Method for producing an electronics module , in particular a transmission control module, the method comprising the steps of: providing a carrier substrate, wherein electronic components are arranged on an outer surface of the carrier substrate and protrude from the outer surface ; and completely covering the electronic components with a protective compound , wherein the covering step comprises the following substeps: providing a mould having depressions made in the mould , wherein the depressions are designed in such a way that they replicate a geometrical form of the electronic components ; at least partially filling the depressions with the protective compound ; and joining the carrier substrate and the mould together in such a way that the electronic components are completely received in the depressions filled with protective compound ; wherein, during the joining together, the mould is arranged in such a way that the protective compound is kept in the depressions by gravity, characterized in that the carrier substrate comprises a carrier board and a circuit board element ; wherein the carrier board and the circuit board element have an opening that is designed to pass completely through the carrier board and the circuit board element , via which excessive protective compound can escape and leave the electronics module during the joining-together step. providing a carrier substrate, wherein electronic components are arranged on an outer surface of the carrier substrate and protrude from the outer surface ; and completely covering the electronic components with a protective compound , wherein the covering step comprises the following substeps: providing a mould having depressions made in the mould , wherein the depressions are designed in such a way that they replicate a geometrical form of the electronic components ; at least partially filling the depressions with the protective compound ; and joining the carrier substrate and the mould together in such a way that the electronic components are completely received in the depressions filled with protective compound ; wherein, during the joining together, the mould is arranged in such a way that the protective compound is kept in the depressions by gravity, characterized in that the carrier substrate comprises a carrier board and a circuit board element ; wherein the carrier board and the circuit board element have an opening that is designed to pass completely through the carrier board and the circuit board element , via which excessive protective compound can escape and leave the electronics module during the joining-together step. providing a mould having depressions made in the mould , wherein the depressions are designed in such a way that they replicate a geometrical form of the electronic components ; at least partially filling the depressions with the protective compound ; and joining the carrier substrate and the mould together in such a way that the electronic components are completely received in the depressions filled with protective compound ; wherein, during the joining together, the mould is arranged in such a way that the protective compound is kept in the depressions by gravity, characterized in that the carrier substrate comprises a carrier board and a circuit board element ; wherein the carrier board and the circuit board element have an opening that is designed to pass completely through the carrier board and the circuit board element , via which excessive protective compound can escape and leave the electronics module during the joining-together step. <EOS>