An electronic device comprising: a support frame ; a circuit board coupled to the support frame and having at least one component ; a thermal pad thermally coupled to the component; a heat sink associated with the thermal pad; and a hold down for providing a biasing force against the heat sink, wherein the hold down is a unitary structure formed of sheet material and comprises: a generally planar portion adapted to be positioned over a surface of the heat sink; and a plurality of connecting structures extending angularly from the generally planar portion and configured to engage the support frame to cause the hold down to apply the biasing force against the heat sink to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame; and wherein the heat sink comprises: a contoured plate that has a generally planar periphery and at least one depression that contacts the thermal pad; and extensions at the outer edges of the planar periphery that are perpendicular to the planar periphery and that extend over edges of the circuit board. a support frame ; a circuit board coupled to the support frame and having at least one component ; a thermal pad thermally coupled to the component; a heat sink associated with the thermal pad; and a hold down for providing a biasing force against the heat sink, wherein the hold down is a unitary structure formed of sheet material and comprises: a generally planar portion adapted to be positioned over a surface of the heat sink; and a plurality of connecting structures extending angularly from the generally planar portion and configured to engage the support frame to cause the hold down to apply the biasing force against the heat sink to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame; and wherein the heat sink comprises: a contoured plate that has a generally planar periphery and at least one depression that contacts the thermal pad; and extensions at the outer edges of the planar periphery that are perpendicular to the planar periphery and that extend over edges of the circuit board. a generally planar portion adapted to be positioned over a surface of the heat sink; and a plurality of connecting structures extending angularly from the generally planar portion and configured to engage the support frame to cause the hold down to apply the biasing force against the heat sink to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame; and wherein the heat sink comprises: a contoured plate that has a generally planar periphery and at least one depression that contacts the thermal pad; and extensions at the outer edges of the planar periphery that are perpendicular to the planar periphery and that extend over edges of the circuit board. a contoured plate that has a generally planar periphery and at least one depression that contacts the thermal pad; and extensions at the outer edges of the planar periphery that are perpendicular to the planar periphery and that extend over edges of the circuit board. <EOS>