A flexible ultrasound transducer for an ultrasound monitoring system for examining a curved object, said flexible ultrasound transducer comprising an integrated circuit structure and a multi-layered structure , said multi-layered structure comprising an array of ultrasound transducing elements , an array of control circuits and flexible layers , said array of ultrasound transducing elements being arranged in a first layer structure of the multi-layered structure and configured for generating ultrasonic energy propagating along a positive direction of main transducer axis Z. said array of control circuits being arranged in a second layer structure of the multi-layered structure , said integrated circuit structure comprising a plurality of Application Specific Integrated Circuits (ASIC), wherein at least one ASIC is configured to support a plurality of individual control circuits , said array of control circuits and said integrated circuit structure being configured for operating the array of ultrasound transducing elements arranged in said first layer structure , said flexible layers being arranged in said multi-layer structure so that the multi-layered structure and the whole ultrasound transducer become flexible, thereby permitting the ultrasound transducer to form a continuous contact with said curved object during operation, wherein said first layer structure is arranged at a position that is further along in a positive direction of the main transducer axis Z than said second layer structure , which first layer structure and said second layer structure of said multi-layered structure , respectively, constitute a frontplane and a backplane of the flexible ultrasound transducer , characterized in that said flexible layers comprise a frontplane flexible layer and a backplane flexible layer , which backplane flexible layer is arranged at a position that is further along in a negative direction of the main transducer axis Z than the second layer structure . said flexible ultrasound transducer comprising an integrated circuit structure and a multi-layered structure , said multi-layered structure comprising an array of ultrasound transducing elements , an array of control circuits and flexible layers , said array of ultrasound transducing elements being arranged in a first layer structure of the multi-layered structure and configured for generating ultrasonic energy propagating along a positive direction of main transducer axis Z. said array of control circuits being arranged in a second layer structure of the multi-layered structure , said integrated circuit structure comprising a plurality of Application Specific Integrated Circuits (ASIC), wherein at least one ASIC is configured to support a plurality of individual control circuits , said array of control circuits and said integrated circuit structure being configured for operating the array of ultrasound transducing elements arranged in said first layer structure , said flexible layers being arranged in said multi-layer structure so that the multi-layered structure and the whole ultrasound transducer become flexible, thereby permitting the ultrasound transducer to form a continuous contact with said curved object during operation, wherein said first layer structure is arranged at a position that is further along in a positive direction of the main transducer axis Z than said second layer structure , which first layer structure and said second layer structure of said multi-layered structure , respectively, constitute a frontplane and a backplane of the flexible ultrasound transducer , characterized in that said flexible layers comprise a frontplane flexible layer and a backplane flexible layer , which backplane flexible layer is arranged at a position that is further along in a negative direction of the main transducer axis Z than the second layer structure . <EOS>