An integrated circuit device , comprising: a first integrated circuit layer having a first surface including a first plurality of emitting apertures and a second plurality of receiving apertures , the first integrated circuit layer further comprising a first plurality of optical emitters and a second plurality of optical receivers , wherein each of the first plurality of emitting apertures is associated with a respective one of the first plurality of optical emitters and each of the second plurality of receiving apertures is associated with a respective one of the second plurality of optical receivers ; a second integrated circuit layer having a second surface facing said first surface , said second surface including a first plurality of receiving apertures and a second plurality of emitting apertures , the second integrated circuit layer further comprising a first plurality of optical receivers and a second plurality of optical emitters , wherein each of the first plurality of receiving apertures is associated with a respective one of the first plurality of optical receivers and each of the second plurality of emitting apertures is associated with a respective one of the second plurality of optical emitters ; and a superlensing element positioned between said first and second surfaces such that an optical signal emitted at the emitting apertures is imaged onto the receiving apertures , wherein said first and second surfaces are separated by a distance that is less than a wavelength of the optical signal, wherein the optical emitters of the second plurality of optical emitters are spatially interleaved with the optical receivers of the first plurality of optical receivers and wherein the optical receivers of the second plurality of optical receivers are spatially interleaved with the optical emitters of the first plurality of optical transmitters . a first integrated circuit layer having a first surface including a first plurality of emitting apertures and a second plurality of receiving apertures , the first integrated circuit layer further comprising a first plurality of optical emitters and a second plurality of optical receivers , wherein each of the first plurality of emitting apertures is associated with a respective one of the first plurality of optical emitters and each of the second plurality of receiving apertures is associated with a respective one of the second plurality of optical receivers ; a second integrated circuit layer having a second surface facing said first surface , said second surface including a first plurality of receiving apertures and a second plurality of emitting apertures , the second integrated circuit layer further comprising a first plurality of optical receivers and a second plurality of optical emitters , wherein each of the first plurality of receiving apertures is associated with a respective one of the first plurality of optical receivers and each of the second plurality of emitting apertures is associated with a respective one of the second plurality of optical emitters ; and a superlensing element positioned between said first and second surfaces such that an optical signal emitted at the emitting apertures is imaged onto the receiving apertures , wherein said first and second surfaces are separated by a distance that is less than a wavelength of the optical signal, wherein the optical emitters of the second plurality of optical emitters are spatially interleaved with the optical receivers of the first plurality of optical receivers and wherein the optical receivers of the second plurality of optical receivers are spatially interleaved with the optical emitters of the first plurality of optical transmitters . <EOS>