A surface mount system , comprising: a circuit board ; and a plurality of surface mount devices , each surface mount device having: an electronic component operable in an electronic circuit; a heat transfer component thermally coupled to the electronic component and having a heat transfer surface configured to interface with a heat sink; and a resiliently flexible lead electrically coupled to the electronic component and to the circuit board , wherein the resiliently flexible lead of each surface mount device is electrically coupled to its respective electronic component and to the circuit board, and wherein the resiliently flexible leads are individually deflected a distance sufficient to cause the heat transfer surfaces of the plurality of surface mounts to be substantially aligned for interfacing with the heat sink; characterised in that the system further comprising a planarization tool to facilitate substantial alignment of the heat transfer surfaces in the common plane, wherein the planarization tool comprises an alignment member having a planar alignment surface configured to interface with the planar heat transfer surfaces, wherein the planarization tool further comprises a backing member configured to support the circuit board, and wherein the alignment member and the backing member are movable relative to one another to facilitate alignment of the planar heat transfer surfaces. a circuit board ; and a plurality of surface mount devices , each surface mount device having: an electronic component operable in an electronic circuit; a heat transfer component thermally coupled to the electronic component and having a heat transfer surface configured to interface with a heat sink; and a resiliently flexible lead electrically coupled to the electronic component and to the circuit board , wherein the resiliently flexible lead of each surface mount device is electrically coupled to its respective electronic component and to the circuit board, and an electronic component operable in an electronic circuit; a heat transfer component thermally coupled to the electronic component and having a heat transfer surface configured to interface with a heat sink; and a resiliently flexible lead electrically coupled to the electronic component and to the circuit board , wherein the resiliently flexible lead of each surface mount device is electrically coupled to its respective electronic component and to the circuit board, and wherein the resiliently flexible leads are individually deflected a distance sufficient to cause the heat transfer surfaces of the plurality of surface mounts to be substantially aligned for interfacing with the heat sink; characterised in that the system further comprising a planarization tool to facilitate substantial alignment of the heat transfer surfaces in the common plane, wherein the planarization tool comprises an alignment member having a planar alignment surface configured to interface with the planar heat transfer surfaces, wherein the planarization tool further comprises a backing member configured to support the circuit board, and wherein the alignment member and the backing member are movable relative to one another to facilitate alignment of the planar heat transfer surfaces. <EOS>