A system for thermal management of computing devices comprises: a central supply line coupled to a fluid source of cooling liquid; a central return line coupled to the fluid source; a rack supply manifold coupled to the central supply line ; a rack return manifold coupled to the central return line ; and a cooling loop assembly coupled to the rack supply manifold and the rack return manifold , the cooling loop assembly coupled to at least one cooling device electrically connected to a circuit board , the cooling loop assembly further comprising: multiple board supply lines ; multiple inlet connectors connected to the rack supply manifold ; and multiple outlet connectors connected to the rack return manifold ; the multiple inlet connectors providing a passageway for the cooling liquid from the central supply line into the cooling loop assembly for distribution to the at least one cooling device , and the multiple outlet connectors providing a passageway to the rack return manifold for the cooling liquid exiting the at least one cooling device , wherein each of the multiple inlet connectors is coupled to a corresponding one of the multiple board supply lines that feeds fluid from the rack supply manifold into the cooling loop assembly , and wherein the cooling loop assembly comprises a board inlet manifold and secondary supply lines , each board supply line connecting a corresponding one of the multiple inlet connectors to the board inlet manifold , and the secondary supply lines connecting the board inlet manifold to the at least one cooling device . a central supply line coupled to a fluid source of cooling liquid; a central return line coupled to the fluid source; a rack supply manifold coupled to the central supply line ; a rack return manifold coupled to the central return line ; and a cooling loop assembly coupled to the rack supply manifold and the rack return manifold , the cooling loop assembly coupled to at least one cooling device electrically connected to a circuit board , the cooling loop assembly further comprising: multiple board supply lines ; multiple inlet connectors connected to the rack supply manifold ; and multiple outlet connectors connected to the rack return manifold ; the multiple inlet connectors providing a passageway for the cooling liquid from the central supply line into the cooling loop assembly for distribution to the at least one cooling device , and the multiple outlet connectors providing a passageway to the rack return manifold for the cooling liquid exiting the at least one cooling device , multiple board supply lines ; multiple inlet connectors connected to the rack supply manifold ; and multiple outlet connectors connected to the rack return manifold ; the multiple inlet connectors providing a passageway for the cooling liquid from the central supply line into the cooling loop assembly for distribution to the at least one cooling device , and the multiple outlet connectors providing a passageway to the rack return manifold for the cooling liquid exiting the at least one cooling device , wherein each of the multiple inlet connectors is coupled to a corresponding one of the multiple board supply lines that feeds fluid from the rack supply manifold into the cooling loop assembly , and wherein the cooling loop assembly comprises a board inlet manifold and secondary supply lines , each board supply line connecting a corresponding one of the multiple inlet connectors to the board inlet manifold , and the secondary supply lines connecting the board inlet manifold to the at least one cooling device . <EOS>