A hot-dip plated steel comprising: a base steel; and a hot-dip plating layer disposed on a surface of the base steel, wherein a chemical composition of the hot-dip plating layer is, by mass%, Al: 10.00% to 30.00%, Mg: 3.00% to 12.00%, Sn: 0% to 2.00%, Si: 0% to 2.50%, Ca: 0% to 3.00%, Ni: 0% or more and less than 0.25%, Cr: 0% or more and less than 0.25%, Ti: 0% or more and less than 0.25%, Co: 0% or more and less than 0.25%, V: 0% or more and less than 0.25%, Nb: 0% or more and less than 0.25%, Cu: 0% or more and less than 0.25%, Mn: 0% or more and less than 0.25%, Bi: 0% or more and less than 5.000%, In: 0% or more and less than 2.00%, Y: 0% to 0.50%, La: 0% or more and less than 0.50%, Ce: 0% or more and less than 0.50%, Fe: 0% to 5.00%, Sr: 0% or more and less than 0.50%, Sb: 0% or more and less than 0.50%, Pb: 0% or more and less than 0.50%, and B: 0% or more and less than 0.50%, a remainder consists of Zn and impurities, a metallographic structure of the hot-dip plating layer contains 5 to 45 area% of an α phase having a grain diameter of 0.5 to 2 μm, the metallographic structure of the hot-dip plating layer contains 15 to 70 area% of a MgZn 2 phase, and among the α phases having the grain diameter of 0.5 to 2 μm, an area ratio of the α phase having a α // MgZn2 orientation relationship to the adjacent MgZn 2 phase is 25% to 100%; wherein, in the metallographic structure of the hot-dip plating layer, the area ratio of the α phase having a grain diameter of 0.5 to 2 μm, the area ratio of the MgZn 2 phase, and the area ratio of the α phase having the α // MgZn2 orientation relationship to the adjacent MgZn 2 phase among the α phases having a grain diameter of 0.5 to 2 μm, are measured as described in the description. a base steel; and a hot-dip plating layer disposed on a surface of the base steel, wherein a chemical composition of the hot-dip plating layer is, by mass%, Al: 10.00% to 30.00%, Mg: 3.00% to 12.00%, Sn: 0% to 2.00%, Si: 0% to 2.50%, Ca: 0% to 3.00%, Ni: 0% or more and less than 0.25%, Cr: 0% or more and less than 0.25%, Ti: 0% or more and less than 0.25%, Co: 0% or more and less than 0.25%, V: 0% or more and less than 0.25%, Nb: 0% or more and less than 0.25%, Cu: 0% or more and less than 0.25%, Mn: 0% or more and less than 0.25%, Bi: 0% or more and less than 5.000%, In: 0% or more and less than 2.00%, Y: 0% to 0.50%, La: 0% or more and less than 0.50%, Ce: 0% or more and less than 0.50%, Fe: 0% to 5.00%, Sr: 0% or more and less than 0.50%, Sb: 0% or more and less than 0.50%, Pb: 0% or more and less than 0.50%, and B: 0% or more and less than 0.50%, a remainder consists of Zn and impurities, a metallographic structure of the hot-dip plating layer contains 5 to 45 area% of an α phase having a grain diameter of 0.5 to 2 μm, the metallographic structure of the hot-dip plating layer contains 15 to 70 area% of a MgZn 2 phase, and among the α phases having the grain diameter of 0.5 to 2 μm, an area ratio of the α phase having a α // MgZn2 orientation relationship to the adjacent MgZn 2 phase is 25% to 100%; wherein, in the metallographic structure of the hot-dip plating layer, the area ratio of the α phase having a grain diameter of 0.5 to 2 μm, the area ratio of the MgZn 2 phase, and the area ratio of the α phase having the α // MgZn2 orientation relationship to the adjacent MgZn 2 phase among the α phases having a grain diameter of 0.5 to 2 μm, are measured as described in the description. <EOS>