An embedded package structure , comprising: an insulation substrate having at least one first conductive via and at least one second conductive via ; a first conductive layer formed on a top surface of the insulation substrate , wherein the first conductive layer is in contact with the at least first conductive via ; a second conductive layer formed on a bottom surface of the insulation substrate , wherein the second conductive layer is in contact with the at least second conductive via ; an electronic component embedded within the insulation substrate , and comprising plural first conducting terminals , wherein the plural first conducting terminals are electrically connected with the first conductive layer and the second conductive layer through the at least one first conductive via and the at least one second conductive via , respectively; a first insulation material layer formed on an outer surface of the first conductive layer and a part of the top surface of the insulation substrate ; a second insulation material layer formed on an outer surface of the second conductive layer and a part of the bottom surface of the insulation substrate ; a passive component located near a first side of the electronic component and separated from the electronic component , wherein the passive component is at least partially embedded within the insulation substrate , wherein a thickness of the passive component is larger than that of the electronic component ; a third conductive layer disposed on the first insulation material layer and electrically connected to the first conductive layer , wherein an outer surface of the third conductive layer is coplanar with a top side of the passive component ; and a fixing structure disposed on the passive component and insulation substrate , and filled between the passive component and insulation substrate to secure the passive component and the insulation substrate . an insulation substrate having at least one first conductive via and at least one second conductive via ; a first conductive layer formed on a top surface of the insulation substrate , wherein the first conductive layer is in contact with the at least first conductive via ; a second conductive layer formed on a bottom surface of the insulation substrate , wherein the second conductive layer is in contact with the at least second conductive via ; an electronic component embedded within the insulation substrate , and comprising plural first conducting terminals , wherein the plural first conducting terminals are electrically connected with the first conductive layer and the second conductive layer through the at least one first conductive via and the at least one second conductive via , respectively; a first insulation material layer formed on an outer surface of the first conductive layer and a part of the top surface of the insulation substrate ; a second insulation material layer formed on an outer surface of the second conductive layer and a part of the bottom surface of the insulation substrate ; a passive component located near a first side of the electronic component and separated from the electronic component , wherein the passive component is at least partially embedded within the insulation substrate , wherein a thickness of the passive component is larger than that of the electronic component ; a third conductive layer disposed on the first insulation material layer and electrically connected to the first conductive layer , wherein an outer surface of the third conductive layer is coplanar with a top side of the passive component ; and a fixing structure disposed on the passive component and insulation substrate , and filled between the passive component and insulation substrate to secure the passive component and the insulation substrate . <EOS>