An LC resonant antenna comprising: a dielectric layer formed by laminating a plurality of sheets, wherein the plurality of sheets comprise: an inductor layer provided with a coil-shaped inductor ; a capacitor layer laminated on the inductor layer in a direction of an axis of a coil center of the inductor ; and a cover layer covering the inductor layer , wherein the capacitor layer comprises a capacitor connected to the inductor , wherein the capacitor comprises a pair of electrode plates arranged in parallel at a distance from each other in a laminating direction, wherein the cover layer has an outer surface including a reference surface , the reference surface being a plane located on a side in the laminating direction of the inductor layer opposite to the capacitor layer and located closest to the inductor in the laminating direction, wherein a distance in the laminating direction between the reference surface and the inductor is smaller than a distance in the laminating direction between the inductor and an electrode plate arranged close to the inductor among the pair of electrode plates , wherein the reference surface is a surface on which an IC chip (C) is placeable, and wherein the inductor is suitable for being electromagnetically coupled to an on-chip antenna of the IC chip (C) or a feed coil comprising the IC chip (C) and a coil. a dielectric layer formed by laminating a plurality of sheets, wherein the plurality of sheets comprise: an inductor layer provided with a coil-shaped inductor ; a capacitor layer laminated on the inductor layer in a direction of an axis of a coil center of the inductor ; and a cover layer covering the inductor layer , wherein the capacitor layer comprises a capacitor connected to the inductor , wherein the capacitor comprises a pair of electrode plates arranged in parallel at a distance from each other in a laminating direction, wherein the cover layer has an outer surface including a reference surface , the reference surface being a plane located on a side in the laminating direction of the inductor layer opposite to the capacitor layer and located closest to the inductor in the laminating direction, wherein a distance in the laminating direction between the reference surface and the inductor is smaller than a distance in the laminating direction between the inductor and an electrode plate arranged close to the inductor among the pair of electrode plates , wherein the reference surface is a surface on which an IC chip (C) is placeable, and wherein the inductor is suitable for being electromagnetically coupled to an on-chip antenna of the IC chip (C) or a feed coil comprising the IC chip (C) and a coil. an inductor layer provided with a coil-shaped inductor ; a capacitor layer laminated on the inductor layer in a direction of an axis of a coil center of the inductor ; and a cover layer covering the inductor layer , wherein the capacitor layer comprises a capacitor connected to the inductor , wherein the capacitor comprises a pair of electrode plates arranged in parallel at a distance from each other in a laminating direction, wherein the cover layer has an outer surface including a reference surface , the reference surface being a plane located on a side in the laminating direction of the inductor layer opposite to the capacitor layer and located closest to the inductor in the laminating direction, wherein a distance in the laminating direction between the reference surface and the inductor is smaller than a distance in the laminating direction between the inductor and an electrode plate arranged close to the inductor among the pair of electrode plates , wherein the reference surface is a surface on which an IC chip (C) is placeable, and wherein the inductor is suitable for being electromagnetically coupled to an on-chip antenna of the IC chip (C) or a feed coil comprising the IC chip (C) and a coil. <EOS>