An electronic assembly, comprising a first electronic component , a second electronic component , and a primary circuit board , wherein the first electronic component is provided with a first secondary circuit board , the second electronic component is provided with a second secondary circuit board , the first secondary circuit board is electrically connected to the primary circuit board by using a first electrical connector , an interlayer space capable of accommodating the second secondary circuit board is formed between the first secondary circuit board and the primary circuit board , a portion of the second secondary circuit board that enters the interlayer space overlaps the first secondary circuit board and is electrically connected to the primary circuit board by using a second electrical connector , and in an overlapping direction, the second secondary circuit board is located between the first secondary circuit board and the primary circuit board , the first electrical connector is located between the first secondary circuit board and the primary circuit board , and the second electrical connector is located between the second secondary circuit board and the primary circuit board , characterized in that in the interlayer space , the primary circuit board , the first secondary circuit board and the second secondary circuit board are parallel to each other, the first secondary circuit board is electrically connected to the primary circuit board by using the first electrical connector , and the portion of the second secondary circuit board that overlaps the first secondary circuit board is electrically connected to the primary circuit board by using the second electrical connector , such that an operating height (H1) of the first electrical connector is greater than an operating height (H2) of the second electrical connector , wherein a difference between an operating height (H1) of the first electrical connector and an operating height (H2) of the second electrical connector is equal to a distance from one side of the first secondary circuit board that faces the primary circuit board to one side of the second secondary circuit board that faces the primary circuit board , wherein the electronic assembly further comprises a positioning mechanism configured to position the first secondary circuit board and the second secondary circuit board. characterized in that in the interlayer space , the primary circuit board , the first secondary circuit board and the second secondary circuit board are parallel to each other, the first secondary circuit board is electrically connected to the primary circuit board by using the first electrical connector , and the portion of the second secondary circuit board that overlaps the first secondary circuit board is electrically connected to the primary circuit board by using the second electrical connector , such that an operating height (H1) of the first electrical connector is greater than an operating height (H2) of the second electrical connector , wherein a difference between an operating height (H1) of the first electrical connector and an operating height (H2) of the second electrical connector is equal to a distance from one side of the first secondary circuit board that faces the primary circuit board to one side of the second secondary circuit board that faces the primary circuit board , wherein the electronic assembly further comprises a positioning mechanism configured to position the first secondary circuit board and the second secondary circuit board. <EOS>