An intermediate circuit arrangement , comprising: - structurally identical first and second partial circuit boards comprising a series connection of at least two capacitor banks , wherein the partial circuit boards each comprise a terminal strip with in each case a positive intermediate circuit connection, a negative intermediate circuit connection and a center connection, a connecting circuit board for electrically connecting respective connections of the terminal strips of the two partial circuit boards to one another, characterised in that the connecting circuit board is a multilayer circuit board comprising two outer metal layers and at least two inner metal layers arranged between the outer metal layers , wherein the outer metal layers each comprise an electrical connection between corresponding connections of the terminal strips of the two partial circuit boards , and wherein at least one first metal layer of the inner metal layers comprises only an electrical connection of the positive intermediate circuit connections of the two partial circuit boards and at least one second metal layer of the inner metal layers comprises only an electrical connection of the negative intermediate circuit connections of the two partial circuit boards . - structurally identical first and second partial circuit boards comprising a series connection of at least two capacitor banks , wherein the partial circuit boards each comprise a terminal strip with in each case a positive intermediate circuit connection, a negative intermediate circuit connection and a center connection, a connecting circuit board for electrically connecting respective connections of the terminal strips of the two partial circuit boards to one another, characterised in that the connecting circuit board is a multilayer circuit board comprising two outer metal layers and at least two inner metal layers arranged between the outer metal layers , wherein the outer metal layers each comprise an electrical connection between corresponding connections of the terminal strips of the two partial circuit boards , and wherein at least one first metal layer of the inner metal layers comprises only an electrical connection of the positive intermediate circuit connections of the two partial circuit boards and at least one second metal layer of the inner metal layers comprises only an electrical connection of the negative intermediate circuit connections of the two partial circuit boards . a connecting circuit board for electrically connecting respective connections of the terminal strips of the two partial circuit boards to one another, characterised in that the connecting circuit board is a multilayer circuit board comprising two outer metal layers and at least two inner metal layers arranged between the outer metal layers , wherein the outer metal layers each comprise an electrical connection between corresponding connections of the terminal strips of the two partial circuit boards , and wherein at least one first metal layer of the inner metal layers comprises only an electrical connection of the positive intermediate circuit connections of the two partial circuit boards and at least one second metal layer of the inner metal layers comprises only an electrical connection of the negative intermediate circuit connections of the two partial circuit boards . <EOS>