An LED filament , comprising: at least two LED sections , wherein each of the at least two LED sections comprises at least two LED chips electrically connected to each other through at least one first wire ; a conductive section comprising a conductor , wherein the at least two LED sections are connected to each other by the conductive section , wherein the conductive section is electrically connected to the LED sections through second wires , wherein a length of each at least one first wire is less than that of the conductor , and wherein a shortest distance between two LED chips located in adjacent said at least two LED sections is greater than a distance between two adjacent LED chips in the same LED section ; at least two conductive electrodes , wherein each of the at least two conductive elecrodes is electrically connected to a corresponding one of the at least two LED sections ; and a light conversion layer , covering the at least two LED sections and a portion of each of the at least two conductive electrodes , wherein the light conversion layer is made of a flexible transparent material; wherein a portion of each at least one first wire is exposed outside the light conversion layer , and a portion of each of the at least two conductive electrodes is exposed outside the light conversion layer, wherein each at least one first wire is a bonding wire comprising a first junction (B) and a second junction (D) which are covered by the light conversion layer , wherein the first junction (B) is between a ball attached to a soldering pad on one of the at least two LED chips and the at least one first wire , and wherein the second junction (D) is between the at least one first wire and two solder butted joints on another of the at least two LED chips . at least two LED sections , wherein each of the at least two LED sections comprises at least two LED chips electrically connected to each other through at least one first wire ; a conductive section comprising a conductor , wherein the at least two LED sections are connected to each other by the conductive section , wherein the conductive section is electrically connected to the LED sections through second wires , wherein a length of each at least one first wire is less than that of the conductor , and wherein a shortest distance between two LED chips located in adjacent said at least two LED sections is greater than a distance between two adjacent LED chips in the same LED section ; at least two conductive electrodes , wherein each of the at least two conductive elecrodes is electrically connected to a corresponding one of the at least two LED sections ; and a light conversion layer , covering the at least two LED sections and a portion of each of the at least two conductive electrodes , wherein the light conversion layer is made of a flexible transparent material; wherein a portion of each at least one first wire is exposed outside the light conversion layer , and a portion of each of the at least two conductive electrodes is exposed outside the light conversion layer, wherein each at least one first wire is a bonding wire comprising a first junction (B) and a second junction (D) which are covered by the light conversion layer , wherein the first junction (B) is between a ball attached to a soldering pad on one of the at least two LED chips and the at least one first wire , and wherein the second junction (D) is between the at least one first wire and two solder butted joints on another of the at least two LED chips . <EOS>