A heat sink, comprising: a heat dissipation substrate , a connector , and a fastener , wherein the heat dissipation substrate is configured to be suitable to dissipate heat for a packaged chip using multi-chip package technology located on a circuit board , and the heat dissipation substrate is suitable to be located on a surface that is of the packaged chip and that is opposite to the circuit board ; and the heat dissipation substrate comprises a first heat dissipation substrate and a second heat dissipation substrate , the first heat dissipation substrate and the second heat dissipation substrate each have a heat conduction surface that is suitable to conduct heat with a chip in the packaged chip, different heat conduction surfaces are suitable to correspond to different chips in the packaged chip, a first end of the connector is fastened to the first heat dissipation substrate , a second end of the connector suspends on an outer side of the second heat dissipation substrate , and the fastener presses against an outer side of the first heat dissipation substrate , to prevent the first heat dissipation substrate from moving far away from the second heat dissipation substrate ; wherein the heat conduction surfaces of the first heat dissipation substrate and the second heat dissipation substrate are both in a same plane; the heat sink is characterized in that : a heat conduction rate of a material that the connector is made of is less than a heat conduction rate of a material that the heat dissipation substrate is made of; the material that the connector is made of is stainless steel or zinc alloy. a heat dissipation substrate , a connector , and a fastener , wherein the heat dissipation substrate is configured to be suitable to dissipate heat for a packaged chip using multi-chip package technology located on a circuit board , and the heat dissipation substrate is suitable to be located on a surface that is of the packaged chip and that is opposite to the circuit board ; and the heat dissipation substrate comprises a first heat dissipation substrate and a second heat dissipation substrate , the first heat dissipation substrate and the second heat dissipation substrate each have a heat conduction surface that is suitable to conduct heat with a chip in the packaged chip, different heat conduction surfaces are suitable to correspond to different chips in the packaged chip, a first end of the connector is fastened to the first heat dissipation substrate , a second end of the connector suspends on an outer side of the second heat dissipation substrate , and the fastener presses against an outer side of the first heat dissipation substrate , to prevent the first heat dissipation substrate from moving far away from the second heat dissipation substrate ; wherein the heat conduction surfaces of the first heat dissipation substrate and the second heat dissipation substrate are both in a same plane; the heat sink is characterized in that : a heat conduction rate of a material that the connector is made of is less than a heat conduction rate of a material that the heat dissipation substrate is made of; the material that the connector is made of is stainless steel or zinc alloy. <EOS>