A device comprising: a printed circuit board for reducing quantum signal crosstalk comprising a plurality of electrically insulating laminate sheets laminated together in a stack, a first electrically conductive layer arranged on a first exterior surface of the stack, the first electrically conductive layer comprising a first conductive trace and a second conductive trace , a second electrically conductive layer arranged on a second exterior surface of the stack, the second exterior surface opposing the first exterior surface, a third conductive trace between a first electrically insulating laminate sheet of the stack and a directly adjacent second electrically insulating laminate sheet of the stack, the third conductive trace being between the first and the second electrically conductive layers a first via extending from the second conductive trace through the stack to the third conductive trace, wherein the first via electrically connects the second conductive trace to the third conductive trace; and a chip comprising a quantum circuit element and a ground contact, wherein the quantum circuit element is electrically coupled to the second conductive trace of the printed circuit board, and the ground contact is electrically coupled to the first conductive trace, such that the first conductive trace and the second electrically conductive layer serve as a first and second ground plane. a printed circuit board for reducing quantum signal crosstalk comprising a plurality of electrically insulating laminate sheets laminated together in a stack, a first electrically conductive layer arranged on a first exterior surface of the stack, the first electrically conductive layer comprising a first conductive trace and a second conductive trace , a second electrically conductive layer arranged on a second exterior surface of the stack, the second exterior surface opposing the first exterior surface, a third conductive trace between a first electrically insulating laminate sheet of the stack and a directly adjacent second electrically insulating laminate sheet of the stack, the third conductive trace being between the first and the second electrically conductive layers a first via extending from the second conductive trace through the stack to the third conductive trace, wherein the first via electrically connects the second conductive trace to the third conductive trace; and a plurality of electrically insulating laminate sheets laminated together in a stack, a first electrically conductive layer arranged on a first exterior surface of the stack, the first electrically conductive layer comprising a first conductive trace and a second conductive trace , a second electrically conductive layer arranged on a second exterior surface of the stack, the second exterior surface opposing the first exterior surface, a third conductive trace between a first electrically insulating laminate sheet of the stack and a directly adjacent second electrically insulating laminate sheet of the stack, the third conductive trace being between the first and the second electrically conductive layers a first via extending from the second conductive trace through the stack to the third conductive trace, wherein the first via electrically connects the second conductive trace to the third conductive trace; and a chip comprising a quantum circuit element and a ground contact, wherein the quantum circuit element is electrically coupled to the second conductive trace of the printed circuit board, and the ground contact is electrically coupled to the first conductive trace, such that the first conductive trace and the second electrically conductive layer serve as a first and second ground plane. <EOS>