A camera module, comprising at least one optical lens ; at least one photosensitive element , wherein the photosensitive element has a photosensitive area and a non-photosensitive area surrounding around the photosensitive area ; a circuit board , wherein the circuit board comprises at least one substrate and at least one electronic component , the substrate has a substrate front surface and a substrate back surface , the substrate front surface and the substrate back surface correspond to each other, wherein the electronic component is conductively connected to the substrate ; wherein the photosensitive element is conductively connected with the substrate , wherein the optical lens is held in the photosensitive path of the photosensitive element , wherein the substrate further has at least one substrate channel , which extends from the substrate front surface to the substrate back surface ; and at least one molded unit , which comprises at least one back surface molded portion , and wherein the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate ; characterized in that a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate , and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to the substrate channel of the substrate , wherein in a thickness direction of the substrate , at least one part of at least one of the electronic components located on the substrate front surface of the substrate and the non-photosensitive area of the photosensitive element are overlapped with each other. at least one optical lens ; at least one photosensitive element , wherein the photosensitive element has a photosensitive area and a non-photosensitive area surrounding around the photosensitive area ; a circuit board , wherein the circuit board comprises at least one substrate and at least one electronic component , the substrate has a substrate front surface and a substrate back surface , the substrate front surface and the substrate back surface correspond to each other, wherein the electronic component is conductively connected to the substrate ; wherein the photosensitive element is conductively connected with the substrate , wherein the optical lens is held in the photosensitive path of the photosensitive element , wherein the substrate further has at least one substrate channel , which extends from the substrate front surface to the substrate back surface ; and at least one molded unit , which comprises at least one back surface molded portion , and wherein the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate ; characterized in that a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate , and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to the substrate channel of the substrate , wherein in a thickness direction of the substrate , at least one part of at least one of the electronic components located on the substrate front surface of the substrate and the non-photosensitive area of the photosensitive element are overlapped with each other. <EOS>