An apparatus for transferring a semiconductor device from a wafer to a target position, comprising a first rotatable transfer assembly (104-1) and a second rotatable transfer assembly (104-2), each rotatable transfer assembly comprising a transfer head (136-1,136-2,136-3,136-4,136-5,136-6,136-7,136-8) rotatable about an axis of rotation of said rotatable transfer assembly, wherein the first rotatable transfer assembly is configured to rotate the transfer head thereof about the axis to a pick-up position to pick up the semiconductor device from the wafer, located in a first plane , and rotate the transfer head about the axis thereof to a transfer position , wherein the transfer position comprises a position where the semiconductor device is located for transfer from the first rotatable transfer assembly to the second rotatable transfer assembly; a transfer assembly actuator operative to effect movement of said at least one of the first rotatable transfer assembly or the second rotatable transfer assembly in an axial direction relative to a plane of rotation of said transfer head, wherein the at least one rotatable transfer assembly is moveable in the axial direction simultaneously with transfer of the semiconductor device at the transfer position, and. wherein said second rotatable transfer assembly is operative to: rotate said transfer head thereof to said transfer position; receive said semiconductor device from said transfer head of said first rotatable transfer assembly; and rotate said transfer head of said second rotatable transfer assembly to said target position located in a second plane , the second plane intersecting the first plane . a first rotatable transfer assembly (104-1) and a second rotatable transfer assembly (104-2), each rotatable transfer assembly comprising a transfer head (136-1,136-2,136-3,136-4,136-5,136-6,136-7,136-8) rotatable about an axis of rotation of said rotatable transfer assembly, wherein the first rotatable transfer assembly is configured to rotate the transfer head thereof about the axis to a pick-up position to pick up the semiconductor device from the wafer, located in a first plane , and rotate the transfer head about the axis thereof to a transfer position , wherein the transfer position comprises a position where the semiconductor device is located for transfer from the first rotatable transfer assembly to the second rotatable transfer assembly; a transfer assembly actuator operative to effect movement of said at least one of the first rotatable transfer assembly or the second rotatable transfer assembly in an axial direction relative to a plane of rotation of said transfer head, wherein the at least one rotatable transfer assembly is moveable in the axial direction simultaneously with transfer of the semiconductor device at the transfer position, and. wherein said second rotatable transfer assembly is operative to: rotate said transfer head thereof to said transfer position; receive said semiconductor device from said transfer head of said first rotatable transfer assembly; and rotate said transfer head of said second rotatable transfer assembly to said target position located in a second plane , the second plane intersecting the first plane . <EOS>