A method of encapsulating an electronic component, the method comprising: applying a first layer of an encapsulating composition onto an electronic component from an applicator roll , the electronic component being disposed on a substrate , the applicator roll comprising an outer surface and being spaced apart from the electronic component such that a gap exists between the applicator roll and the electronic component, the gap controlling the thickness of the first layer of encapsulating composition, the first layer of encapsulating composition encapsulating the electronic component on the substrate , and an interface between the surface of the electronic component and the encapsulating composition being substantially free of voids, wherein the term "void" means a space occupied by a gas, and the phrase "substantially free of voids" means that no voids having a cross sectional dimension greater than 0.1 mm are present and that on average from 0 to no greater than 20 voids are present for each square millimeter of encapsulation composition; wherein applying the first layer includes: (i) passing the substrate past the applicator roll and turning the applicator roll in the same direction as a direction of travel of the substrate , wherein a tangential speed of the applicator roll is greater than or less than a linear speed of the substrate , or (ii) passing the substrate past the applicator roll in a first direction and turning the applicator roll in a direction opposite the first direction. the applicator roll comprising an outer surface and being spaced apart from the electronic component such that a gap exists between the applicator roll and the electronic component, the gap controlling the thickness of the first layer of encapsulating composition, the first layer of encapsulating composition encapsulating the electronic component on the substrate , and an interface between the surface of the electronic component and the encapsulating composition being substantially free of voids, wherein the term "void" means a space occupied by a gas, and the phrase "substantially free of voids" means that no voids having a cross sectional dimension greater than 0.1 mm are present and that on average from 0 to no greater than 20 voids are present for each square millimeter of encapsulation composition; wherein applying the first layer includes: (i) passing the substrate past the applicator roll and turning the applicator roll in the same direction as a direction of travel of the substrate , wherein a tangential speed of the applicator roll is greater than or less than a linear speed of the substrate , or (ii) passing the substrate past the applicator roll in a first direction and turning the applicator roll in a direction opposite the first direction. (i) passing the substrate past the applicator roll and turning the applicator roll in the same direction as a direction of travel of the substrate , wherein a tangential speed of the applicator roll is greater than or less than a linear speed of the substrate , or (ii) passing the substrate past the applicator roll in a first direction and turning the applicator roll in a direction opposite the first direction. <EOS>