A method of manufacturing a plurality of electronic circuits, each electronic circuit comprising a respective first portion , comprising a respective group (G11) of contact pads , and a respective integrated circuit, IC , comprising a respective group (G21) of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad, the method comprising: providing a first structure comprising the plurality of first portions ; providing a second structure comprising the plurality of ICs and a common support arranged to support the plurality of ICs; transferring said ICs from the common support onto a first roller ; transferring said ICs from the first roller onto a second roller ; and transferring said ICs from the second roller onto the first structure such that each group of terminals is mounted on a respective group of contact pads, wherein transferring said ICs from the common support onto the first roller comprises picking said ICs from the common support with the first roller, and wherein said picking comprises engaging each IC with a respective one of a plurality of IC-engaging features provided on the first roller, characterised in that the plurality of ICs are arranged as a regular array on the common support , with a repetition interval of a distance D1 in a first direction, and the plurality of IC-engaging features are arranged as a regular array on the first roller with a repetition interval of n x D1 in a corresponding first direction, where n is an integer greater than or equal to 2, and the method comprises arranging the second structure at a first position relative to the first roller, picking a first group of the plurality of ICs from the common support by engaging each IC of that first group with said IC-engaging features, transferring said first group of ICs from the first roller onto the second roller and then from the second roller onto the first structure. providing a first structure comprising the plurality of first portions ; providing a second structure comprising the plurality of ICs and a common support arranged to support the plurality of ICs; transferring said ICs from the common support onto a first roller ; transferring said ICs from the first roller onto a second roller ; and transferring said ICs from the second roller onto the first structure such that each group of terminals is mounted on a respective group of contact pads, wherein transferring said ICs from the common support onto the first roller comprises picking said ICs from the common support with the first roller, and wherein said picking comprises engaging each IC with a respective one of a plurality of IC-engaging features provided on the first roller, characterised in that the plurality of ICs are arranged as a regular array on the common support , with a repetition interval of a distance D1 in a first direction, and the plurality of IC-engaging features are arranged as a regular array on the first roller with a repetition interval of n x D1 in a corresponding first direction, where n is an integer greater than or equal to 2, and the method comprises arranging the second structure at a first position relative to the first roller, picking a first group of the plurality of ICs from the common support by engaging each IC of that first group with said IC-engaging features, transferring said first group of ICs from the first roller onto the second roller and then from the second roller onto the first structure. <EOS>