A support structure for electrically-powered lighting devices, the structure including: - an elongated laminar substrate having first and second opposed surfaces, the laminar substrate including a ribbon-like substrate having opposite sides, - a layer of electrically-conductive material on the first surface of the laminar substrate , the layer including etching forming first electrically-conductive formations extending along the length of the structure , along the first surface of the laminar substrate , - a distribution along the length of the structure , of electrically-conductive areas on the second surface of the laminar substrate , the distribution including electrically-conductive areas formed via etching, and - electrically-conductive vias extending through the laminar substrate to connect the first electrically-conductive formations and electrically-conductive areas in said distribution, characterized in that : - the support structure includes a network of second electrically-conductive formations including electrically-conductive ink deposited on the second surface of the laminar substrate , with second electrically-conductive formations in said network electrically connected with electrically-conductive areas in said distribution, - the distribution of electrically-conductive areas includes pairs of electrically-conductive areas distributed with a constant separation pitch along the second surface of the laminar substrate , each pair including mutually opposed electrically-conductive areas positioned at said opposite sides of the laminar substrate , and - connection of each electrically-conductive area in said distribution to the first electrically-conductive formations comprises a plurality of electrically-conductive vias . - an elongated laminar substrate having first and second opposed surfaces, the laminar substrate including a ribbon-like substrate having opposite sides, - a layer of electrically-conductive material on the first surface of the laminar substrate , the layer including etching forming first electrically-conductive formations extending along the length of the structure , along the first surface of the laminar substrate , - a distribution along the length of the structure , of electrically-conductive areas on the second surface of the laminar substrate , the distribution including electrically-conductive areas formed via etching, and - electrically-conductive vias extending through the laminar substrate to connect the first electrically-conductive formations and electrically-conductive areas in said distribution, - the support structure includes a network of second electrically-conductive formations including electrically-conductive ink deposited on the second surface of the laminar substrate , with second electrically-conductive formations in said network electrically connected with electrically-conductive areas in said distribution, - the distribution of electrically-conductive areas includes pairs of electrically-conductive areas distributed with a constant separation pitch along the second surface of the laminar substrate , each pair including mutually opposed electrically-conductive areas positioned at said opposite sides of the laminar substrate , and - connection of each electrically-conductive area in said distribution to the first electrically-conductive formations comprises a plurality of electrically-conductive vias . <EOS>