A soldering apparatus comprising: first transfer means for transferring a printed circuit board (P1); second transfer means provided in parallel to a transfer direction of the printed circuit board (P1) transferred by the first transfer means ; a first reflow furnace main body for heating the printed circuit board (P1) transferred by the first transfer means ; a second reflow furnace main body for heating a printed circuit board (P2) transferred by the second transfer means ; and a frame for housing the first reflow furnace main body and the second reflow furnace main body , wherein the frame contains first opening/closing means for opening/closing the first reflow furnace main body and second opening/closing means for opening/closing the second reflow furnace main body , wherein each of the first and second reflow furnace main bodies is configured to have an upper main body and a lower main body , characterized in that the first opening/closing means includes cylinders as first lifting/lowering means for lifting/lowering the upper main body of the first reflow furnace main body vertically, without being rotated relative to the lower main body of the first reflow furnace main body , and a driving mechanism for driving the cylinders , and further includes a sub-frame to which the cylinders are attached below and an upper cover provided above the sub-frame to cover the upper side and lateral side of the upper main body , and the second opening/closing means includes cylinders as second lifting/lowering means for lifting/lowering the upper main body of the second reflow furnace main body vertically, without being rotated relative to the lower main body of the second reflow furnace main body and a driving mechanism for driving the cylinders , and further includes a sub-frame to which the cylinders are attached below and an upper cover provided above the sub-frame to cover the upper side and lateral side of the upper main body . first transfer means for transferring a printed circuit board (P1); second transfer means provided in parallel to a transfer direction of the printed circuit board (P1) transferred by the first transfer means ; a first reflow furnace main body for heating the printed circuit board (P1) transferred by the first transfer means ; a second reflow furnace main body for heating a printed circuit board (P2) transferred by the second transfer means ; and a frame for housing the first reflow furnace main body and the second reflow furnace main body , wherein the frame contains first opening/closing means for opening/closing the first reflow furnace main body and second opening/closing means for opening/closing the second reflow furnace main body , wherein each of the first and second reflow furnace main bodies is configured to have an upper main body and a lower main body , characterized in that the first opening/closing means includes cylinders as first lifting/lowering means for lifting/lowering the upper main body of the first reflow furnace main body vertically, without being rotated relative to the lower main body of the first reflow furnace main body , and a driving mechanism for driving the cylinders , and further includes a sub-frame to which the cylinders are attached below and an upper cover provided above the sub-frame to cover the upper side and lateral side of the upper main body , and the second opening/closing means includes cylinders as second lifting/lowering means for lifting/lowering the upper main body of the second reflow furnace main body vertically, without being rotated relative to the lower main body of the second reflow furnace main body and a driving mechanism for driving the cylinders , and further includes a sub-frame to which the cylinders are attached below and an upper cover provided above the sub-frame to cover the upper side and lateral side of the upper main body . <EOS>