An RFID device having a surface smaller than or equal to 1/4 of the surface of the ID1 format according to the ISO 7810 standard, the RFID device comprising: - a substrate ; - a wire type RF antenna disposed in the substrate; and - an electronic module , disposed in the substrate, the electronic module including: ∘ an RF chip ; ∘ at least one capacitance (CP) in the form of a discrete component external to the RF chip; and ∘ a casing in which the RF chip and said at least one capacitance are encapsulated; ∘ the RF chip and said at least one capacitance (CP) each being electrically connected in parallel to two ends of the RF antenna so that the electronic module can communicate in contactless mode with the outside of the RFID device by using said RF antenna, said ends of the RF antenna being positioned out of said casing, the electronic module comprising a lead frame , the lead frame including: - a first portion (Z0) on which the RF chip and said at least one capacitance are mounted; - two second portions (ZA, ZB), electrically isolated from the first portion (Z0), forming a first and a second connection area (Z1A, Z1B), called inner connection areas, located in the casing, the second portions (ZA, ZB) extending so as to form respectively a first and a second connection area (Z2A, Z2B), called outer connection areas, located outside the casing of the electronic module, each outer connection area (Z2A, Z2B) being connected respectively to a respective end of the RF antenna and to a respective inner connection area (Z1A, Z1B), the RF chip and said at least one capacitance being electrically connected to the ends of the RF antenna via wiring cables , encapsulated in the casing, which connect the RF chip and said at least one capacitance to the inner connection areas. - a substrate ; - a wire type RF antenna disposed in the substrate; and - an electronic module , disposed in the substrate, the electronic module including: ∘ an RF chip ; ∘ at least one capacitance (CP) in the form of a discrete component external to the RF chip; and ∘ a casing in which the RF chip and said at least one capacitance are encapsulated; ∘ the RF chip and said at least one capacitance (CP) each being electrically connected in parallel to two ends of the RF antenna so that the electronic module can communicate in contactless mode with the outside of the RFID device by using said RF antenna, said ends of the RF antenna being positioned out of said casing, ∘ an RF chip ; ∘ at least one capacitance (CP) in the form of a discrete component external to the RF chip; and ∘ a casing in which the RF chip and said at least one capacitance are encapsulated; ∘ the RF chip and said at least one capacitance (CP) each being electrically connected in parallel to two ends of the RF antenna so that the electronic module can communicate in contactless mode with the outside of the RFID device by using said RF antenna, said ends of the RF antenna being positioned out of said casing, - a first portion (Z0) on which the RF chip and said at least one capacitance are mounted; - two second portions (ZA, ZB), electrically isolated from the first portion (Z0), forming a first and a second connection area (Z1A, Z1B), called inner connection areas, located in the casing, the second portions (ZA, ZB) extending so as to form respectively a first and a second connection area (Z2A, Z2B), called outer connection areas, located outside the casing of the electronic module, each outer connection area (Z2A, Z2B) being connected respectively to a respective end of the RF antenna and to a respective inner connection area (Z1A, Z1B), the RF chip and said at least one capacitance being electrically connected to the ends of the RF antenna via wiring cables , encapsulated in the casing, which connect the RF chip and said at least one capacitance to the inner connection areas. <EOS>