Method for producing a calibration cell for an imaging measurement device for checking both geometric dimensions of a semiconductor structure, in particular of a solar cell, and geometric dimensions of an imprint applied thereto, comprising the following steps: providing a transparent substrate , applying a structured specularly reflective layer , which is known with regard to its lateral geometric dimensions, to a side surface of the substrate , wherein the structure embodied by this, which specularly reflects radiation transmitted through the transparent substrate, is configured such that the specularly reflective layer has at least one cutout at which the side surface of the substrate is not covered with the specularly reflective layer , and wherein the at least one cutout is completely surrounded by the specularly reflective layer or two points lie on the contour of the specularly reflective layer which bounds the at least one cutout , and a straight line through the two points together with the bounding contour of the specularly reflective layer encloses a region of the at least one cutout , applying a scattering layer , which diffusely reflects in reflected light, such that the at least one cutout is filled over the whole area, wherein the at least one cutout , if it is not completely enclosed by the specularly reflective layer, is filled over the whole area if the region enclosed by the straight line and the bounding contour is filled over the whole area, wherein as viewed from the substrate side in reflected light the radiation impinging on the scattering layer is diffusely reflected, wherein the specularly reflective layer is applied to the side surface of the substrate such that a circumferential edge region of the side surface of the substrate is left so that it is not covered by the specularly reflective layer . providing a transparent substrate , applying a structured specularly reflective layer , which is known with regard to its lateral geometric dimensions, to a side surface of the substrate , wherein the structure embodied by this, which specularly reflects radiation transmitted through the transparent substrate, is configured such that the specularly reflective layer has at least one cutout at which the side surface of the substrate is not covered with the specularly reflective layer , and wherein the at least one cutout is completely surrounded by the specularly reflective layer or two points lie on the contour of the specularly reflective layer which bounds the at least one cutout , and a straight line through the two points together with the bounding contour of the specularly reflective layer encloses a region of the at least one cutout , applying a scattering layer , which diffusely reflects in reflected light, such that the at least one cutout is filled over the whole area, wherein the at least one cutout , if it is not completely enclosed by the specularly reflective layer, is filled over the whole area if the region enclosed by the straight line and the bounding contour is filled over the whole area, wherein as viewed from the substrate side in reflected light the radiation impinging on the scattering layer is diffusely reflected, wherein the specularly reflective layer is applied to the side surface of the substrate such that a circumferential edge region of the side surface of the substrate is left so that it is not covered by the specularly reflective layer . <EOS>