A fluidic dispensing device , comprising: a housing that includes a fluid reservoir suitable for carrying a fluid that contains an acidic component that is reactive with silicon and a tape automated bonding (TAB) circuit configured to facilitate ejection of the acidic component from the housing , wherein the TAB circuit includes a flex circuit ; and a microfluidic ejection head being mechanically and electrically connected to the flex circuit and having a nozzle plate and a microfluidic ejection chip connected to the nozzle plate , wherein the nozzle plate includes a plurality of nozzle holes and a plurality of fluid chambers associated therewith, wherein the microfluidic ejection chip includes a silicon substrate , an operational layer having a device layer and a flow feature layer formed on the device layer , wherein the device layer includes a layer having conductive and insulative features, and fluid ejection elements attached to a device surface (30-1) of silicon substrate , wherein the fluid ejection elements are respectively associated with the plurality of fluid chambers of the nozzle plate , wherein the silicon substrate has a fluid passageway that is in fluid communication with each of the fluid reservoir and the nozzle plate , the fluid passageway is defined by a silicon sidewall (30-2) of the silicon substrate , and the silicon sidewall (30-2) and corners between the device surface (30-1) and the silicon sidewall (30-2) next to the fluid ejection elements are covered by a permanent passivation layer , the operational layer is attached to the device surface (30-1) of silicon substrate and is configured to provide an electrical connection of the fluid ejection elements to the flex circuit , the silicon sidewall (30-2) and the permanent passivation layer extend continuously around a perimeter of the fluid passageway at silicon substrate . a housing that includes a fluid reservoir suitable for carrying a fluid that contains an acidic component that is reactive with silicon and a tape automated bonding (TAB) circuit configured to facilitate ejection of the acidic component from the housing , wherein the TAB circuit includes a flex circuit ; and a microfluidic ejection head being mechanically and electrically connected to the flex circuit and having a nozzle plate and a microfluidic ejection chip connected to the nozzle plate , wherein the nozzle plate includes a plurality of nozzle holes and a plurality of fluid chambers associated therewith, wherein the microfluidic ejection chip includes a silicon substrate , an operational layer having a device layer and a flow feature layer formed on the device layer , wherein the device layer includes a layer having conductive and insulative features, and fluid ejection elements attached to a device surface (30-1) of silicon substrate , wherein the fluid ejection elements are respectively associated with the plurality of fluid chambers of the nozzle plate , wherein the silicon substrate has a fluid passageway that is in fluid communication with each of the fluid reservoir and the nozzle plate , the fluid passageway is defined by a silicon sidewall (30-2) of the silicon substrate , and the silicon sidewall (30-2) and corners between the device surface (30-1) and the silicon sidewall (30-2) next to the fluid ejection elements are covered by a permanent passivation layer , the operational layer is attached to the device surface (30-1) of silicon substrate and is configured to provide an electrical connection of the fluid ejection elements to the flex circuit , the silicon sidewall (30-2) and the permanent passivation layer extend continuously around a perimeter of the fluid passageway at silicon substrate . <EOS>