A display device, comprising: a first substrate ; a second substrate facing the first substrate ; a coupling member ; and a printed circuit board attached to side surfaces of the first substrate and the second substrate , wherein the first substrate comprises: a base substrate; a display area (DA) including pixels; a non-display area (NA) disposed around the display area (DA); a plurality of connection wirings connected to the pixels, arranged on the base substrate, extending along a first direction (DR1), and spaced apart from each other along a second direction (DR2) intersecting the first direction (DR1); and a plurality of connection pads arranged on a side surface of the first substrate and a side surface of the second substrate , connected to the connection wirings , extending along a thickness direction (DR3), and spaced apart from each other along the second direction (DR2), wherein the coupling member comprises a conductive film portion and is disposed between the printed circuit board and the side surface of the first substrate and between the printed circuit board and the side surface of the second substrate , characterised in that the coupling member further comprises a non-conductive film portion disposed to overlap the connection wirings along the first direction (DR1); and in that the conductive film portion is disposed around the non-conductive film portion. a first substrate ; a second substrate facing the first substrate ; a coupling member ; and a printed circuit board attached to side surfaces of the first substrate and the second substrate , wherein the first substrate comprises: a base substrate; a display area (DA) including pixels; a non-display area (NA) disposed around the display area (DA); a plurality of connection wirings connected to the pixels, arranged on the base substrate, extending along a first direction (DR1), and spaced apart from each other along a second direction (DR2) intersecting the first direction (DR1); and a plurality of connection pads arranged on a side surface of the first substrate and a side surface of the second substrate , connected to the connection wirings , extending along a thickness direction (DR3), and spaced apart from each other along the second direction (DR2), wherein the coupling member comprises a conductive film portion and is disposed between the printed circuit board and the side surface of the first substrate and between the printed circuit board and the side surface of the second substrate , characterised in that the coupling member further comprises a non-conductive film portion disposed to overlap the connection wirings along the first direction (DR1); and in that the conductive film portion is disposed around the non-conductive film portion. a display area (DA) including pixels; a non-display area (NA) disposed around the display area (DA); a plurality of connection wirings connected to the pixels, arranged on the base substrate, extending along a first direction (DR1), and spaced apart from each other along a second direction (DR2) intersecting the first direction (DR1); and a plurality of connection pads arranged on a side surface of the first substrate and a side surface of the second substrate , connected to the connection wirings , extending along a thickness direction (DR3), and spaced apart from each other along the second direction (DR2), wherein the coupling member comprises a conductive film portion and is disposed between the printed circuit board and the side surface of the first substrate and between the printed circuit board and the side surface of the second substrate , characterised in that the coupling member further comprises a non-conductive film portion disposed to overlap the connection wirings along the first direction (DR1); and in that the conductive film portion is disposed around the non-conductive film portion. <EOS>