A method of manufacturing a plurality of optical devices for cameras, each optical device having a fix focus lens module and a mount element for assembling with an image sensor comprising an image sensor plane , wherein each mount element (3a .. b, 43a .. b) has an interior space which accommodates a respective lens module (2a .. b, 42a .. b), wherein the lens modules are lens chips separated from a wafer or a wafer stack assembly , each fix focus lens module comprising one or more lenses or lens parts, the method comprises the steps of: • manufacturing a plurality of lens modules (2a .. d), wherein the lens modules are replicated on wafer scale, and wherein the replication process comprises molding or embossing; • determining a lens module focusing parameter value FP corresponding to a flange focus length FFL which corresponds to a distance between a wafer plane of the lens module and a focal plane on the image sensor side, for each lens module (2a .. d); • providing and allocating mount elements (3a .. b) to the lens modules (2a .. b), whereas the mount elements (3a .. b) are to be arranged within the optical devices to define a fixed separation distance (6a .. b) between the lens modules (2a .. b) and the image sensor plane , the mount elements (3a .. b) having different mount section lengths (7a .. b) by means of which the geometrical distance between the lens module and the image sensor plane is adjusted for each lens module (2a .. d) individually or in groups dependent on the optical properties of the lens modules (2a .. b), to compensate the variation of the lens module focusing parameter values between the plurality of lens modules (2a .. d), so that the focal plane of the lens modules falls into the image plane, particularly the image sensor plane , or lies within the depth of focus of the camera containing the optical device ; and • assembling the lens modules and the mount elements in order to form optical devices . • manufacturing a plurality of lens modules (2a .. d), wherein the lens modules are replicated on wafer scale, and wherein the replication process comprises molding or embossing; • determining a lens module focusing parameter value FP corresponding to a flange focus length FFL which corresponds to a distance between a wafer plane of the lens module and a focal plane on the image sensor side, for each lens module (2a .. d); • providing and allocating mount elements (3a .. b) to the lens modules (2a .. b), whereas the mount elements (3a .. b) are to be arranged within the optical devices to define a fixed separation distance (6a .. b) between the lens modules (2a .. b) and the image sensor plane , the mount elements (3a .. b) having different mount section lengths (7a .. b) by means of which the geometrical distance between the lens module and the image sensor plane is adjusted for each lens module (2a .. d) individually or in groups dependent on the optical properties of the lens modules (2a .. b), to compensate the variation of the lens module focusing parameter values between the plurality of lens modules (2a .. d), so that the focal plane of the lens modules falls into the image plane, particularly the image sensor plane , or lies within the depth of focus of the camera containing the optical device ; and • assembling the lens modules and the mount elements in order to form optical devices . <EOS>