A surface mount clip formed by bending a metallic thin plate, and the surface mount clip comprising: a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board, when the surface mount clip is mounted on an attachment surface of the printed circuit board; a pair of support parts connected to the solder joint part configured to be disposed at an interval between the pair of support parts , the interval allowing a conductive member to be inserted therein; and a resilient contact part that is connected at least to one of the pair of support parts in a manner inclined toward the solder joint part and, when the conductive member is inserted between the pair of support parts , electrically connects the conductor pattern and the conductive member; wherein the pair of support parts each comprises a parallel support portion disposed in parallel to the solder joint part , wherein the width of the pair of support parts is configured to be larger than the width of the solder joint parts , wherein, in the side of the first parallel support portion of the first support part out of the pair of support parts which faces the second support part , the first resilient contact part and a first notch are formed, and, in the side of the second parallel support portion of the second support part which faces the first support part , the second resilient contact part and a second notch are formed, wherein the first resilient contact part and the second notch correspondingly face each other, whereas the second resilient contact part and the first notch correspondingly face each other, and positions of the first resilient contact part and the second resilient contact part are displaced with respect to each other. a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board, when the surface mount clip is mounted on an attachment surface of the printed circuit board; a pair of support parts connected to the solder joint part configured to be disposed at an interval between the pair of support parts , the interval allowing a conductive member to be inserted therein; and a resilient contact part that is connected at least to one of the pair of support parts in a manner inclined toward the solder joint part and, when the conductive member is inserted between the pair of support parts , electrically connects the conductor pattern and the conductive member; wherein the pair of support parts each comprises a parallel support portion disposed in parallel to the solder joint part , wherein the width of the pair of support parts is configured to be larger than the width of the solder joint parts , wherein, in the side of the first parallel support portion of the first support part out of the pair of support parts which faces the second support part , the first resilient contact part and a first notch are formed, and, in the side of the second parallel support portion of the second support part which faces the first support part , the second resilient contact part and a second notch are formed, wherein the first resilient contact part and the second notch correspondingly face each other, whereas the second resilient contact part and the first notch correspondingly face each other, and positions of the first resilient contact part and the second resilient contact part are displaced with respect to each other. <EOS>