A sputtering target for a sputtering chamber, the sputtering target comprising: a sputtering plate comprising a central cylindrical mesa arranged to serve as a sputtering surface , a backside surface opposing the sputtering surface , a back surface opposite the sputtering surface , an outer peripheral wall inclined by an angle (α) of at least about 8 degrees relative to a plane perpendicular to the top plane of the central cylindrical mesa and extending from the sputtering surface to the back surface , and an inner peripheral wall extending from the backside surface to the back surface , wherein a recess that exposes the backside surface of the sputtering plate is formed between the backside surface and the inner peripheral wall ,the backside surface having radially inner, middle and outer regions, the backside surface having: a plurality of circular grooves which are spaced apart from one another; and at least one arcuate channel cutting through the circular grooves and extending from the radially inner region to the radially outer region of the sputtering plate; and an annular-shaped backing plate mounted to the sputtering plate and comprising an annular shaped body defined by a front surface supporting the sputtering plate , an inner peripheral wall , and an annular flange that extends beyond a radius of the sputtering plate , wherein the annular-shaped body defines an open annulus exposing the backside surface of the sputtering plate , and the annular flange comprises a peripheral circular surface and has an outer footing configured for resting on an insulator in the sputtering chamber. a sputtering plate comprising a central cylindrical mesa arranged to serve as a sputtering surface , a backside surface opposing the sputtering surface , a back surface opposite the sputtering surface , an outer peripheral wall inclined by an angle (α) of at least about 8 degrees relative to a plane perpendicular to the top plane of the central cylindrical mesa and extending from the sputtering surface to the back surface , and an inner peripheral wall extending from the backside surface to the back surface , wherein a recess that exposes the backside surface of the sputtering plate is formed between the backside surface and the inner peripheral wall ,the backside surface having radially inner, middle and outer regions, the backside surface having: a plurality of circular grooves which are spaced apart from one another; and at least one arcuate channel cutting through the circular grooves and extending from the radially inner region to the radially outer region of the sputtering plate; and a plurality of circular grooves which are spaced apart from one another; and at least one arcuate channel cutting through the circular grooves and extending from the radially inner region to the radially outer region of the sputtering plate; and an annular-shaped backing plate mounted to the sputtering plate and comprising an annular shaped body defined by a front surface supporting the sputtering plate , an inner peripheral wall , and an annular flange that extends beyond a radius of the sputtering plate , wherein the annular-shaped body defines an open annulus exposing the backside surface of the sputtering plate , and the annular flange comprises a peripheral circular surface and has an outer footing configured for resting on an insulator in the sputtering chamber. <EOS>