A light emitting device package comprising: a body including an insulating material; a first cavity in a first region of the body; a second cavity in a second region of the body; first and second lead frames spaced apart from each other in the first cavity; a third lead frame spaced apart from the second lead frame in the second cavity; a first light emitting device flip-bonded to the first and second lead frames in the first cavity; a second light emitting device flip-bonded to the second and third lead frames in the second cavity; and a molding member in the first and second cavities, wherein the first and second cavities are disposed at different regions in the body and concaved down from a top surface of the body , wherein a first part of the second lead frame disposed in the first cavity is connected to a second part of the second lead frame disposed in the second cavity , characterized in that bottom surfaces of the first, second and third lead frames disposed on bottoms of the first and second cavities are disposed on a same horizontal plane with a bottom surface of the body , wherein upper parts of the first and third lead frames are bent outward of the first and second cavities and disposed between the top surface and the bottom surface of the body closer to the top surface of the body than to the bottom surface of the body , wherein the light emitting device package further comprises: a first separation part disposed on a bottom surface and lateral sides of the first cavity to separate between the first and second lead frames ; and a second separation part disposed on a bottom surface and lateral sides of the second cavity to separate between the second and third lead frames , wherein the first and second separation parts are formed of a material of the body . a body including an insulating material; a first cavity in a first region of the body; a second cavity in a second region of the body; first and second lead frames spaced apart from each other in the first cavity; a third lead frame spaced apart from the second lead frame in the second cavity; a first light emitting device flip-bonded to the first and second lead frames in the first cavity; a second light emitting device flip-bonded to the second and third lead frames in the second cavity; and a molding member in the first and second cavities, wherein the first and second cavities are disposed at different regions in the body and concaved down from a top surface of the body , wherein a first part of the second lead frame disposed in the first cavity is connected to a second part of the second lead frame disposed in the second cavity , characterized in that bottom surfaces of the first, second and third lead frames disposed on bottoms of the first and second cavities are disposed on a same horizontal plane with a bottom surface of the body , wherein upper parts of the first and third lead frames are bent outward of the first and second cavities and disposed between the top surface and the bottom surface of the body closer to the top surface of the body than to the bottom surface of the body , wherein the light emitting device package further comprises: a first separation part disposed on a bottom surface and lateral sides of the first cavity to separate between the first and second lead frames ; and a second separation part disposed on a bottom surface and lateral sides of the second cavity to separate between the second and third lead frames , wherein the first and second separation parts are formed of a material of the body . a first separation part disposed on a bottom surface and lateral sides of the first cavity to separate between the first and second lead frames ; and a second separation part disposed on a bottom surface and lateral sides of the second cavity to separate between the second and third lead frames , wherein the first and second separation parts are formed of a material of the body . <EOS>