An electronic device comprising: a housing including a rear cover and a cover glass facing away from the rear cover ; an antenna array interposed between the rear cover and the cover glass and including a plurality of antenna units ; a printed circuit board, PCB, interposed between the antenna array and the cover glass ; and a communication circuit disposed on the PCB and configured to feed the antenna array , wherein each of the antenna units includes a ground layer and at least one or more antenna elements disposed on the ground layer , wherein each of the antenna elements includes: a via configured to block interference from another antenna unit and extending from the ground layer and having a shape of a square pillar; a radiator having a specified spaced distance from the via and surrounding remaining surfaces other than one of side surfaces of the via ; and a feed part electrically connecting the radiator to the communication circuit, and wherein the communication circuit is configured to transmit/receive a signal of a specified frequency band through an electrical path formed via the antenna array , wherein each of the antenna units includes a nonconductive layer including a first surface , wherein the first surface includes a first region and a second region surrounding a part of the first region, wherein the via extends from the ground layer to the first region, wherein at least part of the radiator is disposed in the second region, wherein the antenna elements include a first antenna element and a second antenna element, wherein each of the antenna units further includes: a central member interposed between the first antenna element and the second antenna element; and a central radiator interposed between the central member and the rear cover. a housing including a rear cover and a cover glass facing away from the rear cover ; an antenna array interposed between the rear cover and the cover glass and including a plurality of antenna units ; a printed circuit board, PCB, interposed between the antenna array and the cover glass ; and a communication circuit disposed on the PCB and configured to feed the antenna array , wherein each of the antenna units includes a ground layer and at least one or more antenna elements disposed on the ground layer , wherein each of the antenna elements includes: a via configured to block interference from another antenna unit and extending from the ground layer and having a shape of a square pillar; a radiator having a specified spaced distance from the via and surrounding remaining surfaces other than one of side surfaces of the via ; and a via configured to block interference from another antenna unit and extending from the ground layer and having a shape of a square pillar; a radiator having a specified spaced distance from the via and surrounding remaining surfaces other than one of side surfaces of the via ; and a feed part electrically connecting the radiator to the communication circuit, and wherein the communication circuit is configured to transmit/receive a signal of a specified frequency band through an electrical path formed via the antenna array , wherein each of the antenna units includes a nonconductive layer including a first surface , wherein the first surface includes a first region and a second region surrounding a part of the first region, wherein the via extends from the ground layer to the first region, wherein at least part of the radiator is disposed in the second region, wherein the antenna elements include a first antenna element and a second antenna element, wherein each of the antenna units further includes: a central member interposed between the first antenna element and the second antenna element; and a central radiator interposed between the central member and the rear cover. a central member interposed between the first antenna element and the second antenna element; and a central radiator interposed between the central member and the rear cover. <EOS>