An oven comprising: - an oven body ; - a cooking chamber disposed in the oven body and configured to receive a food product; a door ; - a radio frequency, RF, heating system configured to provide RF energy into the cooking chamber using solid state electronic components ; and - an air circulation system configured to provide air for cooling the solid state electronic components , - wherein the air circulation system comprises: - an inlet cavity disposed below the cooking chamber , - a region housing the solid state electronic components , and - a cooling fan isolating the inlet cavity from the region housing the solid state electronic components to maintain the inlet cavity at a pressure below ambient pressure to draw cooling air into the inlet cavity via an inlet array , and to maintain the region at a pressure above ambient pressure to discharge air that has cooled the solid state electronic components from the oven body , characterized in that the solid state electronic components are housed in an attic region disposed above the cooking chamber , that an outlet of the cooling fan is operably coupled to a riser duct that carries the cooling air upward from below the cooking chamber to the attic region , that the cooling air exits the riser duct into an inlet header disposed in the attic region and is directed from the inlet header to a heat sink operably coupled to power amplifier electronics configured to generate the RF energy, and that a protruding member is disposed between the power amplifier electronics and a portion of the attic region that is proximate to the door of the oven to prevent air leaving the cooking chamber from direct contact with the power amplifier electronics . - an oven body ; - a cooking chamber disposed in the oven body and configured to receive a food product; a door ; - a radio frequency, RF, heating system configured to provide RF energy into the cooking chamber using solid state electronic components ; and - an air circulation system configured to provide air for cooling the solid state electronic components , - wherein the air circulation system comprises: - an inlet cavity disposed below the cooking chamber , - a region housing the solid state electronic components , and - a cooling fan isolating the inlet cavity from the region housing the solid state electronic components to maintain the inlet cavity at a pressure below ambient pressure to draw cooling air into the inlet cavity via an inlet array , and to maintain the region at a pressure above ambient pressure to discharge air that has cooled the solid state electronic components from the oven body , characterized in that the solid state electronic components are housed in an attic region disposed above the cooking chamber , that an outlet of the cooling fan is operably coupled to a riser duct that carries the cooling air upward from below the cooking chamber to the attic region , that the cooling air exits the riser duct into an inlet header disposed in the attic region and is directed from the inlet header to a heat sink operably coupled to power amplifier electronics configured to generate the RF energy, and that a protruding member is disposed between the power amplifier electronics and a portion of the attic region that is proximate to the door of the oven to prevent air leaving the cooking chamber from direct contact with the power amplifier electronics . - an inlet cavity disposed below the cooking chamber , - a region housing the solid state electronic components , and - a cooling fan isolating the inlet cavity from the region housing the solid state electronic components to maintain the inlet cavity at a pressure below ambient pressure to draw cooling air into the inlet cavity via an inlet array , and to maintain the region at a pressure above ambient pressure to discharge air that has cooled the solid state electronic components from the oven body , <EOS>