A deposition mask including an iron (Fe) and nickel (Ni) alloy metal plate for OLED pixel deposition, the deposition mask comprising, a deposition region (DA) and a non-deposition region (NDA) other than the deposition region (DA) for forming a deposition pattern, wherein the deposition region (DA) includes a plurality of effective portions and an ineffective portion other than an effective portion, the effective portion includes: a plurality of small surface holes (V1) formed on one surface of the deposition mask ; a plurality of large surface holes (V2) formed on the other surface opposite to the one surface of the deposition mask ; a through-hole (TH) communicating the small surface hole and the large surface hole; and an island portion (IS) formed on the other surface of the deposition mask , and disposed between the plurality of through-holes, characterized in that the X-ray diffraction intensity of a plane of the deposition mask is defined as I , X-ray diffraction intensity of a plane of the deposition mask is defined as I , X-ray diffraction intensity of a plane of the deposition mask is defined as I , a X-ray diffraction intensity ratio of the I is defined by the following Equation 1, A = I 200 / I 200 + I 220 + I 111 , and a X-ray diffraction intensity ratio of the I is defined by the following Equation 2, B = I 220 / I 200 + I 220 + I 111 , wherein the A is 0.5 to 0.6, the B is 0.3 to 0.5, and the value A is larger than a value B. a deposition region (DA) and a non-deposition region (NDA) other than the deposition region (DA) for forming a deposition pattern, wherein the deposition region (DA) includes a plurality of effective portions and an ineffective portion other than an effective portion, the effective portion includes: a plurality of small surface holes (V1) formed on one surface of the deposition mask ; a plurality of large surface holes (V2) formed on the other surface opposite to the one surface of the deposition mask ; a through-hole (TH) communicating the small surface hole and the large surface hole; and an island portion (IS) formed on the other surface of the deposition mask , and disposed between the plurality of through-holes, characterized in that the X-ray diffraction intensity of a plane of the deposition mask is defined as I , X-ray diffraction intensity of a plane of the deposition mask is defined as I , X-ray diffraction intensity of a plane of the deposition mask is defined as I , a X-ray diffraction intensity ratio of the I is defined by the following Equation 1, A = I 200 / I 200 + I 220 + I 111 , and a X-ray diffraction intensity ratio of the I is defined by the following Equation 2, B = I 220 / I 200 + I 220 + I 111 , wherein the A is 0.5 to 0.6, the B is 0.3 to 0.5, and the value A is larger than a value B. a plurality of small surface holes (V1) formed on one surface of the deposition mask ; a plurality of large surface holes (V2) formed on the other surface opposite to the one surface of the deposition mask ; a through-hole (TH) communicating the small surface hole and the large surface hole; and an island portion (IS) formed on the other surface of the deposition mask , and disposed between the plurality of through-holes, characterized in that the X-ray diffraction intensity of a plane of the deposition mask is defined as I , X-ray diffraction intensity of a plane of the deposition mask is defined as I , X-ray diffraction intensity of a plane of the deposition mask is defined as I , a X-ray diffraction intensity ratio of the I is defined by the following Equation 1, A = I 200 / I 200 + I 220 + I 111 , and a X-ray diffraction intensity ratio of the I is defined by the following Equation 2, B = I 220 / I 200 + I 220 + I 111 , wherein the A is 0.5 to 0.6, the B is 0.3 to 0.5, and the value A is larger than a value B. <EOS>