An electronic device comprising a substrate having a mating component extending from an interior surface of the substrate , a locking mechanism , the locking mechanism comprising: a chassis having a base , a first side wall extending from a surface of the base , and a second side wall extending from the surface of the base (206, 506 606, 806); a cavity provided in a volume formed by the first side wall , the second side wall , and the surface of the base ; and a cantilevered plate having a first end and a second, opposite end (220, 520 620, 820), wherein the cantilevered plate is attached to the first side wall of the chassis at or adjacent to the first end , and wherein the second end of the cantilevered plate is positioned within the cavity , wherein the cantilevered plate is positioned at an acute angle greater than 0 degrees and less than 90 degrees as measured between a plane formed by the inner surface of the base of the chassis and a plane formed by the cantilevered plate, wherein the cavity is configured to receive the mating component wherein a first side of the mating component is configured to abut the cantilevered plate and a second, opposite side of the mating component is configured to abut a surface of the second side wall extending from the chassis , wherein the cantilevered plate is configured to bend at or adjacent to the second end by the application of a force, therein moving between a locked position and an unlocked position, wherein the mating component comprises a notch in the first side of the mating component , wherein the notch is configured to receive a portion of the second end of the cantilevered plate and secure the mating component in the locked position, and wherein the mating component of the electronic device is securable in the locked position and removable in the unlocked position. a chassis having a base , a first side wall extending from a surface of the base , and a second side wall extending from the surface of the base (206, 506 606, 806); a cavity provided in a volume formed by the first side wall , the second side wall , and the surface of the base ; and a cantilevered plate having a first end and a second, opposite end (220, 520 620, 820), wherein the cantilevered plate is attached to the first side wall of the chassis at or adjacent to the first end , and wherein the second end of the cantilevered plate is positioned within the cavity , wherein the cantilevered plate is positioned at an acute angle greater than 0 degrees and less than 90 degrees as measured between a plane formed by the inner surface of the base of the chassis and a plane formed by the cantilevered plate, wherein the cavity is configured to receive the mating component wherein a first side of the mating component is configured to abut the cantilevered plate and a second, opposite side of the mating component is configured to abut a surface of the second side wall extending from the chassis , wherein the cantilevered plate is configured to bend at or adjacent to the second end by the application of a force, therein moving between a locked position and an unlocked position, wherein the mating component comprises a notch in the first side of the mating component , wherein the notch is configured to receive a portion of the second end of the cantilevered plate and secure the mating component in the locked position, and wherein the mating component of the electronic device is securable in the locked position and removable in the unlocked position. <EOS>