receive the electronics assembly ; wherein the film is formed to be inserted into the at least one opening ; wherein the film comprises an aperture and the at least one absorbent layer configured to be in fluid communication with the aperture; wherein the electronics assembly is configured to be placed in the at least one opening , wherein the film forms a wound facing side of the electronics assembly , wherein the apparatus comprises a three-dimensional porous material in the aperture, wherein the three-dimensional porous material comprises a port, wherein when the electronics assembly is placed in the at least one opening , the port of the three-dimensional porous material receives an inlet of the negative pressure source, wherein in use the three-dimensional porous material prevents wound exudate from entering the negative pressure source, wherein the port is configured to receive the inlet of the negative pressure source in a complementary fit or friction fit engagement. a wound contact layer comprising a proximal wound-facing face and a distal face, wherein the proximal wound-facing face is configured to be positioned in contact with a wound; at least one absorbent layer over the wound contact layer ; a cover layer configured to cover and form a seal over the wound contact layer and the at least one absorbent layer ; an electronics assembly comprising: an electronics unit comprising a negative pressure source; and a housing comprising: a plate or label; and a preshaped film, wherein the electronics unit is enclosed within the film and the plate or label of the housing, wherein the cover layer comprises at least one opening configured to receive the electronics assembly ; an electronics unit comprising a negative pressure source; and a housing comprising: a plate or label; and a preshaped film, a plate or label; and a preshaped film, wherein the electronics unit is enclosed within the film and the plate or label of the housing, wherein the cover layer comprises at least one opening configured to receive the electronics assembly ; wherein the film is formed to be inserted into the at least one opening ; wherein the film comprises an aperture and the at least one absorbent layer configured to be in fluid communication with the aperture; wherein the electronics assembly is configured to be placed in the at least one opening , wherein the film forms a wound facing side of the electronics assembly , wherein the apparatus comprises a three-dimensional porous material in the aperture, wherein the three-dimensional porous material comprises a port, wherein when the electronics assembly is placed in the at least one opening , the port of the three-dimensional porous material receives an inlet of the negative pressure source, wherein in use the three-dimensional porous material prevents wound exudate from entering the negative pressure source, wherein the port is configured to receive the inlet of the negative pressure source in a complementary fit or friction fit engagement. <EOS>