A package apparatus , comprising: a first conductive wiring layer , having a first surface and a second surface that are arranged opposite to each other; a dielectric material layer , formed for allowing the first conductive wiring layer to be disposed inside the same; a second conductive wiring layer , disposed on a first conductive pillar layer and the dielectric material layer; a second conductive pillar layer including conductive pillars, disposed on the second conductive wiring layer ; and a first molding compound layer , formed for allowing the second conductive wiring layer and the second conductive pillar layer to be disposed inside the same; characterized in that it further comprises a first conductive pillar layer including conductive pillars, disposed on the first surface of the first conductive wiring layer , wherein the dielectric material layer is formed for allowing the first conductive wiring layer and the first conductive pillar layer to be disposed inside the same, wherein the first molding compound layer is formed at least partially covering the side surfaces of the conductive pillars of the second conductive pillar layer , the sidewalls of a first trapezoidal-like recess cover the side surfaces of the conductive pillars of the second conductive pillar layer , and the first trapezoidal-like recess with symmetrical sidewalls is formed narrower at its bottom than at its opening between the conductive pillars; wherein the first conductive wiring layer includes wires, and wherein a second trapezoidal-like recess which has symmetrical sidewalls and is narrower at its bottom than at its opening is formed between the wires. a first conductive wiring layer , having a first surface and a second surface that are arranged opposite to each other; a dielectric material layer , formed for allowing the first conductive wiring layer to be disposed inside the same; a second conductive wiring layer , disposed on a first conductive pillar layer and the dielectric material layer; a second conductive pillar layer including conductive pillars, disposed on the second conductive wiring layer ; and a first molding compound layer , formed for allowing the second conductive wiring layer and the second conductive pillar layer to be disposed inside the same; characterized in that it further comprises a first conductive pillar layer including conductive pillars, disposed on the first surface of the first conductive wiring layer , wherein the dielectric material layer is formed for allowing the first conductive wiring layer and the first conductive pillar layer to be disposed inside the same, wherein the first molding compound layer is formed at least partially covering the side surfaces of the conductive pillars of the second conductive pillar layer , the sidewalls of a first trapezoidal-like recess cover the side surfaces of the conductive pillars of the second conductive pillar layer , and the first trapezoidal-like recess with symmetrical sidewalls is formed narrower at its bottom than at its opening between the conductive pillars; wherein the first conductive wiring layer includes wires, and wherein a second trapezoidal-like recess which has symmetrical sidewalls and is narrower at its bottom than at its opening is formed between the wires. <EOS>