A microphone package comprising: a plastic lid including a first conductive lid trace extending along an interior surface of the plastic lid and an electrical shielding layer on an interior surface of the lid at locations not utilized for the first conductive lid trace, wherein the electric shielding layer is electrically coupled to a grounding of a substrate base , and does not overlap with the first conductive lid trace ; wherein the substrate base is coupled to the plastic lid to form a sealed cavity, the substrate base including a first conductive substrate trace arranged to form an electrical connection with the first conductive lid trace ; the microphone package further comprising: a first component mounted on the substrate base and electrically coupled to the first conductive substrate trace ; and a second component mounted on the plastic lid and electrically coupled to the first conductive lid trace such that the electrical connection between the first conductive lid trace and the first conductive substrate trace provides electrical coupling between the first component and the second component , wherein the plastic lid is a molded thermoplastic lid , wherein the first conductive lid trace extends along the interior surface of the sealed cavity from a first location proximal to the second component to a second location that forms the electrical connection with the first conductive substrate trace , and wherein at least one component of a group consisting of the first component and the second component includes a MEMS microphone die positioned in an interior of the sealed cavity. a first conductive lid trace extending along an interior surface of the plastic lid and an electrical shielding layer on an interior surface of the lid at locations not utilized for the first conductive lid trace, wherein the electric shielding layer is electrically coupled to a grounding of a substrate base , and does not overlap with the first conductive lid trace ; wherein the substrate base is coupled to the plastic lid to form a sealed cavity, the substrate base including a first conductive substrate trace arranged to form an electrical connection with the first conductive lid trace ; the microphone package further comprising: a first component mounted on the substrate base and electrically coupled to the first conductive substrate trace ; and a second component mounted on the plastic lid and electrically coupled to the first conductive lid trace such that the electrical connection between the first conductive lid trace and the first conductive substrate trace provides electrical coupling between the first component and the second component , wherein the plastic lid is a molded thermoplastic lid , wherein the first conductive lid trace extends along the interior surface of the sealed cavity from a first location proximal to the second component to a second location that forms the electrical connection with the first conductive substrate trace , and a first component mounted on the substrate base and electrically coupled to the first conductive substrate trace ; and a second component mounted on the plastic lid and electrically coupled to the first conductive lid trace such that the electrical connection between the first conductive lid trace and the first conductive substrate trace provides electrical coupling between the first component and the second component , wherein the plastic lid is a molded thermoplastic lid , wherein the first conductive lid trace extends along the interior surface of the sealed cavity from a first location proximal to the second component to a second location that forms the electrical connection with the first conductive substrate trace , and wherein at least one component of a group consisting of the first component and the second component includes a MEMS microphone die positioned in an interior of the sealed cavity. <EOS>